IC代工生产管理培训

MPC教育资料1：什么是PC2：什么是MPC3：MPC需要关注和解决那些问题4：MPC专业词汇解释第一页，共五十八页。什么是PCPC就是productioncontrolPC是着眼在公司层面，根据销售订单以及生产线产能进行制定生产投入产出计划职责：产品的投入计划确保产品交货期，以及产出计划。确认制品MOVE情况以及提醒交货期会有延迟的产品执行客户需求的产品释放以及停滞等等第二页，共五十八页。什么是MPCMPC的客户是MPP,MPP客户是PC。也就是说详细的完成PC所下达的任务。按生产计划检查、跟踪并准确及时报告生产流程中的问题。依据WIP、制品交期、设备负荷、制程时间限制以及在制品及设备的运行状况等因素调整实时调度系统的运行

提高人员及设备利用率制品流通率的管理及有关数据的提供依据生产数据计算生产能力。第三页，共五十八页。MPC需要解决哪些问题Themissionofamanufacturingfab:TosatisfycustomerandmaximizethecapacityandwaferoutputWhatcustomerwants?OntimedeliveryGoodwaferqualityLowunitpriceMFGindicesindicatestheperformanceofaFab第四页，共五十八页。IndexnameShortdescCTCycleTimeTRTurnRatioMoveWafermovementWIPProductionwaferinprocessEngWIPEngineerwaferinprocessYieldFabYieldHoldHoldWIPTerminateEngineerwaferscrapScrapProductionwaferscrapReworkReworkwaferWSWaferstartWOWaferoutKEY第五页，共五十八页。C/T英文全名：Cycle/Time中文全名:运转周期定义:theaverageleadtimewhichonewafermustpayforrunning,waiting,holding,andtimeonbankfromwaferstarttoQC-Inspection计算方式:∑Cycle_Time_Waferi/Wafer_Output

计算频率/单位:天指标意义:1.考量FAB的硅片的运转速度2.衡量FAB的run货效率第六页，共五十八页。TR英文全名：TurnRatioT/R中文全名:在制品周转率定义:Averagenumberofstageswhichonewafercanpenetrateinoneday 每片硅片平均每天跑过的Stage数计算方式:StageMove/WIPWIP=(BOH+EOH)/2计算频率/单位:每日指标意义:1.由TurnRatio可知硅片处理速度是否正常2.此指标为StageMove与WIP的比值，因此由此可以得知目前的WIP量是否合理，在制品积压成本是否过高，以及生产流程是否顺畅第七页，共五十八页。Move英文全名：WaferMoves中文全名:硅片移动量定义:一片硅片完成一个Stage称为一个StageMove;一片硅片完成一个Step称为StepMove计算方式:由Fab中实际操作的硅片数加总得到计算频率/单位:每日或每月指标意义:1.由各个移动量可以了解目前硅片之处理速度是否正常2.由移动量预估硅片是否赶上速度3.籍此衡量各区域之生产绩效第八页，共五十八页。WIP英文全名：广义上Workinprocess在半导体行业:WaferInProcess中文全名:在制品定义:从硅片投入到硅片产出，Fab内各站积压了相当数量的硅片，统称为Fab内的WIP计算方式:堆积硅片求和计算频率/单位:每日或每月/片指标意义:衡量一个FAB的生产能力的标志

PWIP:ProductionWIPEngWIP:EngineeringWIP第九页，共五十八页。Yield英文全名：Yield中文全名:良率定义:产出硅片良品数量与投入生产之硅片数量的比率计算方式:硅片产出量/（硅片产出量+硅片报废量）计算频率/单位:每月%指标意义:由良率可以显示所生产硅片之制造环境，制程，规格方面之综合表现，故其为最重要的品质指标第十页，共五十八页。英文全名:Hold中文全名:硅片搁置定义:在生产过程中因为控制或者工程原因暂时无法进行生产的硅片数量计算方式:所有holdWIP数量相加计算频率/单位:每日或每月片指标意义:1.衡量工厂生产稳定度 2.衡量因工程原因对生产周期的影响Hold第十一页，共五十八页。Terminate/Scrap英文全名：Scrap中文全名:报废硅片定义:totalwaferscrapquantityinFAB计算方式:所有Scrap求和计算频率/单位:每日或每月片指标意义:1.衡量制程稳定度2.衡量一个FAB的生产良率 3.EngWIPterminate用以衡量工厂研发或者保持制程稳定而用掉的cost第十二页，共五十八页。Rework英文全名:Rework中文全名:返工定义:TotalreworkcountinFablithoarea计算方式:所有rework数目累加计算频率/单位:每日或每月片指标意义:1.衡量Litho制程稳定度2.衡量litho无效movement数量第十三页，共五十八页。WS英文全名:Waferstart中文全名:硅片下线定义:Totalwaferstartcount计算方式:所有下线数目累加计算频率/单位:每日或每月片指标意义:衡量工厂生产规模第十四页，共五十八页。WO英文全名:Waferout中文全名:硅片出货定义:Totalwaferoutcount计算方式:所有出货数目累加计算频率/单位:每日或每月片指标意义:衡量工厂生产规模第十五页，共五十八页。MFGindicesintroductionWhatisa“Golden”Fab第十六页，共五十八页。MPC需要关注哪些问题WaferMovesWaferStepMoveLocationMoveWaferInProcess(WIP)EndOnHand&BeginOnHandTurnRatio(T/R)-DailyEquipmentUPTimeWaferPerHour(WPH)EquipmentEfficiencyUtilizationManufacturingEfficiencyCycleTimePerMaskLayer(C/T)WaferOutLineYieldWaferAcceptanceTest(WAT)FabYield第十七页，共五十八页。WaferMovesDefinitionWaferstepMove=1wafermovingfromoneSteptoanother.WaferstageMove=1wafermovingfromonestagetoanother.MethodofCalculationSumofactualfaborsectionwaferstagemovestogivefabwafersmove,andsectionwafersmoverespectively.PurposeofWaferMoveIndexFrompresentamountofwafermoves,wecandetermineifthepresentproductionrateofthesectionorfabisnormal.Useasameasurementindextocompareshifttoshiftorfabtofab第十八页，共五十八页。SampleCalculationsScenario1: Particularlotof25waferscompleted4stages onthe1stofFebruary2000.Scenario2: Particularlotof25waferscompleted70 stagesinthemonthofJanuary2000.Scenario1Moves: Onthe1stofFebruary2000,Wafer Move =25X4 =100Scenario2Moves: InthemonthofJanuary2000,Wafer Move =25x70 =1750第十九页，共五十八页。WaferStepMoveDefinitionWaferSTEPMove-1wafermovingfromonesteptoanother.(Note:1Stepisequivalentto1equipmentmoveor1metrologystep.)MethodofCalculationSumofactualfab,sectionorequipmentwaferSTEPmovestogivefabwafersmove,sectionwafersmoveandequipmentwafermovesrespectively.PurposeofWaferStepMoveIndexFrompresentamountofwafermoves,wecandetermineifthepresentproductionrateoftheequipmentorsectionisnormal.Useasameasurementindextocompareequipmenttoequipmentorperformanceofoperatortooperator.第二十页，共五十八页。SampleCalculationsScenario1: Particularlotof25waferscompleted6steps onthe1stofFebruary2000.Scenario1StepMoves: Onthe1stofFebruary2000, WaferMove =25X6 =150StepMoves(Assumingtheaveragenumberofstepsperstages3steps/stage)StageMoveson1stofFebruary2000=150/3 =50StageMoves第二十一页，共五十八页。LocationMoveDefinitionTotalnumberofWaferStageMove–1wafermovingfromonestagetoanother.MethodofCalculationSumofstagemoveswithinprocessarea(CVD,PVD,PHOTO,etc).PurposeofLocationMoveIndexFrompresentamountofwafermoves,wecandetermineifthepresentproductionrateoftheprocessareaisnormal.Useasameasurementindextocomparedaytodayormonthtomonthperformanceofaprocessarea.第二十二页，共五十八页。SampleCalculationsScenario1: WaferMoveintheCVDareaforIMD=1200, PETEOS=800,SACVD=500,HDP=400 andBPTEOS=400.Scenario1LocatonMoves:CVDLocationMoves =1,200+ 800+500+400+400 =3,000Moves第二十三页，共五十八页。Wafer

InProcess(WIP)DefinitionNumberofwafersperstep,stage,section,shiftorfab.(ierunning,wait,hold,etc)MethodofCalculationSumofallwafersinthatstep,stage,section,shiftorfabrespectively.PurposeofWorkInProcessIndexFrompresentamountofwafermoves,wecandetermineifthepresentcapacityoftheequipment,sectionorfabissufficient.Useasanindicatortopossiblebottleneckinthefab.MovementoftheWIPindexwillreflectthestabilityoftheequipment/processandatthesametimethecapability(constraints)oftheequipment.第二十四页，共五十八页。EndOnHand&BeginOnHand(1)DefinitionEOH-WIPperstage,sectionorshiftorfabattheENDofashift.BOH-WIPperstage,sectionorshiftorfabattheSTARTofashift.MethodofCalculationSumofallwafersinthatstage,section,shiftorfabrespectivelyattheendorstartofashift.第二十五页，共五十八页。EndOnHand&BeginOnHand(2)PurposeofEOHandBOHIndexBycomparingtheEOHandtheBOHofashift,wecanhaveafeeloftheperformanceoftheequipmentandtheshift.AnincreaseinWIPfromtheBOHtoEOHmayindicatepoorequipmentstatusinthedifferentfabsorsectionsorshifts,orpoordispatchingskilloftheshiftiftheequipmentstatusisnormal.第二十六页，共五十八页。TurnRatio(T/R)-Daily(1)DefinitionNumberofstagescompletedbyeachwaferperday.MethodofCalculationT/R=TotalStageMovesPerDay/AverageWIP(Note:AverageWIPperday=[BOH+EOH]/2)第二十七页，共五十八页。TurnRatio(T/R)-Daily(2)PurposeofTurnRatioIndexFromtheT/Rwecandetermineifthecurrentwaferproductionrateisnormalortooslow.AsthisindicatortakestheratioofStagemovestoAverageWIP,thereforewecoulddetermineif:CurrentWIPisreasonablerelativetobenchmarkedquantity.IsthecostofWIP(inventory)relativetothecostofequipmentlosttimeproportional.CurrentproductionflowissmoothwithnobottleneckIsthestagetargetrealistic.第二十八页，共五十八页。SampleCalculationsScenario1: Onthe1stofFebruary2000,TotalStageMove(CVD)is10,000,theBOHWIPonthatdayis5,500andEOHWIPonthatdayis6,000.Scenario1T/R: Onthe1stofFebruary2000, T/R =10,000/[(5,500+6,000)/2] =1.74(Note:AnaverageT/Rof2.1to2.2isreasonableforafab)第二十九页，共五十八页。EquipmentUPTime(1)DefinitionTimewhenequipmentisfit-for-production.MethodofCalculationUPTime=RunTime+LostTime+TestTime+BackupTimePurposeofUPTimeIndexFromtheUPTimewecandeterminethetotalamountoftimeavailableforproduction.TheratioofLostTimetoAvailableTimeisusedtodeterminetheroomforimprovementintermsofutilizationforaparticularequipment.第三十页，共五十八页。EquipmentUPTime(2)第三十一页，共五十八页。SampleCalculationsScenario1: InFebruary2000,RunTime=700hours,Lost Time=100hours,TestTime=100hours, andBackupTime=50hoursforWCVD equipment.Scenario1WCVDAvailableTime: InFebruary2000, AvailTime =950hours LostRate =100/950 =10.5%第三十二页，共五十八页。WaferPerHour(WPH)(1)DefinitionNumberofwafersprocessedperhour.MethodofCalculationWPH=WaferMove/RunTimePurposeofWaferPerHour(WPH)Index(1)FromthepresentequipmentWPHwecandeterminewhetherthecurrentequipmentrateofproductiontotalisnormal.TheequipmentWPHcanbeusedtoderivetheequipmentcapacity,whichcanbeinturnusedtodetermineifthetotalcapacityforaparticularcapabilityissufficient.第三十三页，共五十八页。WaferPerHour(WPH)(2)PurposeofWaferPerHour(WPH)Index(2)TheratioofthecurrentequipmentWPHtotheTheoretical–WPH(T–WPH)canbeusedtodetermineiftheequipmentispresentlyoperatingintheoptimumconditions.WPHindexcanalsobeusedtomeasureindividualMAorshiftperformance,especiallysoinmanualoperations.RelativeWPHbetweenequipmentrunningthesamerecipecanbeusedtodeterminetheindividualequipment第三十四页，共五十八页。SampleCalculations(1)Scenario1: On1stofFebruary2000,RunTime=20hours andWaferMoves=1700wafersforWCVD equipment.Scenario2: Thesameequipmentforthemonthof February2000,RunTime=600hoursand thetotalWaferMoves=54,000wafers.Scenario3: RunTime=12hours,WaferMovesby OperatorA=500andOperatorB=400on thesameequipment.第三十五页，共五十八页。SampleCalculations(2)Scenario1WCVDWPH: On1stofFebruary2000, WPH=1,700/20 =85wafers/hourScenario2WCVDWPH: InthemonthofFebruary2000, WPH=54,000/600 =90wafers/hourTherefore,wecansaythatthecurrentequipmentrateofproductionislowerthantheaverageforthewholemonth.Scenario3: OperatorAhasaWPH=500/12 =41.67wafers/hour OperatorBhasaWPH=400/12 =33.33wafers/hour第三十六页，共五十八页。EquipmentEfficiency(1)DefinitionPercentageoftheactualwafermovesperhourtotheidealwafermovesperhour.MethodofCalculationEquipmentEfficiency =[(TotalActualWaferMoves/TotalRunTime)/(Average IdealWPH)]X100%Note:Asthe“IdealWPH”isdependentontherecipeofthelotprocessed,the“AverageIdealWPH”isthesumofthe“IdealWPH”multiplebytheproportionofthenumberoflots(duringtheperiodoftime)withthatrecipedividedbytheTotalRunTime.

第三十七页，共五十八页。EquipmentEfficiency(2)PurposeofEquipmentEfficiencyIndexTheequipmentefficiencyindexshowhowmuchdeviationfromtheoptimumperformanceistheequipmentbeingoperatedin.Determineifthereisanyweakness/abnormalitywithanequipmentcapabilities/fabWIPprofile/processcapability.Baseontheefficiencyoftheequipment,weareabletolookintomethodstooptimizetheequipmentandincreasethethroughputoftheequipment.第三十八页，共五十八页。ExamplesExampleofsomesituationsthatLOWERStheequipmentefficiency:Only1SMIFArmisinworkingcondition.Takesalongertimethanusualtoachieverequiredvacuumfortheloadlock–equipmentproblem.SMIFArmunabletounloadautomaticallythereforestatusremains“Run”(RunTimeincreaseswithoutincreaseinoutput)evenwhenwafersalreadycompleteditsprocess.Thebottleneckchamberoftheequipmentisdownandthereforetheimpactdeductedislessthantheactualimpact.Timerequireforachievingvacuumisthesameforalotwith25wafersandonewithonly1wafer.Thereforethetimeperwaferisincreasesignificantlywhenlotwithonly1waferisprocessed.第三十九页，共五十八页。SampleCalculationsScenario1: On1stofFebruary2000,shiftA,WCVD equipment,WaferMoves=375wafers,Run Time=12hours.Thelotsconsistof5lotsof recipeAand10lotsofrecipeB.RecipeA: IdealWPH=30,RecipeB:IdealWPH=45.Scenario1Efficiency:AverageIdeaWPH =(5/15 X30)+(10/15X45) =40waferperhourEquipmentEfficiency=(375/12)/(40)X100 =78.13%第四十页，共五十八页。Utilization(1)DefinitionTheamountoftimedemandedofanequipmentforproduction,versusthetotalamountoftimeavailable.Demand/CapacityMethodofCalculationUtilization=(RunTime+TestTime+BackUpTime)/Total TimeX100%第四十一页，共五十八页。Utilization(2)PurposeofUtilizationIndexForaUtilizationIndexgreaterthan100%forcertainequipment,wecansafelysaythatthepresentequipmentcapacityisnotsufficientforthepresentdemand.Iftheutilizationislowforcertainequipment,buttheWIPishigh,itcouldbeduetotheequipmentnothavingthecapabilitytoruntherecipesrequiredbytheWIP.第四十二页，共五十八页。SampleCalculationsScenario1: Inaday(24hours),WCVDequipmenthas RunTime=12hoursandBackUpTime=6 hours.Scenario1Utilization:Utilization =(12+6)/24X100% =75%第四十三页，共五十八页。ManufacturingEfficiency(1)DefinitionPercentageoftheequipmentavailabletimeusedforproduction(RunTime,TestTimeandBackUpTime)overthetotalequipmentavailabletime(RunTime,TestTime,LostTimeandBackUpTime).MethodofCalculationManufacturingEfficiency=(Utilization/Availability)X100%第四十四页，共五十八页。ManufacturingEfficiency(2)PurposeofManufacturingEfficiencyIndexThemanufacturingefficiencyindexcomparestheperformanceoftheoperatorunderahighWIPsituation.Thehighertheefficiencyindexthebettertheperformance.OneoftheindicatorsforlowWIPforspecificequipment,sectionorfab.AhighWIPandlowmanufacturingefficiencyindexcouldbeduetoequipmentconstraintanditscapabilities.第四十五页，共五十八页。SampleCalculationsScenario1: OperatorA’sequipmenthasRunTime=8 hours,TestTime=1hour,BackUpTime=0 andLostTime=3hours.Scenario1OperatorA:ManufacturingEfficiency =(8+1+0)/(8+1+0+3)X100%=75%第四十六页，共五十八页。CycleTimePerMaskLayer(C/T)(1)DefinitionAveragenumberofdaysrequiredforprocessingbetweentwophotostages.(1layers.onephotostagetoanother)Aseachindividuallayerisdefinedbyaphotostage,thereforethenumberoflayersofaproductisequivalenttothenumberofphotostages.Note:For0.25microntechnology,thereisanaverageof25layers.MethodofCalculationC/T=(TimewhichwaferpassestheQCtest–Timeatwaferstart)/Numberofphotostages.第四十七页，共五十八页。CycleTimePerMaskLayer(C/T)(2)PurposeofWaferMoveIndexBaseonthenumberoflayersoftheproduct,andtheuseoftheaveragecycletimeofthefab,weareabletodeterminetheaveragetimerequiredfortheproductfromstarttocompletion.Thereby,enablingustodecideonthedatefortheproductwaferstartinordertomeetthedeliveryschedule.第四十八页，共五十八页。SampleCalculationsScenario1: Aparticularproducthas16layers,andthe timerequiredfromwaferstarttillQCtestingis 40days.Scenario1C/Tperlayer: C/Tperlayer =40/16 =2.5daysperlayer第四十九页，共五十八页。WaferOutDefinitionTotalquantityofwafersthatpassestheQCtest.MethodofCalculationProductionController(PC)willannouncedtheofficialWaferOutquantity.PurposeofWaferOutIndexTheWaferOutIndexwillindicatethefaboutputstatus.第五十页，共五十八页。SampleCalculationsScenario1: InthemonthofFebruary2000,quantityof wafersthatpassesQCtest=15,000wafers.Scenario1WaferOut: InthemonthofFebruary2000 WaferOut=15,000wafers第五十一页，共五十八页。LineYieldDefinitionPercentageofwafersproducedbythefabpriortoWAT.MethodofCalculation LineYield=(QuantityofWaferProduced)/[(Quantityof WaferProduced)+(QuantityofWafer ScrappedintheProductionProcess)] =(QuantityofWaferProduced)/(Quantityof RawWaferUsedforProduction)PurposeofLineYieldIndexTheLineYieldreflectsthequalityofthemanufacturingsystemofafab.ThehighertheLineYieldthelessermisoperationswithinthefab.第五十二页，共五十八页。S