芯片绑定介绍

1、WIRE BOND PROCESS INTRODUCTION1CONTENTS ASSEMBLY FLOW OF PLASTIC IC Wire Bond 原理 M/C Introduction Wire Bond Process Material SPEC Calculator DEFECT2封裝簡介晶片Die金線 Gold Wire導線架Lead fram3Wafer GrindingDie BondingWafer Sawtoaster Wire BondingDie Surface Coating Molding Laser Mark Solder Ball Placement Sin

2、gulationPacking封裝流程 Dejunk TRIM Solder Plating Solder Plating Dejunk TRIM TRIM/ FORMING BGASURFACEMOUNTPKGTHROUGHHOLE PKG4Wire Bond 原理padleadGold wireBall Bond( 1st Bond )Wedge Bond( 2nd Bond )5GLASSCONTAMINATIONVIBRATIONSiO2SiGOLD BALLPRESSUREMOISTURE AL2O3Al B.PRINCIPLE6銲接條件 HARD WELDING Pressure

3、(Force)Amplify & Frequecy Welding Time (Bond Time)Welding Tempature (Heater)THERMAL BONINGThermal Compressure Ultrasonic Energy (Power)7Bond Head ASSY Low impact forceReal time Bonding Force monitoring High resolution z-axis position with 2.5 micron per step resolution Fast contact detection Suppres

4、sed Force vibration Fast Force response Fast response voice coil wire clamp8X Y TableLinear 3 phase AC Servo motorHigh power AC Current AmplifierDSP based control platformHigh X-Y positioning accuracy of +/- 1 mmResolution of 0.2 mm9W/H ASSY changeover Fully programmable indexer & tracks Motorized w

5、indow clamp with soft close feature Output indexer with leadframe jam protection feature Tool less conversion window clamps and top plate enables fast device10EagleBonding SystemBonding Method Thermosonic (TS)BQM Mode Constant Current, Voltage, Power and Normal (Programmable)Loop Type Normal, Low, S

6、quare & JXY Resolution 0.2 umZ Resolution (capillary travelling motion)2.5 umFine Pitch Capability 35 mm pitch 0.6 mil wireNo. of Bonding Wires up to 1000Program Storage 1000 programs on Hard DiskMultimode Transducer System Programmable profile, control and vibration modesMACHINE SPECIFICATIONS (I)1

7、1Eagle Vision SystemPattern Recognition Time 70 ms / pointPattern Recognition Accuracy + 0.37 umLead Locator Detection 12 ms / lead (3 leads/frame)Lead Locator Accuracy + 2.4 umPost Bond Inspection First Bond, Second Bond Wire TracingMax. Die Level Different 400 500 umFacilitiesVoltage 110 VAC (opti

8、onal 100/120/200/210/220/230/240 VACMACHINE SPECIFICATIONS (II)12Eagle Material Handling SystemIndexing Speed 200 250 ms 0.5 “ pitchIndexer Resolution 1umLeadframe Position Accuracy + 2 milApplicable Leadframe W = 17 75 mm bonding area in Y = 65mm = 17 90 mm bonding area in Y = 54mm L = 280 mm Maxim

9、um T = 0.075 0.8 mmApplicable Magazine W = 100 mm (Maximum) L = 140 300 mm H = 180 mm (Maximum)Magazine Pitch 2.4 10 mm (0.09” 0.39 “)Device Changeover 4 minutesPackage Changeover 100 0,4 90/1004,8,11 9011,15IC type loop type69Gold Wire Gold Wire Manufacturer (Nippon , SUMTOMO , TANAKA. ) Gold Wire

10、Data ( Wire Diameter , Type , )70SPEC Pad Open & Bond Pad Pitch Ball Size Ball Thickness Loop height Wire Pull Ball short Crater Test71BPO&BPP 單位: um or Mil BPO :是指Pad內層X方向及Y方向的size,一般是取最小值為 我們的data BPO :是指Pad如左邊內層至右邊Pad左邊外層邊緣其它依此類推;或著一個Die上出現不同Pad大小那就是以兩個Pad中心距離為BPP,但是一般我們要取一個Die上最小的BPPBond Pad Pit

11、chBond Pad OpenBond Pad Open72Ball SizeBall ThicknessBall Size & Ball Thickness 單位: um，Mil 量測倍率: 50X Ball Thickness 計算公式 60 um BPP 1/2 WD=50% 60 um BPP 1/2 WD=40%50%Ball Size73Loop Heigh 單位: um，Mil 量測倍率: 20XLoop Height 線長74Wire Pull 1 Lifted Bond (Rejected) 2 Break at neck (Refer wire-pull spec) 3 B

12、reak at wire ( Refer wire-pull spec) 4 Break at stitch (Refer stitch-pull spec) 5 Lifted weld (Rejected)75Ball Short 單位: gram or g/mil Ball Shear 計算公式 Intermetallic（IMC）有75%的共晶,SHEAR STRENGTH 標準為6.0g/mil。 SHEAR STRENGTHBall Shear/Area (g/mil) Ball Shear = x; Ball Size = y; Area = (y/2) x/(y/2) = z g

13、/mil76CBall bondTest specimenSpecimen clampShearing ramWireBond shoulderInterfacial contactball bond weld areaBonding padh(A) UnshearedCLCBall bondCLTest specimenSpecimen clampBonding padFull ball attached towire-except for regionsof intermetallic voidingBall separated at bonding pad-Ball interface-

14、residual intermetallic(and sometimes portion of unalloyedball and metal) on pad in bondinteraction area(D) Ball bond-bonding pad interface separation (typical Au to Al)CTest specimenSpecimen clampShearing ramWireMinor fragment of ballattached to wireBonding padCLBall sheared too high(off line, etc.)

15、only aportion of shoulder andball top removedInterfacial contactball bond weld area(B) Wire (ball top and/or side) shearCBall bondCLTest specimenSpecimen clampShearing ramBonding padMajor portionof ball attached to wireInterfacial contact-ball bond weld areaintact(C) Below center line shear, ball sh

16、eared through (typically Au to Au)CBall bondCLTest specimenSpecimen clampBonding padPad metallizationseparates fromunderlying surfaceResidual pad on ballball-pad interfaceremains intact(E) Bond pad liftsTest specimenSpecimen clampCBall bondCLBonding padBonding pad lifts,taking portion of underlyings

17、ubstrate material with it(F) CrateringResidual pad and substrate attachedto ball,ball-pad interface remainsintactShear Failure Modes77Crater Test78Calculate (I) UP Time = (Total Actual Production Times Total Repair Time )Total Actual Production TimeDOWN TIME RATE= Total Repair TimeTotal Actual Produ

18、ction TimesTotal Operator Actual Repair TimeTotal Operator Repair Frequency StoppagesTotal Actual Production Times Total Operator Repair Time Total Operator Repair Frequency StoppagesTotal Technical Actual Repair TimesTotal Technical Repair Frequency StoppagesMTTS (MEAN TIME TO STOP ) =MTBS (MEAN TI

19、ME BETWEEN STOP)=MTTA (MEAN TIME TO ASSISTANCE ) =79Calculate (II) MTBA (Mean Time Between Assistance) = Total Actual Production Times Total Technican Repair Times Total Technical Repair Frequency StoppagesMTBF(Mean Time Between Failure)= Total Actual Production Times Total Technician Repair TimeTot

20、al Change Parts Repair Frequency Stoppage規格寬度 製程寬度 規格上限 - 規格下限 6 ( 公差) (上限 or 下限 ) - 平均值 三個公差 CP ( 製程能力指標) = CPK = =80Quality 正常品 Material Problem 1st Bond issue (Peeling , Ball Lift , Off Center) 2nd Bond issue (滑針，縫點脫，short tail ) Looping Fail (wire snake wire，sweep wire loop base bent )81正常品82Material Problem83With BallWirePad SizeMissing B