PCB各层含义(protel)

1、PCB各层含义(protel1 Signal layer(信号层信号层主要用于布置电路板上的导线.Protel 99 SE提供了32个信号层,包括Top layer(顶层,Bottom layer(底层和30个MidLayer(中间层.2 Internal plane layer(内部电源/接地层Protel 99 SE提供了16个内部电源层/接地层.该类型的层仅用于多层板,主要用于布置电源线和接地线.我们称双层板,四层板,六层板,一般指信号层和内部电源/接地层的数目.3 Mechanical layer(机械层4 Solder mask layer(阻焊层在焊盘以外的各部位涂覆一层涂料,如防

2、焊漆,用于阻止这些部位上锡.阻焊层用于在设计过程中匹配焊盘,是自动产生的.Protel 99 SE提供了Top Solder(顶层和Bottom Solder(底层两个阻焊层.5 Paste mask layer(锡膏防护层它和阻焊层的作用相似,不同的是在机器焊接时对应的表面粘贴式元件的焊盘.Protel 99 SE 提供了Top Paste(顶层和Bottom Paste(底层两个锡膏防护层.6 Keep out layer(禁止布线层用于定义在电路板上能够有效放置元件和布线的区域.在该层绘制一个封闭区域作为布线有效区,在该区域外是不能自动布局和布线的.7 Silkscreen layer(

3、丝印层丝印层主要用于放置印制信息,如元件的轮廓和标注,各种注释字符等.Protel 99 SE提供了Top Overlay和Bottom Overlay两个丝印层.一般,各种标注字符都在顶层丝印层,底层丝印层可关闭.8 Multi layer(多层电路板上焊盘和穿透式过孔要穿透整个电路板,与不同的导电图形层建立电气连接关系,因此系统专门设置了一个抽象的层,多层.一般,焊盘与过孔都要设置在多层上,如果关闭此层,焊盘与过孔就无法显示出来.9 Drill layer(钻孔层钻孔层提供电路板制造过程中的钻孔信息(如焊盘,过孔就需要钻孔.Protel 99 SE提供了Drill gride(钻孔指示图和

4、Drill drawing(钻孔图两个钻孔层.相应的在eagle中也有很多的层(常用的用绿色标记In Layout and Package Editor1 Top Tracks, top side2 Route2 Inner layer (signal or supply3 Route3 Inner layer (signal or supply4 Route4 Inner layer (signal or supply5 Route5 Inner layer (signal or supply6 Route6 Inner layer (signal or supply7 Route7 Inn

5、er layer (signal or supply8 Route8 Inner layer (signal or supply9 Route9 Inner layer (signal or supply10 Route10 Inner layer (signal or supply11 Route11 Inner layer (signal or supply12 Route12 Inner layer (signal or supply13 Route13 Inner layer (signal or supply14 Route14 Inner layer (signal or supp

6、ly15 Route15 Inner layer (signal or supply16 Bottom Tracks, bottom side17 Pads Pads (through-hole元件的引脚(过孔型,贴片引脚算在顶层和底层上18 Vias Vias (through all layers过孔19 Unrouted Airlines (rubber bands20 Dimension Board outlines (circles for holes *板子外形,相当于机械层21 tPlace Silk screen, top side丝印层22 bPlace Silk scree

7、n, bottom side丝印层23 tOrigins Origins, top side (generated autom.元件中间有个十字叉,代表元件位置24 bOrigins Origins, bottom side (generated autom.25 tNames Service print, top side (component NAME26 bNames Service print, bottom s. (component NAME27 tValues Component V ALUE, top side28 bV alues Component V ALUE, bott

8、om side2128制版时可全部放在丝印层29 tStop Solder stop mask, top side (gen. autom.30 bStop Solder stop mask, bottom side (gen. Autom.31 tCream Solder cream, top side32 bCream Solder cream, bottom side33 tFinish Finish, top side34 bFinish Finish, bottom side35 tGlue Glue mask, top side36 bGlue Glue mask, bottom

9、side37 tTest Test and adjustment information, top side38 bTest Test and adjustment inf., bottom side39 tKeepout Restricted areas for components, top side40 bKeepout Restricted areas for components, bottom s.41 tRestrict Restricted areas for copper, top side42 bRestrict Restricted areas for copper, bottom side43 vRestrict Restricted areas for vias44 Drills Conducting through-holes45 Holes Non-conducting holes46 Milling Mil