QYResearch 半导体业务介绍：2023年全球半导体规模达到了5268亿美元

Copyright©|北京恒州博智国际信息咨询有限公司全球知名的半导体公司SemiconductorMarketResea网址：公司简介Whoweare行业涵盖各高科技行业产业链细分市场，如半导体、消费电子、光电显示、化工材料、可再生能源、汽车科技、通信、人工智能、机器人、机械制造、食品药品、医疗器械、农业、石油天然气等。分析师团队来自各产业领域的精英，拥有深厚造诣和丰富研究经验。QYResearch（北京恒州博智国际信息咨询有限公司）成立于2007年，总部位于美国洛杉矶和中国北京。经过连续17年多的沉淀，QYResearch是全球知名的大型咨询公司、具备全球高科技产业深度分析能力,并提供企业顾问咨询服务的研究机构。业务遍及世界160多个国家，在全球30多个国家有固定营销合作伙伴，在美国、欧洲、日本、韩国、印度、等有分支机构，在国内主要城市北京、石家庄、太原、大同、重庆、成都、长沙、武汉、昆明、广州、日照等地设有办公室和专业研究团队。半导体行业横跨半导体设备/零部件、半导体材料、IC设计、制造、封测、存储器、分立器件、传感器、光电显示、工程服务等。为全球及中国半导体产业链客户提供深度的市场调研服务，助力相关产业企业更快速发展。服务范围Whatwedo研究报告提供全球中国市场调研报告定制咨询根据客户需求，提供定制调研报告竞争分析企业调研、份额、成本盈利、客户等行业分析全球地区规模、产销量、价格、进出口等客户分布GlobalClientBase合作客户OurClients半导体产业链半导体市场规模根据世界半导体贸易统计组织（WSTS），2023年全球半导体规模达到了5268亿美元。根据预测，2030年全球半导体规模将达到8560亿美元。全球半导体市场规模（亿美元）增速9,0008,0007,0006,0005,0004,0003,0002,0001,00008,56130%25%20%15%10%5%8,14626.2%7,2477,1966,9156,8405,9845,7415,55914.3%5,26813.6%12.4%4,4046.8%4,1235.2%5.1%4.8%3.3%0%-3.9%-5%-10%-15%-8.2%-12.1%201920202021202220232024202520262027202820292030半导体市场规模细分根据世界半导体贸易统计组织（WSTS）数据，半导体细分领域，集成电路IC占比最高。9,0008,0007,0006,0005,0004,0003,0002,0001,00008,5618,1463366483196227,2477,1966,9156,8407332855632755586812695422585304855,9845,8012235275765,5591912234694105395,2691974383414343034,4041504323554,1231354044162382396,8456,5255,8365,8235,5685,5654,8834,8004,6302,0214,2843,6123,3342,0192,0202,0222,0232,0242,0252,0262,0272,0282,0292,030集成电路分立器件光电器件传感器合计半导体-Design根据调研，2023年全球半导体Fabless市场规模为2036亿美元，预计2030年将达到5469亿美元。全球Fabless规模（亿美元）增速6,0005,0004,0003,0002,0001,000040%35%30%25%20%15%10%5%5,4695,14033.9%33.5%4,28327.0%4,0373,8573,45320.0%15.2%2,58713.6%2,0361,9291,69820216.4%6.1%5.6%4.7%1,2681,1010%-3.4%-5%-10%20192020202220232024202520262027202820292030半导体-Fabless排名根据调研，2023年全球半导体Fabless3企业都分布在美国，其中英伟达占有全球超过20%的份额。2023Fabless收入（百2023Fabless收入（百万美排名企业名称2023Fabless份额排名企业名称2023Fabless份额万美元）元）英伟达高通博通奇景光电Semtech12345678949,16130,38228,18222,68013,8275,50824.14%14.92%13.84%6.79%2.71%1.76%1.58%1.52%1819202122232425269458698558358006396285985920.47%0.43%0.42%0.41%0.39%0.31%0.31%0.29%0.29%創意電子海光信息兆易创新慧荣科技北京君正瑞鼎科技汇顶科技AMD联发科美满电子联咏科技新紫光集团瑞昱半导体3,5883,2163,097韦尔股份MonolithicPowerSystems矽創电子Nordic102,4921,8211.22%0.89%27285455430.27%0.27%矽力杰复旦微电子世芯电子121314CirrusLogic,Inc.SocionextInc.乐尔幸半导体1,7891,5711,4280.88%0.77%0.70%2930315034644470.25%0.23%0.22%海思半导体Synaptics敦泰電子MegaChips15161,3901,2200.68%0.60%32334420.22%0.20%其他厂商17AllegroMicroSystems1,0490.52%3420,37110.00%半导体-制造半导体制造环节企业主要有两大类：Foundry和IDM。根据调研，2023年全球纯代工市场规模为亿美元、IDM制造环节规模为1386亿美元。预计2030年晶圆代工规模将达到2779亿美元。6,0005,0004,0003,0002,0001,00005,0654,7964,2263,9813,8261,8142,2863,5171,7232,1711,9332,8051,4822,7841,4451,8532,5171,3862,3741,4091,9481,2201,7211,1232,7792,0302,6262,0292,2932,0282,1282,0272,0122,0261,7932,0251,3232,0221,3392,0241,1312,0239657285982,0192,0202,021FoundryIDM半导体-制造企业份额半导体制造环节企业主要有两大类：Foundry和IDM。其中Foundry最大厂商为台积电，2023年占全球54%；IDM最大企业主要分布在韩国、美国和欧洲。年全球晶圆代工企业份额6.03%年全IDM企业制造环节份额台积电三星代工54.26%2023三星15.77%英特尔格罗方德SK海力士联华电子UMC中芯国际6.10%5.12%美光7.95%德州仪器2.63%高塔半导体力积电1.26%1.27%意法半导体3.62%4.43%2.74%2.75%1.82%0.84%1.81%世界先进VIS1.07%铠侠华虹半导体上海华力微1.93%1.43%索尼英飞凌恩智浦0.80%东部高科0.72%晶合集成0.88%英特尔0.84%AnalogDevices,Inc.(ADI)瑞萨微芯Microchip0.37%芯联集成0.55%稳懋半导体0.43%安森美1.41%其他厂商5.55%其他厂商30.19%半导体-OSAT半导体封测环节企业主要有三大类：、IDM和Foundry。根据调研，2023年全球市场规模为377亿美元，预计2030年将达到574亿美元。全球市场规模（亿美元）增速700600500400300200100025%20%15%10%5%22.98%57454648748846646012.33%4294134108.63%3777.82%3365.77%5.10%3124.66%3.85%0%-4.30%-5%-10%-15%-12.07%201920202021202220232024202520262027202820292030半导体-OSAT企业份额根据调研，2023年全球前15大厂商占有接近85%的市场份额，核心厂商主要分布在中国台湾、美国、中国大陆、东南亚等地区。合肥颀中科技股份有限公司,0.6%其他厂商,15.9%UnisemGroup,0.8%甬矽电子,0.9%日月光,26.5%Semicon,0.9%Carsem,1.0%颀邦科技,1.7%南茂科技,1.8%京元电子,2.4%1.9%华天科技,4.1%安靠科技,17.2%力成科技,5.6%通富微电,7.8%长电科技,10.9%半导体设备根据SEMI（国际半导体产业协会）数据，2023年全球半导体设备市场规模为1063亿美元，预计2030年将达到1681亿美元。此外，根据调研，全球半导体二手/翻新设备市场规模也非常客观，2023年全球大约为35亿美元。全球半导体设备市场规模（亿美元）增速1,8001,6001,4001,2001,00080050%40%30%20%10%0%1,6811,60210.50%202943.96%1,4501,3731,3361,2801,0991,0761,0631,02519.26%16.55%7125975.60%5.01%4.90%4.30%6003.40%2.80%-1.29%400-8.15%-10%-20%200020192020202120222023202420252026202720282030半导体设备-企业排名根据调研数据，2023年全球前45大半导体设备厂商占有大约97%的市场份额。排名1企业ASML应用材料2023年半导体设备收入（百万美元）2023份额排名企业NuFlareInc.盛美上海2023年半导体设备收入（百万美元）2023份额0.51%0.49%0.47%0.35%0.35%0.30%0.26%0.22%0.22%0.18%0.16%0.16%0.15%0.12%0.10%0.05%19,69812,9978,9227,6202,9652,4582,3542,2061,9001,8191,5161,4411,2671,2481,21021.8%18.5%12.2%8.4%7.2%2.8%2.3%2.2%2.1%1.8%1.7%1.4%1.4%1.2%1.2%1.1%242526272829303132333435363738395445235003753713212752382371881721681591231087723东京电子4泛林半导体KLAProSystemsSCREENIPS拓荆科技华海清科567北方华创爱德万SUSSGroupTECHNO,Ltd.芯源微89ASMInternationalHitachi泰瑞达101213141516Eugene比思科集团LasertecJusungEngineeringOxfordInstruments中科飞测DISCOCorporationCanonU.S.A.NikonPrecisionInc细美事至纯科技TESCO.,1718Ebara1,0288841.0%0.8%4041SamcoInc.56560.05%0.05%AxcelisInc精测电子1920212223中微公司KokusaiElectric屹唐半导体OntoInnovation爱思强8828347926835750.8%0.8%0.7%0.6%0.5%4243444546Plasma-Therm弘塑科技漢辰科技天虹科技其他厂商55500.03%0.03%0.02%0.01%3.00%30283,186半导体二手设备-企业排名根据调研数据，2023年全球前50大半导体二手/翻新设备厂商占有大约95%的市场份额。排名企业名称2023二手设备收入（百万美元）2023份额排名企业名称2023二手设备收入（百万美元）2023份额12LamResearchAppliedMaterials,Inc.(AMAT)KLAProSystemsASML897.56458.80342.90341.49129.15115.0087.1180.6753.9152.6743.8342.8133.1032.6631.9831.7530.3229.4129.1527.7527.2125.9725.9125.2625.12%12.84%9.60%9.56%3.61%3.22%2.44%2.26%1.51%1.47%1.23%1.20%0.93%0.91%0.90%0.89%0.85%0.82%0.82%0.78%0.76%0.73%0.73%0.71%2627282930313233343536CanonU.S.A.MoovTechnologies,Inc.合肥开悦半导体嘉芯半导体21.2720.2719.7219.7219.4216.9615.7115.6015.5815.4915.1814.1414.0413.3313.2412.2411.8711.5211.3810.7810.4110.329.860.60%0.57%0.55%0.55%0.54%0.47%0.44%0.44%0.44%0.43%0.42%0.40%0.39%0.37%0.37%0.34%0.33%0.32%0.32%0.30%0.29%0.29%0.28%0.27%345CAEOnlineMaestechCo.,Ltd争丰半导体6SurplusGLOBALNikon7上海微高精密寶虹科技8吉姆西半导体9KokusaiElectricIntelResaleCorporaton三井住友金融与租赁ASMInternational无锡卓海科技E-TechSolutionInc.亦亨电子101112131415161718192021222324Entrepix,Inc37AMTE(AdvancedMaterialsTechnology&Engineering)383940414243444546474849DISCOCorporationClassOneEquipmentCISCorporation江苏大摩半导体PJPTECH上海图双精密MeidenshaCorporationSemicat,IncIchorSystemsTEL(TokyoElectronLtd.)HightecSystems盛吉盛EquipNet,Inc上海广奕电子靖洋集團RussellCo.,LtdAxcelisTechnologiesIncEbaraTechnologies,Inc.(ETI)江苏晋誉达IntertecSalesCorp.AxusTechnologyAGSemiconductorServices(AGSS)ULVACTECHNO,Ltd.9.54MacquarieSemiconductorandTechnology2523.060.65%50SCREENSPEGermanyGmbH9.120.26%半导体材料根据SEMI数据，2023年全球半导体材料市场规模为667亿美元，预计2030年将达到1022亿美元。其中晶圆制造材料占比62%、封装材料占比38%。1,2001,00080060040020001,022971860334853330821321803312398727280379703275667252643239555205520192623592523526492500447429415404350328201920202021202220232024202520262027202820292030晶圆制造材料封装材料合计半导体材料-细分如下是三个代表性的半导体材料，根据调研，全球范围内企业排名如下：2023全球半导体硅片市场排名全球CMP抛光液与抛光垫排名2023全球半导体光刻胶企业排名2023DuPont26.23%21.10%信越半导体23.81%18.98%东京应化TOK信越化学Shin-EtsuJSR23.28%19.35%17.12%英特格(CMCMaterials)FujimiIncorporatedResonac日立化成安集科技8.97%6.82%5.13%SUMCO环球晶圆13.02%9.89%9.28%6.14%2.82%DuPont12.59%12.40%MerckKGaA(VersumMaterials)富士胶片FujifilmJSRCorporationAGC4.54%4.12%3.57%2.46%2.35%2.22%1.78%1.62%1.35%1.27%0.90%Siltronic世创SKSiltron富士胶片Fujifilm东进世美肯住友化学3.68%2.87%Soitec鼎龙控股KCTech彤程新材1.10%2.88%台塑胜高科技中环领先MerckKGaA(AZ)Soulbrain富士纺Fujibo智勝科技IVT晶瑞电材0.30%2.77%2.64%2.40%1.90%1.27%0.76%0.51%0.51%SKMaterials徐州博康0.60%杭州中欣晶圆沪硅产业SKC(SKEnpulse)圣戈班0.55%0.52%YCCHEMCo.,Ltd东进世美肯0.58%恒坤新材料0.30%Futurrex0.29%合晶集团公司立昂微（金瑞泓）上海超硅半导体北京奕斯伟科技普兴电子TOPPANINFOMEDIA0.55%KPXChemical0.46%TWIIncorporated0.38%英格斯Engis0.31%3M0.27%KemLab™Inc0.24%永光0.18%AllresistGmbH0.14%江苏艾森半导体0.07%捷斯奥集团0.24%FNSTECH0.23%AceNanochem0.19%Vibrantz(Ferro)0.17%江丰电子0.12%上海新阳半导体珠海基石0.02%飞凯材料0.02%有研硅0.37%0.02%麦斯克0.32%浙江中晶科技0.16%国盛电子0.15%新安纳电子0.09%天津海伦晶片0.04%北京航天赛德0.04%川研科技0.02%国科天骥0.02%容大感光0.00%北京欣奕华0.01%江苏南大光电0.04%昂士特科技0.01%其他厂商2.31%其他厂商1.92%其他厂商1.41%半导体设备零部件根据数据，2023年全球半导体设备零部件市场规模为286亿美元，预计2030年将达到472亿美元。核心厂商主要分布在美国、欧洲和日本。全球前60大厂商占有大约80%的市场份额。排名企业名称2023零部件收入（百万美元）2023份额排名企业名称2023零部件收入（百万美元）2023份额12345678ZEISSEntegris2,7281,6421,4811,4711,1491,0169058267757677357075935585415325285214814203552932692472282282152091931809.52%5.73%5.17%5.13%4.01%3.55%3.16%2.88%2.71%2.67%2.57%2.47%2.07%1.95%1.89%1.86%1.84%1.82%1.68%1.46%1.24%1.02%0.94%0.86%0.80%0.80%0.75%0.73%0.67%0.63%313233343536373839404142434445464748495051525354555657585960GST(GlobalStandarardTechnology)FoxsemiconIntegratedTechnologyCSK169.33160.62159.32157.30151.04150.98149.47144.97143.00121.13120.30119.88118.73117.17116.04111.99110.40107.84107.3697.900.59%0.56%0.56%0.55%0.53%0.53%0.52%0.51%0.50%0.42%0.42%0.42%0.41%0.41%0.40%0.39%0.39%0.38%0.37%0.34%0.32%0.31%0.31%0.29%0.29%0.27%0.23%0.22%0.19%0.18%MKSInstrumentsAtlasCopco(Leybold,andEdwardsVacuum)TrumpfPfeifferVacuumGmbHDAIHENCorporationWatlow(CRC)UltraCleanHoldingsInc.(UCT)NGKInsulatorsVATVakuumventileASMLIchorSystemsAppliedMaterials,Inc.(AMAT)AdvancedEnergyBrooksAutomationKyoceraShin-EtsuPolymerTOTOAdvancedCeramicsAdvancedThermalSciencesCorporation(ATS)MorganAdvancedMaterialsSMCCorporationSevenstar9101112131415161718192021222324252627282930MiraialCo.,Ltd.UnisemShinwaControlsHORIBAEbaraCorporationRORZECorporationLamResearchFerrotecSwagelokMiCoCeramicsCo.,Ltd.YaskawaSchunkXycarbTechnologyKuzeTosohQuartzCorporationLOTVacuumPallFujikinCamfil91.7088.2987.4383.4482.7476.9465.9362.69KawasakiRoboticsParkerCoorstekNiterraCo.,Ltd.CKDHirataCorporationJELCorporationSHINKODockweilerDurexIndustriesKITZSCTKashiyamaIndustriesXPPower(Comdel)NipponSeisenGEMÜHandyTube53.8851.88半导体零部件/服务-细分如下是三个代表性的半导体零部件/服务，根据调研，全球范围内企业排名如下：2023全球半导体设备用陶瓷排名年全球半导体熔射服务企业排名2023全球半导体Showhead排名2023NGKInsulatorsKyocera23.73%21.33%TOCALOKoMiCoUCT15.4%14.2%13.9%Lam(Silfex)57.40%HanaMaterialsAppliedMaterialsWorldexIndustryFitiGroup9.96%5.50%2.83%1.99%1.96%1.78%1.56%CoorstekNiterraCo.,Ltd.Ferrotec11.94%8.69%5.40%EnproIndustriesCinos6.5%6.3%MitsubishiMaterialsHahn&CompanyTokaiCarbonMorganAdvancedMaterialsTOTOAdvancedCeramicsMiCoCeramics珂玛材料5.09%4.10%4.03%PentagonTechnologiesMitsubishiChemical(Cleanpart)FrontkenCorporationBerhadHansolIONESOerlikonBalzersDFtech3.3%3.2%3.0%CoorsTek1.47%RSTechnologies1.25%VERSACONNCORP(VCC)1.17%DSTechno1.09%1.85%KrosakiHarimaCeramTec1.60%0.91%0.89%0.73%0.58%2.3%KCParts0.97%2.1%1.7%1.6%1.6%1.4%1.4%1.4%1.3%1.1%1.1%1.1%1.1%1.0%AGCNHKSpring0.75%上海卡贝尼OneSemicon0.71%SchunkXycarbTechnologyTechnoQuartz0.67%先锋精密0.