bp10x硬件设计参考系列datasheet bp1064a2数据手册

6.1.使用条 图图1.结构示意 图2.音频DSP信号处理框 图3.引脚定 图4.封装形式和尺 表表1引脚说 表2GPIO上电状态及电 表3推荐使用条 表6AudioDAC性能@ 表7AudioADC（LINEIN1/3通道）性能@ 表8AudioADC（LINEIN4/5通道）性能@ 表9AudioADC（MIC通道）性能@ 支持DSP指令，集成FPU支持浮点运算ADC8KHz11.025KHz12KHz16KHz22.05KHz24KHz32KHz44.1KHz/ADC0通道带AGC功能324bitDAC8KHz11.025KHz12KHz16KHz22.05KHz24KHz32KHz44.1KHz/位宽32bits 音频和ARC

检测）Watchdog 点，内置PHY1SDIO@UART0支持流控max.450K15IO通道，2个内部电压采样通道：MP2,MP3,WMA,APE,FLAC,AAC,MP4,M4A,WAV（IMA-ADPCM&PCM）,AIF,AIFCProfessionalVoice

能的Example和众多中间件。LQFP64（7mmx图1.结构示意图3.引脚定表1引脚说12 3456I789SPIS_MOSI/UART0_RXD/UART0_TXD/MCLK0_OUT/MCLK0_IN/TIM3_SPIS_CLK/UART0_TXD/UART0_RXD/I2S0_LRCLKI2S1_LRCLK/SPIS_MISO/UART0_CTS/I2S0_BCLK/SPIS_CS/UART0_RTS/I2S0_DO/I2S0_DI/IOLCD0/SPIM_MOSI/UART0_RXD/LCD1/SPIM_CLK/UART0_TXD/LCD2/SPIM_MISO/UART0_CTS/MCLK1_OUT/LCD3/UART0_RTS/I2S1_LRCLK/LCD4/UART1_RXD/I2S1_BCLK/LCD5/UART1_TXD/I2S1_DO/I2S1_DI/LCD6/UART1_CTS/I2S1_DI/I2S1_DO/LCD7/LCD10/LCD11/LCD12/USB_DM/USB_DP/AD0/SD_DAT/SPIM_MOSI/SPIS_MOSI/I2S0_LRCLK/AD1/SD_CLK/SPIM_CLK/SPIS_CLK/I2S0_BCLK/AD2/SD_CMD/SPIM_MISO/SPIS_MISO/UART1_RTS//I2S0_DI/LCD13/AD0/SPIS_CS/UART1_CTS/I2S0_DI/I2S0_DO/LCD14/AD1/UART1_RXD/I2C_SDA/MCLK0_OUT/MCLK0_IN/LCD15/AD2/UART1_TXD/I2C_SCL/AD4/MCLK1_OUT/MCLK1_IN/AD5/SPDIF_AI_0/I2S1_LRCLK/SPDIF_DI/SPDIF_DO/AD6/SPDIF_AI_1/I2S1_BCLK/SPDIF_DI/SPDIF_DO/CLKOUT/AD7/SPDIF_AI_2/I2S1_DO/I2S1_DI/I2C_SDA/SPDIF_DI/SPDIF_DO/DMIC1_DATAD8/SPDIF_AI_3/I2S1_DI/I2S1_DO/I2C_SCL/SPDIF_DI/SPDIF_DO/DMIC1_CLKEFUSEVDD/CLK_OUT/CLK_OUT/LINEIN4_R/AD9//LINEIN4_L/AD10/ /LINEIN5_R/LINEIN5_L/表2GPIO上电状态及电平IO产生电流消耗。复用关系、输入输出和上下拉状态等；也可以表现与a）一致。 表3推荐使用条℃ VVVVVVVVGPIO_A[17:5]/8GPIO_A[4:0]/GPIO_B[3:0]/48-GPIO_A[17:5]/2.6GPIO_A[4:0]/-6AudioDAC@88NoFilter@A-Weighted@NoFilter@A-Weighted@@8NoFilter@A-Weighted@NoFilter@A-Weighted@@8NoNoFilter@A-Weighted@不使用GainBoostPGAGainBoostPGAgain=0dB700mVrms BP1064A2isamoisturesensitivecomponent.ThemoisturesensitivityclassificationisClass3.It’simportantthatthepartsarehandledunderprecautionandapropermanner.Thehandling，bakingandout-of-packstorageconditionsofthemoisturesensitivecomponentsaredescribedinIPC/JEDCS-STD-033A.ThemendsutilizingthestandardprecautionslistedCalculatedshelflifeinSealedBag:12monthsat<40℃and<90%relativePeakPackageBodyTemperature:Afterbagisopened，devicesthatwillbesubjectedtoreflowsolderofotherhightemperatureprocessmustbe:Mountedwithin168hoursoffactorycondition≤30℃/60%Storedat<10%RHifnotDevicesrequirebaking，beforemountingHumidityindicatorcardis>10%whenreadat23±5℃immedia yaftermoisturebarrierbagisItems3aor3bisnotIfbakingisrequired，pleaserefertoJ-STD-033standardforlowtemperature（40℃）bakingrequirementinTape/Reelform.Allinformationanddatacontainedinthis arewithoutanycommitment，arenottobeconsideredasanofferforconclusionofacontract，norshalltheybeconstruedastocreateanyliability.Anynewissueofthis invalidatespreviousissues.Productavailabilityanddeliveryareexclusivelysubjecttoourrespectiveorderconfirmationform;thesameappliestoordersbasedondelivereddevelopmentsamplesdelivered.Bythispublication，ShanghaiMountainViewSiliconCo.，.（“MVSILICON”）doesnotassumeresponsibilityforpatentinfringementsorotherrightsofthirdpartiesthatmayresultfromitsuse.Nopartofthispublicationmaybereproduced，photocopied，storedinaretrievalsystem，ortranslatedinanyformorbyanymeans，electronic，mechanical，manual，optic