PCB板制作工艺流程介绍

1、HDI Manufacturing Process FlowPre-engineeringPattern imagingEtchingLaminatingDrillingCu platingHole pluggingPattern imagingLaminationLaser AblationMechanical drillingPattern imagingCu platingSolder MaskSurface FinishedRoutingVisual inspectionElectric testShippingPre-engineeringPattern imagingEtching

2、LaminatingDrillingDesmearCu platingHole pluggingCu platingBelt SandingLaminationLaser AblationMechanical drillingCu platingPattern imagingSolder MaskGold platingRoutingElectrical testPattern imagingHole counterShippingVisual inspection* Raw material (Thin Core,Copper,Prepreg.)Raw Material : FR-4 (Di

3、funtional,Tetrafuntional)Supplier : EMC ,Nan-YaSheet size : 36”*48” , 40”*48” ,42”*48Core Thickness : 0.003”,0.004”,0.005”,0.006” 0.008”,0.010”,0.012”,0.015” 0.021”,0.031”,0.039”,0.047”Copper Foil : 1/3 oz,1/2 oz,1.0 oz,2 ozPrepreg type : 1080,2113,2116,1506,7628,76301.內層基板 (THIN CORE)LaminateCopper

4、 Foil裁板(Panel Size) COPPER FOILEpoxy GlassPhoto Resist2.內層線路製作(壓膜) (Dry Film Resist Coat)Etch Photoresist (D/F)Photo Resist3. 內層線路製作(曝光)(Expose)A/WArtwork(底片)Artwork(底片)After ExposeBefore Expose4. 內層線路製作(顯影)(Develop)Photo Resist5. 內層線路製作(蝕刻)(Etch)Photo Resist6. 內層線路製作(去膜)(Strip Resist)7.黑氧化 ( Oxide

5、Coating)8. 疊板 (Lay-up)LAYER 2LAYER 3LAYER 4LAYER 5LAYER 1LAYER 6Layer 1Layer 2Layer 3Layer 4Copper FoilCopper FoilInner LayerPrepreg(膠片)Prepreg(膠片)9. 壓合 (Lamination)典型之多層板疊板及壓合結構.COPPER FOIL 0.5 OZThin Core ,FR-4prepreg COMPS0LD.prepreg Thin Core ,FR-4prepreg COPPER FOIL 0.5 OZ疊合用之鋼板疊合用之鋼板10-12層疊合壓合

6、機之熱板壓合機之熱板COPPER FOIL 0.5 OZThin Core ,FR-4prepreg COMPS0LD.prepreg Thin Core ,FR-4prepreg COPPER FOIL 0.5 OZ疊合用之鋼板疊合用之鋼板墊木板鋁板10. 鑽孔 (Drilling)11. 電鍍Desmear & Copper Deposition12. 塞孔(Hole Plugging)13. 去溢膠 (Belt Sanding)14. 減銅 (Copper Reduction) Option15. 去溢膠 (Belt Sanding) Option16. 外層壓膜 Dry Film La

7、mination (Outer layer)Photo Resist17. 外層曝光 ExposeUV光源18. After Exposed19. 外層顯影 Develop20. 蝕刻 Etch20. 去乾膜 Strip Resist21.壓合 (Build-up Layer Lamination)RCC(Resin Coated Copper foil)21. 護形層製作 (壓膜)(Conformal Mask)Dry Film(乾膜)Dry Film(乾膜)Artwork(底片)Artwork(底片)22. 護形層製作 (曝光)(Conformal Mask)Before Exposure

8、After Exposure23.護形層製作 (顯像)(Conformal Mask)24. 護形層製作 (蝕銅) (Conformal Mask)25.護形層製作(去膜) (Conformal Mask)26. 雷射鑽孔 (Laser Ablation)及機械鑽孔Mechanical Drill(P.T.H.)Laser Microvia(Blind Via)27. 機械鑽孔 (Mechanical Drill)28. 電鍍(Desmear & Copper Deposition)29. 外層線路製作 (Pattern imaging)壓膜(D/F Lamination) 曝光(Exposu

9、re)顯像(D/F Developing) 蝕銅 (Etching)去膜(D/F Stripping) 30. 防焊(綠漆)製作 (Solder Mask)WWEI94V-0R10531. S/M 顯像 (S/M Developing)32. 印文字 (Legend Printing)33. 浸金(噴錫)製作(Electroless Ni/Au , HAL)WWEI94V-0R105WWEI94V-0R105Dedicate or universal Tester Flying Probe Tester 34. 成型 (Profile)35. 測試 (Electrical Testing)WW

10、EI94V-0R105WWEI94V-0R10536. 終檢 (Final Inspection)37. O.S.P. (entek plus Cu_106A.) OptionLASER BLIND & BURIED VIA LAY-UPA = THROUGH VIA HOLE (導通孔) B = BURIED VIA HOLE (埋孔)C = One Level Laser Blind Via (雷射盲孔 ) LASER BLIND & BURIED VIA LAY-UPBURIED VIA AND LASER BLIND VIA OPTION (雷射盲埋孔之選擇)DCCD = Two Le

11、vel Laser Via (雷射盲孔 ) CDCB-STAGEFR-4 CoreRCCFR-4 CoreB-STAGERCCABBABURIED VIA LAY-UPA = THROUGH VIA HOLE (導通孔) B = BURIED VIA HOLE (埋孔)C = BLIND VIA HOLE (盲孔 ) D = BLIND HOLE MLB VIA (多層盲孔)BLIND VIA LAY-UPBLIND VIA SEQUENTIAL LAY-UPABBARESINB-STAGE BLIND AND BURIED VIA OPTION (盲 埋 孔 之 選 擇 )DACC E = VIA IN PAD (VIP) (導通孔在pad裡面)EConventional PCBFR-4Build-upLayerBuild-upLayerPho