新产品开发整体流程介紹

C-SystemIntroductionwillcoverRole&Responsibility(R&R)ProcessCxStage:C0:Proposalphase构想阶段C1:Planningphase规划阶段C2:R&DDesignphase设计时间C3:LabPilotRunphase样品试作阶段C4:EngPilotRunphase工程试作阶段C5:PDPilotRunphase试产阶段C6:MassProductionphase量产阶段Role&Responsibility

FunctionResponsibilityPM产品经理-ProductManager(或计划项目经理-ProjectManager)为所负责计划或产品线成败之总负责人,将依产品线之性质指定专人负责某类产品,必须对所负责产品线专业领域之发展及营销双方面皆有相当程度的了解.并依照产品之条件及市场状况,做适当的运用,订定技术或产品市场竞争策略,并在适当的时机推出适当之技术或产品.TMTMisresponsibletocoordinatetechnicalissuesconflictamongHW,SW,IDandMEanddecision-making.TMhastohandleallprojecttechnicalissues.

PCC为规划推广、连络及控制项目进行的负责人,掌握项目进行之情况以协助处理异常状况,使新产品能顺畅切入工厂且如期推出,以提高产品竞争力.协助R&DRELEASE开发阶段BOMCHANGENOTICE.R&DR&D包括电子部门及工业设计部门,若只写HW(HardwareDesign)则指电子部门,若只写ID(INDUSTRIALDESIGN)则指工业设计部门;包括ME,Thermal,Packingdesign.若只写SW(Softwaredesign)则指软件设计部门有负责BIOS,Driver及Pre-load不同工作性质之软件开发功能.R&D人员负责产品之开发、设计、测试规划，包括H/W、S/W及ID的开发、设计、提出新发明及著作权揭露书.

-WistronCaseRole&Responsibility

FunctionResponsibilityHW(HardwareDesign)*HardwareisresponsibleforElectronicEngineeringDesign*Co-workswithS/WandQTtomakesurethattheeveryfunctionworkswellaccordingtospec.*H/WshouldconducttechnicaltransfertoPE.*H/Wshouldinput,update,andmaintainthebugs/issuesinformationinthebugtrackingsystem.SW(SoftwareDesign)*SoftwareisresponsibleforthedesignofBIOS,Driver,Utilities,andS/WPreload.*S/Wco-workswithH/WandQTtomakesurethateveryfunctionworkswellaccordingtothespecification.*S/WhastoreleasetheSCDandtheCert.TeamDocument.*S/WshouldconducttechnicaltransfertoTE.*S/Whastoinput/update/maintainthebugs/issuesinformationinthebugtrackingsystem.ID/ME(IndustrialDesign/MechanicalEngineering)*ID/MEisresponsibleforMechanicalEngineering,ThermalandPackingdesigns.*ID/MEshouldconducttechnicaltransfertoPME.*ID/MEshouldinput,update,andmaintainthebugs/issuesinformationinthebugtrackingsystemused.-WistronCaseRole&Responsibility

FunctionResponsibilityPA(EMI/Safety,QT,CE/Reliability,PCB,OSCertification)为产品保证暨开发支持Function之总称,主要负责根据MRS/PES执行各项产品之测试,诸如EMC/Safety:REGULATORYTEST,CE:RELIABILITYTEST及KEYCOMPONENTAPPROVAL,PCB:PCBLAYOUT,DC:BOM,OS:OS认证etc;…EMC/SafetyAllproductstomeetEMC/Safetyrequirementsandguaranteethelegalityintheinternationalmarketing.申请产品之安规、测试、Debug..QT为R&D辖下所属之测试单位人员,主要负责各项产品之测试,诸如COMPATIBILITYTEST,SOFTWARETEST,S/WPRELOADTEST,DIAGNOSTICPROGRAMTEST,ETC.,CE/Reliability组件承认测试、不良品故障分析及其他附件等材料质量之管制及保证产品相关之可靠度与环境实验，以及可靠度工程之研究与制定.PCBPCBLayout之申请、PCB之设计、Orcadlibrary&Mentorlibrary的建立与管理.信号质量CAE分析,PCBlayout外包厂商之管理，PCB制造厂商之管理.OSCertification执行公司各产品之OS兼容性认证测试及LOGO申请.O.S.BetaSite测试PDM料号编码及控管,BOM制作-WistronCaseRole&Responsibility

FunctionResponsibilityAM(AccountManager)1.争取订单与客户合约协商.2.协调产品SPEC.工程变更

SAMPLEAPPROVAL.3.适时反应市场需求与趋势.MM(MaterialManagement)1.MMisresponsiblefornewsupplierdevelopment,partspurchasing2.Controllingmechanicaltoolingstatusincludingtheschedule,capacity,partsreadiness,concerns3.Managethedependencies,longlead-timeitems.4.MMalsoco-workswithSQMandCEforcomponentqualityimprovementandthekeycomponentQVLfinalversionSQM(SupplierQualityManagement)*零件质量管理及参与分包商之评鉴/管理(SQRCPlan/Status)*负责异常材料分析、追踪与改善.*负责进行产品

QVLCANDIDATEAPPROVAL操作系统

ATmfg.

GCSD1.开发及推动全球客户服务及支持计划.2.各项售后服务及支持作业.3.参与Field质量改善作业(EWG)FI负责评估

ProjectCost,决定

Project是否可行以及

Project所花费之

Cost.

Legal合约及专利审核-WistronCaseRole&Responsibility

FunctionResponsibilityCFECFEactsonbehalfofWistronglobalmanufacturingoperationtodealwiththecustomer,andalsoactsasarepresentativeofthecustomerwhendealingwithinternalWistronteams.BasedontheC4/C5checklist,relatedreportsandprojectstatus,CFEisresponsibletoconcludetheexitjudgment(ReadyorNotready)duringC4/C5ExitmeetingstodeterminewhetheraproductcanmoveontoPDpilotrun/MPornotNPI1.负责规划、协调、整合与提供各Site制造所需相关信息与技术数据2.协调安排新产品转移至海外生产工厂3.协调处理海外生产工厂发生之生产相关问题PE/PME1.产品设计审查,产品问题之发觉及产品移交.2.协助生产良率提升,克服生产瓶颈,提高生产力.

3.协助订定制造规格及引进新的制作技术,进行改善以确保产品质量.IE1.设计及管理一个高效率的整合制造系统.2.消除浪费、杜绝不合理，提高生产力

3.生产流程规划、制程改善、标准工时制定

QA1.执行制程及产品之检验并反应质量报告请相关单位改善质量2.3.协助工程单位必要之验证测试.

4.建立PCBA,FinalAssembly之检验标准QE1.执行DQA.FDI,MTBF,ORTTest2.执行产品开发过程之可靠度及环境测试(C4)3.协助工程测试验证4.质量工程问题分析与解决

-WistronCaseRole&Responsibility

FunctionResponsibilityPD(Production)PDhastoworkwithPE,PMEandIErespectivelytogettestingequipment&tools,assemblytools,andSOPreadybeforeC5Exit.PDisresponsibletoproducetheproduct.PDisnotjustforefficiencyonlybutalsoquality.PSE(ProcessEngineer)PSEisresponsibleforSMTprocessandforreleasingtheSMTpilotrunreport.PSEisalsoresponsiblefortheprocesscontinuousimprovement(CIP).FAE(FailureAnalysisEngineer)orREFAEisresponsibleforissuingthefailureanalysisreportandforwardingthistorelateddepartmentsforproductqualityimprovement.FAEisalsoresponsibleforpreparingrepairSOPifapplicable.TETEisresponsibleforprovidingandmaintainingTestPlanandTestProgram.TEalsoimplementallthepreloadtoproductionlineandreporttheproblemsrelatedtopreloadtopreloadteam.PMC/GPMC(PlanMaterialControl/GlobalPlanMaterialControl)GPMC/PMCisresponsibleforproductfulfillment,finalshippingmodel,supplysiteandcapacityplan,andrampupplanforallsites.-WistronCaseWistronC-SystemQualityControlProposalPhasePlanningPhaseR&DDesignPhaseLabPilot-runPhaseEngineeringPilot-runPhaseProductionPilot-runPhaseMassProductionPhaseC0C1C2C3C4C5CheckPointWistronC-PhaseNPIFDI/MTBFDQA/PQC/FQCCompatibility/DiagnosticSimulationTestLayout&drawing-SignalIntegrity-DFXCheck-AVL-C-TestPlansReliability/StressEMI/SafetyOS&Pre-LoadWIH/WPH/WZS/WKSMRSCheck-ServiceCostEstimate-Simulation-DesignPeerReview-LessonsLearnedAvailabilityDevelopPlanLaunchFAI&SPCMTBFDemoCIP/CLCAParetoAnalysisEWGReadyAFRTestReportsPre-QVLReadyDiagnosticsProgramBugList&ActionDCN/ECN/ECRFAIreportPFMEASQRCTrainingMTBFReviewQMP/QPA/QSAFPYRPPAPServiceability

DesignTestPlansIntegrateDesignReviewSignalQualityDFXIndexInitialSupplierAuditMemorandumDFMEASimulationMTBFEstimateMVPConcept/ProposalMRSDefinitionScopeSCEInvestigation&ProposalDesign&SourcingIntegrationValidationReleaseProductLifeCycleMDRR/C4Go/NoGo?MRR/C5Go/NoGo?C6OOB/OBAORT/StressEWG/FQHAFR/DOANewCSystemArchitectureProgressC0ExitC0ActivityC0EntryC1ExitC1ActivityC1EntryC2ExitC2ActivityC2EntryC3ExitC3ActivityC3EntryC4ExitC4ActivityC4EntryC5ExitC5ActivityC5EntryC6ExitC6ActivityC6EntryTimeDetailActivitiesSubjectScopeDefinitionProcedure….ActivitiesDefinitionRecord&ReportFormatDefinitionEscalationRuleMeasurementStandardProjectManagement&SystemMaintenanceNewCSystemProductDevelopmentProposalPhasePlanningPhaseR&D

DesignPhaseLabPilotRunPhaseEng.PilotRunPhaseProductionPilotrunPhaseMassproductionphaseC2meeting

C3meeting C4meeting C5meeting

C3checklistHWDVtestreportSWFVtestreportMEtestreportReliabilitytest

report(prel.)ME/Artwork

/packingdrawingPAL/ROM

datalistingC3manufacturability

reviewreportSampleapprove

status&buglist

reviewC4checklistBOMQVLTimestandardSystemBIOS/KBC

FWreleaseS/WDriver/AP/

Utility/Diagnostic

ReleaseEEEng.P/RreportSMTWSP/RreportPCBAWSP/RreportMEEng.P/RreportEng.P/RQAreviewreportSchematics&jumpersettingTestprogram/ProcedureSOPforPCBA/FAUsermanualR/NPackingstandardCompatibilitytestreportReliabilityandC4ReliabilitytestreportKeyComponentverificationSparepartslistC5checklistServiceGuideEMCSafetyreportPDP/RyieldrateanalysisrptPCBAinspectioninstructionProductinspectioninstructionMTBFDEMOtestreportPMPMC0meeting C1meetingPMC1checklistInvention

disclosureTimescheduleProjectteamModelnumber

defineGreendesign

guideandreview

checklistNonQVL/Sample

approvalrequestformC2checklistPESEMC/Safety

RequestFormBOM/QVL(Prel.)PCBLayout(prel.)Outsourcingmodule

specificationPMNPIC0C1C2C3C4C5C6C6meetingGCSDC6checklistProductphase

outnoticeC0ChecklistMRSC0/PMC0Meeting 阶段C0构想阶段(ProposalPhase)负责单位计划经理(ProjectManager)或产品经理(ProductManager)目的*确订提案构想或市场需求规格书(MRS)*可行性分析工作重点

*相关提案之市场资料搜集*相关提案之关键技术资料搜集*R&D提出技术可行性分析*PM执行可行性及效益评估审核会议C0目的评估是否成立项目计划，进行研发检核项目计划提案书或市场需求规格书(MRS)

C0-工作重点及检核项目NewCSystemProductDevelopmentProposalPhasePlanningPhaseR&D

DesignPhaseLabPilotRunPhaseEng.PilotRunPhaseProductionPilotrunPhaseMassproductionphaseC2meeting

C3meeting C4meeting C5meeting

C3checklistHWDVtestreportSWFVtestreportMEtestreportReliabilitytest

report(prel.)ME/Artwork

/packingdrawingPAL/ROM

datalistingC3manufacturability

reviewreportSampleapprove

status&buglist

reviewC4checklistBOMQVLTimestandardSystemBIOS/KBC

FWreleaseS/WDriver/AP/

Utility/Diagnostic

ReleaseEEEng.P/RreportSMTWSP/RreportPCBAWSP/RreportMEEng.P/RreportEng.P/RQAreviewreportSchematics&jumpersettingTestprogram/ProcedureSOPforPCBA/FAUsermanualR/NPackingstandardCompatibilitytestreportReliabilityandC4ReliabilitytestreportKeyComponentverificationSparepartslistC5checklistServiceGuideEMCSafetyreportPDP/RyieldrateanalysisrptPCBAinspectioninstructionProductinspectioninstructionMTBFDEMOtestreportPMPMC0meeting C1meeting PMC0ChecklistMRSC2checklistPESEMC/Safety

RequestFormBOM/QVL(Prel.)PCBLayout(prel.)Outsourcingmodule

specificationPMNPIC0C1C2C3C4C5C6C6meetingGCSDC6checklistProductphase

outnoticeC1checklistInvention

disclosureTimescheduleProjectteamModelnumber

defineGreendesign

guideandreview

checklistNonQVL/Sample

approvalrequestformC1/PMC1Meeting C1-工作重点及检核项目阶段C1规划阶段(PlanningPhase)负责单位计划经理(ProjectManager)或产品经理(ProductManager)目的*规格的拟订

*项目组织的成立*项目时程的规划工作重点

*选任技术经理(TechnicalManager,简称TM)并成立项目组织*计划项目经理(ProjectManager)或产品经理，规划项目时程*召开C1审核会议*法务确认LegalConcern、如PotentialPatentList,InventionDisclosure*成立项目团队审核会议C1目的成立项目团队、确定开发时程检核项目TimeScheduleProjectTeamInventionDisclosureGreenDesignCheckListSampleRequestForm

Case-bottleCocainEngland开采铝矿一吨铝土提炼半吨氧化铝半小时加工半吨氧化铝熔炼成1/4吨金属铝再加工二周成铝锭瑞典或梛威熔炉工厂澳大利亚澳大利亚化学还原工厂加热至华氏900度压延成1/8inch薄片瑞典和德国压延厂船运一个月冷轧成1/80inch薄片冷轧厂英国易拉罐厂成型，清洗，烘干，防锈装填，印刷英国可乐厂消费铝罐回收尽16%EcologicalRucksack(生态包袱)生产一片半导体芯片所产生之废料为产品重量之十万倍生产一台笔记本电脑所产生之废料为产品重量之四千倍生产一公升佛罗里达橘子汁需要两公升汽油及一千公升之水生产一吨纸需用掉九十八吨之其他资源

数据源:绿色资本主义─天下出版社EURoHS

Directive指令期程2003.01.27指令发布2003.02.13欧盟公报发行,指令生效2004.08.13转为会员国当地法律,法规或行政指令2006.07.01新投入之产品不得含有禁用物质指令要求/禁用项目铅(Pb)镉(Cd)汞(Hg)六价铬(Cr6+)多溴联苯(PBB)多溴化二苯乙醚(PBDE)(Therestrictionoftheuseofcertainhazardoussubstancesinelectricalandelectronicequipment)EURoHS管制规格SubstancesE.U.建议值Lead(Pb)铅;焊锡1000PPMLead(Pb)铅;塑料,线材,涂料1000PPMCadmium(Cd)镉100PPMMercury(Hg)汞1000PPMHex.Chromium(Cr6+)六价铬1000PPMPBB(聚溴联苯)1000PPMPBDE(聚溴二苯醚)1000PPM重金属：汞、铅、镉、六价铬溴性耐燃剂：聚溴联苯(PBBs)、溴联苯醚(PBDEs)注：另有管制规范外的项目EUWEEE

DirectiveDirective2002/96/EC期程2003.01.27指令发布2003.02.13欧盟公报发行，指令生效2004.08.13转为会员国当地法律,法规或行政指令2005.08.13完成回收系统建构,制造商因应回收之

财务规划就绪2006.12.31回收再利用率达每人每年4kg2008.12.31订定下阶段目标回收TargetofRecoveryandRecycling(WasteElectricalandElectronicEquipment)WEEECategory

Largehouseholdappliances

Smallhouseholdappliances

IT&telecommunicationsappliances

Consumerequipment

Lightingequipment

Electricalandelectronictools

Toys,leisure&sportsequipment

Medicaldevices

Monitoringandcontrolinstruments

Automaticdispensers

RateofRecovery

RateofRecycling

80%

75%

70%

50%

75%

65%

75%

65%

70%

50%

70%

50%

70%

50%

*

*

70%

50%

80%

75%

*Tobedeterminedby31December2006

NewCSystemProductDevelopmentProposalPhasePlanningPhaseR&D

DesignPhaseLabPilotRunPhaseEng.PilotRunPhaseProductionPilotrunPhaseMassproductionphaseC2meeting

C3meeting C4meeting C5meeting

C3checklistHWDVtestreportSWFVtestreportMEtestreportReliabilitytest

report(prel.)ME/Artwork

/packingdrawingPAL/ROM

datalistingC3manufacturability

reviewreportSampleapprove

status&buglist

reviewC4checklistBOMQVLTimestandardSystemBIOS/KBC

FWreleaseS/WDriver/AP/

Utility/Diagnostic

ReleaseEEEng.P/RreportSMTWSP/RreportPCBAWSP/RreportMEEng.P/RreportEng.P/RQAreviewreportSchematics&jumpersettingTestprogram/ProcedureSOPforPCBA/FAUsermanualR/NPackingstandardCompatibilitytestreportReliabilityandC4ReliabilitytestreportKeyComponentverificationSparepartslistC5checklistServiceGuideEMCSafetyreportPDP/RyieldrateanalysisrptPCBAinspectioninstructionProductinspectioninstructionMTBFDEMOtestreportPMPMC0meeting C1meeting PMC0ChecklistMRSPMC1checklistInvention

disclosureTimescheduleProjectteamModelnumber

defineGreendesign

guideandreview

checklistNonQVL/Sample

approvalrequestformNPIC0C1C2C3C4C5C6C6meetingGCSDC6checklistProductphase

outnoticeC2checklistPESEMC/Safety

RequestFormBOM/QVL(Prel.)PCBLayout(prel.)Outsourcingmodule

specificationC2/PMC2Meeting C2-工作重点及检核项目阶段C2设计时间(R&DDesignPhase)

负责单位技术经理(TechnicalManager)研发部门目的*软、硬件、机构设计

*证实设计可行性*修正软、硬件、机构规格工作重点

*电路设计并完成电路图*机构设计并完成机构设计图*机电整合设计并完成机电接口设计*软件设计并完成初步版本*电路设计Review*机构设计Review*机电整合设计Review*建立初步之测试计划(硬件、软件、机构)审核会议C2目的*确定计划规格*检讨设计时间之工作成效*决定是否进入样品试作*查核是否发出专利之申请检核项目Schematics(Preliminary)S/WSpecificationMechanical&ThermalTestPlanInventionDisclosureInventionDisclosureNewCSystemProductDevelopmentProposalPhasePlanningPhaseR&D

DesignPhaseLabPilotRunPhaseEng.PilotRunPhaseProductionPilotrunPhaseMassproductionphaseC2meeting

C3meeting C4meeting C5meeting

C4checklistBOMQVLTimestandardSystemBIOS/KBC

FWreleaseS/WDriver/AP/

Utility/Diagnostic

ReleaseEEEng.P/RreportSMTWSP/RreportPCBAWSP/RreportMEEng.P/RreportEng.P/RQAreviewreportSchematics&jumpersettingTestprogram/ProcedureSOPforPCBA/FAUsermanualR/NPackingstandardCompatibilitytestreportReliabilityandC4ReliabilitytestreportKeyComponentverificationSparepartslistC5checklistServiceGuideEMCSafetyreportPDP/RyieldrateanalysisrptPCBAinspectioninstructionProductinspectioninstructionMTBFDEMOtestreportPMC0meeting C1meeting PMC0ChecklistMRSPMC1checklistInvention

disclosureTimescheduleProjectteamModelnumber

defineGreendesign

guideandreview

checklistNonQVL/Sample

approvalrequestformC2checklistPESEMC/Safety

RequestFormBOM/QVL(Prel.)PCBLayout(prel.)Outsourcingmodule

specificationPMNPIC0C1C2C3C4C5C6C6meetingGCSDC6checklistProductphase

outnoticeC3checklistHWDVtestreportSWFVtestreportMEtestreportReliabilitytestreport(prel.)ME/ArtworkpackingdrawingPAL/ROMdatalistingC3manufacturabilityreviewreportSampleapprovestatus&buglistreviewC3/PMC3Meeting C3-工作重点及检核项目阶段C3样品试作阶段(LabPilotRunPhase)

负责单位技术经理(TechnicalManager)研发部门目的*设计验证

*依测试结果修改、变更设计工作重点

*样品试作材料准备*样品试作*针对样品进行测试及验证*搜集Project成本资料*拟定C3质量量化目标*机构设计问题检讨及除错(Debug)，测试报告检讨*电路设计问题检讨及除错(Debug)，测试报告检讨*软件设计问题检讨除错(Debug)，测试报告检讨*法务-稽核文件之形成要件是否符合法定要件或工程规范

-专利著作权、商标等知识产权之申请准备

审核会议C3目的检讨样品测试验证之结果、并决定是否进入工程试作阶段检核项目*HWdesignverificationreport*Microprocessor/EEPROMdatalisting*Mechanicaltestreport*SWfunctionverificationtestreport*MechanicalDrawing(Preliminary)*C3TestReport*C4TestPlan

NewCSystemProductDevelopmentProposalPhasePlanningPhaseR&D

DesignPhaseLabPilotRunPhaseEng.PilotRunPhaseProductionPilotrunPhaseMassproductionphaseC2meeting

C3meeting C4meeting C5meeting

C3checklistHWDVtestreportSWFVtestreportMEtestreportReliabilitytest

report(prel.)ME/Artwork

/packingdrawingPAL/ROM

datalistingC3manufacturability

reviewreportSampleapprove

status&buglist

reviewC5checklistServiceGuideEMCSafetyreportPDP/RyieldrateanalysisrptPCBAinspectioninstructionProductinspectioninstructionMTBFDEMOtestreportPMC0meeting C1meeting PMC0ChecklistMRSPMC1checklistInvention

disclosureTimescheduleProjectteamModelnumber

defineGreendesign

guideandreview

checklistNonQVL/Sample

approvalrequestformC2checklistPESEMC/Safety

RequestFormBOM/QVL(Prel.)PCBLayout(prel.)Outsourcingmodule

specificationPMNPIC0C1C2C3C4C5C6C6meetingGCSDC6checklistProductphase

outnoticeC4checklistBOMQVLTimestandardSystemBIOS/KBCFWreleaseS/WDriver/AP/Utility/DiagnosticreleaseEEEng.P/RreportSMTWSP/RreportPCBAWSP/RreportMEEng.P/RreportEng.P/RQAreviewreportSchematics&jumpersettingTestprogram/ProcedureSOPforPCBA/FAUsermanualR/NPackingstandardCompatibilitytestreportReliabilityandC4ReliabilitytestreportKeyComponentverificationSparepartslistC4/PMC4Meeting WistronMobileReliabilityTestPlanEnvironmentThermalProfileTestTemperatureandHumidityTestVibration,Shock,DropTestsAltitudeTest,AcousticsTestsMTBFPrediction

EMCLightning/SurgeTestVoltageDipTestEFT,ESDTestHarmonicTestIEC1000-4-XXEMI/EMSPowerLineInterferenceLineVoltage/FrequencyTestPowerSurgeTestVoltageDipandInterruptionPowerOn/OffTestEFT/BImmunityTestComplexMarginTestTransportationVibrationTestAltitudeTestShockTestDropTestUser

InclineOperationTestBenchHandlingTestPowerSavingTestPressureTestAudioQualityTortureTestReliabilityTest–LCDModuleWistronMobileReliabilityTestPlanItemTestConditionSampleSizeTimeResultHighTemp/HighHumidOp50℃80%RHDynamin20500HoursPassLowTempOp0℃,Dynamic5500HoursPassHighTempOp60℃,Dynamic10500HoursPassHighTemp/HighHumidstorage60℃,90%RH,Storage2240HoursPassLowTempstorage-20℃,Storage2240HoursPassT/C(Non-Op)-20℃(30Min)~60℃(30Min),Storage3100cyclePassAltitudetestOperating&Storage272HoursPassELP-20℃,Dynamic5072HoursPassVibration(Non-Op)5~500Hz,0.37Oct/min,1.5G,X/Y/Z3-PassShock(Non-Op)180G,2msec,HalfSine,±X,±Y,±Z3-PassBoxVibration5~500Hz,1.0G,0.5Oct/min15-PassBoxDrop76㎝drop15-PassESDOperatingTop_Case:±12kVPanelⅠ:±15kVPanelⅡ:±15kV5-PassNon-OperatingUserconnector:±2kVBottomcover:±12kV5-PassPanel(ref)±3kV5-PassPush5kgf(resultAfter24Hours)2-PassImageStickingMosaicPattern(8X6)104HoursPassWistronMobileReliabilityTest-LCDC4-工作重点及检核项目阶段C4工程试作阶段(ENGPilotRunPhase)

负责单位技术经理(TechnicalManager)研发部门工程部门目的*工程试作与验证

*依验证结果改善设计*准备技术资料以便技术移转、授权或移转技术至相关生产单位工作重点

完成系统软件或应用软件之设计、测试及除错提出软件之程序代码(SourceCode)正式发出电路图(Schematics)、料表清单(BOM)及已验证料表供货商清单(QVL)进行工程试作阶段之测试、验证及除错并提出测试验证报告提出工程试作阶段之试作报告及改善建议完成生产或技术移转所需之相关测试程序及程序法务﹕完成专利、著作权、商标申请

审核会议C4目的检讨工程试作结果，并决定是否进入试产阶段完成各项技术移转或生产所需之文件，并进行系统残留问题之检讨与对策验证检核项目*S/WFirmwarerelease*BOM*MEENGP/Rreport*EEENGP/Rreport*TestProgram*PCBartwork*C4Testreport*Schematics*SWsourcecode*Transferplan

NewCSystemProductDevelopmentProposalPhasePlanningPhaseR&D

DesignPhaseLabPilotRunPhaseEng.PilotRunPhaseProductionPilotrunPhaseMassproductionphaseC2meeting

C3meeting C4meeting C5meeting

C3checklistHWDVtestreportSWFVtestreportMEtestreportReliabilitytest

report(prel.)ME/Artwork

/packingdrawingPAL/ROM

datalistingC3manufacturability

reviewreportSampleapprove

status&buglist

reviewC4checklistBOMQVLTimestandardSystemBIOS/KBC

FWreleaseS/WDriver/AP/

Utility/Diagnostic

ReleaseEEEng.P/RreportSMTWSP/RreportPCBAWSP/RreportMEEng.P/RreportEng.P/RQAreviewreportSchematics&jumpersettingTestprogram/ProcedureSOPforPCBA/FAUsermanualR/NPackingstandardCompatibilitytestreportReliabilityandC4ReliabilitytestreportKeyComponentverificationSparepartslistPMPMC0meeting C1meeting PMC0ChecklistMRSPMC1checklistInvention

disclosureTimescheduleProjectteamModelnumber

defineGreendesign

guideandreview

checklistNonQVL/Sample

approvalrequestformC2checklistPESEMC/Safety

RequestFormBOM/QVL(Prel.)PCBLayout(prel.)Outsourcingmodule

specificationPMC0C1C2C3C4C5C6C6meetingGCSDC6checklistProductphase

outnoticeC5checklistServiceGuideEMCSafetyreportPDP/RyieldrateanalysisrptPCBAinspectioninstructionProductinspectioninstructionMTBFDEMOtestreportC5/NPIC5Meeting C5-工作重点及检核项目阶段C5试产阶段

(ProductionPilotRunPhase)

负责单位生产部门(Production)物管部门(MaterialManagement)工程部门(Engineering)技术经理(TechnicalManager)研发部门(R&D)目的预为建立量