AEC-Q200 reliability test for magenetics.ppt

1、TABLE OF METHODS REFERENCED MAGNETICS,TABLE OF METHODS REFERENCED MAGNETICS,TABLE OF METHODS REFERENCED MAGNETICS,High temperature storage Standard MIL-STD -202 METHOD 108 Equipment Programmable temperature and humidity chamber Testing method Temp: 125 degree C Unpowered Duration: 1000hrs Measuremen

2、t check appearance and electrical characteristic test prior to and after exposure. Measurement at24+/-2 hours after test conclusion.,ENVIRONMENTAL TEST,2.Temperature cycling Standard JESD22 METHOD JA104 Equipment Fast variety temperature test chamber Testing method Temp: -40 to 125 ramp rate : 10 /m

3、in Cycle rate :1 cycle per hour Soak time : 15min at temp extreme Test cycle: 1000 cycles Measurement Check appearance and electrical characteristic test prior to and after exposure, Measurement at 24+/-2 hours after test conclusion.,ENVIRONMENTAL TEST,TEST CURVE,3.Thermal shock Standard MIL-STD -20

4、2 METHOD 107 Equipment Thermal shock test chamber (air to air) Testing condition Temp:-40 degree 125degre . Test cycle: 300 cycles. Transfer time :20s max.,ENVIRONMENTAL TEST,Temperature profile of thermal shock,TEST CURVE,4.Biased moisture (steady state) Standard MIL-STD -202 METHOD 103 Equipment P

5、rogrammable temperature and humidity chamber Testing method Ta: 85 degree C Humidity: 85 % R.H. Duration: 1000hrs,ENVIRONMENTAL TEST,5.Moisture resistance Standard MIL-STD -202 METHOD 106 Equipment Programmable temperature and humidity chamber Testing method T = 24 hours/cycle Humidity :80% 100% R.H

6、. Temperature varied:25 65 Cycle number:10 Measurement Check appearance and electrical characteristic test prior to and after exposure, Measurement at 24+/-2 hours after test conclusion.,ENVIRONMENTAL TEST,TEST CURVE,PHYSICAL CHARACTERISTICS TEST,6. Vibration Standard MIL-STD -202 METHOD 204 Equipme

7、nt Mechanical vibration tester Testing condition Peak amplitude :0.06inch Freq range :102000hz ， freq varied with logarithmically Sweep time: 102k10hz,20min Vibrating direction: X,Y,Z Number of cycle:12 times each direction( total 36 times and about 12 hours),Peak amplitude :0.06inch （10 to 60hz） Fr

8、eq range :102000hz Sweep time: 102k10hz,20min Vibrating direction: X,Y,Z Number of cycle:12 times each direction,TEST CURVE,7.Mechanical shock Standard MIL-STD -202 METHOD 213 Equipment Half sine-wave-generator Testing method Three shocks in each direction shall be applied along the three mutually p

9、erpendicular axes of the test specimen (18 shocks in total),PHYSICAL CHARACTERISTICS TEST,A：Acceleration Amplitude D: duration of pulse,TEST CURVE,8.Terminal strength Pull test (leaded) Standard MIL-STD -202 METHOD 211 Equipment Tensile tester Testing method Applied force: 910g Duration : 5 to 10 s

10、Shear stress test (SMD剥离强度) Test method Component mounted on PCB and apply a 1.8kg force for 60s. Measurement Magnification of 20X employed for inspection of junction. Electrical test.,Direction of force,PHYSICAL CHARACTERISTICS TEST,9.Resistance to soldering heat Standard MIL-STD -202 METHOD 210 Eq

11、uipment Solder pot (lead-through hole component) Testing method Verify the temperature in the pot is 260 +/- 5 Application of flux around 5 to 10 seconds Put the sample on the solder pot and hold it 10+/- 1seconds, immersion and emersion rate:25+/-6mm/s Depth of immersion :1.27mm (otherwise specifie

12、d) Clean the flux on the sample using alcohol. Inspect the sample using a 10X magnifier Measurement Check appearance and electrical characteristic test prior to and after exposure, Measurement at 24+/-2 hours after test conclusion.,PHYSICAL CHARACTERISTICS TEST,9.Resistance to soldering heat Equipme

13、nt IR-reflow oven (SMD) Testing condition,PHYSICAL CHARACTERISTICS TEST,cool,10.Solderability test Standard J-STD-002 Equipment Solder pot Testing method Verify the temperature in the pot is 245 +/- 5 Application of flux around 5 to 10 seconds Put the sample on the solder pot and hold it 5+0/-0.5 s,

14、 immersion and emersion rate:25+/-6mm/s Clean the flux on the sample using alcohol. Inspect the sample using a 30X magnifier Accept criteria :the solder cover at least 95% of the area.,PHYSICAL CHARACTERISTICS TEST,11. Board flex( terminal bond strength test ) Standard AEC-Q200-005 Testing method Ch

15、eck the electrical characteristic & appearance before test. Sample mounted on a 100mm *40mm FR4 PCB using soldering reflow Apply a force to bent PCB 2mm min Keep the bending point for about 60s. Check the electrical characteristic & appearance (part crack or termination failure).,PHYSICAL CHARACTERI

16、STICS TEST,12. Resistance to Solvents Standard MIL-STD -202 METHOD 215 Testing method Prepare solvent (isopropyl alcohol: kerosene: ethylbenzene =4:9:3 volume ) Specimen be completely immersed in solvent for 3+0.5/-0min Brush dipped in solution until wetted and brush part 10 strokes . Repeat 2 more

17、times Air blow dry Inspect at 3x magnifier for marking and 10 x for part damage.,PHYSICAL CHARACTERISTICS TEST,EMC TEST,13. ESD (Human Body Model) Standard AECQ-200-002 Equipment ESD simulator (HBM): a capacitance and resistance model that characterize person as a source of electrostatic charging ,t

18、o determine component ESD sensitivity.,Testing method If an expected max withstand voltage cant be estimated, the following flow chart can be used.,NOTE： Direct Contact Discharge: probe contact pin under test directly. Air Discharge: ESD simulator placed =15mm away from the pin, and probe slowly move to pin (v=5mm/s),EMC TEST,Failure criteria The component no longer meet spec requirement .(i