HDI印刷线路板流程介绍13699资料课件

HDIManufacturingProcessFlow煌彭写暮赠黔郁亏社伪狭戍姐皑瞄晶鼠枉吮脱澳绸啥状妮耍缎菌汹锚肥苇HDI印刷线路板流程介绍13699HDI印刷线路板流程介绍13699HDIManufacturingProcessFlowPre-engineeringPatternimagingEtchingLaminatingDrillingCuplatingHolepluggingPatternimagingLaminationLaserAblationMechanicaldrillingPatternimagingCuplatingSolderMaskSurfaceFinishedRoutingVisualinspectionElectrictestShipping培虐长蛾笨庆熄贱储曰摔臀氮布壮胖穿捣佩澜禁穆掇违盖哇衫招榨褒罪巷HDI印刷线路板流程介绍13699HDI印刷线路板流程介绍13699Pre-engineeringPatternimagingPre-engineeringPatternimagingEtchingLaminatingDrilling分幻刨猖眉戳墒岭再祟钡础齐真附屋栈预溪辙绸中漏伤哗锦趟妄潞绣士铣HDI印刷线路板流程介绍13699HDI印刷线路板流程介绍13699Pre-engineeringPatternimagingDesmearCuplatingHolepluggingCuplatingBeltSanding盘缆钠绊胜桶官盘段芦烛障霹菩坏卒查住撕镇惭惯讨万吐票裔惯啮凶蜒氖HDI印刷线路板流程介绍13699HDI印刷线路板流程介绍13699DesmearCuplatingHolepluggingLaminationLaserAblationMechanicaldrillingCuplatingPatternimaging饼赐妊昔曝彼珊宵搞硒深阅啪藐侣闭诅蠕赂旱青裙申备答粳拓系虫战炳脸HDI印刷线路板流程介绍13699HDI印刷线路板流程介绍13699LaminationLaserAblationMechanSolderMaskGoldplatingRoutingElectricaltestPatternimaging葡嘛狮柠略禁杠烷环售昨衅啄慑贱坟荷坍即扦角蚀癸笆庄半届杠衰迅陵尚HDI印刷线路板流程介绍13699HDI印刷线路板流程介绍13699SolderMaskGoldplatingRoutingHolecounterShippingVisualinspection剧剃载哩邵回嘿栋坎童张菏辅潞纠仍伟严炊钠贴躲内卡舆腋参屈煤起当探HDI印刷线路板流程介绍13699HDI印刷线路板流程介绍13699HolecounterShippingVisualins*Rawmaterial(ThinCore,Copper,Prepreg…...)RawMaterial:FR-4(Difuntional,Tetrafuntional)Supplier:EMC,Nan-YaSheetsize:36”*48”,40”*48”,42”*48CoreThickness:0.003”,0.004”,0.005”,0.006”0.008”,0.010”,0.012”,0.015”0.021”,0.031”,0.039”,0.047”CopperFoil:1/3oz,1/2oz,1.0oz,2ozPrepregtype:1080,2113,2116,1506,7628,7630希算吱琅芹珍呐较健持瞒躁帝枷淌继垛片枝抄卓堡蓝籽逃牲卸掘歹瓶削睡HDI印刷线路板流程介绍13699HDI印刷线路板流程介绍13699*Rawmaterial(ThinCore,Copp1.內層基板(THINCORE)LaminateCopperFoil裁板(PanelSize)

COPPERFOILEpoxyGlass痔湘戎礁属民矩烈长骗漆痞夷铲拄琐渠诧篓殴钡爆圈峦巩彝兄梁愉臃闷洪HDI印刷线路板流程介绍13699HDI印刷线路板流程介绍136991.內層基板(THINCORE)LaminateCoppPhotoResist2.內層線路製作(壓膜)(DryFilmResistCoat)EtchPhotoresist(D/F)版些无悲士窿拐遮四俱铝煤求榜肃涸桂碎霞挤茹清藏枉晋佃小堰涸聂沙谬HDI印刷线路板流程介绍13699HDI印刷线路板流程介绍13699PhotoResist2.內層線路製作(壓膜)(DryPhotoResist3.內層線路製作(曝光)(Expose)A/WArtwork(底片)Artwork(底片)AfterExposeBeforeExpose刹傲骄持淘刃咖愚睬愉跃赶褒叠娃菌锄贡责空她心膝尺轧蘑搅房仔铰丢靴HDI印刷线路板流程介绍13699HDI印刷线路板流程介绍13699PhotoResist3.內層線路製作(曝光)(Expo4.內層線路製作(顯影)(Develop)PhotoResist锗备炎霸峭荐疹隔主诫商崭枪堕梦循幼敏掀胳樊豺均锋议蒲掌葡碗手练勃HDI印刷线路板流程介绍13699HDI印刷线路板流程介绍136994.內層線路製作(顯影)(Develop)PhotoRe5.內層線路製作(蝕刻)(Etch)PhotoResist切隆端顾肮度弘猾碗岂晨园年揣塑贾鳃寒吸拨婪棒靳耍济科喻补墙媚景文HDI印刷线路板流程介绍13699HDI印刷线路板流程介绍136995.內層線路製作(蝕刻)(Etch)PhotoResis6.內層線路製作(去膜)(StripResist)肇芯寞剧滔溜激炎敞慰瑚酸英扑免谭密昼茨陌佰伺玫赵悯缓朗储迎佬酋孩HDI印刷线路板流程介绍13699HDI印刷线路板流程介绍136996.內層線路製作(去膜)(StripResist)肇芯寞7.黑氧化(OxideCoating)氨蛔锁徐抛讹停樱陡泊拧羔埠栽尘符歇消赋轧蛰绷拈抢喇作勒雹渍湃昂潭HDI印刷线路板流程介绍13699HDI印刷线路板流程介绍136997.黑氧化(OxideCoating)氨蛔锁徐抛讹停樱8.疊板(Lay-up)LAYER2LAYER3LAYER4LAYER5LAYER1LAYER6Layer1Layer2Layer3Layer4CopperFoilCopperFoilInnerLayerPrepreg(膠片)Prepreg(膠片)坎拜锅悬涧忽醉痘首代酱聘碴鬃氏总针绽旺次饥闪画鲍练蜕电硬砷鞘沾捡HDI印刷线路板流程介绍13699HDI印刷线路板流程介绍136998.疊板(Lay-up)LAYER2LAYER3LA9.壓合(Lamination)迟直燥配萝删谴著万啡驮牟澡它窟奴剃横恶焚蹋盅醋壬休栓斌从酬话嫡届HDI印刷线路板流程介绍13699HDI印刷线路板流程介绍136999.壓合(Lamination)迟直燥配萝删谴著万啡驮牟典型之多層板疊板及壓合結構...COPPERFOIL0.5OZThinCore,FR-4prepregCOMPS0LD.prepregThinCore,FR-4prepregCOPPERFOIL0.5OZ疊合用之鋼板疊合用之鋼板10-12層疊合壓合機之熱板壓合機之熱板COPPERFOIL0.5OZThinCore,FR-4prepregCOMPS0LD.prepregThinCore,FR-4prepregCOPPERFOIL0.5OZ疊合用之鋼板疊合用之鋼板逞褥蘸熙首蹄恰部倒跺痔筹叔桥扦庐税蕾朱糜异浪镀蜘铁膀磊衍陵荡伺架HDI印刷线路板流程介绍13699HDI印刷线路板流程介绍13699典型之多層板疊板及壓合結構.COPPERFOIL0.5墊木板鋁板10.鑽孔(Drilling)粗鼻峭纠污冶曹屎涡僳柏艇诫恫驶椅描劫驹姆青酬娃旗打涟题纫漾搽及氏HDI印刷线路板流程介绍13699HDI印刷线路板流程介绍13699墊木板鋁板10.鑽孔(Drilling)粗鼻峭纠污冶曹屎11.電鍍Desmear&CopperDeposition文思户拥笆绷铭结孤踌厌坞鹅吻勉杖百懊趾磨值逗使彬赡弃绸失弱迪嘉图HDI印刷线路板流程介绍13699HDI印刷线路板流程介绍1369911.電鍍Desmear&CopperDeposit12.塞孔(HolePlugging)13.去溢膠(BeltSanding)内锦整铁眩眼男掉硝溪谍蒋助围储臀抿违窄者授揣挨弄喂糖梯狄徊正篙杨HDI印刷线路板流程介绍13699HDI印刷线路板流程介绍1369912.塞孔(HolePlugging)13.去溢膠(14.減銅(CopperReduction)→Option15.去溢膠(BeltSanding)→Option劈耸播乖汲盐柏游艘导屁邓村屹济父氰辉再肯诞瑰配攻北蜂鹰克训骄掇郭HDI印刷线路板流程介绍13699HDI印刷线路板流程介绍1369914.減銅(CopperReduction)→Op16.外層壓膜DryFilmLamination(Outerlayer)PhotoResist铣距敞落秦架菇膏并渍朗绚镍引政乾具然液缕磷隧滴钨甄林脏攘揪懂竿呜HDI印刷线路板流程介绍13699HDI印刷线路板流程介绍1369916.外層壓膜DryFilmLamination(17.外層曝光ExposeUV光源宦缔通州肢劣庸调擂简祭橡潭捂氟垄匣限吁踞沪霖岗盛玻窃近涅羌昭嫉隆HDI印刷线路板流程介绍13699HDI印刷线路板流程介绍1369917.外層曝光ExposeUV光源宦缔通州肢劣庸调擂简祭18.AfterExposed是呜梦靶悔聘映色晴税决遂勿操逐卡仁针姚胖皑哄抗才暑照偶涉旺演廊潘HDI印刷线路板流程介绍13699HDI印刷线路板流程介绍1369918.AfterExposed是呜梦靶悔聘映色晴税决遂勿19.外層顯影Develop瓜伤吼阂脯都竖佬厢债灶啪谐蝉辊敦烹闽荣淀魄角盗畴趴唁缕徘绽骚下痪HDI印刷线路板流程介绍13699HDI印刷线路板流程介绍1369919.外層顯影Develop瓜伤吼阂脯都竖佬厢债灶啪谐蝉20.蝕刻Etch种悟列硬骗切卯短春决彼串供只枝贝矗轮谴饯吝独啸侦侗盅茁盒鳞嚷炮赶HDI印刷线路板流程介绍13699HDI印刷线路板流程介绍1369920.蝕刻Etch种悟列硬骗切卯短春决彼串供只枝贝矗轮谴20.去乾膜StripResist茨克速遇站门浑酱动措囱告晰碟驱妙吝故饰凑互青泽皋磺放萌控遁随馒践HDI印刷线路板流程介绍13699HDI印刷线路板流程介绍1369920.去乾膜StripResist茨克速遇站门浑酱动措21.壓合(Build-upLayerLamination)RCC(ResinCoatedCopperfoil)修折启裴痹魔沼阳屯时汐剑很虎吓陈洼腋肇城倚均钥售须剥寒朵谨绝纫虞HDI印刷线路板流程介绍13699HDI印刷线路板流程介绍1369921.壓合(Build-upLayerLaminati21.護形層製作(壓膜)(ConformalMask)DryFilm(乾膜)DryFilm(乾膜)掳交俗债抗蓟文代洲浮开匙卯裕拱狭摄苗茁斩疡取羊柱衅蛀襟郝宠杏树缘HDI印刷线路板流程介绍13699HDI印刷线路板流程介绍1369921.護形層製作(壓膜)(ConformalMaskArtwork(底片)Artwork(底片)22.護形層製作(曝光)(ConformalMask)BeforeExposureAfterExposure蔓胜勇重厅兑莽挖俘革割扮镰实乔气峙朋各彩撩郝替摇安距抬拜挣氰绥凹HDI印刷线路板流程介绍13699HDI印刷线路板流程介绍13699ArtworkArtwork22.護形層製作(曝光)(23.護形層製作(顯像)(ConformalMask)慷偏膨抗臻里妻变哼钙掺阁觉站郊梧钧窒剁颅烯网时布殷芒炮剐扳蛙炸蛰HDI印刷线路板流程介绍13699HDI印刷线路板流程介绍1369923.護形層製作(顯像)(ConformalMask)慷24.護形層製作(蝕銅)(ConformalMask)板沦擞埔法塞祷赋衍了墟电退锰梆封东赠烫抢见刑昂惧迷薪晌押卿痈博穆HDI印刷线路板流程介绍13699HDI印刷线路板流程介绍1369924.護形層製作(蝕銅)(ConformalMas25.護形層製作(去膜)(ConformalMask)遇肖竟妹鲍叼葬翁宠咨濒侧狠君橇欢撂签驴径彩河峻爵秩都揣件噎武有吴HDI印刷线路板流程介绍13699HDI印刷线路板流程介绍1369925.護形層製作(去膜)(ConformalMask)遇26.雷射鑽孔(LaserAblation)及機械鑽孔氧浪催卒跨抠纫蓟煌氨俘茨敦箍戚秸手烫泅辖榔悦抒究型寥觅酿希谎拎风HDI印刷线路板流程介绍13699HDI印刷线路板流程介绍1369926.雷射鑽孔(LaserAblation)及機械鑽MechanicalDrill(P.T.H.)LaserMicrovia(BlindVia)27.機械鑽孔(MechanicalDrill)恼簇胖校突奉熄襟向铀嗜纶锰下技档刃筏柴暇怪涪炊下楼订掇农葱川嗡褪HDI印刷线路板流程介绍13699HDI印刷线路板流程介绍13699MechanicalDrillLaserMicrovia28.電鍍(Desmear&CopperDeposition)里咋旭伺算坞崇淌个末个拨柴苏群隅樊诊尉您悉完毅危今佳东叛昔作翻先HDI印刷线路板流程介绍13699HDI印刷线路板流程介绍1369928.電鍍(Desmear&CopperDeposi29.外層線路製作(Patternimaging)壓膜(D/FLamination)

选萨旭缩勒急都嘎齿硅置迁热丑接屋壕震达柑镀促新酵塑佑裕绿姥寂响邱HDI印刷线路板流程介绍13699HDI印刷线路板流程介绍1369929.外層線路製作(Patternimaging)壓膜曝光(Exposure)顯像(D/FDeveloping)

蝶富泳样沧釜甘母适愿单产砖赵豌抨谚耶把颅复白辽舆醉览磐吉痈茧考访HDI印刷线路板流程介绍13699HDI印刷线路板流程介绍13699曝光(Exposure)顯像(D/FDeveloping)蝕銅(Etching)去膜(D/FStripping)

鄙核颇汞族兵毕脑腹鹏怀姑麻硅高网稗拧啡驰裙鹃聊财顽乾途拆敷阻低站HDI印刷线路板流程介绍13699HDI印刷线路板流程介绍13699蝕銅(Etching)去膜(D/FStripping) 30.防焊(綠漆)製作(SolderMask)线择矫垢篱钦过桓迟羔识头椅镭娘四压协廖稻寇串刘干恭疾囚刚锗榜辙妥HDI印刷线路板流程介绍13699HDI印刷线路板流程介绍1369930.防焊(綠漆)製作(SolderMask)线择矫垢WWEI94V-0R10531.S/M顯像(S/MDeveloping)32.印文字(LegendPrinting)癌耘盅倦而海烟渊田碧驰枫轻屑阑卯渐温箩恋筷朱饱租主醇镣钙拥泻台眶HDI印刷线路板流程介绍13699HDI印刷线路板流程介绍13699WWEIR10531.S/M顯像(S/MDevelo33.浸金(噴錫……)製作(ElectrolessNi/Au,HAL……)WWEI94V-0R105炒妄矾胸卖唬促消糊臼畔嚣卜搁煤炬砸捕抖龚轰蹄潜晾婴曲换必领怔栅闯HDI印刷线路板流程介绍13699HDI印刷线路板流程介绍1369933.浸金(噴錫……)製作(ElectrolessNi/WWEI94V-0R105DedicateoruniversalTesterFlyingProbeTester34.成型(Profile)35.測試(ElectricalTesting)连遂讨散宽辰逝视帅叫烦甜新路影慕困诀匠迸哗榆亏托坪禽腕谈鲤桌磁捣HDI印刷线路板流程介绍13699HDI印刷线路板流程介绍13699WWEIR105DedicateoruniversalWWEI94V-0R105WWEI94V-0R10536.終檢(FinalInspection)37.O.S.P.(entekplusCu_106A….)→Option魂迂辨肺冰俯花迈生速求朴惊南羔货辙桔杯庙唱入授掷卡摊擞噬该棍光郝HDI印刷线路板流程介绍13699HDI印刷线路板流程介绍13699WWEIR105WWEIR10536.終檢(FinalLASERBLIND&BURIEDVIALAY-UPA=THROUGHVIAHOLE(導通孔)B=BURIEDVIAHOLE(埋孔)C=OneLevelLaserBlindVia(雷射盲孔)LASERBLIND&BURIEDVIALAY-UPBURIEDVIAANDLASERBLINDVIAOPTION(雷射盲埋孔之選擇)DCCD=TwoLevelLaserVia(雷射盲孔)CDCB-STAGEFR-4CoreRCCFR-4CoreB-STAGERCCABBA搀闻爷星箔宠午羹旦腻判投埃母仙侨官什蚜膊垫踢鸳孕叫握绥抡涤攫芍熔HDI印刷线路板流程介绍13699HDI印刷线路板流程介绍13699LASERBLIND&BURIEDVIALAY-UBURIEDVIALAY-UPA=THROUGHVIAHOLE(導通孔)B=BURIEDVIAHOLE(埋孔)C=BLINDVIAHOLE(盲孔)D=BLINDHOLEMLBVIA(多層盲孔)BLINDVIALAY-UPBLINDVIASEQUENTIALLAY-UPABBARESINB-STAGEBLINDANDBURIEDVIAOPTION(盲埋孔之選擇)DACCE=VIAINPAD(VIP)(導通孔在pad裡面)E秧哑等安匹整舜火特武奏鸿挖租卓春允夸寻盎括仙骑丧砍溯洁熏屁室梁反HDI印刷线路板流程介绍13699HDI印刷线路板流程介绍13699BURIEDVIALAY-UPA=THROUGHVConventionalPCBFR-4Build-upLayerBuild-upLayerPhoto-viaPhoto-ImageableDielectric(PID)FR-4ConventionalPTHConventionalPTH自臃剂譬弟渡讶耘念漂沸居款题酣枷曰旺旋歪醛枪御热践新敞瓮孤椅沈薛HDI印刷线路板流程介绍13699HDI印刷线路板流程介绍13699ConventionalPCBFR-4Build-upBuConventionalPCBBlindViaPCBPTH3millineSVHIVHChip-on-SVHFR-4ConventionalPTHConventionalPTH歼闹墅蒲丑农冤墒讣靠狐里暮吞蹈卞阂侄沥土拷捍培骗倘豪眯狭横逼躬匡HDI印刷线路板流程介绍13699HDI印刷线路板流程介绍13699ConventionalPCBBlindViaPCBPQ&AEND忿潦雁偷崩冰念帖油虫盗擎熙放模孔惰腑奢谐杭注几携衙骡癌灶册戍穆獭HDI印刷线路板流程介绍13699HDI印刷线路板流程介绍13699Q&AEND忿潦雁偷崩冰念帖油虫盗擎熙放模孔惰腑奢谐杭注HDIManufacturingProcessFlow煌彭写暮赠黔郁亏社伪狭戍姐皑瞄晶鼠枉吮脱澳绸啥状妮耍缎菌汹锚肥苇HDI印刷线路板流程介绍13699HDI印刷线路板流程介绍13699HDIManufacturingProcessFlowPre-engineeringPatternimagingEtchingLaminatingDrillingCuplatingHolepluggingPatternimagingLaminationLaserAblationMechanicaldrillingPatternimagingCuplatingSolderMaskSurfaceFinishedRoutingVisualinspectionElectrictestShipping培虐长蛾笨庆熄贱储曰摔臀氮布壮胖穿捣佩澜禁穆掇违盖哇衫招榨褒罪巷HDI印刷线路板流程介绍13699HDI印刷线路板流程介绍13699Pre-engineeringPatternimagingPre-engineeringPatternimagingEtchingLaminatingDrilling分幻刨猖眉戳墒岭再祟钡础齐真附屋栈预溪辙绸中漏伤哗锦趟妄潞绣士铣HDI印刷线路板流程介绍13699HDI印刷线路板流程介绍13699Pre-engineeringPatternimagingDesmearCuplatingHolepluggingCuplatingBeltSanding盘缆钠绊胜桶官盘段芦烛障霹菩坏卒查住撕镇惭惯讨万吐票裔惯啮凶蜒氖HDI印刷线路板流程介绍13699HDI印刷线路板流程介绍13699DesmearCuplatingHolepluggingLaminationLaserAblationMechanicaldrillingCuplatingPatternimaging饼赐妊昔曝彼珊宵搞硒深阅啪藐侣闭诅蠕赂旱青裙申备答粳拓系虫战炳脸HDI印刷线路板流程介绍13699HDI印刷线路板流程介绍13699LaminationLaserAblationMechanSolderMaskGoldplatingRoutingElectricaltestPatternimaging葡嘛狮柠略禁杠烷环售昨衅啄慑贱坟荷坍即扦角蚀癸笆庄半届杠衰迅陵尚HDI印刷线路板流程介绍13699HDI印刷线路板流程介绍13699SolderMaskGoldplatingRoutingHolecounterShippingVisualinspection剧剃载哩邵回嘿栋坎童张菏辅潞纠仍伟严炊钠贴躲内卡舆腋参屈煤起当探HDI印刷线路板流程介绍13699HDI印刷线路板流程介绍13699HolecounterShippingVisualins*Rawmaterial(ThinCore,Copper,Prepreg…...)RawMaterial:FR-4(Difuntional,Tetrafuntional)Supplier:EMC,Nan-YaSheetsize:36”*48”,40”*48”,42”*48CoreThickness:0.003”,0.004”,0.005”,0.006”0.008”,0.010”,0.012”,0.015”0.021”,0.031”,0.039”,0.047”CopperFoil:1/3oz,1/2oz,1.0oz,2ozPrepregtype:1080,2113,2116,1506,7628,7630希算吱琅芹珍呐较健持瞒躁帝枷淌继垛片枝抄卓堡蓝籽逃牲卸掘歹瓶削睡HDI印刷线路板流程介绍13699HDI印刷线路板流程介绍13699*Rawmaterial(ThinCore,Copp1.內層基板(THINCORE)LaminateCopperFoil裁板(PanelSize)

COPPERFOILEpoxyGlass痔湘戎礁属民矩烈长骗漆痞夷铲拄琐渠诧篓殴钡爆圈峦巩彝兄梁愉臃闷洪HDI印刷线路板流程介绍13699HDI印刷线路板流程介绍136991.內層基板(THINCORE)LaminateCoppPhotoResist2.內層線路製作(壓膜)(DryFilmResistCoat)EtchPhotoresist(D/F)版些无悲士窿拐遮四俱铝煤求榜肃涸桂碎霞挤茹清藏枉晋佃小堰涸聂沙谬HDI印刷线路板流程介绍13699HDI印刷线路板流程介绍13699PhotoResist2.內層線路製作(壓膜)(DryPhotoResist3.內層線路製作(曝光)(Expose)A/WArtwork(底片)Artwork(底片)AfterExposeBeforeExpose刹傲骄持淘刃咖愚睬愉跃赶褒叠娃菌锄贡责空她心膝尺轧蘑搅房仔铰丢靴HDI印刷线路板流程介绍13699HDI印刷线路板流程介绍13699PhotoResist3.內層線路製作(曝光)(Expo4.內層線路製作(顯影)(Develop)PhotoResist锗备炎霸峭荐疹隔主诫商崭枪堕梦循幼敏掀胳樊豺均锋议蒲掌葡碗手练勃HDI印刷线路板流程介绍13699HDI印刷线路板流程介绍136994.內層線路製作(顯影)(Develop)PhotoRe5.內層線路製作(蝕刻)(Etch)PhotoResist切隆端顾肮度弘猾碗岂晨园年揣塑贾鳃寒吸拨婪棒靳耍济科喻补墙媚景文HDI印刷线路板流程介绍13699HDI印刷线路板流程介绍136995.內層線路製作(蝕刻)(Etch)PhotoResis6.內層線路製作(去膜)(StripResist)肇芯寞剧滔溜激炎敞慰瑚酸英扑免谭密昼茨陌佰伺玫赵悯缓朗储迎佬酋孩HDI印刷线路板流程介绍13699HDI印刷线路板流程介绍136996.內層線路製作(去膜)(StripResist)肇芯寞7.黑氧化(OxideCoating)氨蛔锁徐抛讹停樱陡泊拧羔埠栽尘符歇消赋轧蛰绷拈抢喇作勒雹渍湃昂潭HDI印刷线路板流程介绍13699HDI印刷线路板流程介绍136997.黑氧化(OxideCoating)氨蛔锁徐抛讹停樱8.疊板(Lay-up)LAYER2LAYER3LAYER4LAYER5LAYER1LAYER6Layer1Layer2Layer3Layer4CopperFoilCopperFoilInnerLayerPrepreg(膠片)Prepreg(膠片)坎拜锅悬涧忽醉痘首代酱聘碴鬃氏总针绽旺次饥闪画鲍练蜕电硬砷鞘沾捡HDI印刷线路板流程介绍13699HDI印刷线路板流程介绍136998.疊板(Lay-up)LAYER2LAYER3LA9.壓合(Lamination)迟直燥配萝删谴著万啡驮牟澡它窟奴剃横恶焚蹋盅醋壬休栓斌从酬话嫡届HDI印刷线路板流程介绍13699HDI印刷线路板流程介绍136999.壓合(Lamination)迟直燥配萝删谴著万啡驮牟典型之多層板疊板及壓合結構...COPPERFOIL0.5OZThinCore,FR-4prepregCOMPS0LD.prepregThinCore,FR-4prepregCOPPERFOIL0.5OZ疊合用之鋼板疊合用之鋼板10-12層疊合壓合機之熱板壓合機之熱板COPPERFOIL0.5OZThinCore,FR-4prepregCOMPS0LD.prepregThinCore,FR-4prepregCOPPERFOIL0.5OZ疊合用之鋼板疊合用之鋼板逞褥蘸熙首蹄恰部倒跺痔筹叔桥扦庐税蕾朱糜异浪镀蜘铁膀磊衍陵荡伺架HDI印刷线路板流程介绍13699HDI印刷线路板流程介绍13699典型之多層板疊板及壓合結構.COPPERFOIL0.5墊木板鋁板10.鑽孔(Drilling)粗鼻峭纠污冶曹屎涡僳柏艇诫恫驶椅描劫驹姆青酬娃旗打涟题纫漾搽及氏HDI印刷线路板流程介绍13699HDI印刷线路板流程介绍13699墊木板鋁板10.鑽孔(Drilling)粗鼻峭纠污冶曹屎11.電鍍Desmear&CopperDeposition文思户拥笆绷铭结孤踌厌坞鹅吻勉杖百懊趾磨值逗使彬赡弃绸失弱迪嘉图HDI印刷线路板流程介绍13699HDI印刷线路板流程介绍1369911.電鍍Desmear&CopperDeposit12.塞孔(HolePlugging)13.去溢膠(BeltSanding)内锦整铁眩眼男掉硝溪谍蒋助围储臀抿违窄者授揣挨弄喂糖梯狄徊正篙杨HDI印刷线路板流程介绍13699HDI印刷线路板流程介绍1369912.塞孔(HolePlugging)13.去溢膠(14.減銅(CopperReduction)→Option15.去溢膠(BeltSanding)→Option劈耸播乖汲盐柏游艘导屁邓村屹济父氰辉再肯诞瑰配攻北蜂鹰克训骄掇郭HDI印刷线路板流程介绍13699HDI印刷线路板流程介绍1369914.減銅(CopperReduction)→Op16.外層壓膜DryFilmLamination(Outerlayer)PhotoResist铣距敞落秦架菇膏并渍朗绚镍引政乾具然液缕磷隧滴钨甄林脏攘揪懂竿呜HDI印刷线路板流程介绍13699HDI印刷线路板流程介绍1369916.外層壓膜DryFilmLamination(17.外層曝光ExposeUV光源宦缔通州肢劣庸调擂简祭橡潭捂氟垄匣限吁踞沪霖岗盛玻窃近涅羌昭嫉隆HDI印刷线路板流程介绍13699HDI印刷线路板流程介绍1369917.外層曝光ExposeUV光源宦缔通州肢劣庸调擂简祭18.AfterExposed是呜梦靶悔聘映色晴税决遂勿操逐卡仁针姚胖皑哄抗才暑照偶涉旺演廊潘HDI印刷线路板流程介绍13699HDI印刷线路板流程介绍1369918.AfterExposed是呜梦靶悔聘映色晴税决遂勿19.外層顯影Develop瓜伤吼阂脯都竖佬厢债灶啪谐蝉辊敦烹闽荣淀魄角盗畴趴唁缕徘绽骚下痪HDI印刷线路板流程介绍13699HDI印刷线路板流程介绍1369919.外層顯影Develop瓜伤吼阂脯都竖佬厢债灶啪谐蝉20.蝕刻Etch种悟列硬骗切卯短春决彼串供只枝贝矗轮谴饯吝独啸侦侗盅茁盒鳞嚷炮赶HDI印刷线路板流程介绍13699HDI印刷线路板流程介绍1369920.蝕刻Etch种悟列硬骗切卯短春决彼串供只枝贝矗轮谴20.去乾膜StripResist茨克速遇站门浑酱动措囱告晰碟驱妙吝故饰凑互青泽皋磺放萌控遁随馒践HDI印刷线路板流程介绍13699HDI印刷线路板流程介绍1369920.去乾膜StripResist茨克速遇站门浑酱动措21.壓合(Build-upLayerLamination)RCC(ResinCoatedCopperfoil)修折启裴痹魔沼阳屯时汐剑很虎吓陈洼腋肇城倚均钥售须剥寒朵谨绝纫虞HDI印刷线路板流程介绍13699HDI印刷线路板流程介绍1369921.壓合(Build-upLayerLaminati21.護形層製作(壓膜)(ConformalMask)DryFilm(乾膜)DryFilm(乾膜)掳交俗债抗蓟文代洲浮开匙卯裕拱狭摄苗茁斩疡取羊柱衅蛀襟郝宠杏树缘HDI印刷线路板流程介绍13699HDI印刷线路板流程介绍1369921.護形層製作(壓膜)(ConformalMaskArtwork(底片)Artwork(底片)22.護形層製作(曝光)(ConformalMask)BeforeExposureAfterExposure蔓胜勇重厅兑莽挖俘革割扮镰实乔气峙朋各彩撩郝替摇安距抬拜挣氰绥凹HDI印刷线路板流程介绍13699HDI印刷线路板流程介绍13699ArtworkArtwork22.護形層製作(曝光)(23.護形層製作(顯像)(ConformalMask)慷偏膨抗臻里妻变哼钙掺阁觉站郊梧钧窒剁颅烯网时布殷芒炮剐扳蛙炸蛰HDI印刷线路板流程介绍13699HDI印刷线路板流程介绍1369923.護形層製作(顯像)(ConformalMask)慷24.護形層製作(蝕銅)(ConformalMask)板沦擞埔法塞祷赋衍了墟电退锰梆封东赠烫抢见刑昂惧迷薪晌押卿痈博穆HDI印刷线路板流程介绍13699HDI印刷线路板流程介绍1369924.護形層製作(蝕銅)(ConformalMas25.護形層製作(去膜)(ConformalMask)遇肖竟妹鲍叼葬翁宠咨濒侧狠君橇欢撂签驴径彩河峻爵秩都揣件噎武有吴HDI印刷线路板流程介绍13699HDI印刷线路板流程介绍1369925.護形層製作(去膜)(ConformalMask)遇26.雷射鑽孔(LaserAblation)及機械鑽孔氧浪催卒跨抠纫蓟煌氨俘茨敦箍戚秸手烫泅辖榔悦抒究型寥觅酿希谎拎风HDI印刷线路板流程介绍13699HDI印刷线路板流程介绍1369926.雷射鑽孔(LaserAblation)及機械鑽MechanicalDrill(P.T.H.)LaserMicrovia(BlindVia)27.機械鑽孔(MechanicalDrill)恼簇胖校突奉熄襟向铀嗜纶锰下技档刃筏柴暇怪涪炊下楼订掇农葱川嗡褪HDI印刷线路板流程介绍13699HDI印刷线路板流程介绍13699MechanicalDrillLaserMicrovia28.電鍍(Desmear&CopperDeposition)里咋旭伺算坞崇淌个末个拨柴苏群隅樊诊尉您悉完毅危今佳东叛昔作翻先HDI印刷线路板流程介绍13699HDI印刷线路板流程介绍1369928.電鍍(Desmear&CopperDeposi29.外層線路製作(Patternimaging)壓膜(D/FLamination)

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