GB 51037-2014 微组装生产线工艺设备安装工程施工及验收规范

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11、 x i52. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . c s 1 ) 3 Contents 1 General prov1s1ons ( 1 ) 2 Terms ( 2 ) 3 Basic requirements ( 4 3. 1 Construction conditions ( 4 3. 2 Equipment unpacking ( 5 ) 3. 3 Equipment moving 5 ) 3.

12、4 Equipment installation ( 6 ) 3. 5 Equipment debugging and commissioning ( 7 ) 4 Installation, debugging and comm1ss1onmg of low temperature co-fined ceramic and thick film substrate production process equipment ( 9 ) 4. 1 General requirements ( 9 ) 4. 2 Tape caster 9 ) 4. 3 Blanker ( 10 ) 4. 4 Gre

13、en tape puncher ( 10 ) 4. 5 l.,aser puncher ( 11 ) 4. 6 Via filling machine ( 12 ) 4. 7 Screen printer ( 13 ) 4. 8 Stacking n1achinc ( 13 ) 4. 9 Isostatic lamina tor ( 15 ) 4. 10 Hot cutter ( 15 ) 4. 11 Low temperature co-fined ceramic box furnace ( 16 ) 4. 12 4. 13 4 Thickfilm belt furnace Laser re

14、sistor trimmer ( 1 7 ) ( 1 7 ) 3 Installation, debugging and commissioning of thin film substrate production process equipment ( 18) 5. 1 General requirements ( 18 ) 5. 2 Magnetic sputtering deposition system ( 18) 5 . 3 Vacuum e v a po rat ion cop pc r-coat e d machine ( 1 9 ) 5. 4 Chemical v:por d

15、eposition system ( 21 ) S. 5 Spin coating and hot plate system ( 22 ) 5. 6 s. 7 Exposure machine Developing system ( 23 ) ( 2 1 ) 5. 8 Reactive ion etching machine ( 25 ) 5. 9 Chemical mechanical polishing machine ( 26 ) 6 Installation, debugging and commissioning of assembling and packaging process

16、 equipment C 28 ) 6. 1 6. 2 Gcnera I rcq u i rem en ts Die at tching machine ( 28 ) ( 28 ) 6. 3 Die eutectic bonder ( 29 ) 6 . 4 Eu t cc tic () v e r1 C 2 9 ) 6. 5 Wire lJondcr ( 30 ) 6. 6 6. 7 Flip chip bonder Plasma cleaner ( 31 ) ( 31 ) 6. 8 Selective spray coating machine ( 32 ) 6. 9 Parallel sc

17、am welder . ( 32 ) 6. 10 Energy storage welder ( 33 ) 6. 11 Laser welder ( 34 ) 7 Installation, debugging and commissioning of process inspection equipment UI1UG 11/J 1-1 o 2. 0. 7 it packaging 2 tXlf H14 ( f JI Lt) il!fr Ka 1? fQ 8 1 -TZtX*, -=tt4it, *ii -it?fOit=-ff o 2. 0. 8 .I Z: ;fliij!LJ proce

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