PCB设计规范-模板合集

硬件部PCB设计规范-SMD元器件封装库尺寸要求篇制作日期.03.21执行日期.03.28PagePAGE99/103目的用于研发中心硬件部PCB设计所使用的元器件封装库中的焊盘图形及SMD焊盘图形尺寸要求。范围本规范适用于公司硬件部所有PCB制作。职责及权限文件编写标准文件制定单位为研发中心硬件部，修改需要通知相关部门，其他任何单位和个人不得随意更改。术语SMD:SurfaceMountDevices/表面贴装元件。RA：ResistorArrays/排阻。MELF：MetalelectrodeLeadlessfacecomponents/金属电极无引线端面元件.SOT：Smalloutlinetransistor/小外形晶体管。SOD：Smalloutlinediode/小外形二极管。SOIC：SmalloutlineIntegratedCircuits/小外形集成电路.SSOIC:ShrinkSmallOutlineIntegratedCircuits/缩小外形集成电路.SOP:SmallOutlinePackageIntegratedCircuits/小外形封装集成电路.SSOP:ShrinkSmallOutlinePackage/缩小外形封装集成电路.TSOP:ThinSmallOutlinePackage/薄小外形封装.TSSOP:ThinShrinkSmallOutlinePackage/收缩薄小外形封装.CFP:CeramicFlatPacks/陶瓷扁平封装.SOJ:SmalloutlineIntegratedCircuitswithJLeads/“J”形引脚小外形集成电路.PQFP：PlasticQuadFlatPack/塑料方形扁平封装。SQFP：ShrinkQuadFlatPack/缩小方形扁平封装。CQFP：CeramicQuadFlatPack/陶瓷方形扁平封装。PLCC：Plasticleadedchipcarriers/塑料封装有引线芯片载体。LCC：Leadlessceramicchipcarriers/无引线陶瓷芯片载体。DIP：Dual-In-Linecomponents/双列引脚元件。PBGA：PlasticBallGridArray/塑封球栅阵列器件。使用说明1)、表格中的“min”表示最小尺寸；“max”最大尺寸；“ref”表示参考尺寸；“basic”表示基本尺寸；封装名称中的“mm”表示公制型号；[in]表示英制型号。2)、区域网格表示图形占用的网格数，表中给出为网格的数量，换算成mm时，应乘以0.5mm。焊盘图形SMD：表面贴装方焊盘图形尺寸表面贴装方焊盘图形尺寸因应符合图1的要求。见图1：焊盘名称X（mm）Y(mm)焊盘名称X（mm）Y(mm)焊盘名称X（mm）Y(mm)SMD0r17X1r600.171.60SMD0r80X3r400.803.40SMD2r20X2r002.202.00SMD0r25X1r600.251.60SMD1r00X0r901.000.90SMD2r20X2r602.202.60SMD0r30X1r600.281.80SMD1r00X1r001.001.00SMD2r40X2r002.402.00SMD0r35X1r800.351.80SMD1r00X1r401.001.40SMD2r40X2r402.402.40SMD0r35X2r600.352.60SMD1r00X1r601.001.60SMD2r40X2r602.402.60SMD0r40X1r600.401.60SMD1r00X3r401.003.40SMD2r60X1r452.601.45SMD0r40X1r800.401.80SMD1r20X1r401.201.40SMD2r60X1r502.601.50SMD0r40X2r200.402.20SMD1r20X2r001.202.00SMD2r70X1r602.701.60SMD0r50X1r800.501.80SMD1r20X2r201.202.20SMD2r70X1r802.701.80SMD0r50X2r000.502.00SMD1r30X1r001.301.00SMD2r80X1r402.801.40SMD0r50X2r200.502.20SMD1r40X2r201.402.20SMD3r20X1r803.201.80SMD0r60X2r000.602.00SMD1r40X2r401.402.40SMD3r40X1r903.401.90SMD0r60X2r200.602.20SMD1r40X3r401.403.40SMD3r60X1r803.601.80SMD0r65X2r200.652.20SMD1r50X1r301.501.30SMD3r60X2r203.602.20SMD0r65X2r400.652.40SMD1r60X1r201.601.20SMD4r00X1r804.001.80SMD0r65X2r600.652.60SMD1r60X1r301.601.30SMD5r40X6r205.406.20SMD0r70X0r600.700.60SMD1r80X1r401.801.40SMD4r00X1r804.001.80SMD0r80X1r400.801.40SMD1r80X1r601.801.60SMD6r80X1r906.801.90SMD0r80X1r600.801.60SMD2r00X1r602.001.60SMD6r80X9r606.809.60SMD0r80X2r600.802.60SMD2r00X1r802.001.80SMD13r60X13r4013.6013.40图1表面贴装方焊盘图形尺寸SMDC：表面贴装圆焊盘图形尺寸表面贴装圆焊盘图形尺寸应符合图2要求。见图2：焊盘名称C（mm）焊盘名称C（mm）SMDC0r350.35SMDC0r900.90SMDC0r400.40SMDC1r001.00SMDC0r500.50SMDC2r602.60SMDC0r600.60图2表面贴装圆焊盘图形尺寸SMDF表面贴装手指焊盘图形尺寸表面贴装手指焊盘图形尺寸应符合图3要求。见图3：焊盘名称X（mm）Y(mm)焊盘名称X（mm）Y(mm)SMDF1r00X2r501.002.50SMDF1r80X2r501.802.50SMDF1r00X2r801.002.80SMDF1r80X2r301.802.30图3表面贴装手指焊盘图形尺寸THC通孔圆焊盘图形尺寸通孔圆焊盘图形尺寸应符合图4要求。见图4：焊盘名称C（mm/mil）D(mm/mil)焊盘名称C（mm/mil）D(mm/mil)THC0r50D0r200.45/180.20/8THC1r30D0r801.30/510.80/32THC0r60D0r300.60/240.30/12THC1r40D0r901.40/550.90/36THC0r70D0r400.70/280.40/16THC1r50D1r001.50/601.00/40THC0r90D0r500.80/360.50/20THC2r60D1r302.60/1021.30/51THC1r10D0r601.10/440.60/24THC3r20D1r603.20/1261.60/63THC1r20D0r701.20/480.70/28THC4r00D2r004.00/1582.00/79THC1r20D0r701.23/490.73/29THC0r00D3r000/03.00/118图4通孔圆焊盘图形尺寸THS通孔方焊盘图形尺寸通孔方焊盘图形尺寸应符合图5要求。见图5：焊盘名称S（mm/mil）D(mm/mil)焊盘名称S（mm/mil）D(mm/mil)THS1R10D0R601.10/440.60/24THS1r50D1r001.50/601.00/40THS1r20D0r701.20/480.70/28THS2r60D1r302.60/1021.30/51THS1r30D0r801.30/510.80/32THS3r20D1r603.20/1261.60/63THS1r40D0r901.40/550.90/36THS4r00D2r004.00/1582.00/79图5通孔方焊盘图形尺寸THR通孔矩形焊盘图形尺寸通孔矩形焊盘图形尺寸应符合图6要求。见图6：焊盘名称X（mm/mil）Y（mm/mil）D(mm/mil)THR1r20X1r40D0r701.20/481.40/550.70/28图6通孔矩形焊盘图形尺寸SMD元器件及焊盘图形尺寸SMD分立元件7.1.1SMD电阻a)、SMD电阻元件尺寸应符合图7的规定。见图7：封装名称L(mm)S(mm)W(mm)T(mm)H(mm)minmaxminmaxminmaxminmaxmax0402R1.001.100.400.700.480.600.100.300.400603R1.501.700.701.110.700.950.150.400.600805R1.852.150.551.321.101.400.150.650.651206R3.053.351.552.321.451.750.250.750.711210R3.053.351.552.322.342.640.250.750.712010R4.855.153.153.922.352.650.350.850.712512R6.156.454.455.223.053.350.350.850.71图7SMD电阻元件尺寸b)、SMD电阻的焊盘尺寸应符合图8的规定。见图8：封装名称Z(mm)G(mm)X(mm)Y(mm)C(mm)区域网格（网格单元号码）refref0402R2.200.400.700.901.302×40603R2.800.601.001.101.704×60603R-W3.200.800.701.202.004×60805R3.200.601.501.301.904×80805R-W3.600.801.001.402.204×81206R4.401.201.801.602.804×101206R-W4.801.201.201.803.004×101210R4.401.202.701.602.806×102010R6.202.602.701.804.406×142512R7.403.803.201.805.608×16注：大于0603R的元件在波峰焊时，Y-尺寸向外侧增加0.2mm，X-尺寸减小30%。封装名称加后缀“-W”。图8SMD电阻的焊盘尺寸7.1.2SMD电容a)、SMD电容元件尺寸应符合图9的规定。见图9：封装名称L(mm)S(mm)W(mm)T(mm)H(mm)Minmaxminmaxminmaxminmaxmax0402C0.901.100.300.650.400.600.100.300.600504C1.021.320.260.720.771.270.130.381.020603C1.451.750.450.970.650.950.200.500.850805C1.802.200.301.111.051.450.250.751.101206C3.003.401.502.311.401.800.250.751.351210C3.003.401.502.312.302.700.250.751.351812C4.204.802.303.463.003.400.250.951.351825C4.204.802.303.466.006.800.250.951.10图9SMD电容元件尺寸b)、SMD电容焊盘尺寸应符合图10的规定。见图10：封装名称Z(mm)G(mm)X(mm)Y(mm)C(mm)区域网格（网格单元号码）refref0402C1.600.400.700.601.002×40504C2.000.401.300.801.204×60603C2.800.601.001.101.704×60603C-W3.200.800.701.202.004×60805C3.200.601.501.301.904×80805C-W3.600.801.001.402.204×81206C4.401.201.801.602.804×101206C-W4.801.201.201.803.004×101210C4.401.202.701.602.806×101812C5.802.003.401.903.908×121825C5.802.006.801.903.9014×12注：大于0603C的元件在波峰焊时，Y-尺寸向外侧增加0.2mm，X-尺寸减小30%。封装名称加后缀“-W”。图10SMD电容焊盘尺寸7.1.3SMD电感a)、SMD电感元件尺寸应符合图11的规定。见图11：封装名称L(mm)S(mm)W1(mm)W2(mm)T(mm)H1(mm)H2(mm)minMaxminmaxminmaxminmaxminmaxmaxmax2012L-C1.702.301.101.760.601.20——0.100.301.20—3216L-C2.903.501.902.631.301.90——0.200.501.90—4516L-C4.204.802.603.530.601.20——0.300.801.90--2825L-P2.202.800.901.621.952.112.102.540.370.652.290.073225L-P2.903.500.901.831.401.800.501.002.000.504532L-P4.204.802.203.133.003.400.501.002.800.505038L-P4.354.952.813.512.462.623.413.810.510.773.800.763225-3230L-M3.003.401.602.181.802.002.302.700.400.702.400.514035L-M3.814.320.811.601.201.502.923.181.201.502.671.274532L-M4.204.802.303.152.002.203.003.400.650.953.400.505650L-M5.305.503.304.323.804.204.705.300.501.005.801.008530L-M8.258.765.256.041.201.502.923.181.201.502.671.27注:C为Chip的简写,P为Prec.w/w(Precisionwire–wound)的简写,M为Molded的简写。图11SMD电感元件尺寸b)、SMD电感焊盘尺寸应符合图12的规定。见图12：封装名称Z(mm)G(mm)X(mm)C(mm)Y(mm)区域网格（网格单元号码）refref2012L-C3.001.001.002.001.004×83216L-C4.201.801.603.001.206×104516L-C5.802.601.004.201.604×122825L-P3.801.002.402.401.406×103225L-P4.601.002.002.801.806×104532L-P5.802.203.604.001.808×145038L-P5.803.002.804.401.408×143225-3230L-M4.401.202.202.801.606×104035L-M5.401.001.403.202.208×124532L-M5.801.802.403.802.008×145650L-M6.803.204.005.001.8012×168530L-M9.805.001.407.402.408×22注：1、后缀“-C”的元件在波峰焊时，Y-尺寸向外侧增加0.2mm，X-尺寸减小30%。封装名称加后缀“-W”。2、后缀“-P”和“-M”的元件在波峰焊时，Y-尺寸向外侧增加0.2mm，X-尺寸不变，封装名称加后缀“-W”。图12SMD电感焊盘尺寸7.1.4SMD钽电容a)、SMD钽电容元件尺寸应符合图13的规定。见图13：封装名称L(mm)S(mm)W1(mm)W2(mm)T(mm)H1(mm)H2(mm)minmaxminmaxminmaxminmaxminmaxmaxmax3216T3.003.400.801.741.171.211.401.800.501.100.701.803528T3.303.701.102.042.192.212.603.000.501.100.702.106032T5.706.302.503.542.192.212.903.501.001.601.002.807343T7.007.603.804.842.392.914.004.601.001.601.003.10图13SMD钽电容元件尺寸b)、SMD钽电容的焊盘尺寸应符合图14的规定。见图14：封装名称Z(mm)G(mm)X(mm)Y(mm)C(mm)区域网格（网格单元号码）refref3216T4.800.801.202.002.806×123528T5.001.002.202.003.008×126032T7.602.402.202.605.008×187343T9.003.803.002.606.4010×20注：元件在波峰焊时，Y尺寸向外侧增加0.2mm，X尺寸不变，封装名称加后缀“-W”。图14SMD钽电容焊盘尺寸7.1.5MELF（金属电极无引线端面元件）a)、MELF元件尺寸应符合图15的规定。见图15：mm[in]封装名称L(mm)S(mm)W(mm)T(mm)元件类型MinMaxminmaxminmaxminmaxSOD80[MLL34]3.303.702.202.651.601.700.410.55二极管SOD87[MLL41]4.805.203.804.252.442.540.360.50二极管2012M[0805M]1.902.101.161.441.351.450.230.370.10mW电阻3216M[1206M]3.003.401.862.311.751.850.430.570.25mW电阻3516M[1406M]3.303.702.162.611.551.650.430.570.12W电阻5923M[2309M]5.706.104.364.812.402.500.530.670.25W电阻图15MELF元件尺寸b)、MELF的焊盘尺寸应符合图16的规定。见图16：mm[in]封装名称Z(mm)G(mm)X(mm)Y(mm)C(mm)AB区域网格（网格单元号码）refrefSOD80[MLL34]4.802.001.801.403.400.500.506×12SOD87[MLL41]6.303.402.601.454.850.500.506×142012M[0805M]3.200.601.601.301.900.500.354×83216M[1206M]4.401.202.001.602.800.500.556×103516M[1406M]4.802.001.801.403.400.500.556×125923M[2309M]7.204.202.601.505.700.500.656×18注：元件在波峰焊时，Y尺寸向外侧增加0.2mm，X尺寸不变，封装名称加后缀“-W”。图16MELF焊盘尺寸7.1.6SMD排阻a)、SMD排阻元件尺寸应符合图17的规定。见图17：封装名称L(mm)W(mm)T(mm)A(mm)B(mm)P(mm)C(mm)1206RA3.2±0.101.6±0.150.5±0.100.5±0.150.3±0.150.8±0.10.3±0.15图17SMD排阻元件尺寸b)、SMD排阻焊盘尺寸应符合图18的规定。见图18：封装名称区域网格（网格单元号码）1206RA8x6图18SMD排阻焊盘尺寸7.1.7SOT23a)、SOT23的尺寸应符合图19的规定。见图19：封装名称L(mm)S(mm)W(mm)T(mm)H(mm)P(mm)MinmaxminmaxminmaxminmaxmaxnomSOT232.302.601.101.470.360.460.450.601.100.95图19SOT23的元件尺寸b)、SOT23的焊盘尺寸应符合图20的规定。见图20：封装名称Z(mm)G(mm)X(mm)Y(mm)C(mm)E(mm)区域网格（网格单元号码）refRefrefSOT23(回流焊)3.600.801.001.402.200.958×8注:如果采用波峰焊工艺,“Y”尺寸外延0.2mm.图20SOT23焊盘尺寸7.1.8SOT89a)、SOT89的尺寸应符合图21的规定。见图21：封装名称L(mm)T(mm)W1(mm)W2(mm)W3(mm)K(mm)H(mm)P(mm)minmaxminmaxminmaxminmaxminmaxminmaxmaxbasicSOT893.944.250.891.200.360.480.440.561.621.832.602.851.601.50图21SOT89的元件尺寸b)、SOT89的焊盘尺寸应符合图22的规定。见图22：封装名称Z(mm)Y1(mm)X1(mm)X2(mm)X3(mm)Y2(mm)Y3(mm)E(mm)区域网格（网格单元号码）MinmaxminmaxrefRefbasicSOT895.401.400.800.801.001.802.002.404.901.5012×10图22SOT89焊盘尺寸7.1.9SOD123a)、SOD123的尺寸应符合图23的规定。见图23：封装名称L(mm)S(mm)W1(mm)W2(mm)T(mm)H(mm)minMaxMinmaxminmaxminmaxMinmaxmaxSOD1233.553.852.352.930.450.651.401.700.250.601.35SMB5.215.592.173.311.962.213.303.940.761.522.41图23SOD123的元件尺寸b)、SOD123的焊盘尺寸应符合图24的规定。见图24：封装名称Z(mm)G(mm)X(mm)Y(mm)C(mm)区域网格（网格单元号码）refrefSOD1235.001.800.801.603.404×12SMB6.802.002.402.404.408×16图24SOD123焊盘尺寸7.1.10SOT143a)、SOT143的尺寸应符合图25的规定。见图25：封装名称L(mm)S(mm)W1(mm)W2(mm)T(mm)P1(mm)P2(mm)H(mm)MinMaxminmaxMinmaxminmaxMinmaxbasicbasicMaxSOT1432.102.641.001.690.370.460.760.890.250.551.921.721.20图25SOT143的元件尺寸b)、SOT143的焊盘尺寸应符合图26的规定。见图26：封装名称Z(mm)G(mm)X1(mm)X2(mm)C(mm)E1(mm)E2(mm)Y(mm)区域网格（网格单元号码）MinmaxrefbasicBasicrefSOT1433.600.801.001.001.202.201.901.701.408×8图26SOT143焊盘尺寸7.1.11SOT223a)、SOT223的尺寸应符合图27的规定。见图27：封装名称L(mm)S(mm)W1(mm)W2(mm)T(mm)H(mm)P1(mm)P2(mm)MinMaxminmaxMinmaxminmaxMinmaxmaxbasicBasicSOT2236.707.304.104.920.600.882.903.180.901.301.802.304.60图27SOT223的元件尺寸b)、SOT223的焊盘尺寸应符合图28的规定。见图28：封装名称Z(mm)G(mm)X1(mm)X2(mm)Y(mm)C(mm)E1(mm)E2(mm)区域网格（网格单元号码）MinmaxrefrefbasicbasicSOT2238.404.001.203.403.602.206.202.304.6018×14图28SOT223焊盘尺寸7.1.12TO252/TO268a)、TO252的尺寸应符合图29的规定。见图29：封装名称L(mm)W1(mm)W2(mm)T1(mm)T2(mm)P1(mm)P2(mm)H(mm)MinMaxminMaxMinmaxminmaxMinmaxbasicbasicmaxTS-003a9.3210.410.640.914.355.350.510.804.005.502.284.572.38TS-005b14.6015.880.510.916.226.862.292.798.009.002.545.084.83TO26818.7019.101.151.4513.3013.602.402.7012.4012.705.4510.905.10注a:以前为TO252。注b：以前为TO263。图29TO252的元件尺寸b)、TO252的焊盘尺寸应符合图30的规定。见图30：封装名称Z(mm)Y1(mm)Y2(mm)X1(mm)X2(mm)C(mm)区域网格（网格单元号码）refTS-003*11.201.606.201.005.407.3024×16TS-005**16.603.409.601.006.8010.1036×24TO26819.803.4013.401.4013.6011.4042×34图30TO252焊盘尺寸7.1.13SMD220元件a)、元件尺寸应符合图31的规定。见图31：封装名称图31SMD-220元件尺寸b)、焊盘尺寸应符合图32的规定。见图32：封装名称区域网格（网格单元号码）SMD-22024x36图32SMD-220焊盘尺寸7.1.14SMA元件a)、SMA元件尺寸应符合图33的规定。见图33：封装名称图33SMA元件尺寸b)、焊盘尺寸应符合图34的规定。见图34：0.0952.40.0952.4封装名称区域网格（网格单元号码）SMA6x14图34SMA焊盘尺寸7.1.15SOT-323元件a)、SOT-323元件尺寸应符合图35的规定。见图35：封装名称图35SOT-323元件尺寸b)、SOT-323焊盘尺寸应符合图36的规定。见图36：0.650.651.80.40.91.80.40.9封装名称区域网格（网格单元号码）SOT-3234x6图37SOT-323焊盘尺寸7.1.16SOT-363元件a)、SOT-363元件尺寸应符合图38的规定。见图38：封装名称图38SOT-363元件尺寸b)、SOT-363焊盘尺寸应符合图39的规定。见图39：0.650.650.40.91.80.40.91.8封装名称区域网格（网格单元号码）SOT-3634x6图39SOT-363焊盘尺寸两侧翼形引脚元件7.2.1SOIC[SmallOutlineIntegratedCircuits:小外形集成电路]a)、SOIC的尺寸应符合图40的规定。见图40：封装名称L(mm)S(mm)W(mm)T(mm)A(mm)B(mm)H(mm)P(mm)minmaxminMaxminmaxminmaxminmaxminmaxminmaxbasicSO8-1505.806.203.264.550.330.510.401.273.804.004.805.001.351.751.27SO8-30010.0010.657.468.850.330.510.401.277.407.605.055.452.352.651.27SO14-1505.806.203.264.550.330.510.401.273.804.008.558.751.351.751.27SO14-30010.0010.657.468.850.330.510.401.277.407.608.809.202.352.651.27SO16-1505.806.203.264.550.330.510.401.273.804.009.8010.001.351.751.27SO16-30010.0010.657.468.850.330.510.401.277.407.6010.1010.502.352.651.27SO20-30010.0010.657.468.850.330.510.401.277.407.6012.6013.002.352.651.27SO24-30010.2910.648.219.010.360.510.531.047.407.6015.5415.852.342.641.27SO24-35011.8112.179.7310.540.360.510.531.048.769.0215.5415.852.342.641.27SO28-30010.2910.648.219.010.360.510.531.047.407.6018.0818.392.342.641.27SO28-35011.8112.179.7310.540.360.510.531.048.769.0218.0818.392.342.641.27SO32-30010.2910.648.219.010.360.510.531.047.407.6020.6220.932.342.641.27SO32-35011.8112.179.7310.540.360.510.531.048.769.0220.6220.932.342.641.27SO36-30010.2910.648.219.010.360.510.531.047.407.6023.1623.472.342.641.27SO36-35011.8112.179.7310.540.360.510.531.048.769.0223.1623.472.342.641.27图40SOIC的元件尺寸b)、SOIC的焊盘尺寸应符合图41的规定。见图41：封装名称Z(mm)G(mm)X(mm)Y(mm)C(mm)D(mm)E(mm)区域网格（网格单元号码）refrefrefbasicSO8-1507.403.000.602.205.203.811.2716×12SO8-30011.407.000.602.209.203.811.2724×12SO14-1507.403.000.602.205.207.621.2716×20SO14-30011.407.000.602.209.207.621.2724×20SO16-1507.403.000.602.205.208.891.2716×22SO16-30011.407.000.602.209.208.891.2724×22SO20-30011.407.000.602.209.2011.431.2724×28SO24-30011.407.000.602.209.2013.971.2724×32SO24-35013.008.600.602.2010.8013.971.2728×32SO28-30011.407.000.602.209.2016.511.2724×38SO28-35013.008.600.602.2010.8016.511.2728×38SO32-30011.407.000.602.209.2019.051.2724×44SO32-35013.008.600.602.2010.8019.051.2728×44SO36-30011.407.000.602.209.2021.591.2724×48SO36-35013.008.600.602.2010.8021.591.2728×48图41SOIC焊盘尺寸7.2.2SSOIC[SmallOutlineIntegratedCircuits:小外形集成电路]a)、SSOIC的尺寸应符合图42的规定。见图42：封装名称L(mm)S(mm)W(mm)A(mm)B(mm)H(mm)T(mm)P(mm)minmaxminmaxMinMaxminmaxminmaxminmaxminmaxbasicSSO48-25-29510.0310.677.998.950.200.307.407.6015.7516.002.412.200.511.020.635SSO56-25-29510.0310.677.998.950.200.307.407.6018.2918.542.412.200.511.020.635SO64-31-47214.0014.5012.4013.050.300.4511.9012.1026.1726.431.922.000.510.800.800图42SSOIC的元件尺寸b)、SSOIC的焊盘尺寸应符合图43的规定。见图43：封装名称Z(mm)G(mm)X(mm)Y(mm)C(mm)D(mm)E(mm)区域网格（网格单元号码）refrefrefrefSSO48-25-29511.607.200.402.209.4014.610.63524×34SSO56-25-29511.607.200.402.209.4017.150.63524×38SO64-31-47215.4011.400.502.0013.4024.800.8032×54图43SSOIC焊盘尺寸7.2.3SOP[SmallOutlinePackageIntegratedCircuits:小外形封装集成电路]a)、SOP的尺寸应符合图44的规定。见图44：封装名称L(mm)S(mm)W(mm)T(mm)A(mm)B(mm)H(mm)P(mm)minmaxminmaxMinmaxminmaxminMaxMaxmaxbasicSOP65.726.993.725.110.350.510.601.003.924.726.351.51.27SOP85.726.993.725.110.350.510.601.003.924.726.351.51.27SOP105.726.993.725.110.350.510.601.003.924.728.891.51.27SOP125.726.993.725.110.350.510.601.003.924.728.891.51.27SOP145.726.993.725.110.350.510.601.003.924.7211.431.51.27SOP167.628.895.627.010.350.510.601.005.026.2211.432.01.27SOP187.628.895.627.010.350.510.601.005.026.2213.972.01.27SOP207.628.895.627.010.350.510.601.005.026.2213.972.01.27SOP229.5310.807.538.920.350.510.601.006.338.1316.512.51.27SOP249.5310.807.538.920.350.510.601.006.338.1316.512.51.27SOP2811.4312.709.4310.820.350.510.601.008.2310.0319.053.01.27SOP3011.4312.709.4310.820.350.510.601.008.2310.0321.593.01.27SOP3213.3414.6111.3412.730.350.510.601.0010.1411.9421.593.51.27SOP3613.3414.6111.3412.730.360.510.601.0010.1411.9424.133.51.27SOP4015.2416.5113.2414.630.350.510.601.0012.0413.8427.944.01.27SOP4215.2416.5113.2414.630.350.510.601.0012.0413.8427.944.01.27图44SOP的元件尺寸b)、SOP的焊盘尺寸应符合图45的规定。见图45：封装名称Z(mm)G(mm)X(mm)Y(mm)C(mm)D(mm)E(mm)区域网格（网格单元号码）refrefrefbasicSOP67.403.000.602.205.202.541.2716×14SOP87.403.000.602.205.203.811.2716×14SOP107.403.000.602.205.205.081.2716×18SOP127.403.000.602.205.206.351.2716×18SOP147.403.000.602.205.207.621.2716×24SOP169.405.000.602.207.208.891.2720×24SOP189.405.000.602.207.2010.161.2720×28SOP209.405.000.602.207.2011.431.2720×28SOP2211.206.800.602.209.0012.701.2724×34SOP2411.206.800.602.209.0013.971.2724×34SOP2813.208.800.602.2011.0016.511.2728×40SOP3013.208.800.602.2011.0017.781.2728×44SOP3215.0010.600.602.2012.8019.051.2732×44SOP3615.0010.600.602.2012.8021.591.2732×50SOP4017.0012.600.602.2014.8024.131.2736×56SOP4217.0012.600.602.2014.8025.401.2736×56图45SOP焊盘尺寸7.2.4TSOP[ThinSmallOutlinePackage:薄小外形封装]a)、TSOP的尺寸应符合图46的规定。见图46：封装名称引脚数量L(mm)S(mm)W(mm)T(mm)A(mm)B(mm)H(mm)P(mm)minmaxMinMaxMinmaxminmaxminMaxminMaxmaxbasicTSOP6×14-161613.8014.2012.4012.980.200.400.400.705.806.2012.2012.601.270.65TSOP6×16-242415.8016.2014.4014.980.100.300.400.705.806.2014.2014.601.270.50TSOP6×18-282817.8018.2016.4016.780.050.220.400.705.806.2016.2016.601.270.40TSOP6×20-363619.8020.2018.4018.980.050.150.400.705.806.2018.2018.601.270.30TSOP8×14-242413.8014.2012.4012.980.200.400.400.707.808.2012.2012.601.270.65TSOP8×16-323215.8016.2014.4014.980.100.300.400.707.808.2014.2014.601.270.50TSOP8×18-404017.8018.2016.4016.980.050.220.400.707.808.2016.2016.601.270.40TSOP8×20-525219.8020.2018.4018.980.050.150.400.707.808.2018.2018.601.270.30TSOP10×14-282813.8014.2012.4012.980.200.400.400.709.8010.2012.2012.601.270.65TSOP10×16-404015.8016.2014.4014.980.100.300.400.709.8010.2014.2014.601.270.50TSOP10×18-484817.8018.2016.4016.980.050.220.400.709.8010.2016.2016.601.270.40TSOP10×20-646419.8020.2018.4018.980.050.150.400.709.8010.2018.2018.601.270.30TSOP12×14-363613.8014.2012.4012.980.200.400.400.7011.8012.2012.2012.601.270.65TSOP12×16-484815.8016.2014.4014.980.100.300.400.7011.8012.2014.2014.601.270.50TSOP12×18-606017.8018.2016.4016.980.050.220.400.7011.8012.2016.2016.601.270.40TSOP12×20-767619.8020.2018.4018.980.050.150.400.7011.8012.2018.2018.601.270.30图46TSOP的元件尺寸b)、TSOP的焊盘尺寸应符合图47的规定。见图47：封装名称Z(mm)G(mm)X(mm)Y(mm)C(mm)D(mm)E(mm)引脚数量区域网格（网格单元号码）refrefrefbasicTSOP6×14-1614.8011.600.401.6013.204.550.651614×32TSOP6×16-2416.8013.600.281.6015.205.500.502414×36TSOP6×18-2818.8015.600.251.6017.205.200.402814×40TSOP6×20-3620.8017.600.171.6019.205.100.303614×44TSOP8×14-2414.8011.600.401.6013.207.150.652418×32TSOP8×16-3216.8013.600.281.6015.207.500.503218×36TSOP8×18-4018.8015.600.251.6017.207.600.404018×40TSOP8×20-5220.8017.600.171.6019.207.500.305218×44TSOP10×14-2814.8011.600.401.6013.208.450.652822×32TSOP10×16-4016.8013.600.281.6015.209.500.504022×36TSOP10×18-4818.8015.600.251.6017.209.200.404822×40TSOP10×20-6420.8017.600.171.6019.209.300.306422×44TSOP12×14-3614.8011.600.401.6013.2011.050.653626×32TSOP12×16-4816.8013.600.281.6015.2011.500.504826×36TSOP12×18-6018.8015.600.251.6017.2011.600.406026×40TSOP12×20-7620.8017.600.171.6019.2011.100.307626×44图47TSOP焊盘尺寸7.2.5CFP[CeramicFlatPacks:陶瓷扁平封装]a)、CFP的尺寸应符合图48的规定。见图48：封装名称引脚数量L(mm)S(mm)W(mm)T(mm)A(mm)B(mm)H(mmE(mm)minmaxMinMaxMinmaxminmaxminMaxMaxmaxbscMO003-10109.009.606.467.260.250.350.901.272.545.087.362.501.27MO003-14149.009.606.467.260.250.350.901.272.545.089.902.501.27MO004-101011.0011.608.469.260.380.480.901.275.087.627.362.501.27MO004-141411.0011.608.469.260.380.480.901.275.087.629.902.501.27MO004-161611.0011.608.469.260.380.480.901.275.087.6211.172.501.27MO018-202011.0011.608.469.260.250.350.901.277.6210.1613.712.501.27MO019-242415.0015.6012.4613.260.380.480.901.277.6210.1616.252.501.27MO019-282815.0015.6012.4613.260.460.560.901.277.6210.1618.792.501.27MO020-363617.0017.6014.4615.260.380.480.901.2710.1612.7023.873.001.27MO020-404017.0017.6014.4615.260.330.430.901.2710.1612.7026.413.001.27MO021-161620.0020.6017.4618.260.380.480.901.2712.7015.2411.172.501.27MO021-242420.0020.6017.4618.260.380.480.901.2712.7015.2416.252.501.27MO021-363620.0020.6017.4618.260.380.480.901.2712.7015.2423.873.001.27MO022-202022.0022.6019.4620.260.380.480.901.2715.2417.7813.712.501.27MO022-424222.0022.6019.4620.260.460.560.901.2715.2417.7827.683.001.27MO023-363627.0027.6024.4625.260.380.480.901.2720.3222.8623.873.001.27MO023-505027.0027.6024.4625.260.380.480.901.2720.3222.8632.763.001.27图48CFP的元件尺寸b)、CFP的焊盘尺寸应符合图B49的规定。见图49：封装名称Z(mm)G(mm)X(mm)Y(mm)C(mm)D(mm)E(mm)引脚数量区域网格（网格单元号码）RefRefRefbasicMO003-1010.206.000.652.208.05.081.271022×16MO003-1410.206.000.652.208.07.621.271422×22MO004-1012.208.000.652.2010.05.081.271026×16MO004-1412.208.000.652.2010.07.621.271426×22MO004-1612.208.000.652.2010.08.891.271626×24MO018-2012.208.000.652.2010.011.431.272026×28MO019-2416.2012.000.652.2014.013.971.272434×34MO019-2816.2012.000.652.2014.016.511.272834×38MO020-3618.2014.000.652.2016.021.591.273638×48MO020-4018.2014.000.652.2016.024.131.274038×54MO021-1621.2017.000.652.2019.08.891.271644×24MO021-2421.2017.000.652.2019.013.971.272444×34MO021-3621.2017.000.652.2019.021.591.273644×48MO022-2023.2019.000.652.2021.011.431.272048×28MO022-4223.2019.000.652.2021.025.401.274248×56MO023-3628.2024.000.652.2026.021.591.273658×48MO023-5028.2024.000.652.2026.030.481.275058×66图49CFP焊盘尺寸两侧“J”形引脚元件[SOJ]a)、SOJ的尺寸应符合图50a和50b的规定。见图50a和50b：封装名称L(mm)S(mm)W(mm)T(mm)B(mm)H(mm)P(mm)MinmaxminMaxMinmaxminmaxminMaxmaxbasicSOJ14-3008.388.764.385.060.380.511.602.009.659.963.751.27SOJ16-3008.388.764.385.060.380.511.602.0010.9211.233.751.27SOJ18-3008.388.764.385.060.380.511.602.0012.1912.503.751.27SOJ20-3008.388.764.385.060.380.511.602.0013.4613.773.751.27SOJ22-3008.388.764.385.060.380.511.602.0014.7315.043.751.27SOJ24-3008.388.764.385.060.380.511.602.0016.0016.313.751.27SOJ26-3008.388.764.385.060.380.511.602.0017.2717.583.751.27SOJ28-3008.388.764.385.060.380.511.602.0018.5418.853.751.27SOJ14-3509.6510.035.656.330.380.511.602.009.659.963.751.27SOJ16-3509.6510.035.656.330.380.511.602.0010.9211.233.751.27SOJ18-3509.6510.035.656.330.380.511.602.0012.1912.503.751.27SOJ20-3509.6510.035.656.330.380.511.602.0013.4613.773.751.27SOJ22-3509.6510.035.656.330.380.511.602.0014.7315.043.751.27SOJ24-3509.6510.035.656.330.380.511.602.0016.0016.313.751.27SOJ26-3509.6510.035.656.330.380.511.602.0017.2717.583.751.27SOJ28-3509.6510.035.656.330.380.511.602.0018.5418.853.751.27图50aSOJ的元件尺寸封装名称L(mm)S(mm)W(mm)T(mm)B(mm)H(mm)P(mm)MinmaxminMaxMinmaxminmaxminMaxmaxbasicSOJ14-40010.9211.306.927.600.380.511.602.009.659.963.751.27SOJ16-40010.9211.306.927.600.380.511.602.0010.9211.233.751.27SOJ18-40010.9211.306.927.600.380.511.602.0012.1912.503.751.27SOJ20-40010.9211.306.927.600.380.511.602.0013.4613.773.751.27SOJ22-40010.9211.306.927.600.380.511.602.0014.7315.043.751.27SOJ24-40010.9211.306.927.600.380.511.602.0016.0016.313.751.27SOJ26-40010.9211.306.927.600.380.511.602.0017.2717.583.751.27SOJ28-40010.9211.306.927.600.380.511.602.0018.5418.853.751.27SOJ14-45012.1912.578.198.870.380.511.602.009.659.963.751.27SOJ16-45012.1912.578.198.870.380.511.602.0010.9211.233.751.27SOJ18-45012.1912.578.198.870.380.511.602.0012.1912.503.751.27SOJ20-45012.1912.578.198.870.380.511.602.0013.4613.773.751.27SOJ22-45012.1912.578.198.870.380.511.602.0014.7315.043.751.27SOJ24-45012.1912.578.198.870.380.511.602.0016.0016.313.751.27SOJ26-45012.1912.578.198.870.380.511.602.0017.2717.583.751.27SOJ28-45012.1912.578.198.870.380.511.602.0018.5418.853.751.27图50bSOJ的元件尺寸b)、SOJ的焊盘尺寸应符合图51a和51b的规定。见图51a和51b：封装名称Z(mm)G(mm)X(mm)Y(mm)C(mm)D(mm)E(mm)区域网格（网格单元号码）refrefbasicbasicSOJ14-3009.405.000.602.207.207.621.2720×22SOJ16-3009.405.000.602.207.208.891.2720×24SOJ18-3009.405.000.602.207.2010.161.2720×26SOJ20-3009.405.000.602.207.2011.431.2720×28SOJ22-3009.405.000.602.207.2012.701.2720×32SOJ24-3009.405.000.602.207.2013.971.2720×34SOJ26-3009.405.000.602.207.2015.241.2720×36SOJ28-3009.405.000.602.207.2016.511.2720×38SOJ14-35010.606.200.602.208.407.621.2724×22SOJ16-35010.606.200.602.208.408.891.2724×24SOJ18-35010.606.200.602.208.4010.161.2724×26SOJ20-35010.606.200.602.208.4011.431.2724×28SOJ22-35010.606.200.602.208.4012.701.2724×32SOJ24-35010.606.200.602.208.4013.971.2724×34SOJ26-35010.606.200.602.208.4015.241.2724×36SOJ28-35010.606.200.602.208.4016.511.2724×38图51aSOJ焊盘尺寸封装名称Z(mm)G(mm)X(mm)Y(mm)C(mm)D(mm)E(mm)区域网格（网格单元号码）refrefbasicbasicSOJ14-40011.807.400.602.209.607.621.2726×22SOJ16-40011.807.400.602.209.608.891.2726×24SOJ18-40011.807.400.602.209.6010.161.2726×26SOJ20-40011.807.400.602.209.6011.431.2726×28SOJ22-40011.807.400.602.209.6012.701.2726×32SOJ24-40011.807.400.602.209.6013.971.2726×34SOJ26-40011.807.400.602.209.6015.241.2726×36SOJ28-40011.807.400.602.209.6016.511.2726×38SOJ14-45013.208.800.602.2011.007.621.2728×22SOJ16-45013.208.800.602.2011.008.891.2728×24SOJ18-45013.208.800.602.2011.0010.161.2728×26SOJ20-45013.208.800.602.2011.0011.431.2728×28SOJ22-45013.208.800.602.2011.0012.701.2728×32SOJ24-45013.208.800.602.2011.0013.971.2728×34SOJ26-45013.208.800.602.2011.0015.241.2728×36SOJ28-45013.208.800.602.2011.0016.511.2728×38图51bSOJ焊盘尺寸四边有翼形引脚的元件7.4.1PQFP(PlasticQuadFlatPack)a)、PQFP方形元件的尺寸应符合图52的规定。见图52：封装名称(总引脚数)L(mm)S(mm)W(mm)T(mm)A(mm)B(mm)E(mm)H(mm)minmaxminmaxminmaxminmaxrefrefbasicmaxPQFP8419.5520.0517.5518.160.200.300.751.0016.8016.800.6354.57PQFP10022.1022.6020.1020.710.200.300.751.0019.3519.350.6354.57PQFP13227.2027.7025.2525.810.200.300.751.0024.4024.400.6354.57PQFP16432.2532.7530.2530.860.200.300.751.0029.4029.400.6354.57PQFP19637.3537.8535.3535.960.200.300.751.0034.4034.400.6354.57PQFP24441.6542.1539.6540.260.200.300.751.0045.4045.400.6354.57图52PQFP元件的标准尺寸

b)、PQFP的焊盘尺寸应符合图53的规定。见图53：封装名称(总引脚数)Z(mm)G(mm)X(mm)Y(mm)C(mm)D(mm)E(mm)区域网格（网格单元号码）refrefrefrefPQFP8421.0017.000.352.0018.8012.700.63544×44PQFP10023.6019.600.352.0021.4015.240.63550×50PQFP13228.6024.600.352.0026.4020.320.63558×58PQFP16433.8029.800.352.0031.6025.400.63568×68PQFP19638.8034.800.352.0036.6030.480.63580×80PQFP24443.2039.200.352.0041.0038.100.63588×88图53PQFP的焊盘尺寸7.4.2SQFP(ShrinkQuadFlatPack),方形a)、SQFP的尺寸应符合图54a,54b,54c,54d的规定。见图54a,54b,54c,54d：封装名称L(mm)S(mm)W(mm)T(mm)A(mm)B(mm)P(mm)H(mm)minmaxminmaxminmaxminmaxrefrefbasicmaxSQFP5×5-246.807.205.205.890.100.300.400.805.005.000.501.70SQFP5×5-326.807.205.205.890.100.300.400.805.005.000.501.70SQFP5×5-32-F6.807.205.205.890.050.220.400.805.005.000.401.70SQFP5×5-406.807.205.205.890.050.220.400.805.005.000.401.70SQFP5×5-486.807.205.205.890.050.150.400.805.005.000.301.70SQFP5×5-566.807.205.205.890.050.150.400.805.005.000.301.70SQFP6×6-327.808.206.206.890.100.300.400.806.006.000.501.70SQFP6×6-407.808.206.206.890.100.300.400.806.006.000.501.70SQFP6×6-40-F7.808.206.206.890.050.220.400.806.006.000.401.70SQFP6×6-487.808.206.206.890.050.220.400.806.006.000.401.70SQFP6×6-567.808.206.206.890.050.150.400.806.006.000.301.70SQFP6×6-647.808.206.206.890.050.150.400.806.006.000.301.70SQFP7×7-408.809.207.207.890.100.300.400.807.007.000.501.70SQFP7×7-488.809.207.207.890.100.300.400.807.007.000.501.70SQFP7×7-568.809.207.207.890.050.220.400.807.007.000.401.70SQFP7×7-648.809.207.207.890.050.220.400.807.007.000.401.70SQFP7×7-728.809.207.207.890.050.150.400.807.007.000.301.70SQFP7×7-808.809.207.207.890.050.150.400.807.007.000.301.70图54aSQFP元件的标准尺寸封装名称L(mm)S(mm)W(mm)T(mm)A(mm)B(mm)P(mm)H(mm)minmaxminmaxminmaxminmaxrefrefbasicmaxQFP10×10-4412.9513.4510.8511.550.300.450.650.9510.0010.000.802.45QFP10×10-5212.9513.4510.8511.550.220.380.650.9510.0010.000.652.45SQFP10×10-6411.8012.2010.2010.890.100.300.400.8010.0010.000.502.20SQFP10×10-7211.8012.2010.2010.890.100.300.400.8010