Q3D提取封装寄生参数

1、Q3D操作比较简单，只简单做个示意。把QFN封装的bondingwire在ansoftlinks设置好，选中所有net，然后export转到Q3D中。-夕Objects+air-BT_systems+夕Box4a?y抽電|a|XQ|H凰盪題吗龜甑遵口墨工S也V1、二厂或1OO凸10日內O胃占闻二J0D三團QFN-茲Q3DModellQMcidel+ILWets闻Mesh.Operat+HlReduceMatr+Analysis啓Optimetric:LResults+FieldOverl+|Definitions+COPPER+夕ADJR55I_b.+QA5_bwire+夕BBAGC_bwin

2、+CP_bwire+QDVDD_bwire.+夕GND_bwirej+GND_bwire_+QGND_bwirej+夕GND_bwire_+GND_bwire_-+QGND_bwire_+夕GND_bwire_+GND_bwire_+QGND_bwire_+夕GND_bwire_+GND_bwire_+QGND_bwire_+夕GND_bwire_r=.arir&2jIS!B6.export出扫描到的封装参数。g辽Q3DM.：.dQLl*：NculeL由工letsE3JN亡shLiper4ticns-MlHeduesNatriKOriganalEill-j3!ArL：il7Eisj9一：Set

3、uiOpiime+rRenameHesuitsXDeletEfieldOtiHABSJX加HJAC=/Mi白圉Fiksl-Jj-A.Mi再、MiHCllDefinition.2Rcperties.AnalyzeReverttoInitialMesh上pplyixeshUDatlGn5ExfiortCircuit.Bcfile.ConvergeneeMatrix.MabiK：ModelTjipe:InductenctResistance:NumberofCells:CoLplingLimits:DKCancel7.用IBIS编辑器打开检查.pak文件，没有问题就可以用于仿真了。Workspace

4、Workspace-pjM芒切QIHISVteftFil=MamJQFileRetfi【Datensource；gNotCopynght申DefinePackageMecHQHN:inManufacturer：OOem:iftDesaiptmNumberOFPins:-ifiPinNumbers;HModelData：QTnixtanceMatrix:nCapacitanceMatrix=-inReslstarceMatrix：-nEndHccidDatd:西EndPackageMedelj丄印dtemplateLibrary匚：=匚co匚匚u1C011匚I2口CM：予rm宀T5IQ6星珮:漱

5、:ft:;:Q04Q口口马1监口口3045046.IBISVer4.0；FileHaneifilphwFileRei/l1.0:DateThuHay1019:43:592012SourceAnsoftQ3DEztraclor7Dir口jecH：QFM.Motas.CopyrightArLsoftCorporaiion.199B-2003Allrightsreser：/亡d.DefinePaulsaseMbdeLQFlfacturerlUrihnoTmREfflUnkriovnDescriptionHoneJijmberQfPlus2STiriNunbersADJESSI_51_srcAS_27_srcBBAGC_50_sicCP_2rc二SCLSDA40arc二SDATSPD_3src=TSPDULCaD1az-ULChDTr:ir门“L：-VTTnri:-uET-vr.r_A_srr=vr.r_AliTTjrr-rr=VTTjrr-iVLLJ.|_?|：匚-/LiLl.Kill二刘，rc-KJALL-弟丄USpai35_natiia:：:：:：:：:：:：:;:;:;:;:；：:;:;:;:;:;:；：:;:：:;:;:;:;:;:;：；:;:;:;:;:;:;:;:;:;