主板相关专有名词缩写

常见专有名词，缩写列表AGP:AcceleraGraphicsPort加速籍圜阜=加速绘图阜PCIBusPeripheraComponentInterconnectj®ft元件装置速接胜流排=外围组件装置连接总线ISABus:IndustryStanArchitectuBus工棠*票莘架京毒胜流排=工业标准架构总线Device装置=装置Bridge槁接器=桥接器P2P=PCItoPCIBridgeH2P=HosttoPCIBridgeP2IBridge=PCItoISABridgeConfiguration^®=规划\配置VID:VendorI段造商^别碣=VendorID制造商识别码DID:DeviceI踱置^别碣=DeviceID装置识别码SVID:SubsysteVendorID次系第充裂造商^别碣=SubsystemVendor次系统制造商识别码SSID:SubsystemSystem次I系^系第充系第形戳别碣=SubsystemSystem眺系统系统识别码CPU:CentralProcessing中n央魂理罩元=中央处理单元L1=Level1L2=Level2L3=Level3CacheMemory:快取言印意髓=高速缓存BIOS:BasicInputandOutputSB本^输出入系第充=基本输出入系统MainBoard主檄板=主板Chassis:檄克殳，雷胸主檄外克殳.克殳子=机壳，计算机主机外壳，壳子Case:横克殳，1胸主横外克殳克殳子=机壳，计算机主机外壳，壳子Interrupts=中断Register存器=缓存器ROM:ReadOnlyMemory唯^言印意髓=只读存储器PROM:ProgrammableROM可程式唯^言己情髓=可程序只读存储器EPROM:ErasablePROM可抹除可程式唯^言印意髓=可抹除可程序只读存储器EEPROM:ElectronicEEPROM=1标式可抹除可程式唯^言印意髓=电气式可抹除可程序只读存储器RAM:RandomAccessMemory随横存取言己情髓=随机存取内存SDR:SingleDataROH倍资料僖输率=单倍数据传输率DDR:DoubleDataRaft倍资料僖翰率=双倍数据传输率QDR:QuadDataRat四倍资料僖翰率=四倍数据传输率RISC:ReducedInstructionSetCo^M指令集1胸=精简指令集计算机CISC:ComplexInstructionSetCompgtft指令集1胸=复杂指令集计算机PSB:ProcessrSystemBust理器系统胜流排=处理器系统总线FSB:FrontSideB前端E流排=前端总线USB:UniversalSerBus通用序列^流排=通用序列总线SMBus:SystemManagementBi系第充管理E流排=系统管理总线SMM:SystemManagemenMode系第充管理模式=系统管理模式APIC:AdvanceProgrammableInterrupt*^!0可程式中限斤控制器=进阶可程序中断控制器ACPI:AdvanceConfigurati&nPowerManagemenInterfa^^^®及雷源管理介面=进阶规划及电源管理接口PS/2:PersonalSystem2KB=Keyboard导建盘=键盘MS=Mouse滑鼠=鼠标Cursor=游*票=光标Transistor晶髓=晶体管TTL=TransistorTransistLogic雷晶髓雷晶髓^辑=晶体管晶体管逻辑F.F.:Flip日正反器=触发器GART:GraphicsAddressRemappingTfbS地址映坐寸表=绘图地址映对表O/D:OpenDraiH汲集=开汲集O/C:OpenCollects集桎=开集极T/S:Tri-St三熊=三态S/T/S:SustainTri-备隹持三熊=维持三态HT:HyperThreadin超朝行名者=超执行绪HT:HyperTranspc超傅翰阜=超传输阜PIO:ProgrammedIO可程式翰出入=可程序输出入DMA:DirectMemoryAcces直接言印意髓存取=直接内存存取UDMA:UltraDMADBI:DynamicBusInversion熊E流排反向=动态总线反向BSP:BootstraProcessojl重力虚理器=激活处理器AP:ApplicationProceH用诚理器=应用处理器RTC:RealTimeClo即畤畤月底=实时时脉IO:InputandOutjpu出入=输出入DRAM:DynamicRandomAccessMemory重力熊随檄存取言印意髓=动态随机存取内存SRAM:StatiRandomAccessMemor蒲熊随横存取言印意髓=静态随机存取内存UPS:UninterruptiPowerSupply不限斤雷系第充=不断电系统FlashROM快断印意髓=闪存PnP:Plug&Play即插即用=即插即用ATA:AdvancedTechnologAttachmentSATA:SerialATA(ATAttachment序列ATA=序列ATAPATA:ParalleATA(ATAttachment)亚列ATA=并列ATANB:NorthBridg北裔=北桥SB:SouthBrid南^=南桥Chipset:晶片务且=芯片组FDD:款式磁碟檄物碟）=软式磁盘驱动器软盘）Floppy：款式磁碟檄（软碟）=软式磁盘驱动器软盘）FloppyDis歉式磁碟片酬碟片）=软式磁盘片软盘片）HardDriver硬式磁碟横硬碟）=硬式磁盘驱动器硬盘）Controlled制器=控制器IDE:IntegratDriveElectronicsIDEController=I控制器=IDE控制器FDC=FloppyControlf^磁碟控制器=软式磁盘控制器MemoryControllefEE意髓控制器=内存控制器CoreLogic核心^辑（指晶片且）=核心逻辑（指芯片组）VGA:VideoGraphiAdapter视言琨奢圜装置=视讯绘图装置COMPort:CommunicationPoHtH阜（Seria序列阜）=CommunicationPoffi^阜（Seria序列阜）LPTPort:LocalPrinterPort（ParalU列阜）｝t=:LocalPrinterPort（Paral并列阜）'t:OS:OperationSyst作棠系第充=OperaionSystem操作系统H/W:Hardware硬髓=Hardware硬件S/W:Softwarf髓=Software软件F/W:Firmwar^］髓=Firmware韧体IrDA:InfraredDataAssociationPAT:PerformanceAccelerationTechno效能加加速技彳桁=效能加速技术ATAPI:AdvancedTechnologyAttachmentPacketInterfaceATA:AdvancedTechnologyAttachmentIDE:IntegratedDriveElectronicsEIDE:EnhanceIDEVRM:VoltageRegulatorModUS!言周筋模且=电压调节模块DIMM:DualIn-LineMemoryModuleSIMM:SingleIn-LineMemoryModuleDIP:插件=插件（双列直插式）SMT:SurfacMountTechnology表面黏著技彳桁=表面黏着技术SMD:SurfaceMountDev表e面黏著装置=表面黏着装置（贴片式）MOSFET:MetalOxideSemiconductoFiledEffectTrans金H氧化物半W^W效S晶髓=金属氧化物半导体场效晶体管CMOS:ComplementaryMetalOxideSemiconductors金屠氧化物半W髓=互补金属氧化物半导体DVMT:DynamicVideoMemoryTechnolo通熊视言刊言印意髓技彳桁=动态视讯内存技术ESCD:ExtendedSystemConfiguration妈申系第充规割资料=延伸系统规划资料PLL:PhaseLockLo相^回路=相锁回路PXI:PCExtensionforInstrumentationProtoco通言而荔定=通讯协议GPIB:General-PurpInterfaBus通用介面胜流排=通用接口总线EU:ExectionUni执行部件IU:instruction立旨令部件BU:busunit总线部件AU:Adressun地址部件MMU:存储器管理部件BIU:总线接口部件ALU:ArithmeticLogicUni算矍攵^辑罩元=算数逻辑单元FPU:FloatingPoint浮黑睛算罩元=浮点运算单元ISR:InterruptSeRoutine中新向量服矜常式=中断向量服务例程T.PThrottlPoin廊流黑占=节流点EDO:ExtendedDataOutp延t伸M料输出=延伸资料输出FPM:FastPageMod快'速页模式=快速页模式PPM:PartsPerMil囤I分之…=百万分之….POST:PowerOnSelfT^自我测^=开机自我测试IPMI:IntelligentPlatformManagement智慧ffH管理介面=智能平台管理接口FRU:FielReplaceablUnitI2O:IntelligentInput/智慧型值俞出入=智能型输出入PCB:PrintCircuit压印刷‘置路板=印刷电路板O.E.M.:OriginalEquipManufacture客户委^生座裂造=客户委托生产制造C.E.M.ComponentEquipmentManufacturer5委^生座裂造=客户委托生产制造O.D.M.:OriginalDesignManufa客|氐委^言殳言十裂造=客户委托设计制造S.M.A.R.T.:Self-MonitoringAnalysisandReporting自我hnOBO分析回幸艮技彳桁=自我诊断分析回报技术G更盘）1X:一倍速=一倍速2X:二倍速=二倍速4X:四倍速=四倍速8X:八倍速=八倍速Connector速结器=连结器Socket插座=插座Header排金十=排针Slot插槽=插槽Resisto＜阻器=电阻器Capacitor®容器=电容器Inducto‘感器=电感器Transien暂熊=瞬时VTT:VoltageTransientToolScope:示波器=示波器ECC=ErrorCheckingandCorrection愈查舆修正=错误检查与修正LPC=LowPinCountPjM:ProjectMana毒案管理g市=项目管理师PM:ProductManageir品管理g=产品管理师PE:ProductionEngineer工程g=产品工程师ICT:InCircuitTestATE:AutoTestEquipmentSchematic^路圜=线路图Layout彳布富泉=布线Simulatio模才疑=仿真Waveform波形=波形GerberTimingMeasurement畤序量测=时序量测RisingTimeFallingTimeHighTimeLowTimeSkewFlightTimeGlitchMonotonicNon-monotonicFormFactor:AT:AdvanceTechnology皆技彳桁=进阶技术ATX:AdvancedTechnologyExpandingMicroATXFlexATXNLXChipsetVendo晶片裂造商=芯片制造商Intel美商英代崩=美商英特尔AMD美商超微=美商超微VIA威盛1子=威盛电子SiS矽统科技=硅统科技Ali=榻智科技=扬智科技OEM/OEMCustomer:OEM/OEM客户IBMUK祭商棠横器公司=国际商业机器公司DELL戴WW^=戴尔计算机NewHP(HP+Compaq)惠普科技=惠普科技NEC日电SONYFujitsuSieme富士SDRAM:SynchronousDynamiRandomAccessMemoryCSA:CommunicatioStreamingA