印制电路板资料

印制电路中英对照一、粽合阖*H印裂11路：printedcircuit印^^路：printedwiringE喉板：printedboardE|3裂板K路：printedcircuitboard(pcb)E^^路板：printedwiringboard(pwb)E喉元件：printedcomponent7、印裂接黑占：printedcontact8、E|3裂板装酉己：printedboardassembly9、板：board10、罩面印裂板：single-sidedprintedboard(ssb)11、面印裂板：double-sidedprintedboard(dsb)12、多唇印裂板：mulitlayerprintedboard(mlb)13、多^印mft路板：mulitlayerprintedcircuitboard14、多^印^^路板：mulitlayerpritedwiringboard刚性印裂板：rigidprintedboard刚性罩面印裂板：rigidsingle-sidedprintedborad18、刚性多）1印裂板：rigidmultilayerprintedboard19、挠性多）1印裂板：flexiblemultilayerprintedboard20、捷性印裂板：flexibleprintedboard21、捷性罩面印裂板:flexiblesingle-sidedprintedboard22、捷性面印裂板：flexibledouble-sidedprintedboard23、挠性印裂Ut路：flexibleprintedcircuit（fpc）24、挠性印^^路：flexibleprintedwiringprinted25、刚性印裂板：flex-rigidprintedboard,rigid-flexboardprinted刚性面印裂板：flex-rigiddouble-sidedprintedboard,rigid-flexdouble-sidedprinted刚性多）1印裂板：flex-rigidmultilayerprintedboard,rigid-flexmultilayerprintedboard28、膂平印裂板：flushprintedboard29、金!!芯印裂板：metalcoreprintedboard30、金!!基印裂板：metalbaseprintedboard多重^^印裂板：mulit-wiringprintedboard陶瓷印裂板：ceramicsubstrateprintedboard醇制板：electroconductivepasteprintedboard34、模塑Ut路板：moldedcircuitboard35、模附喉板：stampedprintedwiringboard36、J®［序多)1印裂板：sequentially-laminatedmulitlayer37、散^印裂板：discretewiringboard38、微^印裂板：microwireboard39、SWf印裂板：buile-upprintedboard40、SWf多)1印裂板：build-upmulitlayerprintedboard(bum)41、SWf捷印裂板：build-upflexibleprintedboard42、表面唇合ft路板：surfacelaminarcircuit(slc)43、埋入凸现速印裂板：b2itprintedboard多唇膜基板：multi-layeredfilmsubstrate(mfs)全丙醇通多唇印裂板：alivhmultilayerprintedboard46、戴晶片板：chiponboard(cob)47、埋Ut阻板：buriedresistanceboard48、母板：motherboard49、子板：daughterboard50、背板：backplane51、裸板：bareboard52、板爽心板：copper-invar-copperboard53、勤熊捷性板:dynamicflexboard54、青等Ii挠性板：staticflexboard55、可断拼板：break-awayplanel56、W：cable57、挠性扁平^^:flexibleflatcable(ffc)58、薄膜HI皆U:membraneswitch59、混合ft路：hybridcircuit60、厚膜：thickfilm61、厚膜ft路：thickfilmcircuit62、薄膜：thinfilm63、薄膜混合ft路：thinfilmhybridcircuit64、互建：interconnection65、型见conductortraceline66、膂平^flushconductor67、AM俞球transmissionline68、跨交：crossover69、板遏插朝edge-boardcontact70、增弓金板：stiffener71、基底：substrate72、基板面：realestate73、^^面：conductorside74、元件面：componentside75、焊接面：solderside76、印裂：printing77、余周格：grid78、Bl形：pattern79、醇UBI形：conductivepattern80、非箝IBI形：non-conductivepattern81、字元：legend82、IOS:mark二、基材：1、基材：basematerial2、唇厘!板：laminate覆金!!箔基材：metal-cladbadematerial4、覆铜1箔)1厘!板：copper-cladlaminate(ccl)罩面覆铜1箔唇厘1板：single-sidedcopper-cladlaminate面覆铜1箔唇厘!板：double-sidedcopper-cladlaminate7、裱^合)1板：compositelaminate8、薄唇厘!板：thinlaminate9、金!!芯覆铜1箔唇厘1板：metalcorecopper-cladlaminate10、金!!基覆铜1）1厘1板：metalbasecopper-cladlaminate11、捷性恋嗣箔雒薄膜：flexiblecopper-claddielectricfilm12、基材料：basismaterial13、IS浸材料：prepreg14、粘条吉片：bondingsheetIS浸粘条吉片：preimpregnatedbondingsheer16、璟氧玻璃基板：epoxyglasssubstrate17、加成法用）1板：laminateforadditiveprocess18、BOH内）1覆箔板：masslaminationpanel内唇芯板：corematerial催化板材：catalyzedboard,coatedcatalyzedlaminate21、Uli催化）1厘!板：adhesive-coatedcatalyzedlaminate22、Uli瓢催板：adhesive-coateduncatalyzedlaminate23、粘条吉唇：bondinglayer24、粘条吉膜：filmadhesive25、Uli粘膂腺留^薄膜：adhesivecoateddielectricfilm26、瓢支撑II粘剜膜：unsupportedadhesivefilm27、覆:coverlayer(coverlay)28、增弓金板材：stiffenermaterial29、铜1箔面：copper-cladsurface30、去铜箔面：foilremovalsurface31、板面：uncladlaminatesurface32、基膜面：basefilmsurface33、II粘剜面：adhesivefaec34、原始光面：platefinish35、粗面：mattfinish36、畿向：lengthwisedirection37、模向：crosswisedirection38、剪切板：cuttosizepanel39、酚醛东氏St覆铜1箔板：phenoliccellulosepapercopper-cladlaminates(phenolic/paperccl)40、璟氧东氏St覆铜1箔板：epoxidecellulosepapercopper-cladlaminates(epoxy/paperccl)41、璟氧玻璃布基覆铜1箔板：epoxidewovenglassfabriccopper-cladlaminates42、璟氧玻璃布余球M合覆铜1箔板：epoxidecellulosepapercore,glassclothsurfacescopper-cladlaminates43、璟氧玻璃布玻璃^雉裱^合覆铜1箔板：epoxidenonwoven/wovenglassreinforcedcopper-cladlaminates44、聚酯玻璃布覆铜1箔板：ployesterwovenglassfabriccopper-cladlaminates45、聚酰克胺玻璃布覆铜1箔板：polyimidewovenglassfabriccopper-cladlaminates46、曼焉杰酰克胺三嗪璟氧玻璃布覆铜箔板：bismaleimide/triazine/epoxidewovenglassfabriccopper-cladlamimates47、璟氧合成雉布覆铜1箔板：epoxidesyntheticfiberfabriccopper-cladlaminates48、聚四乙烯玻璃^雉覆铜1箔板：teflon/fiberglasscopper-cladlaminates49、超薄型）1厘!板：ultrathinlaminate50、陶瓷基SM箔板：ceramicsbasecopper-cladlaminates51、紫外^阻擒型演嗣箔板：uvblockingcopper-cladlaminates三、基材的材料1、aF皆榭脂：a-stageresin2、bF皆榭脂：b-stageresin3、cF皆榭脂：c-stageresin4、璟氧榭月旨：epoxyresin5、酚醛榭脂：phenolicresin聚酉旨榭月旨：polyesterresin聚酰克胺榭脂：polyimideresin来酰克胺三嗪榭脂：bismaleimide-triazineresin丙烯酸榭脂：acrylicresin三聚富胺甲醛榭脂：melamineformaldehyderesin11、多官能璟氧榭脂：polyfunctionalepoxyresin12、澳化璟氧榭月旨：brominatedepoxyresin13、璟氧酚醛：epoxynovolac14、氟榭脂：fluroresin15、矽榭月旨：siliconeresin16、矽烷：silane17、聚合物：polymer18、瓢定形聚合物：amorphouspolymer19、余吉晶现象：crystallinepolamer20、晶现象：dimorphism21、共聚物：copolymer22、合成榭脂：synthetic23、热固性榭脂：thermosettingresin24、热塑性榭脂：thermoplasticresin25、感光性榭脂：photosensitiveresin26、璟氧富量：weightperepoxyequivalent(wpe)27、璟氧值：epoxyvalue28、曼富胺：dicyandiamide29、粘条阴W:binder30、II粘剜：adesive31、固化剜：curingagent32、阻燃剜：flameretardant33、遮光剜：opaquer34、增塑剜：plasticizers35、不鲍和聚酯：unsatuiatedpolyester36、聚酯薄膜：polyester37、聚酰克胺薄膜：polyimidefilm(pi)38、聚四氟乙烯：polytetrafluoetylene(ptfe)39、聚全氟乙烯丙烯薄膜：perfluorinatedethylene-propylenecopolymerfilm(fep)40、增弓金材料：reinforcingmaterial41、玻璃^雉：glassfiber42、e玻璃^雉：e-glassfibre43、d玻璃^雉：d-glassfibre44、s玻璃^雉：s-glassfibre45、玻璃布：glassfabric46、非^布：non-wovenfabric47、玻璃^雉塾：glassmats48、yarn49、filament50、股：strand51、weftyarn52、warpyarn53、但尼:denier54、^向：warp-wise55、东草向：weft-wise,filling-wise物；10阜密度：threadcount物weavestructure58、平敏plainstructure59、1s布：greyfabric60、稀唇微物：wovenscrim61、弓球bowofweave62、05：endmissing63、缺余草：mis-picks64、东草斜：bias65、折痕：crease66、waviness67、龟眼：fisheye68、毛圈H：featherlength69、厚薄段：mark70、裂split71、热度：twistofyarn72、浸灌!剜含量：sizecontent73、浸润蒯残留量：sizeresidue74、虑理剜含量：finishlevel75、浸灌!剜：size76、偶嗡HW:couplintagent77、虑理^物：finishedfabric78、聚酰胺雉：polyarmidefiber79、聚酯^雉非^布：non-wovenpolyesterfabric80、浸清余氏：impregnatinginsulationpaper81、聚芳酰胺^雉余氏：aromaticpolyamidepaper82、断裂H：breakinglength83、吸水高度：heightofcapillaryrise84、漏弓金度保留率：wetstrengthretention85、白度：whitenness86、陶瓷：ceramics87、醇Ut箔：conductivefoil88、铜1箔：copperfoil89、ft解铜箔：electrodepositedcopperfoil(edcopperfoil)90、延铜1箔：rolledcopperfoil91、退火铜箔：annealedcopperfoil92、延退火铜箔：rolledannealedcopperfoil(racopperfoil)93、薄铜箔：thincopperfoil94、铜箔：adhesivecoatedfoil95、Uli月旨铜箔：resincoatedcopperfoil(rcc)96、裱^合金!!箔：compositemetallicmaterial97、载11箔：carrierfoil98、殷瓦：invar99、箔(剖面)翰廓：foilprofile100、光面：shinyside101、粗糙面：matteside虑理面：treatedside防鳏理：stainproofing104、面虑理纲1箔：doubletreatedfoil四、to原理H:shematicdiagramBWBl:logicdiagram印^^路傣printedwirelayoutIK：masterdrawing5、可裂造性design-for-manufacturabilityUtlP甫助computer-aideddesign.(cad)UtlP甫助裂造：computer-aidedmanufacturing.(cam)ft月面集成裂造：computerintegratmanufacturing.(cim)UtlP甫助工程：computer-aidedengineering.(cae)10、flip甫助测IS：computer-aidedtest.(cat)11、ft子^^自勤化：electricdesignautomation.(eda)工程自勤化：engineeringdesignautomaton.(eda2)到装薪^自勤化：assemblyaidedarchitecturaldesign.(aaad)HIP甫助mBl:computeraideddrawingft月面控制IS示：computercontrolleddisplay.(ccd)佛局：placement17、:routing18、布置layout19、重布：rerouting20、模fihsimulation21、BWIH比：logicsimulation22、Ut路IK比：circitsimulation23、日寺序模88:timingsimulation24、模化：modularization25、傣完成率：layouteffeciency26、械器描述格式：machinedescriptionmformat.(mdf)27、械器描述格式H料H:mdfdatabse28、料H：designdatabase29、黑占：designorigin30、僵化OPt:optimization(design)31、供tStHS化坐HU:predominantaxis32、表格原黑占：tableorigin33、II像：mirroring34、Uffe文件：drivefile35、中fW槽：intermediatefile36、裂造检manufacturingdocumentation37、彳宁列支撑H料H:queuesupportdatabase38、元件安置：componentpositioningIB形IS示：graphicsdispaly比例因数：scalingfactor描描填充：scanfilling42、矩形填充：rectanglefilling43、填充域：regionfilling44、physicaldesign45、thlogicdesign46、路：logiccircuit47、唇次hierarchicaldesign48、自IM向下薪也top-downdesign49、自底向上薪也bottom-updesign50、M：net51、数位化：digitzing52、理郎」检查：designrulechecking53、走(布)^器：router(cad)54、余周路表：netlist55、UtlP甫助ft路分析：computer-aidedcircuitanalysis56、子^余罔：subnet目襟函数：objectivefunction理：postdesignprocessing(pdp)59、互勤式装UtSthinteractivedrawingdesign60、费用矩障：costmetrix工程H:engineeringdrawing方我1框H：blockdiagram63、迷宫：moze64、元件密度：componentdensity65、巡:iM售®travelingsalesmanproblem自由度：degreesfreedom入度：outgoingdegree68、出度：incomingdegree69、曼哈联(距离隹：manhattondistance70、It黑裹德距离隹：euclideandistance71、余周路：network72、障列：array73、段：segment74、:logic75、自9b化:logicdesignautomation76、分球separatedtime77、分高separatedlayer78、定J®［序：definitesequence五、形状奥尺寸：1、(通道)：conduction(track)2、(H)3s度：conductorwidth3、^^距离隹：conductorspacing4、)1:conductorlayer5、3s度/fW距：conductorline/space6、第一^:conductorlayerno.119、偏置速接H:offsetland腹（背）裸IS:back-bardlandIS址：anchoringspaur22、速接UBI形：landpattern23、速接SO罔格障列：landgridarray24、孔璟：annularring25、元件孔：componenthole26、安装孔：mountinghole27、支撑孑L:supportedhole2838、瓢速接IS孔：landlesshole39、中fW孔：interstitialhole40、瓢速接H醇通孔：landlessviahole41、引醇孔：pilothole42、端接全隙孔：terminalclearomeehole43、准表面fWmt孑L：quasi-interfacingplated-throughhole44、准尺寸孔：dimensionedhole45、在速接IS中醇通孔：via-in-pad46、孔位：holelocation47、孔密度：holedensity48、孑LU：holepatternductor60、^度：designwidthofconductor中心品巨：centertocenterspacing/fW距：conductorwidth/space63、距：pitch64、精系曲都距：finepitch65、）W:layerjWfWSl：layer-to-layerspacing67、遏品巨：edgespacing68、外形trimline69、截面稹：crossectionarea70、真K值表测量：truthtabletest型不售位置：truepositiontolerance72、精不售位置：accuracy73、精碓位cumulativetolerance74、精不售度：accuracy84、醇通系周路：basicgrid85、醇通系周格：trackgrid86、醇通孔系周格：viagrid87、速通30罔格：pad(land)grid88、定位偏差：positionaltolerance89、封型靶H：bornbsight90、梳状Bl形：combpattern91、封型襟言己：registermark92、散^^:heatsinkplane六、IltlR互建表面fW速接：interlayerconnection)WfW速接：interlayerconnection12、St穿速接：throughconnection13、支^:stub14、印裂插HI：tab15、筵梢：keyingslot16、速接器：connector板遏速接器：edgeboardconnector18、速接器GS:connectorarea19、直角板遏速接器：rightangleedgeconnector20、偏梢口：polarizingslot21、偏置端接GS:offsetterminalarea22、接地：ground23、端接隔离隹（空璟）：terminalclearance24、速通性：continuity25、速接器接斶：connectorcontact26、接福蜀面稹：contactarea35、插卡速接器：card-insertionconnector36、截流量：current-carryingcapacity37、:path38、最短路彳系:shortestpath39、徽涯路criticalpath40、倒角：miter41、串推：daisychain42、斯坦系内榭：steinertree43、最小生成榭：minimumspanningtree(MST)44、瓶SOS度：neckedwidth45、短叉I1度：spurlength46、短柱I1度：stuble