SMT 工艺流程讲义知识点梳理汇总

主旨：SMT工艺流程讲議一.目的:通过集中进行培训.使技朮员掌握更多的知识去为生产过程当中出现的问题.更快更准确地去分析和解决.达到提高生产效率.提高品质质量.降低物料消耗.二.培训人员三.内容:ＳＭＴ工艺流程有关ＰＰＭ的鱼骨架分析图 3.1.1(Ｏven)3.1.3(Printing)３.１.5(员工补料)XY.Table稳定性３.１.８(其它)XY.Table水平度轨道状况剐刀速度切刀状况剐刀压力CAM速度炉温极限设置网的平面度取放PCB板状况程序优化状况炉温设置网眼大小补料速度车间灰尘状况排废气状况网眼密度补料正确性车间涩度回流风速网眼制造补料手法车间空气状况炉速钢网厚度组件偏位认识车间温度锡浆金属比来料规格成像参数设置nozzle尺寸状况锡浆粘度性组件氧化状况nozzle参数设置nozzle磨损状况17.5MM锡浆溶点温度组件极性组件外行尺寸设置nozzle中心位置金属颗粒大小组件缺损状况feeder参数设置nozzle堵塞状况金属颗粒形状纸带状况组件识别数据设置nozzle反光纸状况助焊剂含量胶带状况组件补偿数据设置nozzle真空状况PCB板规格有关速度数据设置feeder规格PCB拚板标准性feeder导盖Feeder齿轮Feeder中心3.1.73.1.2(Solder)3.1.4(物料)nozz和3.1.6(组件数据)feederFUJI--CP6,CP642,CP643OperationManuPowerBoxOperationBox1In-conveyorOut-conveyorServoBox1ServoBox2ControlBox2ControlBox1XY-TablePlacingHead CPURACK(FRONT)CPURACKJUNPERSETSpaceconsolespacevisionservo1servo2servo3I/OC/CGCHservo42345678910111213shortopenSERVOBOX1D2AXISXAXISD1AXIS(11SA-2)(125SA-1)(11SA-1)CACR-44-FK1CSY1ASGDBB-60VD-Y189CACR-FK1CSY1AFM5FM6SERVOBOX2YAXISZFRQFQNCMIPCB0FM11FM12SAPCB3SAPCB2SAPCB12012193181741665157148139121011CP机器操作介绍机器结构说明:有关CP-6series机器大致有以下几部分组成.1.机架(用于放置和固定各部位的连结接).2.伺服箱BOX1(用于对D1.D2.X.AXIS的控制以及相关继电器回路控制)3.伺服箱BOX2(用于对Y.Z.FRQ.FQ.NC等AXIS的控制以及相关继电回路控制)4.控制箱BOX1(各动作位置的感应输出和输入控制)5.控制箱BOX2(机器各部分的供电输出和VME主板)6.主电源箱(主供电箱交流电380~V的输入和应输出转换回路)7.操作箱BOX前(CRT1.CRT2.CAMAXIS的控制回路)8.操作箱BOX后(CRT3的控制回路)9.物料驱动台TABLE1.TABLE2.10.置放头(贴片主体部分)11.X.Y工作台(PCB贴组件工作台)12.凸轮箱(置放头的传动主体)13.机板输出和输入部分(PCB板输送主体)14.消音箱(废料箱以及杂音控制)TwentyWorkStation的说明:CP6以上的机器工作站有20个.一般都是每个头所在的位子,相对应也有一个工作站,CP6一般都是20个头,从字母A到从字母T.每个头上都有6个NOZ-ZLE.吸嘴.机器在生产时按PROGRAM中PDDATA资料规定的来选不同的NOZ-ZLE.ST1:从FEEDER上吸取组件,料带切刀动作,真空开关切换,吸嘴上下动作,供料连杆动作,组件耗尽侦测.ST2:大组件吸取侦测.ST3:置件角度的预转,在这里只能做粗略的预转.ST4:无功能.ST5::置件工作头误差角度的校正.ST6:组件照相处理和PDDATA的数据进行核对.ST7.8.9:把ST6站的数据进行软件处理.硬件不动作.ST10:对ST3D的预转角度进行最终确认.ST11:吸嘴上下动作真空开关切换进行贴片工作.ST12:针对ST10站最终贴片角度的还原.ST13:置件角度的预转还原.对ST13粗略预转角度还原.ST14:置件工作头A的检知.ST15:吸咀头角度原点的确认,不在原点位置的将被SKIP退到ST12进行重新还原.ST16:对做影像处理不能通过之零件进行收集.ST17:对切换前NOZZLE位置进行检测.ST18:对吸咀位置进行切换(也就是选出下步要吸料的NOZZLER).ST19:对ST18吸咀对切的位置进行最终确认.ST20:无功能.备注:ST1-ST11是吸料,检查,贴装过程,ST12-ST20是还原检查确认过程.SMT生产现场工艺参数的调整方法合格焊接工艺参数控制丝印工艺参数控制贴装工艺参数控制结束开始PCB烘..烤90分钟左右平整度.可焊性检查焊膏的搅拌(3/5分钟)分析原因及时解决问题合格合格一.铅锡膏功能I/O信号名称说明地址信号名称注解X000EMERGENCYSW紧急停止键X001STARTSW开始键X003CYCLESTOP恢复键X004TMCOUNT1定时器2000小时已满X005TMCOUNT2定时器6000小时已满X008INCHINGRIGHTMCHING右键X009INCHINGLEFTINCHING左键X00AINCHINGDOWNINCHING下降键X00BINCHINGUPINCHING上升键X00CINCHINGCWINCHING顺时针按键X00DINCHINGCCWINCHING逆时针按键X00FSHIFTKEY轴的选择键X010-X015F1-F6六个功能键X017-(MINUSSKY)负号键X018-X01BE1-E4INCHING数字键X01C-X01FTENKEY1-TENKEY4数字键X020MACHINEREDY机器准备就绪X021AIROK气压检查开关X022THERMALOK温度感应SENRORSX023SERVOREADY伺服状态就绪X024TABLEREADYTABLE在用台状态X025-X027处于短路状态X028FRONTDOOROK前面安全门开关检查X029REARDOOROK后面安全门开关检查X02BVACUUMOK真空开关检查X02CCAMHANDIECHK凸轮手柄开关检查X02DFEEDERCHKFEEDER位开关检查X02EFENCE1CHK料台栅栏杆1开关检查X02FFENCE2CHK料台栅栏杆2开关检查X030TABLEUPCHKTABLE上升位检查X032TABLEDNCHKTABLE下升位检查X033PCBSETOKTABLEPCB水平检查X034CONVCLUKCHKTABLE上下位的状态检查X036HARDREADY凸轮准备就绪X03ACONVPCBCHKTABLE上板的感应检查X03BREAROPERATION机器操作板转到后面操作X03CFEEDERFWPOSST1FEEDER连杆的上极限检查X03DFEEDERBWPOSST1FEEDER连杆的下极限检查X03ECAMZERVPOSCAM原点位置检查X03FST11DNPOSST11气缸的下极限检查X040SERVOBOX1SERVOBOX1准备就绪X041SERVCBOX2SERVOBOX2准备就绪X042TAPEENDCHKTAPEENDDETECTION零件用尽检测X044PQROT270DEG预转角度气缸的回开位检查X045PQROT90DEG预转角度气缸的回退位检查X046SETCANCEL1取消右边料台X047SETCANCEL2取消左边料台X049HEADACHK置件头A位的检查X04A-X04CNOZCHKST171-3ST17NOZZLE型号的检查分三组光束X04D-X04FNOZCHKST191-3ST19NOZZLE型号的检查分三组光束X050PRQROT270DEG预转角度还原气缸的回开位检查X051PRQROT90DEG预转角度还原气缸的回退位检查X052NOZORGPOSST12ST12NOZ吻合齿输原点位检查X053NOZCLUTST12ST12NOZ齿输吻合状况检查X054DUMPPARTS废料盒的测知X055OILALARM循环油报警X056NOLORGPOSST15ST15NOZZLE原点的确认X057CYCLEMODE转为暂停模式X05ASHUTTER1UPCHK料站挡板1上升位检查X05BSHUTTER1DNCHK料站挡板1下降位检查X05CSHUTTER1-2UPDNCHK料站挡板1上升.下降位检查X05ETRANSFERIN输送板传送输入位感应器检查X05FTRANSFEROUT输送板传送输出位感应器检查SX006CAXISZEROCAM归零感应SX00AFRQAXISZERO预转AXIS归零感应SX00EZAXISZEROZAXIS归零感应SX00C-DZAXIS+_OTZAXIS上下极限感应SX014-15XAXIS+_OTXAXIS正负极限感应SX016XAXISZEROX轴归零感应SX017XAXISREADYX轴INTERLOC打开SX018-19YAXIS+_OTYAXIS正负极限感应SX01EFQAXISZERO预转确认轴归零感应SX024-25D1AXIS_+OTD1轴正负极限感应SX026D1AXISZERROD1轴归零感应SX027D1AXISREADTD1轴INTERLOCK打开SX028-SX02B为D2轴同上D1轴为D2轴同上D1轴SX02ENCAXISZERONC轴归零感应(SET)-(MANUAL)-(I/O)检查输入和输出信号SMT组件的贴装方式类型贴装方式贴装结构电路基板元器件特征全单面APCB单面表面工艺简单,适合IA表表面贴装陶瓷基板贴装于小型,薄型化面B组件的电路贴装IB组双面APCB双面同上高密度贴装装表面贴装B陶瓷基板薄型化SMD和THTA先插后贴,工艺较IIA都在A面双面PCB同上复杂,贴装密度高双B面THC在A面,A和BTHT和SMC/SMDIIB混两面都有SMD双面PCB同上贴装在PCB同一装侧IICSMD和THT双面PCB同上复杂,很少用在双面表面贴装先贴后插,工艺,单先贴法单面PCB及通孔插简单组装密度低III面装元器件混先插后贴,工艺装后贴法单面PCB同上复杂组装密度高(1).全表面组装(IA和IB型):IA型,所有SMT组件均放在PCB板的一面,组装密度高,IB型,SMT组件在PCB板的二面,组装密度更高.可采用细间距器件和再流焊工艺进行组装.(2).双面混合组装(IIA型.IIB型.IIC型):采用双面印制板,双波峰焊和再流焊.一般采用先贴后插法.(3).单面混合组装(III型):III型有先贴和后贴之分,均采用单面板和双波峰焊工艺.铅焊膏特性(配方比较)序组成成分温度塑性应用特性号(配方)(溶焊范围)(偏差)180AU/20SN280E0黄金表面最佳沾焊258BI/42SN138E0溶点低,强度极高325BI/37.5IN/37.5SN70-110L40溶点更低,强度高可作各种金属表面最焊接437.5PB/25IN/37.5SN134S-181L47沾锡性好43PB/14BI/43SN163E0缺点:不适合作黄金的焊接2AG/36PB/62SN179E0含有少量银,适合作银表面焊52AG/88PB/10SN268S-290L22缺点:不适合作金表面焊接1.5AG/97PB/1SN309E03.5AG/96.5SN221E0无铅.应用广64AG/96SN221E0适合各种金属表面焊接5AG/95SN221S-240L1975PB/25IN250S-264L14应用于晶体.芯片内部对装750PB/50IN180S-209L29柔软延展性好25PB/75IN156S-165L937PB/63SN183E040PB/60SN183S-188L5850PB/50SN183S-216L33成本低.固着力高90PB/10SN268S-302L34缺点:不适合作金,银表面焊接45PB/55SN183S-211L2895PB/5SN308S-312L4注:(1)E表示Eutectic,S表示Solids,L表示Liquids.(2)Au金Ag银Bi铋In锌Pb铅Sn锡SMT工艺流程说明进料/检查锡膏,PCB.钢板等及其它辅助材料的准备与检查印刷锡膏PCB锡膏印刷检查点锡膏印刷质量检查贴片元器件贴装检查点贴片质量检查回流焊元器件焊接NO检查焊点品质检查修补YES单面贴插混装单面贴装点胶胶水点滴检查点点胶质量检查贴片组件贴装检查点贴片质量检查固化组件固化插?件NO单面贴装是否插件选择插件插装组件YES单面贴插混装元器件焊接波峰焊修补NO检验焊接质量检查清洗PCB,元器件焊点清洗检查点清洗效果检查在线测试焊点电性测试修补OK!电性测试结果选择包装产品包装入库送入仓库存放DATA[non] 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