电镀基础知识培训ppt课件

1、Atotech (China) Chemicals Ltd.SH安美特上海青浦分公司 PRESENTS ELECTROPLATING TRAINING电镀培训电镀培训 OUTLINE内容提要INTRODUCTION介绍介绍ELECTROCHEMISTRY电化学电化学CLEANING & PREPLATE 清洗及预镀清洗及预镀NICKEL 镍镍Copper 铜铜DECORATIVE CHROMIUM装饰铬装饰铬TESTING测试测试FILTRATION 过滤过滤TROUBLE SHOOTING故障处理故障处理WHAT IS ELECTROPLATING ?什么是电镀？THE DEPOSI

2、TION OF A METALLIC COATING UPON A NEGATIVELY CHARGED CATHODE BY THE PASSING OF AN ELECTRIC CURRENT在电流通过时，有金属层沉积在带负电荷在电流通过时，有金属层沉积在带负电荷的阴极表面的阴极表面.WHAT IS THE PURPOSE ?电镀的目的是什么？TO OBTAIN A METALLIC COATING HAVING CERTAIN PROPERTIES SUCH AS HARDNESS, BRIGHTNESS, CORROSION RESISTANCE AND TO REPRODUCE ID

3、ENTICAL FORMS IN ELECTROFORMING.是为了得到具有某种特性的金属层，如：硬是为了得到具有某种特性的金属层，如：硬度、光亮度、耐腐性及在度、光亮度、耐腐性及在电铸方面复制同样电铸方面复制同样的形状的形状.REQUIREMENTS要求SOURCE OF DIRECT CURRENT直流电源直流电源A PLATING TANK电镀槽电镀槽A SOLUTION CONTAINING THE DISSOLVED SALTS OF THE METAL TO BE PLATED含有待镀的可溶性金属盐的溶液含有待镀的可溶性金属盐的溶液ANODE ( POSITIVE ELECTRO

4、DE )阳极（正电极）阳极（正电极）A PREPARED OBJECT - CATHODE ( NEGATIVE ELECTRODE ) 准备好的待镀工件准备好的待镀工件-阴极（负电极）阴极（负电极） WHAT IS DIRECT CURRENT ?bTHE FLOW OF ELECTRONS IN THE SAME DIRECTION BETWEEN POSITIVE AND NEGATIVE ELECTRODES在正负电极之间电子向同样的方向移动在正负电极之间电子向同样的方向移动.WHAT IS A PLATING SOLUTION ?电镀液是什么？bA CONDUCTING MEDIUM

5、 FOR THE MOVEMENT OF METAL IONS IN SOLUTION BETWEEN AN ANODE AND A CATHODE溶液中在阳极与阴极间金属离子移动的导电介溶液中在阳极与阴极间金属离子移动的导电介质质.WHAT IS pH ?什么是pH值？bTHE MEASUREMENT OF ACIDITY OR ALKALINITY用来度量酸碱度的用来度量酸碱度的bON A SCALE FROM 0 TO 14PH值的范围处于值的范围处于0-14之间之间b 0 TO 6.9 BEING ACIDIC AND 7.1 TO 14 ALKALINE AND 7.0 BEING

6、NEUTRAL. 小于小于7的为酸性，大于的为酸性，大于7且小于等于且小于等于14的为碱性，的为碱性，7.0为中性为中性HOW ARE PLATING SOLUTION MAINTAINED ?如何维护电镀液？CHEMICAL ANALYSIS OF THE CONSTITUENTS持续的化学分析持续的化学分析HULL CELL PLATING TESTS赫氏槽电镀测试赫氏槽电镀测试ADDITION OF CHEMICALS添加化学品添加化学品ELIMINATION OF CONTAMINANTS 去除污染物去除污染物PERIODIC PURIFICATION定期净化定期净化REGULAR I

7、NSPECTION OF PARTS FOR DEFECTS缺陷缺陷/次品的常规检查次品的常规检查PHYSICAL TESTING物理测试物理测试WHAT IS A METAL ION ?什么是金属离子？bA METAL ION IS AN ATOM OF A METAL HAVING A POSITIVE ELECTRICAL CHARGE金属离子是带正电荷的金属原子金属离子是带正电荷的金属原子(失去电子失去电子) WHAT ARE THE SOURCES OF METAL IONS ?金属离子来自何处？METAL SALTS IN PLATING SOLUTION电镀液中的金属盐电镀液中的

8、金属盐SOLUBLE METAL ANODES可溶性的金属阳极可溶性的金属阳极WHAT ARE ANODE BAGS ?什么是阳极袋？bANODE BAGS ARE POROUS MEMBRANES PLACED AROUND ANODES TO COLLECT SLUDGE FORMING ON THE DISSOLVING ANODE阳极袋是包扎在阳极外面阳极袋是包扎在阳极外面,会将电镀过程中产会将电镀过程中产生的阳极泥收集在袋内的多孔的袋。生的阳极泥收集在袋内的多孔的袋。Basic ELECTROCHEMISTRY基本的电化学理论ELECTROCHEMISTRY 电化学Plating C

9、ell 电镀槽Ni+Ni+Cl-Cl-+_Rectifier整流器整流器ANODE阳极阳极CATHODE阴极阴极ANODE阳极阳极CATHODE REACTIONS 阴极反应Cathode 阴极Reduction of ions离子还原反应离子还原反应Draw electrons from the external circuit从外部电路中吸收电子从外部电路中吸收电子TYPICAL REACTION 典型的反应典型的反应Ni+ + 2e- Ni (metal 金属金属)2H+ + 2e- H24H2O + 4e- 2H2 + 4(OH)-ANODE REACTIONS 阳极反应Anode 阳

10、极Oxidation of metal to ions 金属氧化成阳离金属氧化成阳离子子Release of electrons to external circuit 将将电子释放至外部电路电子释放至外部电路TYPICAL REACTION 典型的反应典型的反应Ni Ni+ + 2e-4OH- O2 + 2H2O + 4e-2H2O O2 + 4H+ + 4e-RATE OF CURRENT FLOW 电流速率Amperes安培安培 = Volts 伏特伏特 Ohms 欧姆欧姆I 电流电流= E 电压电压 R 电阻电阻Amperes 安培安培Time 时间时间Equivalent Weigh

11、t of Metal 金属当量金属当量b One ampere flowing for one second represents one coulomb. Faraday law states that 96,500 coulombs (one Faraday) will deposit one gram equivalent weight of a metal. Equivalent weight is the atomic weight of the metal divided by its valence.b1安培的电流安培的电流1秒的时间通过的电量等于秒的时间通过的电量等于1库仑。库

12、仑。法拉第定律：法拉第定律：1个法拉第即个法拉第即96,500库仑的电量可以库仑的电量可以沉积沉积1克当量的金属。克当量是金属的原子量除以克当量的金属。克当量是金属的原子量除以它的化合价它的化合价.weight of metal deposited沉积的金属重量沉积的金属重量 96,500 Coulombs Deposit At. Wt. = grams 96,500库仑的镀层库仑的镀层 ValenceWEIGHT OF NICKEL PLATED电镀镍的重量KNOWN FACTORS已知的条件已知的条件Current 电流电流= 50 amps安培安培Time 时间时间 = 15 mins分

13、钟分钟原子量原子量 At. Wt. Ni = 58.7 Valence = 化合价化合价, 2 价价CALCULATION 计算计算96,500 = 45,000 X = 13.7 GRAMS 克克 58.7 x grams 2CALCULATING THICKNESS FROM WEIGHT从重量计算厚度Thickness = WT 1um=10 -4 cmdensity x area1mil = 25. 4 umEXAMPLE :wt = 0.136 grams. Density of Ni = 8.9Area = 4 cm2Thickness = 0.1368.9 x 4Answer =

14、 1.5 milsCURRENT IN CELL电镀槽中的电流Anode阳极阳极-e = cathode阴极阴极 +eAnode阳极阳极-e = corrosion溶解溶解 -e + Oxygen氧氧 -e Cathode阴极阴极+e = plating所镀金属所镀金属+e + hydrogen氢氢+eThe exchange of electrons at the anode and the cathode or the total flow of current at each electrode is always equal.电子在阳极和阴极上交换电子在阳极和阴极上交换,在阴阳极上流动

15、的电在阴阳极上流动的电流总是相等的。流总是相等的。DEPOSITION WITH H 2 LIBERATION伴随着氢气释放的沉积 NET RESULT 最终的结果最终的结果1.Cathode Efficiency Reduced阴极电流效率的降低阴极电流效率的降低2.pH Increased pH值升高值升高Anode阳极阳极Cathode阴极阴极Ni+2Ni+22H+H2PLATING EFFICIENCY AND TIME OF PLATING电镀效率和电镀时间% EFFICIENCY效率效率 = ACTUAL NI PLATED实际镀的实际镀的镍镍 X 100 THEORETICAL

16、(FARADAYS LAW ) 理论的（法拉第定律）理论的（法拉第定律）FACTORS AFFECTING PLATING CURRENT影响电镀电流的因素Hydrogen Liberation ( cathode )氢气释放（阴极）氢气释放（阴极）Oxygen Liberation ( anode )氧气释放（阳极）氧气释放（阳极）Polarization极化极化Concentration Polarization ( Diffusion )浓度极化（扩散）浓度极化（扩散）Hydrogen Overvoltage氢过电位氢过电位POLARIZATION极化E = IRE = Volts伏特伏

17、特 ( potential difference电位差电位差 )R = Resistance电阻电阻 ( resistance of solution to the flow of current 溶液对电流的阻抗溶液对电流的阻抗) I = Current电流电流 ( flow of electricity电荷的移动电荷的移动 )E = CURRENT电流电流 (I) X RESISTANCE电阻电阻 (R)Ep = Change in potential difference due to Polarization from resistance. 由于电阻升高造由于电阻升高造成的极化成的极

18、化,极化导致的电位差的改变极化导致的电位差的改变.POLARIZATION 极化EIEpR= E IEP= PolarizationCONCENTRATION POLARIZATION 浓度极化CONCENTRATION OF METAL IONS BUILD ON THE SURFACE OF THE ANODE 阳极表面的金属离子浓度阳极表面的金属离子浓度CONCENTRATION OF THE METAL IONS DECREASE AT THE SURFACE OF THE CATHODE 阴极表面的金属离子浓度减少阴极表面的金属离子浓度减少CHANGE IN ANODE AND CA

19、THODE FILMS CAUSES POLARIZATION阳极和阴极膜层的改变导致了极化阳极和阴极膜层的改变导致了极化CONCENTRATION POLARIZATION 浓度极化Ni +IonsANODE阳极阳极CATHODE 阴极阴极+ + + + +EFFECT 影响影响Agitation 打气打气Temperature 温度温度HYDROGEN OVERVOLTAGE氢过电位POLARIZATION DUE TO EVOLUTION OF HYDROGEN UPON A SPECIFIED ELECTRODE SURFACE OR THE EXCESS POTENTIAL ABOV

20、E THE EQUILIBRIUM POTENTIAL REQUIRED TO EVOLVE HYDROGEN AT THE CURRENT DENSITY SPECIFIED.在指定的电极表面上氢气的形成而引起的极化在指定的电极表面上氢气的形成而引起的极化 或或 在某一电流密度下氢的形成所要求的超出平衡电在某一电流密度下氢的形成所要求的超出平衡电位后的电位位后的电位.HYDROGEN OVERVOLTAGE氢过电压FACTORS 要素要素TYPE OF METAL金属的种类金属的种类SURFACE ROUGHNESS 表面的粗糙度表面的粗糙度TYPE OF SOLUTION 溶液的类型溶液的

21、类型CURRENT DENSITY电流密度电流密度TEMPERATURE温度温度HYDROGEN OVERVOLTAGE 氢过电位 (1 ma/cm2)ZnSnCdCuNiAgAuCPt-0.80-0.80-0.80-0.60-0.40-0.30-0.15-0.110.00ELECTROMOTIVE SERIES 电势序列VoltsAl3+ -1.66Zn2+ -0.76Cr3+ -0.74Fe2+ -0.44Cd2+ -0.40Co2+ -0.29Ni2+ -0.25Sn2+ -0.14Pb2+ -0.13 VoltsH1+ 0.00Sb3+ +0.10Bi3+ +0.20Cu2+ +0.3

22、4 Cu1+ +0.52 Rh3+ +0.80Ag1+ +0.80Pt2+ +1.20Au1+ +1.68 ANY QUESTIONS ?有问题吗？CLEANING & PREPLATE清洗与预镀清洗与预镀PURPOSE FOR CLEANING清洗的目的TO PROVIDE ADHESION ON THE SUBSEQUENT DEPOSITS保障后续的镀层的结合力保障后续的镀层的结合力.TO OBTAIN A HIGH QUALITY FINISH DEPOSIT得到高品质的完美镀层得到高品质的完美镀层TO OBTAIN THE DESIRED PROPERTIES OF THE

23、DEPOSITS镀层具有期望的各种特性镀层具有期望的各种特性.EFFECTS OF IMPROPER CLEANING不正确清洗的影响POOR BONDING TO BASE METAL与基体与基体(素材素材)金属间差的结合力金属间差的结合力PEELING OF DEPOSIT镀层的起皮镀层的起皮SKIP PLATE漏镀漏镀MICRO ROUGHNESS 微观粗糙微观粗糙PITTING起泡起泡POOR CORROSION RESISTANCE差的耐腐性差的耐腐性CONTAMINATED BATHS 污染镀液污染镀液PRECLEANING OPTIONS预清洗的选择MECHANICAL CLEA

24、NING 机械清洗机械清洗WET OR DRY BLASTING 干法喷砂干法喷砂/丸丸SOLVENT CLEANING 溶剂清洗溶剂清洗DEGREASING, EMULSION, DIPHASE 脱脂、乳化、脱脂、乳化、固液相分离固液相分离.ALKALINE CLEANING 碱洗碱洗SPRAY, SOAK, ELECTRO, ULTRASONIC 喷射、浸泡、喷射、浸泡、电解、超声波电解、超声波ACID CLEANING 酸洗酸洗SOAK, ELECTRO 浸泡、电解浸泡、电解HOW CLEANERS WORK清洗剂如何工作DISPERSION 分散分散SAPONIFICATION皂化皂化

25、EMULSIFICATION乳化乳化DISPERSION分散分散DISPERSION IS A METHOD WHEREBY SOLID PARTICLES ARE BROKEN DOWN TO SMALL PARTICLES BY THE ACTION OF SURFACTANTS AND OTHER COMPONENTS IN A CLEANER. THE PRINCIPLE IS EFFECTIVE FOR RESIDUE LEFT FROM POLISHING OPERATIONS分散是一种方法，固体的微粒通过表面活化剂和清分散是一种方法，固体的微粒通过表面活化剂和清洗剂中其它组分的作

26、用分散成小的微粒。这个原则洗剂中其它组分的作用分散成小的微粒。这个原则对抛光时留下的残余物的清洗是有效的。对抛光时留下的残余物的清洗是有效的。HOW CLEANERS WORK清洁剂如何工作HOW CLEANERS WORK清洗剂如何工作DISPERSION 分散分散SAPONIFICATION皂化皂化EMULSIFICATION乳化乳化SAPONIFICATION皂化皂化SAPONIFICATION IS THE CHEMICAL ACTION BY WHICH FATTY ACID, FATTY OIL OR OTHER REACTABLE SOIL IS CONVERTED TO A W

27、ATER SOLUBLE COMPOUND, SOAP. ELEVATED TEMPERATURES, CONCENTRATION, AND pH PROMOTES THE SPEED AND COMPLETION OF THE REACTION皂化是将脂肪酸皂化是将脂肪酸/脂肪油或其它可反应的污物转化成脂肪油或其它可反应的污物转化成水溶性的混合物水溶性的混合物(肥皂肥皂)。提高温度、浓度和。提高温度、浓度和pH值都值都会促进反应的速度和反应的完成。会促进反应的速度和反应的完成。HOW CLEANERS WORK清洗剂如何工作HOW CLEANERS WORK清洗剂如何工作DISPERSION

28、 分散分散SAPONIFICATION皂化皂化EMULSIFICATION乳化乳化EMULSIFICATION乳化乳化EMULSIFICATION IS A CHEMICAL PROCESS BY WHICH SURFACTANTS PENETRATE OILS AND SOILS AND BREAK THEM DOWN TO TINY WATER SOLUBLE GLOBULES DISPERSED AND SUSPENDED IN SOLUTION乳化是一种化学过程，表面活性剂渗透油和污乳化是一种化学过程，表面活性剂渗透油和污物，将它们在溶液中分散成微小的分散性的水物，将它们在溶液中分散成

29、微小的分散性的水溶性水珠和悬浮液溶性水珠和悬浮液.HOW CLEANERS WORK清洗剂如何工作TYPE OF CLEANING清洗的种类SOLVENT DEGREASING溶剂脱脂溶剂脱脂ALKALINE CLEANING碱洗碱洗SPRAY CLEANING喷射清洁洗喷射清洁洗ACID PICKLING浸酸浸酸TYPE OF CLEANING清洗的种类SOLVENT CLEANING 溶剂脱脂溶剂脱脂MIXTURES OF SUITABLE SOLVENTS AND SURFACTANTS. 适合的溶剂和表面活性剂的混合适合的溶剂和表面活性剂的混合USED IN VAPOR DEGREAS

30、ING.在蒸汽除油时使用在蒸汽除油时使用MINIMAL USE DUE TO HEALTH AND ENVIRONMENTAL CONCERNS.由于健康和环境方面的考虑尽量少使用由于健康和环境方面的考虑尽量少使用ALKALINE CLEANERS 碱洗THREE MAJOR COMPONENTS 三种主要成份三种主要成份BUILDERS-SODIUM HYDROXIDE 氢氧化钠氢氧化钠 or主体主体 POTASSIUM HYDROXIDE 氢氧化钾氢氧化钾 SILICATES 硅酸盐硅酸盐 CARBONATES 碳酸盐碳酸盐 CONDENSED PHOSPHATES 浓缩磷酸盐浓缩磷酸盐

31、ADDITIVES- CHELATING AGENTS TO COUNTERACT EFFECTS OF HARD WATER AND METAL IONS.添加剂添加剂-螯合物可以消除硬水和金属离子的影响螯合物可以消除硬水和金属离子的影响.SURFACTANTS-DISPLACE AND DISPERSE SOIL. LOWER SURFACE TENSION OF CLEANER AT METAL SURFACE FOR UNIFORM COVERAGE.TYPES OF ALKALINE CLEANERS碱洗的类型SOAK 浸泡浸泡-HIGH INFINITY FOR OILS AND

32、GREASES DUE TO HIGH SURFACTANT CONTENT 高的表面活性剂的含量可除去大量的油脂高的表面活性剂的含量可除去大量的油脂-DESIGNED FOR SPECIFIC CLEANING为某些清洗而设计为某些清洗而设计.SPRAY 喷射喷射-MECHANICAL IMPINGEMENT AND CHEMICAL CLEANING 机械冲击与化学冲洗机械冲击与化学冲洗-LOW FOAMING 低泡低泡ALKALINE CLEANERS碱洗TYPES OF ALKALINE CLEANING碱洗的类型TYPES OF ALKALINE CLEANING碱洗的类型ALKAL

33、INE CLEANING 碱洗CATHODIC ELECTROCLEANING阴极电除油阴极电除油HYDROGEN LIBERATED AT THE CATHODE. THE VOLUME OF THE HYDROGEN IS TWICE THAT OF OXYGEN GENERATED AT THE ANODE.阴极释放出氢气，氢气量是阳极释放的氧气量的两倍阴极释放出氢气，氢气量是阳极释放的氧气量的两倍.ACTIVATES SURFACE.活化表面活化表面.CERTAIN OXIDE FILMS ARE REDUCED.某些氧化膜被还原某些氧化膜被还原.A DISADVANTAGE IS T

34、HAT METALLIC IONS CAN DEPOSIT ON THE WORK AS A LOOSE ADHERENT SMUT.缺点是金属离子会以疏松的污物形式沉积在工件表面缺点是金属离子会以疏松的污物形式沉积在工件表面.ALKALINE CLEANING 碱洗ANODIC ELECTROCLEANING阳极电解除油阳极电解除油OXYGEN LIBERATED AT THE ANODE. THIS TYPE OF CLEANING WILL REMOVE SMUT. 阳极释放出氧气，这种形式的清洗能除去污垢阳极释放出氧气，这种形式的清洗能除去污垢.METALLIC CONTAMINATE

35、S WILL NOT DEPOSIT ON WORK.金属污染物不会沉积在工件表面金属污染物不会沉积在工件表面.FORMS OXIDES产生氧化膜产生氧化膜PASSIVATES SURFACE钝化表面钝化表面.ELECTROCLEANING REACTIONS电解除油反应ANODE REACTION 阳极反应阳极反应4(OH)- - 4e 2H2O + O2CATHODE REACTION 阴极反应阴极反应4H2O + 4e 4(OH)- + 2H2ALKALINE CLEANING 碱洗ULTRASONIC 超声波超声波 ULTRASONIC GENERATORS ARE USED TO C

36、REATE SOUND WAVES WHICH IN TURN ARE CONVERTED WITHIN THE SOLUTION TO MECHANICAL ENERGY.超声波发生器被用来产生声波，它在溶液中会被转化成机械超声波发生器被用来产生声波，它在溶液中会被转化成机械能能.ULTRASONIC ENERGY ALTERNATELY COMPRESSES AND EXPANDS THE SOLUTION WHICH PRODUCES SEVERAL CONCURRENT EFFECTS.超生波可选择性地压缩和膨胀液体，使之产生几种同步效应超生波可选择性地压缩和膨胀液体，使之产生几种同步

37、效应CAVITATION DUE TO FREQUENCY ASSISTS THE PHYSICAL REMOVAL OF SOILS.由于高频率导致的气穴现象导致污物被物理方法去除由于高频率导致的气穴现象导致污物被物理方法去除.ALKALINE CLEANING 碱洗SPRAY CLEANING 喷射清洁喷射清洁SOLUTION IS USUALLY MILDLY ALKALINE DEPENDING UPON THE BASE METAL.根据基材的不同，溶液常常含有微碱性。根据基材的不同，溶液常常含有微碱性。ACCOMPLISHED BY PUMPING THE CLEANING SOL

38、UTION THROUGH A SERIES OF PIPES AND JETS.通过一系列的管和喷射装置，通常由泵来输送清洗剂通过一系列的管和喷射装置，通常由泵来输送清洗剂.ACTION OF PHYSICAL IMPACT AND CHEMICAL ACTION REMOVES DUST, METAL FINES, CARBON SMUT AND OTHER RESIDUES.物理的冲击作用和化学反应去除了灰尘、金属物理的冲击作用和化学反应去除了灰尘、金属微尘微尘、碳、碳化物和其它的残留物。化物和其它的残留物。TYPE OF CLEANING 清洗的类型ACID PICKLING 过酸过酸

39、WHY DO WE PICKLE? 为什么要用酸浸泡？为什么要用酸浸泡？TO REMOVE OXIDES FROM THE SURFACE OF THE METAL TO OBTAIN GOOD BONDING OF THE SUBSEQUENT DEPOSIT.去除金属表面的氧化膜，使后来的金属镀层得到好的结合力。去除金属表面的氧化膜，使后来的金属镀层得到好的结合力。NEUTRALIZE ANY RESIDUAL ALKALINE FILM LEFT ON THE SURFACE.中和残留在表面的碱性膜。中和残留在表面的碱性膜。ACID PICKLING 过酸去氧化膜CHEMISTRY OF

40、 PICKLING 过酸的化学反应过酸的化学反应ACID酸酸 + BASE基材基材 H2O水水 + SALT盐盐Sulfuric Acid + Caustic Soda Water + Sodium Sulfate硫酸硫酸氢氧化钠氢氧化钠水水 硫酸钠硫酸钠ACID酸酸 + METAL金属金属 H2 氢气氢气 + SALT盐盐Sulfuric Acid + Steel Hydrogen + Ferrous Sulfate硫酸硫酸 不锈钢不锈钢氢气氢气硫酸亚铁硫酸亚铁ACID酸酸 + METALLIC OXIDE金属氧化物金属氧化物 H2O水水 + SALT盐盐Sulfuric Acid + Co

41、pper Oxide Water + Copper Sulfate硫酸硫酸氧化铜氧化铜水水 硫酸铜硫酸铜ACID PICKLING酸浸泡METALS金属金属CHEMICALS 过酸使用的化学品过酸使用的化学品 STEELH2SO4 or HCl不锈钢不锈钢ACID SALTS ( NH4HF )酸性盐酸性盐COPPER & H2SO4 or HClCu ALLOYSORGANIC ACIDS 有机酸有机酸铜及铜合金铜及铜合金ACID FORMING SALTS 酸盐酸盐ALUMINUM H2SO4, H3PO4, HNO3 or HF铝铝 ZINC & ALLOYS ACID

42、FORMING SALTS 酸盐酸盐锌及锌合金锌及锌合金SOAK CLEANER TYPE热浸清洗剂的类型NON ETCHING 不发生浸蚀的不发生浸蚀的BUFFING COMPOUND REMOVAL除腊水除腊水USED AS ULTRASONIC CLEANER超声波清洗用清洗剂超声波清洗用清洗剂LIGHT DIRT AND SOIL REMOVAL轻微脏物和污物去除剂轻微脏物和污物去除剂CLEANING & PICKLING清洗与过酸活化彻底除油并水洗后的工件过酸是为了除去氧化物和活化基材的表面彻底除油并水洗后的工件过酸是为了除去氧化物和活化基材的表面. BRIGHT ACID

43、COPPER PLATING光亮酸铜电镀光亮酸铜电镀 BRIGHT ACID COPPER PLATING光亮酸铜电镀光亮酸铜电镀APPLICATIONS 应用应用DECORATIVE INTERMEDIATE COATING装饰的中间层装饰的中间层Steel 不锈钢不锈钢Zinc Die Casting 锌压铸锌压铸Brass 黄铜黄铜Plastics 塑料塑料Aluminum 铝铝INDUSTRIAL COATING工业用的镀层工业用的镀层Electroforming 电成型电成型Electrotyping 电铸电铸Rotogravure 印刷用滚筒印刷用滚筒Electroclading

44、电镀金属包层电镀金属包层Stop-Off in Case hardening 中转镀层中转镀层ACID COPPER PROCESS FEATURES酸铜流程特点酸铜流程特点BRIGHT 光亮光亮GOOD LEVELING 好的填平好的填平DUCTILE 延展性好延展性好STRESS FREE 无应力无应力FINE GRAIN DEPOSITS镀层结晶细致镀层结晶细致EASY TO CONTROL 容易控制容易控制FAST PLATING 快速电镀快速电镀EASILY BUFFED 容易抛光容易抛光GOOD ELONGATION 好的延展性好的延展性GOOD MICROTHROW 好的微观均镀

45、性好的微观均镀性MACHINEABLE 好的机械加工性能好的机械加工性能GOOD ELECTRICAL CONDUCTIVITY 好的电导性好的电导性Why Acid Copper ?Why Acid Copper ?为什么用酸铜为什么用酸铜抛抛/磨光后提供好的填平效果磨光后提供好的填平效果Mirror Smooth Surface180 GritScratchesLEVELING 填平填平MACROTHROW宏观上的均镀宏观上的均镀THE ABILITY TO DEPOSIT METAL RELATIVELY UNIFORMLY OVER A BROAD CURRENT DENSITY RA

46、NGE 在一个宽的电流密度范在一个宽的电流密度范围内相对地镀层均匀分布围内相对地镀层均匀分布的能力的能力MICROTHROW 微观上的均镀微观上的均镀THE ABILITY TO DEPOSIT METAL IN GROOVES, PORES, CRACKS AND SURFACE IMPERFECTIONS OF MICROSCOPIC NATURE在凹槽、小孔、裂纹和其在凹槽、小孔、裂纹和其他表面微观缺陷上沉积镀他表面微观缺陷上沉积镀层的能力层的能力.Why Acid Copper ? Why Acid Copper ? 为何用酸铜？为何用酸铜？Provides Leveling of S

47、cratches将砂痕印填平将砂痕印填平DgTgTsGood LevelingMicrothrow好的填平好的填平 及微观均镀及微观均镀Poor/No Leveling差差/无填平无填平% Leveling = Tg- Ts x 100 DgWhy Acid Copper ? Why Acid Copper ? 为何用酸铜为何用酸铜 Provides A Bright, Easy to Buff Surface for Coverage of Very Minor Blemishes in Castings, Aluminum or Plastic 提供一个光亮的、电镀后容易抛光覆盖压铸件提供

48、一个光亮的、电镀后容易抛光覆盖压铸件,铝材或塑料表面铝材或塑料表面的微小缺陷的镀层的微小缺陷的镀层. Bright Surface That Requires Little/No Buffing少少/ 不要求抛光的光亮表面不要求抛光的光亮表面. Long Term Protection Against Corrosion长期耐蚀长期耐蚀Microscopic Section Of A Porous Casting. Plating Has Bridged Surface Pores多孔压铸件的横截面图，电镀镀层覆盖了多孔压铸件的横截面图，电镀镀层覆盖了表面表面的微孔的微孔.SpotsSurfa

49、ce Pores表面微孔表面微孔TYPICAL BATH FORMULATION传统的槽液配方及条件传统的槽液配方及条件Copper Sulfate 硫酸铜硫酸铜Sulfuric Acid 硫酸硫酸Chloride 氯离子氯离子Ultra Agents 添加剂添加剂Temperature 温度温度Anode Current Density 阳极电流密度阳极电流密度Cathode Current Density 阴极电流密度阴极电流密度BATH CHEMISTRY槽液化学物槽液化学物CuSO4 Cu+ + SO4= Cathode Anode阴极阴极阳极阳极H2SO4 2H+ + SO4=Cat

50、hodeAnode阴极阴极阳极阳极HCl H+ + Cl-Cathode AnodeAcid Copper PlateAcid Copper Plate酸铜电镀酸铜电镀Key Ingredients 关键成份关键成份:Copper Sulfate 硫酸铜硫酸铜180-225 g/LSulfuric Acid 硫酸硫酸45-90 g/LAcid Copper PlateAcid Copper Plate酸铜电镀酸铜电镀Other Ingredients 其它成份其它成份:Chloride 氯化物氯化物80-120 mg/LUltra mu 开缸剂开缸剂8-10 ml/LUltra A 添加剂添加

51、剂0.3-0.5 ml/LUltra B 添加剂添加剂0.3-0.5 ml/LCOPPER SULFATE 硫酸铜硫酸铜HIGH CONC.高浓度高浓度LOSS OF BRIGHTNESS AND LEVELING光亮度和填平性能的减少光亮度和填平性能的减少 ,并且阳极易结晶、钝化并且阳极易结晶、钝化 240 g/lLOW CONC.低浓度低浓度LOSS IN LEVELING AND BATH CONDUCTIVITY槽液导电性和填平槽液导电性和填平性能的减少性能的减少 113 g/lFunction of Ingredients 各成份的各成份的功能功能At 113 gL At 285 g

52、/L Low copper content can cause reduced leveling, slow deposition, and a narrow current density range铜含量低将减少填平性能、沉积慢和电流密铜含量低将减少填平性能、沉积慢和电流密度范围窄度范围窄. Concentrations 248 g/L copper sulfate may produce crystals on tank walls, and anode bags, yielding rough deposits, and poor anode corrosion.硫酸大于硫酸大于248

53、g/L会在槽壁中、阳极袋中产生会在槽壁中、阳极袋中产生结晶结晶,引起粗糙的沉积和阳极溶解不好引起粗糙的沉积和阳极溶解不好.Low Copper Sulfate低硫酸铜低硫酸铜The Hull Cell indicates that at 113 g/L Copper Sulfate a deposit that is burned at very high current densities is produced.赫氏槽实验显示赫氏槽实验显示113g/L浓度下的硫浓度下的硫酸铜液中沉积的金酸铜液中沉积的金属在高电流密度下属在高电流密度下出现烧焦的情况出现烧焦的情况SULFURIC ACID

54、硫酸硫酸GRAIN REFINEMENT晶粒细化晶粒细化SOLUTION CONDUCTIVITY溶液导电溶液导电REDUCES ANODE POLARIZATION减少阳极极化减少阳极极化IMPROVES THROWING POWER提高均镀能力提高均镀能力SULFURIC ACID 硫酸硫酸HIGH CONC.高浓度高浓度 INCREASED ANODE CORROSION增加阳极溶解增加阳极溶解 INCREASE IN COPPER CONTENT铜含量增加铜含量增加LOW CONC.低浓度低浓度 HCD BURNING高电流密度烧焦高电流密度烧焦 NODULATION结瘤结瘤 POOR

55、 LEVELING填平差填平差 DULLNESS颜色暗颜色暗Function of Ingredients各成份的各成份的作用作用180 g/L Sulfuric Acid = high current density area burning and anode passivation.浓度大于浓度大于180g/L的硫酸会使高的硫酸会使高电流密度区烧焦，并使阳极钝化电流密度区烧焦，并使阳极钝化。 Concentrations 120 ppm光亮度及填平度降低光亮度及填平度降低STRIATION起条纹起条纹NODULATION起块起块LOW CONC.低浓度低浓度 DULLNESS IN HC

56、D AREA高电流密度区颜色发暗高电流密度区颜色发暗POOR LEVELING填平差填平差POOR ANODE CORROSION阳极溶解差阳极溶解差The Chloride Helps Anodes Dissolve And Works With Brightener For Full Brightness And Leveling氯化物帮助阳极溶解，氯化物帮助阳极溶解，并与光亮剂配合以增加并与光亮剂配合以增加光亮度和填平效果光亮度和填平效果Effect of Chloride ConcentrationEffect of Chloride Concentration氯化物浓度的影响氯化物浓

57、度的影响0 ppm50 ppm 375 ppmEffect of Chloride ConcentrationEffect of Chloride Concentration氯化物浓度的影响氯化物浓度的影响Hull Cell Plated With Chloride at 150 ppm氯化物含量为氯化物含量为150ppm的赫氏槽电镀片的赫氏槽电镀片Dull At HighCurrent Density高密度区颜色暗高密度区颜色暗Effect of Chloride ConcentrationEffect of Chloride Concentration氯化物浓度的影响氯化物浓度的影响Low

58、 (15 ppm) Chloride 低氯离子浓度低氯离子浓度 (15ppm）Streaky “Rippled” Deposit条纹状的条纹状的“波纹波纹”沉积沉积Chloride vs Anode Appearance氯化物与阳极外观氯化物与阳极外观Hull Cell Anode赫氏槽阳极赫氏槽阳极Normal Anode Appearance正常的阳极外观正常的阳极外观White Film = High Chloride白膜白膜=高氯离子高氯离子Additives 添加剂添加剂Panel Plated In Solution With No Additives没有使用添加剂的电镀试片没有使

59、用添加剂的电镀试片 EK- C EK- BMELEKTRA III Additives 添加剂添加剂 Add. 1 Add. 2Additives添加剂添加剂 Hull Cell Panel With High Current Density Burn高电流密度烧焦的赫氏槽片高电流密度烧焦的赫氏槽片Additives添加剂添加剂 Add. 1 Add. 2添加剂添加剂1添加剂添加剂2Additive添加剂添加剂 Hull Cell Plated, With Add. 1 1.0% , Add 2 0.25% 赫氏槽电镀，赫氏槽电镀，1.0%的添加剂的添加剂1，0.25%的的添加剂添加剂2Add

60、itives 添加剂添加剂 Add. 1 Add. 2添加剂添加剂1添加剂添加剂2Additive 添加剂添加剂 Low Add.2 Concentration (0.1% /Volume)添加剂添加剂2低浓度（低浓度（0.1%，体积百分比），体积百分比）Additives 添加剂添加剂 Add. 1 Add. 2添加剂添加剂1添加剂添加剂2Additive添加剂添加剂High Add. 2 (1.0%/ Volume)添加剂添加剂2高浓度（高浓度（1.0%，体积百分比），体积百分比）Dull & Lumpy暗且粗糙暗且粗糙Additives 添加剂添加剂 Add. 1 Add. 2添加剂添加剂1添加剂添加剂2Additive