电路板制作流程

,PCBPRESENTATION,PCBPRESENTATION,PCBPRESENTATION,PCBManufacturingProcessFlow,PCBManufacturingProcessFlow,PCBManufacturingProcessFlow,April,20,1999JOHNNYHSU,流程圖PCBMfg.FLOWCHART,UPDATED:1999,04,16,顧客(CUSTOMER),工程製前(FRONT-ENDDEP.),裁板(LAMINATESHEAR),內層乾膜(INNERLAYERIMAGE),預疊板及疊板(LAY-UP),通孔電鍍(P.T.H.),液態防焊(LIQUIDS/M),外觀檢查(VISUALINSPECTION),成型(FINALSHAPING),業務(SALESDEPARTMENT),生產管理(P&MCONTROL),蝕銅(I/LETCHING),鑽孔(PTHDRILLING),壓合(LAMINATION),外層乾膜(OUTERLAYERIMAGE),二次銅及錫鉛電鍍(PATTERNPLATING),蝕銅(O/LETCHING),檢查(INSPECTION),噴錫(HOTAIRLEVELING),電測(ELECTRICALTEST),出貨前檢查(OQC),包裝出貨(PACKING&SHIPPING),曝光(EXPOSURE),壓膜(LAMINATION),前處理(PRELIMINARYTREATMENT),顯影(DEVELOPIG),蝕銅(ETCHING),去膜(STRIPPING),黑化處理(BLACKOXIDE),烘烤(BAKING),預疊板及疊板(LAY-UP),壓合(LAMINATION),後處理(POSTTREATMENT),曝光(EXPOSURE),壓膜(LAMINATION),二次銅電鍍(PATTERNPLATING),錫鉛電鍍(T/LPLATING),去膜(STRIPPING),蝕銅(ETCHING),剝錫鉛(T/LSTRIPPING),塗佈印刷(S/MCOATING),預乾燥(PRE-CURE),曝光(EXPOSURE),顯影(DEVELOPING),後烘烤(POSTCURE),多層板內層流程(INNERLAYERPRODUCT),MLB,全板電鍍(PANELPLATING),銅面防氧化處理(OSP(EntekCu106A),外層製作(OUTER-LAYER),TENTING,PROCESS,鍍金手指(G/FPLATING),鍍化學鎳金(E-lessNi/Au),ForO.S.P.,選擇性鍍鎳鍍金(SELECTIVEGOLD),印文字(SCREENLEGEND),網版製作(STENCIL),圖面(DRAWING),工作底片(WORKINGA/W),製作規範(RUNCARD),程式帶(PROGRAM),鑽孔,成型機(D.N.C.),底片(MASTERA/W),磁片,磁帶(DISK,M/T),藍圖(DRAWING),資料傳送(MODEM,FTP),AOI檢查(AOIINSPECTION),除膠渣(DESMER),通孔電鍍(E-LESSCU),DOUBLESIDE,前處理(PRELIMINARYTREATMENT),前處理(PRELIMINARYTREATMENT),前處理(PRELIMINARYTREATMENT),全面鍍鎳金(S/GPLATING),雷射鑽孔(LASERABLATION),BlindedVia,顯影(DEVELOPIG),P3,(1)Front-endProcess(Tooling),P4,(2)多層板內層製作流程,MLB,DOUBLESIDE,BlindedVia,P5,(3)OuterLayerProcessFlow,P6,ForO.S.P.,(4)SurfaceFinished&FinalInspection,P7,TypicalPCBManufacturingProcess,1.（基板）THINCORE,2.（压膜）DryFilmResistCoat,P8,TypicalPCBManufacturingProcess,4.（显影）Develop,3.（曝光）Expose,P9,TypicalPCBManufacturingProcess,5.（蚀刻）Etch,6.（剥膜）StripResist,P10,TypicalPCBManufacturingProcess,7.（叠合）Lay-up,8.（压合）Lamination,P11,TypicalPCBManufacturingProcess,9.（钻孔）Drilling(Primary),10.（PTH&镀铜）PTH&CopperDeposition,P12,TypicalPCBManufacturingProcess,11.（外层压膜）DryFilmLamination(Outerlayer),12.（曝光）Expose,P13,TypicalPCBManufacturingProcess,13.（显影）Develop,14.（镀二铜）PatternPlating,P14,TypicalPCBManufacturingProcess,15.（镀锡铅）TinPlating,16.（剥膜）FilmStripping,P15,TypicalPCBManufacturingProcess,15.（蚀刻）Etch,16.（剥锡铅）TinStripping,P16,TypicalPCBManufacturingProcess,18.（表面处理）SurfaceFinished(ElectrolessNi/Au,HAL),17.（防焊）SolderMask(SprayCoating),P17,Lay-upStructure,.,P18,1.下料裁板LaminateShear(PanelSize),2.內層板壓乾膜DryFilmResistCoat(InnerLayers),P19,3.曝光Expose,4.曝光後AfterExpose,P20,5.內層板顯影Develop,6.酸性蝕刻Power/Ground/Signal(Etch),P21,8.黑化OxideTreatment,7.去乾膜StripResist,P22,9.疊板Lay-up,P23,10.壓合Lamination,11.鑽孔(Drill&Deburr)(P.T.H.&BlindVia),P24,12.鍍通孔及一次電鍍Desmear&CopperDeposition,13.外層壓膜D/FPhotoResistCoat,P25,14.外層曝光Expose(Outer-Layer),15.曝光後AfterExpose,P26,16.外層顯影Develop,17.線路蝕刻(酸性蝕刻)(Etch),P27,18.去乾膜StripResist,19.防焊SolderMaskCoat,P