日本电气化学(Denka)散热铝基板中文介绍

1、Insulated Metal Substrate HITT PLATE绝缘高导热铝基板DENKI KAGAKU KOGYO .日本电气化学工业有限公司DENKAAutomotive音频Audio发光二极管LED标准(IMS)换流器Inverter晶体管TransistorDC/DC Converter 直流 /直流转化器Motor driverNew Usage 新应用Power Supply 电源供应器Power Electronics 动力电子设备Suitable field for IMSThe适用于工业管理学会Power supply 电源供应器CPU board 中央处理器主板VT

2、R, TV 磁带录像机 ,电视马达驱动器Power AMP. 功率放大器Computer 电脑 高导热铝基板Tuner 调谐器EPS 应急电源装置 Power module 电源模块The field suitable for Hybrid IC 适用与混合集成电路领域Regulator 调节器Regulator 调节器Motor regulator 马达调节SW regulator 开关调节器Pre-AMP. 前置放大器汽车Communication通讯High frequency AMP高频放大器Oscillator振荡器Micro-strip circuit微带型混频器Classific

3、ation of printed circuit board 印刷线路板的分类Substrate with thick film circuit. 厚膜陶瓷线路板Substrate with thin circuit. 薄膜陶瓷线路板Substrate Multi-layer 多层陶瓷线路板Ceramic substrate 陶瓷基片Comparison of properties with each substrate 每种基材的性能对照Evaluate item 评估项目Insulated metal substrate 绝缘金属基材Alumina substrate铝基材Glass-ep

4、oxy substrate玻璃环氧树脂基材Thermal resistance oC/W热变电阻(80um)(635um)Breakdown voltage 击穿电压Heat resistance 耐热性Dielectric constant 介电常数7-894-5Specific heat 比热系数Mechanical strength 机械强度XProcessing 制程XMass process 量产性*Al base type基本类型Typical structure of IMS 标准层 的典型结构Conductor (Cu foil, etc.) 导体(铜箔等)Insulator绝

5、缘层Metal Base( Al, Cu, Fe, etc.)金属基材(铝，铜，铁等)ical structure of HIC典型的混合集成电路结构Ni plating 镍层Al wire铝丝Plastic case塑胶外壳Semiconductor半导体Chip resistance 贴片电阻Resin树脂Lead terminal引线端子Insulator绝缘层Aluminum board 铝板IMS 标准层Development performance of IMS 标准层的发展方向Improvement of Insulator 绝缘层的改善 Higher thermal condu

6、ctivity, higher reliability and higher heat resistance. 更高的导热系数，高可靠性和高耐热性 .Field of each substrate 每种基材的领域额)V(egatlovdeta压电定Air conditioner空调设备HITT PLATE(IMS) 高导热铝基板Industrial machine 工业机器氧化铝层AlN substrate 氮化铝层Audio 音频50Market request 市场需求100 Rated current(A)额定电流Cost down, down sizing andH igher the

7、rmal conductivity 低成本小型化高导热系数Thermal conductivity 导热系数2W/mKTH-14W/mK8W/mKLineup of HITT PLATE s ins绝ula缘to高r 导热铝基板的应用范围导)Km/W(ytivitcudnoclamreh数系热Usage : Industry, LED, etc. 应用：工业， LED等TH-1高耐热高导热型Usage : Consumer products, Industry, etc.应用：消费品，工业等M-2 heHaigth rheesaits rteasi耐热性EL-1高耐焊裂型Usage : Onl

8、y automotive 应用：仅仅汽车Heat cycle reliability 长 期可靠性Comparison of HITT PLATE高 导热铝基板对照600 650阻电变热W/Coecnatsiserlamreh00 50 100 150 200 Thickness of insulator 绝缘层厚度Test sample测试样品TO-2202SC2233)The results of thermal resistance by thermal viewer热变电阻耐热测试的结果IMS B-1(8W/mK) type IMS B-1类型 Alumina DBC氧化铝合基板Low

9、低High高.最高温度Typical properties of super high thermally conductive type 典型的超高导热类型性能Property 性能Test method 测试方法Unit 单位一般型 K-1高导热高耐热型 TH-1超高导热型 B-1Thermal conductivity导热系 数Laser flash method 激光闪光光解W/mKThermal resistance热变电阻DKK method 便携式 PH分析仪o /WThickness of insulator 绝缘层厚度SEM 扫描式电子显微镜um100125125Dielec

10、tric breakdown 介电击穿step by step 逐步增加kVPvoeletal gsterength 剥离强度Based on JIS C6481基于日本工业标准 C6481N/cmTg 结晶温度TMA热机械分析仪o104165165Volume resistivity 体积电阻 率at 25o 在 25 度下?cm151016101510Dielectric conctant 介电常数at1M Hz 在 1兆赫兹Dielectric loss tangent介电损耗at1M Hz 在 1兆赫兹电气转化装置DENKA HITT PLATE in Automotive 日本电气化

11、学公司高导热铝基板在汽车上的应用EPS发动机DC/DC converter 直流 / 直流转化器CUSuspension controller 悬浮控制器Generator PLATE 高导热铝基板Technical trend of EPS应急电池的技术趋势Replace to EPS应急电源的替代3%Fuel efficient will be better 3% compared with dromechanical power steering 向相比较燃烧Rapid diffusion to 1000cc 2000cc car 迅速提高了1000cc-2000cc卡路里查询High

12、thermal conductivityHigh heat resistance 高导热系数高耐热性Lrge current 大电流reliability against solder crack可靠性防焊裂Improvement to decrease solder cracks of bear chip改善了芯片的焊裂 Improvement to decrease solder cracks of bear chipA shape of substrate under heat cycle test 基材热循环测试的模拟Solder crack 测量条件等Case of cooCase

13、of heat up在容Solder 焊盘l down在容器中冷却Chip resistor贴片电阻高耐热TH-1Aluminum plate 铝板高导热 一般型 25 在 25度下 25 在 25度下耐焊裂型EL-1resistivity (Ohm cm) 体积电阻率Dielectric constant 介电常数Dielectric loss tangent 介电损耗Thickness of dielectric layer (um) 介电层厚度Thermal resistance ( /W) 热变电阻X 1016 1MHz 在 1 兆赫兹 1MHz 在 1 兆 赫兹SEM 扫描式 电子显

14、微镜 Denka method 便 携式PH分析仪125(Y type)IOO(Y type)IOO(Y type)X1015X 1015X 1015110Stre ngth(N/cm)剥离强度Dielectric breakdown voltage ( KV)Normal condition 正常状态1Dielectric breakdown voltage ( KV)Normal condition 正常状态1voltage method 介质击穿电压 KV 逐步增加电压*1*1*10Crack at solder after heat-cycle 焊盘开裂在焊后加热 Liquid-Liq

15、uid 液液层分析-40 (7min.) +125( 7min.)500 cycles500个循环 ，Rate of Grade-C,D(%) 比率和等级 1000 cycles1000个循环 ，63100312125 chip resistor mounted 2125 贴片电阻安装Glass transition point ( CAll figures in the tables are typical val）所u e有s.的表格里是T平M均A值 methodRate of Grade-C,D(%) 比率和等级or DMA method165(TMA)*1 Measured with

16、comb-shaped pattern.*2 50hrs after PCT treatment. 压力锅煮实验 50小时后Temperature measurementTO-220 (2SC2233) 温度测量Silicone: Sgtreepa bsye s硅tep层increasingDielectric layerAl plate 铝板Heatsink(Water-cooled)散热器(水冷)Measurement for thermal conductivity 引1: 测量导电率Size of Cu land under Tr. : 10 X 15mm,铜面的尺寸 :10 15mm

17、 Size of substrate : 30 X 30mm,基材的尺寸 : 30 30mmCrack开裂Grade of cracks after heat cycle 引 2.在热循环之后开裂的等级0500005000Comparison of solder crack property 焊盘开裂的性能比较100)%(kcarcredlosfoecnedicn率生发的80604020高热循环可靠型Heat cycle condition : -40125 热循环条件 : -40 1251000Number of heat cycle 热循环次数 热循环次数High heat resista

18、nt type -“2”M高耐热型 ”M-2”of the dielectric layers 介电层的表单数值Items 项目Maximam OperatinTge mpertu（re ） 在紫外线烘烤下 ,最大操作温度by ULHigh heat resistant type1)155M-2高耐热型(Under developin显g影后)Traditional Type115K-1一般型1)It is a recognition acquisition schedule in June-2005. 在2005年六月测试识别进度表250 200 150 100Oven Temperture

19、 烤箱温度Fig1 Heat resistant test 引 1.耐热测试 (Dielectric Strength)绝缘强度New substrate has the high MOT(UL specification) and the excellent reliability.新的基材有很高的关键性（UL规格下 ）和卓越的可靠性High heat resistant type “M-2 ” 高耐热型 M-2High heat resistant type “M-2 ” 高耐热型 M-2Table 1. Characteristics of the dielectric layers 表

20、一 . 介电层的特性Items 项目High heat resistant type M-2 (under developing) 耐高 热型 M-2(显影后 )Traditional Type K-1 一般类型 K-1Maximum Operating Temperature( ) by ULUL1)115最大操作温度155Thermal Conductivity (w/mk) 导热系数22Volume resistivity( .cm) at 25 ( )体1313积电阻率在 25度下1010Dielectric Constant 1MHz, at 25 ( ) 电常数在 1兆赫兹 ,25

21、 度下介Dielectric loss tangent 1MHz, at 25 ( ) 电损耗在 1兆赫兹 ,25度下介Samples AL base plate: ,Cu foil: 70um, dielectric layer: 150 um 铝基板样品 :毫米, 铜箔: 70微米, 介电层: 150微米1) It is a recognition acquisition schedule in June-2005 在2005年六月测试识别进度表D E N K ATable 2. Durability test result (typical values) 表二 . 耐久性试验结果 (平均值 )Items 项目Treatment conditions条件设定Dielectric breakdown voltage strength (kv) 介质击穿电压 (千伏 )Peel strength (N/cm