IC专业术语.doc

封装形式：封装形式是指安装半导体集成电路芯片用的外壳。它不仅起着安装、固定、密封、保护芯片及增强电热性能等方面的作用，而且还通过芯片上的接点用导线连接到封装外壳的引脚上，这些引脚又通过印刷电路板上的导线与其他器件相连接。衡量一个芯片封装技术先进与否的重要指标是芯片面积与封装面积之比，这个比值越接近1越好。封装大致经过了如下发展进程：结构方面：TODIPLCCQFPBGA CSP；材料方面：金属、陶瓷陶瓷、塑料塑料；引脚形状：长引线直插短引线或无引线贴装球状凸点；装配方式：通孔插装表面组装直接安装。英文简称英文全称中文解释DIPDouble In-line Package双列直插式封装。插装型封装之一，引脚从封装两侧引出，封装材料有塑料和陶瓷两种。DIP是最普及的插装型封装，应用范围包括标准逻辑IC，存贮器LSI，微机电路等。PLCCPlastic Leaded Chip CarrierPLCC封装方式，外形呈正方形，32脚封装，四周都有管脚，外形尺寸比DIP封装小得多。PLCC封装适合用SMT表面安装技术在PCB上安装布线，具有外形尺寸小、可靠性高的优点。PQFPPlastic Quad Flat PackagePQFP封装的芯片引脚之间距离很小，管脚很细，一般大规模或超大规模集成电路采用这种封装形式，其引脚数一般都在100以上。SOPSmall Outline Package19681969年菲为浦公司就开发出小外形封装（SOP）。以后逐渐派生出SOJ（J型引脚小外形封装）、TSOP（薄小外形封装）、VSOP（甚小外形封装）、SSOP（缩小型SOP）、TSSOP（薄的缩小型SOP）及SOT（小外形晶体管）、SOIC（小外形集成电路）等。常见英文缩写解释（按字母顺序排列）：ASICApplication Specific Integrated Circuit专用ICCPLDComplex Programmable Logic Device复杂可编程逻辑器件EDAElectronic Design Automation电子设计自动化FPGAField Programmable Gate Array现场可编程门阵列GALGeneric Array Logic通用阵列逻辑HDLHardware Description Language硬件描述语言IPIntelligent Property智能模块PALProgrammable Array Logic可编程阵列逻辑RTLRegister Transfer Level寄存器传输级描述SOCSystem On a Chip片上系统SLICSystem Level IC系统级ICVHDLVery high speed integrated circuit Hardware Description Language超高速集成电路硬件描述语言英文全称英文简称中文名称ACROSecureACROSecure宏聚科技（深圳）有限公司8x8, Inc.8x88x8ACC Microelectronics Corp.ACC MicroACC MicroAcer Laboratories, Inc.Acer LaboratoriesAcer LaboratoriesActel CorporationActelActelAnalog Devices Inc.AD模拟器件Adaptec, Inc.AdaptecAdaptecAdvanced Hardware Architectures, Inc.Advanced HardwareAdvanced HardwareAdvanced Micro Devices, Inc.Advanced Micro先进线性器件公司Aeroflex Circuit TechnologyAeroflexAeroflexAgilent Technologies, Ltd.AGILENT安捷伦AITech InternationalAITech IntlAITech IntlAKM Semiconductor, Inc.AKM SemiAKM SemiAllegro Micro Systems, Inc.ALLEGROALLEGROAlliance SemiconductorAlliance Semi联合半导体ALLTEKALLTEKALLTEKAlpha SemiconductorAlpha SemiAlpha SemiAltera CorporationAlteraAlteraAdvanced Micro Devices, Inc.AMD先进微器件American Microsystems, Inc.American Micro美国微系统公司AMIAMIAMIAMP IncorporatedAMP安普AMPHENOLAMPHENOLAMPHENOLAMTRONAMTRONAMTRONAnadigics, Inc.AnadigicsAnadigicsAnalogic CorporationAnalogicAnalogicApex Microtechnology CorporationApex MicroApex MicroAMCC (Applied Micro Circuits Corp)Applied Micro CircuitsApplied Micro CircuitsAptek Williams, Inc.Aptek WilliamsAptek WilliamsAptos Semiconductor CorporationAptos SemiAptos SemiArizona Microtek, Inc.Arizona Microtek亚利桑那Array MicrosystemsArray MicroArray MicroARTESYNARTESYNARTESYNASILIANTASILIANTASILIANTAstec SemiconductorAstec SemiAstec SemiAtmel CorporationATMEL爱特美尔AUCTOR MAPLEAUCTOR MAPLEAUCTOR MAPLEAUDIOCODESAUDIOCODESAUDIOCODESAustin Semiconductor, Inc.Austin SemiAustin SemiAustria Mikro Systeme International, Inc.Austria Mikro奥地利微系统AverLogic Technologies, Inc.AverlogicAverlogicAVX Corporation. 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WINBOND华邦XHKYXHKYXHKYXicor,inc.XicorXicorXilinx Corp.XILINX赛灵斯ZilogZilogZilog 模拟滤波器 光纤通信 高速信号处理和转换 无线/射频光线通讯，模拟 显示支持电路 高频模拟和混合信号ASIC数字转换器，接口，电源管理，电池监控 DC/DC电源 电压基准MAXIM前缀是“MAX”。DALLAS则是以“DS”开头。MAX或MAX说明：1后缀CSA、CWA 其中C表示普通级，S表示表贴，W表示宽体表贴。2 后缀CWI表示宽体表贴，EEWI宽体工业级表贴，后缀MJA或883为军级。3 CPA、BCPI、BCPP、CPP、CCPP、CPE、CPD、ACPA后缀均为普通双列直插。举例MAX202CPE、CPE普通ECPE普通带抗静电保护 MAX202EEPE 工业级抗静电保护（-45-85） 说明 E指抗静电保护MAXIM数字排列分类 1字头 模拟器 2字头 滤波器 3字头 多路开关 4字头 放大器 5字头 数模转换器 6字头 电压基准7字头 电压转换 8字头 复位器 9字头 比较器 DALLAS命名规则例如DS1210N.S. DS1225Y-100INDN=工业级 S=表贴宽体 MCG=DIP封Z=表贴宽体 MNG=DIP工业级IND=工业级 QCG=PLCC封 Q=QFP管脚数：A: 8 B: 10，64C: 12，192 D: 14E: 16 F: 22，256G: 24 H: 44I: 28 J: 32K: 5，68 L: 40M: 7，48 N: 18O: 42 P: 20Q: 2，100 R: 3，84S: 4，80 T: 6，160U: 60 V: 8（圆形）W: 10（圆形） X: 36Y: 8（圆形） Z: 10（圆形）四字母后缀：例如：MAX1480ACPIA = 指标等级或附带功能C = 温度范围P = 封装类型I = 管脚数下面是MAXIM的命名规则：三字母后缀：例如：MAX358CPDC = 温度范围P = 封装类型D = 管脚数温度范围：C = 0 至 70 （商业级）I = -20 至 +85 （工业级）E = -40 至 +85 （扩展工业级）A = -40 至 +85 （航空级）M = -55 至 +125 （军品级）封装类型：A SSOP(缩小外型封装)B CERQUADC TO-220, TQFP(薄型四方扁平封装)D 陶瓷铜顶封装E 四分之一大的小外型封装F 陶瓷扁平封装H 模块封装, SBGA(超级球式栅格阵列, 5x5 TQFP)J CERDIP (陶瓷双列直插)K TO-3 塑料接脚栅格阵列L LCC (无引线芯片承载封装)M MQFP (公制四方扁平封装)N 窄体塑封双列直插P 塑封双列直插Q PLCC (塑料式引线芯片承载封装)R 窄体陶瓷双列直插封装(300mil)S 小外型封装T TO5,TO-99,TO-100U TSSOP,MAX,SOTW 宽体小外型封装（300mil）X SC-70（3脚，5脚，6脚）Y 窄体铜顶封装Z TO-92，MQUAD/D 裸片/PR 增强型塑封/W 晶圆 DSP信号处理器 放大器工业用器件 通信 电源管理 移动通信视频/图像处理器等 模拟A/D D/A 转换器 传感器 模拟器件AD产品以“AD”、“ADV”居多，也有“OP”或者“REF”、“AMP”、“SMP”、“SSM”、“TMP”、“TMS”等开头的。后缀的说明：1、后缀中J表示民品（0-70），N表示普通塑封，后缀中带R表示表示表贴。2、后缀中带D或Q的表示陶封，工业级（45-85）。后缀中H表示圆帽。3、后缀中SD或883属军品。 例如：JN DIP封装 JR表贴 JD DIP陶封 DSP 信号处理器等嵌入式控制器 高性能运放IC 存储器 A/D D/A 模拟器件转换接口IC等 54LS军品系列 CD4000军品系列 工业 / 民用电表微控制器等TI产品命名规则：SN54LS/HC/HCT/或SNJ54LS/HC/HCT中的后缀说明：1、 SN或SNJ表示TI品牌2、 SN军标，带N表示DIP封装，带J表示DIP（双列直插），带D表示表贴，带W表示宽体3、 SNJ军级，后面代尾缀F或/883表示已检验过的军级。CD54LS/HC/HCT：1、无后缀表示普军级2、后缀带J或883表示军品级CD4000/CD45：1、 后缀带BCP或BE属军品2、 后缀带BF属普军级3、 后缀带BF3A或883属军品级TL：1、 后缀CP普通级 IP工业级 后缀带D是表贴2、 后缀带MJB、MJG或带/883的为军品级3、 TLC表示普通电压 TLV低功耗电压TMS320系列归属DSP器件， MSP430F微处理器BB产品命名规则： 前缀ADS模拟器件 后缀U表贴 P是DIP封装 带B表示工业级 前缀INA、XTR、PGA等表示高精度运放 后缀U表贴 P代表DIP PA表示高精度 FLASH 快闪记忆体，嵌入式奔腾处理器，Xscale, 个人数字助理PDA StrongARM处理器及开发工具，IXA网络处理器，i960RISC处理器，PCI-PCI Bridge 芯片，8位及16位单片机INTEL产品命名规则： N