SMT常用部分英文技术术语-辅料部分

/11SMT常用部分英文技术术语一辅料部分1,产品名称Lead-Free无铅Material材料No-residue低残留No-clean免清洗SolderPaste锡膏SolderBar锡条SolderWire锡线SolderPerform预成型锡料SolderSphere球形锡料Flux助焊剂Cleaner清洗剂Thinner稀释剂SurfaceMountAdhesive表面贴装胶Underfill/Underfiller底部填充胶/填料Encapsulant/Sealant密封剂/胶Adhesive胶/粘合剂InstantAdhesive速凝胶Bonder邦定胶/黑胶Abrasive研磨剂Silicone硅脂Accelerator促进剂，加速剂Saponifier皂化剂Coating涂料，覆料Activator活化剂，活性剂Inhibitor阻缓剂ThermallyConductiveAdhesive导热胶ThermallyConductiveSilicone导热硅脂ElectricallyConductiveSilicone导电硅胶2，客户产品名称&客户部门及各部门员工职称液晶显示器LCD(LiquidCrystalDisplay)发光二极管LED(LightEmittingDiode)电阻resistance电阻器resistor整流器rectifier电容capacitance电容器capacitor/capacitator电感inductance电感器inductor/inducer变压器transformer蓄电池storagebattery继电器electricalrelay充电器charger/batterycharger电源power/powersupply集成电路IC(IntegratedCircuit)电路板circuitboard不间断电源UPS(UninterruptablePowerSupply)连接器connector操作指导书/工艺文件operationguide/processpaper设计文件DesignDocument技术标准technicalstandard3，产品测试项目Density/SpecificGravity比重Colour颜色Odor气味SolidContent/Percentagenonvolatile固体含量HalideContent卤化物含量FlashPoint闪点AcidNumber/Value酸值(酸价)Viscosity粘度值Foamingtest起泡试验Physicalstate/Appearance物理状态PHValue酸碱度BoilingPoint沸点MeltingPoint熔点UpperExplosionLimitsinair空气中爆炸上限LowerExplosionLimitsinair空气中爆炸下限Solubilityinwater水溶解度DynamicViscosity动态粘度值RequiredThinner使用稀释剂/配套稀释剂WaterContent含水量VaporPressure蒸汽压力EvaporationRate挥发率/挥发速度DryingPoint干点TLV(ThresholdLimitValue)临界值，极限值TLVofSolvent容许吸入量GlassTransitionTemperature玻璃化温度CoefficientofThermalConductivity导热系数TensileStrength抗拉伸强度ShearStrength抗剪切强度PowderMeshSize/Shape粉末(颗粒)尺寸/形状MetalContent金属含量CopperMirror铜镜测试SilverChromate铬酸银测试SIR(SurfaceInsulationResistance)表面绝缘阻抗VolumeResistance体积电阻率Hardness硬度DielectriConstant介电常数dielectricloss介电损耗dielectriclossangletangent介电损耗角正切waterabsorbingcapacity吸水率grainsize/particlesize颗粒(大小)分布rateofexpansion扩展率shrinkagefactor收缩率adhesionstrength/bondingstrength粘接强度linearexpansioncoefficient线性膨胀系数degreeofliberation游离度coefficientofthermalconductivity导热系数Corrosion腐蚀测试Ductilityfactor延展性系数Thixotropy触变性Thixotropyindex触变性指数linearcoefficientofthermalexpansion线性热膨胀系数ElasticityCoefficient弹性系数CreepStrength抗蠕变强度WhiskTest锡须发生测试（或其它金属须）4，助焊剂单位&包装&标签单位Oz盎司（Ounce,1Oz=28.35xx）g/gm克（gram）℃摄氏度［Celsius,1℃=（Tx1.8+32）=33.8°F］°F华氏度［Fahrenheit,1°F=（T-32）/1.8=-17.2℃］L升/公升［Litre,Liter,1L=0.2199xx（英），=0.2641加仑（美，液）］Pound/Lb.磅（1磅=0.4536千克）Gal.力口仑［Gallon,1Gal（英）=4.5461升，1Gal（xx）=3.7854升］标签ShelfLife贮存寿命WorkingLife工作寿命LotNo.批号Net/NetWeight净重Exp.Date有效期至Mfg.Date制造日期5，品质管理专业术语QC(qualitycontrol)品质管理(员)SQC(StatisticalQualityControl)统计品质管理TQC(TotalQuality^^「。^全面品质管理AQL(AcceptableQualityLevel)允许水准，可接受品质等级QA(QualityAudit)品质稽核QE(QualityEngineering)质量工程IPQC(InProcessQualityControl)制程检验FQC(FinalQualityControl)最终检验，线上检验OQC(OutgoingQualityControl)出货检验SIP(StandardInspectionProcedure)检验标准MQM(ModernQualityManagement)(日本)现代品质管理体系(比ISO9001严格)QCC(QualityControlCircle)CheckSheet6，其他项目被欧盟禁止的有害物质Lead铅PbCadmium镉CdMercury汞/水银HgHexavalentChromium六价铬Cr+6PBB(Polybrominatedbiphenyls)溴化联苯PBDE(Polybrominatedbiphenylether)溴化联苯醚常见金属中英文名tinxxSnlead铅Pbsilver银Agcopper铜Cubismuth铋Bizinc锌Znnickel镍Niantimony锑Sbaluminum铝AlCadmium镉Cdferrum铁Fechromium铬Crarsenic石砷Asxx名称及缩写JapanxxTaiwanxxTaiwanDistrict台湾地区HongkongxxU.S.A(UnitedStatesofAmerica)美国U.S(UnitedStates)美国SouthKoreaxx品管圈核查表，审查表U.K(UnitedKingdom)英国，联合王国ItalyxxWEEE—(WasteFromElectricalAndElectronicEquipment)欧盟《关于报废电子电器设备指令》(简称：WEEE指令)ROHS—(TheUseOfCertainHazardousSubstancesInElectricalAndElectronicEquipment)欧盟《关于在电子电气设备中限制使用某些有害物质指令》(简称：ROHS指令)ISO(InternationalOrganizationforStandardization)国际标准化组织Rework/Reworking返修CASxx化学文摘EMSOEMOSPENIGIMAgIMSnSAC(Sn/Ag/Cu)MSDS(MaterialSafetyDataSheet)PreheatZoneSoakZoneRamptoReflowReflowZoneCoolingZoneRef