LED焊线原理介绍.ppt

1、什麼是 WIRE BOND,L/F,一. W/B 銲線基本理論 :,二. BONDING (固態銲接)的四大基本要素 : 要如何才能得到最佳的銲接，主要要素如下 A. 壓力。(BOND FORCE) B. 振盪功率。(BOND POWER) C. 銲接時間。(BOND TIME) D. 銲接溫度。(TEMPERATURE),1. 目前我們電子產品銲接是採用固態銲接， 所謂固態銲接，就是金屬在未達熔解溫度 下之銲接。決定固態銲接的要素有那些？,1. 鋁墊之構造: a. 最上層為少量水氣與雜質 b. 第二層為氧化鋁 c. 第三層才是純鋁 d. 第四層是二氧化鋁 e. 最下層就是矽層,2. 最佳之銲

2、接，就是金球與純鋁密切結合。 故如何運用四大基本要素，掌控最佳配合 時機為學習要旨。 如壓力、振盪過大會造成缺鋁或矽崩 過小昨則無法有效排除第一、二層與純鋁 層作密切接合銲接。,三. 金球與鋁墊之最佳銲接 :,溫度,溫度,金球,二氧化矽層,矽層,純鋁,玻璃層,水氣及雜質,氧化鋁,金球與鋁墊的銲接模式,鋁墊SEM側視圖,L/F,* WIRE BOND *,pad,lead,Free air ball is captured in the chamfer,Free air ball is captured in the chamfer,pad,lead,Free air ball is captu

3、red in the chamfer,pad,lead,Free air ball is captured in the chamfer,pad,lead,Free air ball is captured in the chamfer,pad,lead,Formation of a first bond,pad,lead,Formation of a first bond,pad,lead,Formation of a first bond,pad,lead,heat,PRESSURE,Ultrasonic Vibration,Formation of a first bond,pad,le

4、ad,Ultra Sonic Vibration,heat,PRESSURE,Capillary rises to loop height position,pad,lead,Capillary rises to loop height position,pad,lead,Capillary rises to loop height position,pad,lead,Capillary rises to loop height position,pad,lead,Capillary rises to loop height position,pad,lead,Formation of a l

5、oop,pad,lead,Formation of a loop,pad,lead,pad,lead,pad,lead,pad,lead,pad,lead,pad,lead,pad,lead,pad,lead,pad,lead,pad,lead,pad,lead,pad,lead,pad,lead,pad,lead,pad,lead,pad,lead,pad,lead,Formation of a second bond,pad,lead,heat,Formation of a second bond,pad,lead,heat,heat,pad,lead,heat,heat,pad,lead,heat,heat,pad,lead,pad,lead,pad,lead,pad,lead,pad,lead,pad,lead,pad,lead,Disconnection of the tail,pad,lead,Disconne