KPⅠ电镀制作能力评估报告

(KPI&II)ManufacturingEngineering致：文开进先生/王小林先生/张光华先生由：杨志勇/黄家荣发出：范军杰/李跃辉日期：07/11/2023文件编号:KPI-ME-GD-O-157-2023影送：陈惠珍小姐/黄少南先生/潘观平先生Sub：KPⅠ电镀制作力气评估报告一、背景：1.0MIL以上的制板按目前正常生产工艺〔一次全板+一次图电〕无法到达客户的要求，均需增加一次全板电铜流程，但随着此类制板数量的不断增加，严峻影响了图电工序的生产出货；所以现对电镀制作力气做一次评估，请P&D在技术上供给帮助。10.35MM以下，按正常生产工艺〔一次全板+一次图电〕,其孔内铜厚状况；2、评估现电镀的深镀力气和镀铜均匀性状况。三、评估状况：A、孔内镀铜厚的评估试板板号：KP44864A00 客户：HONO1试板要求和特点：板厚:0.057“—0.070“ 生产板尺寸:11.70“X22.10“最小钻咀直径:0.35MM 线距:3.5MILMIN孔内铜厚要求:0.7mil(min)、0.8mil(average)镀铜密度:C/S 59.16% S/S 52.20%23、试板过程⑴生产流程：钻孔 三合一 干菲林 图形电镀 蚀刻⑵生产条件：a三合一：PTH按正常，全板电铜：18ASF*24MINb图形电镀：图电线生产，电铜电流：16ASF*60MINc电铜缸药水浓度：浓度成份 要求范围CUSO4H2SO4CL-

55-65g/L210-230g/L40-70PPM(0.5-2ml/L)/(3-8ml/L)(3~15ml/L)/(4-50ml/L)

58.2g/L217g/L51.6PPM1.3ml/L9.6ml/L

图形电镀57.5g/L221.3g/L48PPM6.2ml/L17.8ml/L⑶试板数量及挂板方式：共试板一条飞巴10PN，按如下方式挂板1212345678910⑷测试板和测试点的选取：每张板按如下位置选取测量3〔微切测量孔的孔径均为ABC 制板方向孔⑸孔内铜厚切片测试结果如下:点12345678910A0.30.20.20.30.30.30.30.20.30.3B0.20.40.30.40.30.30.30.30.30.3C0.40.30.20.20.30.30.40.40.30.2MAX0.4AVG0.29A0.40.60.70.40.50.30.30.60.60.3B0.40.40.50.20.60.50.50.50.50.5C0.30.50.60.80.30.60.50.50.50.7MAX0.8AVG0.49A0.70.80.90.70.80.60.60.80.90.6B0.60.80.80.60.90.80.80.80.80.8C0.70.80.81.10.60.91.00.90.80.9MIN0.6MAX1.0AVG0.79工程测量孔内最小铜厚全板MIN0.2图电工程测量孔内最小铜厚全板MIN0.2图电MIN0.2孔内B、电镀深镀力气评估1、板料：尺寸〔16″×20″〕板厚〔3.0mm〕〔H/HOZ〕2、流程：钻孔 三合一 图电 微切片测量3、生产条件：⑵电铜缸药水浓度：浓度浓度成份要求范围全板电镀图形电镀CUSO455-65g/L57.8g/LH2SO4210-230g/L225g/L56g/L218g/LCL-

40-70PPM(0.5-2ml/L)/(3-8ml/L)(3~15ml/L)/

448.6PPM 53PPM7.2ml/L1.6ml/L潮湿剂(全板/图电)0.45mm0.40mm0.45mm0.40mm0.35mm0.30mm0.45mm0.40mm0.35mm0.30mm0.45mm0.40mm0.35mm0.30mm(一)孔径排例图示BDABD

(4-50ml/L)

10.5ml/L

24.7ml/LABCABC〔每I 种孔径三J 个点〕C(二)镀铜厚取点读数示意图 (三)微切片取样图示6孔径工程孔内最小铜厚孔径工程孔内最小铜厚孔内平均铜厚0.45mm 1AVG1(%)AVG2(%)孔内最小铜厚孔内平均铜厚0.4mm 1AVG1(%)AVG2(%)孔内最小铜厚孔内平均铜厚0.35mm 1AVG1(%)AVG2(%)孔内最小铜厚孔内平均铜厚0.3mm 1AVG1(%)AVG2(%)备注 A线(旧拉)B线(拉)A(mil)B(mil)C(mil)A(mil)B(mil)C(mil)0.40.40.40.40.40.50.60.50.50.50.50.70.91.01.10.91.01.144.440.036.444.440.045.566.750.045.555.650.063.640.343.354.156.40.30.30.20.30.40.50.50.40.50.50.60.71.00.90.90.70.91.130.033.322.242.944.445.550.044.455.671.466.763.628.544.350.067.20.30.20.40.40.40.50.40.40.50.50.50.60.81.01.20.81.01.237.520.033.350.040.041.750.040.041.762.550.050.030.343.943.954.20.30.40.40.40.40.40.40.50.50.50.50.50.91.01.01.30.80.933.340.040.030.850.044.444.450.050.038.562.555.637.841.748.152.26、小结1、6.7:1～10:1纵横比的制板在图形电镀深镀力气都很差，并跟纵横比(孔径)的大小没多大的规律性；2、B线(拉)相比照A线(旧拉)要好，具体如下：6.2-16.7:1的制板，B线比A56.4%-54.1%=2.3%6.2-27.5:1的制板，B线比A67.2.%