日本电气化学(Denka)散热铝基板中文介绍

1、 Insulated Metal Substrate HITT PLATE绝缘高导热铝基板 DENKI KAGAKU KOGYO K.K.日本电气化学工业有限公司推荐精选DENKAQQ:79124316荐精选The field suitable for Hybrid IC推荐精选 适用与混合集成电路领域.Audio 音频Power AMP. 功率放大器Pre-AMP. 前置放大器Motor driver 马达驱动器Transistor 晶体管Inverter 换流器Micro-strip circuit 微带型混频器Oscillator 振荡器 Regulator 调

2、节器EPS 应急电源装置Power module 电源模块 高导热铝基板(IMS) 标准SW regulator 开关调节器DC/DC Converter 直流/直流转化器 LED 发光二极管CPU board 中央处理器主板Power supply 电源供应器VTR, TV 磁带录像机,电视Tuner 调谐器Regulator 调节器Suitable field for IMS推荐精选The Motor regulator 马达调节器 Automotive 汽车New Usage 新应用 Communication 通讯High frequency AMP 高频放大器Computer 电脑P

3、ower Electronics 动力电子设备Power Supply 电源供应器适用于工业管理学会推荐精选 Classification of printed circuit board 印刷线路板的分类推荐精选 Ceramic substrate 陶瓷基片 Insulated Metal Substrate 绝缘金属基材Substrate with thick film circuit.厚膜陶瓷线路板 Substrate with thin circuit.薄膜陶瓷线路板Substrate Multi-layer 多层陶瓷线路板Metal Base Substrate ( Al, Cu,

4、Fe) 金属基材(铝,铜,铁)Metal Core Substrate (Al, Cu, Fe)金属芯基材(铝,铜,铁)推荐精选 Metal Base Substrate with Multi-Layer (FR-4)多层环氧树脂金属基材Paper based material (phenol) 纸基板(酚基材)Glass cloth based material (epoxy, polyimide)玻璃基材（环氧树脂，聚酰亚胺）Rigid substrate刚性基板推荐精选Organic substrate有机基板 Flexiuble substrate柔性基板e 推荐精选Composite

5、 (combination with different materials)复合材料（与不同的材料结合）Thermoplastic resin 热塑性树脂Film material (polyimide, polyester)薄膜材料（聚酰亚胺，聚酯）推荐精选*Al base typeEvaluate item评估项目Insulated metal substrate绝缘金属基材Alumina substrate 铝基材Glass-epoxy substrate玻璃环氧树脂基材Thermal resistance ºC/W热变电阻0.6(80um)0.7(635um)3.41.6m

6、mBreakdown voltage 击穿电压Heat resistance 耐热性Dielectric constant 介电常数7-894-5Specific heat 比热系数0.280.370.19Mechanical strength 机械强度XProcessing 制程XMass process 量产性基本类型Comparison of properties with each substrate 每种基材的性能对照推荐精选Typical structure of IMS 标准层的典型结构Conductor (Cu foil, etc.) 导体（铜箔等）Insulator绝缘层Me

7、tal Base（Al, Cu, Fe, etc.)金属基材（铝，铜，铁等）推荐精选推荐精选Typical structure of HIC 典型的混合集成电路结构Ni plating 镍层Al wire铝丝推荐精选Plastic case塑胶外壳Semiconductor半导体Chip resistance贴片电阻Resin 树脂推荐精选Lead terminal引线端子推荐精选Insulator绝缘层Aluminum board 铝板IMS 标准层推荐精选Development performance of IMS 标准层的发展方向Improvement of Insulator 绝缘层的

8、改善Higher thermal conductivity, higher reliabilityand higher heat resistance.更高的导热系数，高可靠性和高耐热性.推荐精选Field of each substrate 每种基材的领域Industrial machine工业机器Rated voltage(V)额定电压Air conditioner推荐精选500 空调设备HITT PLATE(IMS)高导热铝基板Alumina substrate氧化铝层AlN substrate氮化铝层推荐精选Audio音频50100Rated current(A)额定电流推荐精选Mar

9、ket request市场需求Cost down, down sizing and Higher thermal conductivity低成本小型化高导热系数 推荐精选TH-1高耐热高导型K-1 一般型性型推荐精选 Thermal 2W/mKconductivity导热系数 4W/mKB-1超高导热型8W/mK推荐精选Lineup of HITT PLATEs insulator 绝缘高导热铝基板的应用范围Thermal conductivity (W/mK) 导热系数Usage : Industry, LED, etc. 应用：工业，LED等B-1超高导热型Usage : Consumer

10、 products, Industry, etc.应用：消费品，工业等推荐精选TH-1高耐热高导热型M-2K-1一般型 High heat resistance 高耐热性High heat resistanceHeat cycle reliability 长期可靠性推荐精选EL-1高耐焊裂型Usage : Only automotive应用：仅仅汽车推荐精选Comparison of HITT PLATE 高导热铝基板对照Thermal resistance ºC/W 热变电阻1.210.80.6推荐精选0.40.20Alumina substrate氧化铝层推荐精选05010015

11、0200600650推荐精选Thickness of insulator 绝缘层厚度推荐精选推荐精选IMS B-1(8W/mK) type IMS B-1类型(0.125mmt)热变电阻耐热测试的结果Alumina DBC氧化铝合基板(0.635mm)Test sample 测试样品基材substrateTO-220推荐精选Low低High高（2SC2233)推荐精选Max.temp.最高温度The results of thermal resistance by thermal viewer推荐精选Property 性能Test method测试方法Unit单位一般型K-1高导热高耐热型TH

12、-1超高导热型B-1Thermal conductivity导热系数Laser flash method 激光闪光光解W/mK2.04.08.0Thermal resistance热变电阻DKK method便携式PH分析仪º/W0.640.460.35Thickness of insulator 绝缘层厚度SEM 扫描式电子显微镜um100125125Dielectric breakdown 介电击穿voltagestep by step逐步增加kV6.86.35.2Peel strength 剥离强度Based on JIS C6481基于日本工业标准C6481N/cm25.22

13、2.127.7Tg 结晶温度TMA热机械分析仪º104165165Volume resistivity体积电阻率at 25º 在25度下cm 154.3×10 161.9×10 156.1×10Dielectric conctant介电常数at1M Hz 在1兆赫兹7.17.87.4Dielectric loss tangent介电损耗at1M Hz 在1兆赫兹0.0040.0180.013Typical properties of super high thermally conductive type典型的超高导热类型性能推荐精选DC/DC

14、 converter 直流/直流转化器ECU电气转化装置推荐精选Generator发动机 PLATE高导热铝基板EPS应急电源推荐精选Suspension controllerDENKA HITT PLATE in Automotive 日本电气化学公司高导热铝基板在汽车上的应用 悬浮控制器推荐精选Technical trend of EPS应急电池的技术趋势推荐精选Replace to EPS应急电源的替代Fuel efficient will be better3% compared with推荐精选hydromechanical power steering与流体动力转向相比较燃烧性提高

15、了3%Rapid diffusion to 1000cc 2000cc car迅速提高了1000cc-2000cc卡路里<Inquiry>查询推荐精选High thermal conductivityHigh heat resistance高导热系数高耐热性 Large current 大电流 reliability against solder crack可靠性防焊裂 推荐精选Improvement to decrease solder cracks of bear chip改善了芯片的焊裂推荐精选A shape of substrate under heat cycle tes

16、t 基材热循环测试的模拟推荐精选Case of cool down在容器中冷却Chip resistor贴片电阻Solder 焊盘Aluminum plate铝板Case of heat up在容器中加热Aluminum plate铝板推荐精选Solder crack /Close up 焊盘开裂/断路Solder crack焊盘开裂推荐精选Chip resistor贴片电阻Solder焊盘Cu foil铜箔推荐精选Chip resistor贴片电阻推荐精选Solder焊盘Solder crack焊盘开裂Insulator绝缘层Al base plate铝基推荐精选Glass transiti

17、on point ()玻璃化温度()Typical properties of high heat cycle reliability type ”EL-1”耐焊裂型“EL-1”高热循环典型性测试Revised 修订 : 08/23/'01推荐精选Items 项目Thermal conductivity (W/mK)导热系数 Measurement condition, etc.测量条件等TMA method or DMA method机械方法和动态力学方法 高导热高耐热TH-14.0一般型K-12.0耐焊裂型EL-12.4-2.7推荐精选104(TMA)57(DMA)推荐精选Volu

18、me resistivity (Ohm cm)体积电阻率Dielectric constant 介电常数Dielectric loss tangent 介电损耗Thickness of dielectric layer (um) 介电层厚度Thermal resistance (/W) 热变电阻 25 在25度下 1MHz 在1兆赫兹 1MHz 在1兆赫兹SEM 扫描式电子显微镜Denka method 便携式PH分析仪4.5 X 10167.20.004125(Y type)0.504.3 X 10157.00.004100(Y type)0.641.0 10157.40.0241100.5

19、1-0.55推荐精选Peeling strength (N/cm) 剥离强度 Normal condition：Based on JIS C6481 正常状态：基于日本工业标准C6481 22.125.219.6推荐精选Dielectric breakdown voltage（KV）Normal condition正常状态8.36.83.5*1推荐精选voltage method 介质击穿电压KV 逐步增加电压 1000hrs after 85,85%RH,DC100V treatment 1000个小时85,85湿度直流电压100V% 5.7*11000hrs after 150,DC100

20、V treatment 在150，电压100V情况下1000小时后 5.0 5.55.7*14.2*13.8*14.0*13.7*1推荐精选Crack at solder after heat-cycle焊盘开裂在焊后加热 Liquid-Liquid 液液层分析-40(7min.) +125（7min.)500 cycles 500个循环， Rate of Grade-C,D(%) 比率和等级1000 cycles 1000个循环， 63100031推荐精选2125 chip resistor mounted 2125贴片电阻安装All figures in the tables are ty

21、pical values.所有的表格里是平均值 *1 Measured with comb-shaped pattern. 测量都是用梳型模式 *2 50hrs after PCT treatment. 压力锅煮实验50小时后 Rate of Grade-C,D(%) 比率和等级推荐精选Temperature measurementTO-220 (2SC2233)温度测量Grade-A A等级的没有开裂No crack2125 Tip resistor 2125小电阻Grade-B B等级 芯片和焊盘连接处开裂Crack at connection between chip and solde

22、r.推荐精选 Silicone grease硅层推荐精选Heatsink（Water-cooled） 散热器(水冷)Dielectric layer介电层Al plate铝板Eutectic solder共熔焊接 Grade-C Grade-DCrack extending from the connection between chip and solderC等级 从芯片和焊盘连接处延伸出去开裂.Crack开裂Broken electrical conductivity.D等级 导电破坏Crack开裂推荐精选Crack 开裂Fig.1 Measurement for thermal cond

23、uctivity 引1:测量导电率 Size of Cu land under Tr. : 10 X 15mm,铜面的尺寸:10×15mm推荐精选 Size of substrate : 30 X 30mm,基材的尺寸: 30×30mmFig.2 Grade of cracks after heat cycleGlass transition point ( C) TMA method or DMA method 165(TMA): Step by step increasing 96 hrs after PCT压力锅煮（121 ,2atm） treatment 96小时（

24、121,2大气压）情况下 8.2 引2.在热循环之后开裂的等级推荐精选100推荐精选Incidence of solder crack (%) 焊裂的发生率8060K-1General type一般型Chip size : 2125 芯片尺寸:2125推荐精选Heat cycle condition : -40125 热循环条件: -4012540推荐精选20EL-1High heat cycle reliability type 高热循环可靠型推荐精选0推荐精选05001000推荐精选Number of heat cycleComparison of solder crack propert

25、y 焊盘开裂的性能比较 热循环次数推荐精选High heat resistant type “M-2” 高耐热型”M-2”推荐精选 Table.MOT of the dielectric layers 介电层的表单数值Items 项目Maximam Operating Temperture（） by UL 在紫外线烘烤下,最大操作温度High heat resistant typeM-2高耐热型(Under developing显影后）1)155Traditional TypeK-1一般型1151.E+05推荐精选 1.E+041.E+03 1)It is a recognition acqu

26、isition schedule in June-2005. 在2005年六月测试识别进度表1.E+02推荐精选250200150100推荐精选Oven Temperture 烤箱温度Fig1Heat resistant test 引1.耐热测试(Dielectric Strength)绝缘强度 New substrate has the high MOT(UL specification) and the excellent reliability.推荐精选新的基材有很高的关键性(UL规格下)和卓越的可靠性推荐精选High heat resistant type “M-2” 高耐热型M-2T

27、able 1. Characteristics of the dielectric layers表一 . 介电层的特性 Items 项目High heat resistant type M-2 (under developing)耐高热型M-2(显影后)Traditional Type K-1一般类型K-1Maximum Operating Temperature() by UL UL 最大操作温度 1)155115Thermal Conductivity (w/mk) 导热系数22Volume resistivity(.cm) at 25 () 体积电阻率在25度下13>1013>

28、;10Dielectric Constant 1MHz, at 25 () 介电常数在1兆赫兹,25度下4.47.1Dielectric loss tangent 1MHz, at 25 () 介电损耗在1兆赫兹,25度下0.0040.004Samples AL base plate: 1.5mm,Cu foil: 70um, dielectric layer: 150 um 铝基板样品:1.5毫米, 铜箔: 70微米, 介电层: 150微米1) It is a recognition acquisition schedule in June-2005推荐精选 在2005年六月测试识别进度表 D E N K A推荐精选 High heat resistant type “M-2” 高耐热型M-2 Table 2. Durability test result (typical values) 表二 . 耐久性试验结果(平均值)Items 项目Treatment conditions 条件设定Dielectric breakdown voltage strength (kv) 介质