半导体一些术语的中英文对照

半导体一些术语的中英文对照精选文档半导体一些术语的中英文对照离子注入机ionimplanterLSS理论LindhandScharffandSchiotttheory又称“林汉德-斯卡夫-斯高特理论”。沟道效应射程分布深度分布投影射程channelingeffectrangedistributiondepthdistributionprojectedrangestoppingdistancestoppingpower标准阻止截面standardstoppingcrosssection退火annealing激活能activationenergy等温退火isothermalannealing激光退火laserannealing应力感生缺陷stress-induceddefect择优取向preferredorientation制版工艺mask-makingtechnology图形畸变patterndistortion初缩精缩母版铬版干版firstminificationfinalminificationmastermaskchromiumplatedryplate乳胶版emulsionplate透明版see-throughplate高分辨率版highresolutionplate,HRP超微粒干版plateforultra-microminiaturization掩模mask掩模对准maskalignment对准精度alignmentprecision光刻胶photoresist又称“光致抗蚀剂”。负性光刻胶正性光刻胶无机光刻胶多层光刻胶negativephotoresistpositivephotoresistinorganicresistmultilevelresist电子束光刻胶electronbeamresistX射线光刻胶X-rayresist刷洗scrubbing甩胶spinning涂胶photoresistcoating后烘postbaking光刻photolithographyX射线光刻X-raylithography电子束光刻electronbeamlithography离子束光刻ionbeamlithography深紫外光刻deep-UVlithography光刻机maskaligner投影光刻机projectionmaskaligner曝光exposure接触式曝光法contactexposuremethod接近式曝光法proximityexposuremethod光学投影曝光法opticalprojectionexposuremethod电子束曝光系统electronbeamexposuresystem分步重复系统step-and-repeatsystem显影development线宽linewidth去胶strippingofphotoresist氧化去胶removingofphotoresistbyoxidation等离子[体]去胶removingofphotoresistbyplasma刻蚀etching干法刻蚀dryetching反应离子刻蚀各向同性刻蚀各向异性刻蚀反应溅射刻蚀reactiveionetching,RIEisotropicetchinganisotropicetchingreactivesputteretching离子铣ionbeammilling又称“离子磨削”。等离子[体]刻蚀plasmaetching钻蚀undercutting剥离技术lift-offtechnology又称“浮脱工艺”。终点监测endpointmonitoring金属化metallization互连interconnection多层金属化multilevelmetallization电迁徙electromigration回流reflow磷硅玻璃phosphorosilicateglass硼磷硅玻璃boron-phosphorosilicateglass钝化工艺passivationtechnology多层介质钝化multilayerdielectricpassivation划片scribing电子束切片electronbeamslicing烧结sintering印压indentation热压焊thermocompressionbonding热超声焊thermosonicbonding冷焊coldwelding点焊spotwelding球焊ballbonding楔焊wedgebonding内引线焊接innerleadbonding外引线焊接outerleadbonding梁式引线beamlead装架工艺mountingtechnology附着adhesion封装packaging金属封装metallicpackaging陶瓷封装ceramicpackaging扁平封装flatpackaging塑封plasticpackage玻璃封装glasspackaging微封装micropackaging又称“微组装”。管壳package管芯die引线键合leadbonding引线框式键合leadframebonding带式自动键合tapeautomatedbonding,TAB激光键合laserbonding超声键合ultrasonicbonding红外键合infraredbonding微电子辞典Abruptjunction突变结Acceleratedtesting加速实验Acceptor受主Acceptoratom受主原子Accumulation积累、堆积Accumulatingcontact积累接触Accumulationregion积累区Accumulationlayer积累层Activeregion有源区Activecomponent有源元Activedevice有源器件Activation激活Activationenergy激活能Activeregion有源(放大)区Admittance导纳Allowedband允带Alloy-junctiondevice合金结器件Aluminum(Aluminium)铝Aluminum–oxide铝氧化物Aluminumpassivation铝钝化Ambipolar双极的Ambienttemperature环境温度Amorphous无定形的，非晶体的Amplifier功放扩音器放大器Analogue(Analog)comparator模拟比较器Angstrom埃Anneal退火Anisotropic各向异性的Anode阳极Arsenic(AS)砷Auger俄歇Augerprocess俄歇过程Avalanche雪崩Avalanchebreakdown雪崩击穿Avalancheexcitation雪崩激发Backgroundcarrier本底载流子Backgrounddoping本底掺杂Backward反向Backwardbias反向偏置Ballastingresistor整流电阻Ballbond球形键合Band能带Bandgap能带间隙Barrier势垒Barrierlayer势垒层Barrierwidth势垒宽度Base基极Basecontact基区接触Basestretching基区扩展效应Basetransittime基区渡越时间Basetransportefficiency基区输运系数Base-widthmodulation基区宽度调制Basisvector基矢Bias偏置Bilateralswitch双向开关Binarycode二进制代码Binarycompoundsemiconductor二元化合物半导体Bipolar双极性的BipolarJunctionTransistor(BJT)双极晶体管Bloch布洛赫Blockingband阻挡能带Blockingcontact阻挡接触Body-centered体心立方Body-centredcubicstructure体立心结构Boltzmann波尔兹曼Bond键、键合Bondingelectron价电子Bondingpad键合点Bootstrapcircuit自举电路Bootstrappedemitterfollower自举射极跟随器Boron硼Borosilicateglass硼硅玻璃Boundarycondition边界条件Boundelectron束缚电子Breadboard模拟板、实验板Breakdown击穿Breakover转折Brillouin布里渊Brillouinzone布里渊区Built-in内建的Build-inelectricfield内建电场Bulk体/体内Bulkabsorption体吸收Bulkgeneration体产生Bulkrecombination体复合Burn-in老化Burnout烧毁Buriedchannel埋沟Burieddiffusionregion隐埋扩散区Can外壳Capacitance电容Capturecrosssection俘获截面Capturecarrier俘获载流子Carrier载流子、载波Carrybit进位位Carry-inbit进位输入Carry-outbit进位输出Cascade级联Case管壳Cathode阴极Center中心Ceramic陶瓷(的)Channel沟道Channelbreakdown沟道击穿Channelcurrent沟道电流Channeldoping沟道掺杂Channelshortening沟道缩短Channelwidth沟道宽度Characteristicimpedance特征阻抗Charge电荷、充电Charge-compensationeffects电荷补偿效应Chargeconservation电荷守恒Chargeneutralitycondition电中性条件Chargedrive/exchange/sharing/transfer/storage电荷驱动/交换/共享/转移/存储Chemmicaletching化学腐蚀法Chemically-Polish化学抛光Chemmically-MechanicallyPolish(CMP)化学机械抛光Chip芯片Chipyield芯片成品率Clamped箝位Clampingdiode箝位二极管Cleavageplane解理面Clockrate时钟频率Clockgenerator时钟发生器Clockflip-flop时钟触发器Close-packedstructure密堆积结构Close-loopgain闭环增益Collector集电极Collision碰撞CompensatedOP-AMP补偿运放Common-base/collector/emitterconnection共基极/集电极/发射极连接Common-gate/drain/sourceconnection共栅/漏/源连接Common-modegain共模增益Common-modeinput共模输入Common-moderejectionratio(CMRR)共模抑制比Compatibility兼容性Compensation补偿Compensatedimpurities补偿杂质Compensatedsemiconductor补偿半导体ComplementaryDarlingtoncircuit互补达林顿电路ComplementaryMetal-Oxide-SemiconductorField-Effect-Transistor(CMOS)互补金属氧化物半导体场效应晶体管Complementaryerrorfunction余误差函数Computer-aideddesign(CAD)/test(CAT)/manufacture(CAM)计算机辅助设计/测试/制造CompoundSemiconductor化合物半导体Conductance电导Conductionband(edge)导带(底)Conductionlevel/state导带态Conductor导体Conductivity电导率Configuration组态Conlomb库仑ConpledConfigurationDevices结构组态Constants物理常数Constantenergysurface等能面Constant-sourcediffusion恒定源扩散Contact接触Contamination治污Continuityequation连续性方程Contacthole接触孔Contactpotential接触电势Continuitycondition连续性条件Contradoping反掺杂Controlled受控的Converter转换器Conveyer传输器Copperinterconnectionsystem铜互连系统Couping耦合Covalent共阶的Crossover跨交Critical临界的Crossunder穿交Crucible坩埚Crystaldefect/face/orientation/lattice晶体缺陷/晶面/晶向/晶格Currentdensity电流密度Curvature曲率Cutoff截止Currentdrift/dirve/sharing电流漂移/驱动/共享CurrentSense电流取样Curvature弯曲Customintegratedcircuit定制集成电路Cylindrical柱面的Czochralshicrystal直立单晶Czochralskitechnique切克劳斯基技术(Cz法直拉晶体J)Danglingbonds悬挂键Darkcurrent暗电流Deadtime空载时间Debyelength德拜长度德布洛意Decderate减速Decibel(dB)分贝Decode译码Deepacceptorlevel深受主能级Deepdonorlevel深施主能级Deepimpuritylevel深度杂质能级Deeptrap深陷阱Defeat缺陷Degeneratesemiconductor简并半导体Degeneracy简并度Degradation退化DegreeCelsius(centigrade)/Kelvin摄氏/开氏温度Delay延迟Density密度Densityofstates态密度Depletion耗尽Depletionapproximation耗尽近似Depletioncontact耗尽接触Depletiondepth耗尽深度Depletioneffect耗尽效应Depletionlayer耗尽层DepletionMOS耗尽MOSDepletionregion耗尽区Depositedfilm淀积薄膜Depositionprocess淀积工艺Designrules设计规则Die芯片(复数dice)Diode二极管Dielectric介电的Dielectricisolation介质隔离Difference-modeinput差模输入Differentialamplifier差分放大器Differentialcapacitance微分电容Diffusedjunction扩散结Diffusion扩散Diffusioncoefficient扩散系数Diffusionconstant扩散常数Diffusivity扩散率Diffusioncapacitance/barrier/current/furnace扩散电容/势垒/电流/炉Digitalcircuit数字电路Dipoledomain偶极畴Dipolelayer偶极层Direct-coupling直接耦合Direct-gapsemiconductor直接带隙半导体Directtransition直接跃迁Discharge放电Discretecomponent分立元件Dissipation耗散Distribution分布Distributedcapacitance分布电容Distributedmodel分布模型Displacement位移Dislocation位错Domain畴Donor施主Donorexhaustion施主耗尽Dopant掺杂剂Dopedsemiconductor掺杂半导体Dopingconcentration掺杂浓度Double-diffusiveMOS(DMOS)双扩散MOS.Drift漂移Driftfield漂移电场Driftmobility迁移率Dryetching干法腐蚀Dry/wetoxidation干/湿法氧化Dose剂量Dutycycle工作周期Dual-in-linepackage(DIP)双列直插式封装Dynamics动态Dynamiccharacteristics动态属性Dynamicimpedance动态阻抗Earlyeffect厄利效应Earlyfailure早期失效Effectivemass有效质量Einsteinrelation(ship)爱因斯坦关系ElectricEraseProgrammableReadOnlyMemory(E2PROM)一次性电可擦除只读存储器Electrode电极Electrominggratim电迁移Electronaffinity电子亲和势Electronic-grade电子能Electron-beamphoto-resistexposure光致抗蚀剂的电子束曝光Electrongas电子气Electron-gradewater电子级纯水Electrontrappingcenter电子俘获中心ElectronVolt(eV)电子伏Electrostatic静电的Element元素/元件/配件Elementalsemiconductor元素半导体Ellipse椭圆Ellipsoid椭球Emitter发射极Emitter-coupledlogic发射极耦合逻辑Emitter-coupledpair发射极耦合对Emitterfollower射随器Emptyband空带Emittercrowdingeffect发射极集边(拥挤)效应Endurancetest=lifetest寿命测试Energystate能态Energymomentumdiagram能量-动量(E-K)图Enhancementmode增强型模式EnhancementMOS增强性MOSEntefic(低)共溶的Environmentaltest环境测试Epitaxial外延的Epitaxiallayer外延层Epitaxialslice外延片Expitaxy外延Equivalentcurcuit等效电路Equilibriummajority/minoritycarriers平衡多数/少数载流子ErasableProgrammableROM(EPROM)可搽取(编程)存储器Errorfunctioncomplement余误差函数Etch刻蚀Etchant刻蚀剂Etchingmask抗蚀剂掩模Excesscarrier过剩载流子Excitationenergy激发能Excitedstate激发态Exciton激子Extrapolation外推法Extrinsic非本征的Extrinsicsemiconductor杂质半导体Face-centered面心立方Falltime下降时间Fan-in扇入Fan-out扇出Fastrecovery快恢复Fastsurfacestates快界面态Feedback反馈Fermilevel费米能级Fermi-DiracDistribution费米-狄拉克分布Femipotential费米势Fickequation菲克方程(扩散)Fieldeffecttransistor场效应晶体管Fieldoxide场氧化层Filledband满带Film薄膜Flashmemory闪烁存储器Flatband平带Flatpack扁平封装Flickernoise闪烁(变)噪声Flip-floptoggle触发器翻转Floatinggate浮栅Fluorideetch氟化氢刻蚀Forbiddenband禁带Forwardbias正向偏置Forwardblocking/conducting正向阻断/导通Frequencydeviationnoise频率漂移噪声Frequencyresponse频率响应Function函数Gain增益Gallium-Arsenide(GaAs)砷化钾Gamyrayr射线Gate门、栅、控制极Gateoxide栅氧化层Gauss(ian)高斯Gaussiandistributionprofile高斯掺杂分布Generation-recombination产生-复合Geometries几何尺寸Germanium(Ge)锗Graded缓变的Graded(gradual)channel缓变沟道Gradedjunction缓变结Grain晶粒Gradient梯度Grownjunction生长结Guardring保护环Gummel-Poommodel葛谋-潘模型Gunn-effect狄氏效应Hardeneddevice辐射加固器件Heatofformation形成热Heatsink散热器、热沉Heavy/lightholeband重/轻空穴带Heavysaturation重掺杂Hell-effect霍尔效应Heterojunction异质结Heterojunctionstructure异质结结构HeterojunctionBipolarTransistor(HBT)异质结双极型晶体Highfieldproperty高场特性HighperformanceMOS(H-MOS)高性能MOS.Hormalized归一化Horizontalepitaxialreactor卧式外延反应器Hotcarrior热载流子Hybridintegration混合集成Image-force镜象力Impactionization碰撞电离Impedance阻抗Imperfectstructure不完整结构Implantationdose注入剂量Implantedion注入离子Impurity杂质Impurityscattering杂志散射Incrementalresistance电阻增量(微分电阻)In-contactmask接触式掩模Indiumtinoxide(ITO)铟锡氧化物Inducedchannel感应沟道Infrared红外的Injection注入Inputoffsetvoltage输入失调电压Insulator绝缘体InsulatedGateFET(IGFET)绝缘栅FETIntegratedinjectionlogic集成注入逻辑Integration集成、积分Interconnection互连Interconnectiontimedelay互连延时Interdigitatedstructure交互式结构Interface界面Interference干涉/晶格缺陷/晶格畸变Internationalsystemofunions国际单位制Internallyscattering谷间散射Interpolation内插法Intrinsic本征的Intrinsicsemiconductor本征半导体Inverseoperation反向工作Inversion反型Inverter倒相器Ion离子Ionbeam离子束Ionetching离子刻蚀Ionimplantation离子注入Ionization电离Ionizationenergy电离能Irradiation辐照Isolationland隔离岛Isotropic各向同性JunctionFET(JFET)结型场效应管Junctionisolation结隔离Junctionspacing结间距Junctionside-wall结侧壁Latchup闭锁Lateral横向的Lattice晶格Layout版图Latticebinding/cell/constant/defect/distortion晶格结合力/晶胞/晶格/晶格常熟Leakagecurrent(泄)漏电流Levelshifting电平移动Lifetime寿命linearity线性度Linkedbond共价键LiquidNitrogen液氮Liquid－phaseepitaxialgrowthtechnique液相外延生长技术Lithography光刻LightEmittingDiode(LED)发光二极管LoadlineorVariable负载线LocatingandWiring布局布线Longitudinal纵向的Logicswing逻辑摆幅Lorentz洛沦兹Lumpedmodel集总模型Majoritycarrier多数载流子Mask掩膜板，光刻板Masklevel掩模序号Maskset掩模组DflipflopDMatching匹配Maxwell麦克斯韦Meanfreepath平均自由程Meanderedemitterjunction梳状发射极结Meantimebeforefailure(MTBF)平均工作时间Megeto-resistance磁阻Mesa台面MESFET-MetalSemiconductor金属半导体FETMetallization金属化Microelectronictechnique微电子技术Microelectronics微电子学Millenindices密勒指数Minoritycarrier少数载流子Misfit失配Mismatching失配Mobileions可动离子Mobility迁移率Module模块Modulate调制Molecularcrystal分子晶体MonolithicIC单片ICMOSFET金属氧化物半导体场效应晶体管Mos.Transistor(MOST)MOS.晶体管Multiplication倍增Modulator调制Multi-chipIC多芯片ICMulti-chipmodule(MCM)多芯片模块Multiplicationcoefficient倍增因子Nakedchip未封装的芯片(裸片)Negativefeedback负反馈Negativeresistance负阻Nesting套刻Negative-temperature-coefficient负温度系数Noisemargin噪声容限Nonequilibrium非平衡Nonrolatile非挥发(易失)性Normallyoff/on常闭/开Numericalanalysis数值分析Occupiedband满带Officienay功率Offset偏移、失调Onstandby待命状态Ohmiccontact欧姆接触Opencircuit开路Operatingpoint工作点Operatingbias工作偏置Operationalamplifier(OPAMP)运算放大器Opticalphoton=photon光子Opticalquenching光猝灭Opticaltransition光跃迁Optical-coupledisolator光耦合隔离器Organicsemiconductor有机半导体Orientation晶向、定向Outline外形Out-of-contactmask非接触式掩模Outputcharacteristic输出特性Outputvoltageswing输出电压摆幅Overcompensation过补偿Over-currentprotection过流保护Overshoot过冲Over-voltageprotection过压保护Overlap交迭Overload过载Oscillator振荡器Oxide氧化物Oxidation氧化Oxidepassivation氧化层钝化Package封装Pad压焊点Parameter参数Parasiticeffect寄生效应Parasiticoscillation寄生振荡Passination钝化Passivecomponent无源元件Passivedevice无源器件Passivesurface钝化界面Parasitictransistor寄生晶体管Peak-pointvoltage峰点电压Peakvoltage峰值电压Permanent-storagecircuit永久存储电路Period周期Periodictable周期表Permeable-base可渗透基区Phase-lockloop锁相环Phasedrift相移Phononspectra声子谱Photoconduction光电导Photodiode光电二极管Photoelectriccell光电池Photoelectriceffect光电效应Photoenicdevices光子器件Photolithographicprocess光刻工艺(photo)resist(光敏)抗腐蚀剂Pin管脚Pinchoff夹断PinningofFermilevel费米能级的钉扎(效应)Planarprocess平面工艺Planartransistor平面晶体管Plasma等离子体Plezoelectriceffect压电效应Poissonequation泊松方程Pointcontact点接触Polarity极性Polycrystal多晶Polymersemiconductor聚合物半导体Poly-silicon多晶硅Potential(电)势Potentialbarrier势垒Potentialwell势阱Powerdissipation功耗Powertransistor功率晶体管Preamplifier前置放大器Primaryflat主平面Principalaxes主轴Print-circuitboard(PCB)印制电路板Probability几率Probe探针Process工艺Propagationdelay传输延时Pseudopotentialmethod膺势发Punchthrough穿通Pulsetriggering/modulating脉冲触发/调制PulseWidenModulator(PWM)脉冲宽度调制Punchthrough穿通Push-pullstage推挽级Qualityfactor品质因子Quantization量子化Quantum量子Quantumefficiency量子效应Quantummechanics量子力学Quasi–Fermi－level准费米能级Quartz石英Radiationconductivity辐射电导率Radiationdamage辐射损伤Radiationfluxdensity辐射通量密度Radiationhardening辐射加固Radiationprotection辐射保护Radiative-recombination辐照复合Radioactive放射性Reachthrough穿通Reactivesputteringsource反应溅射源Readdiode里德二极管Recombination复合Recoverydiode恢复二极管Reciprocallattice倒核子Recoverytime恢复时间Rectifier整流器(管)Rectifyingcontact整流接触Reference基准点基准参考点Refractiveindex折射率Register寄存器Registration对准Regulate控制调整Relaxationlifetime驰豫时间Reliability可靠性Resonance谐振Resistance电阻Resistor电阻器Resistivity电阻率Regulator稳压管(器)Relaxation驰豫Resonantfrequency共射频率Responsetime响应时间Reverse反向的Reversebias反向偏置Samplingcircuit取样电路Sapphire蓝宝石(Al2O3)Satellitevalley卫星谷Saturatedcurrentrange电流饱和区Saturationregion饱和区Saturation饱和的Scaleddown按比例缩小Scattering散射Schockleydiode肖克莱二极管Schottky肖特基Schottkybarrier肖特基势垒Schottkycontact肖特基接触Schrodingen薛定厄Scribinggrid划片格Secondaryflat次平面Seedcrystal籽晶Segregation分凝Selectivity选择性Selfaligned自对准的Selfdiffusion自扩散Semiconductor半导体Semiconductor-controlledrectifier可控硅Sendsitivity灵敏度Serial串行/串联Seriesinductance串联电感Settletime建立时间Sheetresistance薄层电阻Shield屏蔽Shortcircuit短路Shotnoise散粒噪声Shunt分流Sidewallcapacitance边墙电容Signal信号Silicaglass石英玻璃Silicon硅Siliconcarbide碳化硅Silicondioxide(SiO2)二氧化硅SiliconNitride(Si3N4)氮化硅SiliconOnInsulator绝缘硅Siliverwhiskers银须Simplecubic简立方Singlecrystal单晶Sink沉Skineffect趋肤效应Snaptime急变时间Sneakpath潜行通路Sulethreshold亚阈的Solarbattery/cell太阳能电池Solidcircuit固体电路SolidSolubility固溶度Sonband子带Source源极Sourcefollower源随器Spacecharge空间电荷Specificheat(PT)热Speed-powerproduct速度功耗乘积Spherical球面的Spin自旋Split分裂Spontaneousemission自发发射Spreadingresistance扩展电阻Sputter溅射Stackingfault层错Staticcharacteristic静态特性Stimulatedemission受激发射Stimulatedrecombination受激复合Storagetime存储时间Stress应力Straggle偏差Sublimation升华Substrate衬底Substitutional替位式的Superlattice超晶格Supply电源Surface表面Surgecapacity浪涌能力Subscript下标Switchingtime开关时间Switch开关Tailing扩展Terminal终端Tensor张量Tensorial张量的Thermalactivation热激发Thermalconductivity热导率Thermalequilibrium热平衡ThermalOxidation热氧化Thermalresistance热阻Thermalsink热沉Thermalvelocity热运动Thermoelectricpovoer温差电动势率Thick-filmtechnique厚膜技术Thin-filmhybridIC薄膜混合集成电路Thin-FilmTransistor(TFT)薄膜晶体Threshlod阈值Thyistor晶闸管Transconductance跨导Transfercharacteristic转移特性Transferelectron转移电子Transferfunction传输函数Transient瞬态的Transistoraging(stress)晶体管老化Transittime渡越时间Transition跃迁Transition-metalsilica过度金属硅化物Transitionprobability跃迁几率Transitionregion过渡区Transport输运Transverse横向的Trap陷阱Trapping俘获Trappedcharge陷阱电荷Trianglegenerator三角波发生器Triboelectricity摩擦电Trigger触发Trim调配调整Triplediffusion三重扩散Truthtable真值表Tolerahce容差Tunnel(ing)隧道(穿)Tunnelcurrent隧道电流Turnover转折Turn-offtime关断时间Ultraviolet紫外的Unijunction单结的Unipolar单极的Unitcell原(元)胞Unity-gainfrequency单位增益频率Unilateral-switch单向开关Vacancy空位Vacuum真空Valence(value)band价带Valuebandedge价带顶Valencebond价键Vapourphase汽相Varactor变容管Varistor变阻器Vibration振动Voltage电压Wafer晶片Waveequation波动方程Waveguide波导Wavenumber波数Wave-particleduality波粒二相性Wear-out烧毁Wirerouting布线Workfunction功函数Worst-casedevice最坏情况器件Yield成品率Zenerbreakdown齐纳击穿Zonemelting区熔法AS:AbnormalTailSensitivity?线尾灵敏度异常AT:AbnormalTailThreshold?线的阀值异常Bnd:Bond键合B／H：BondHead焊头BBOS:BondBallOnStitchBFM:BallFormationMonitor检测烧球质量BOS:BasicOperation&Setup基本操作&设置BPO:Bond