回焊炉温设定演示文稿

回焊炉温度设定演示文稿目前一页\总数二十页\编于十五点优选回焊炉温度设定ppt目前二页\总数二十页\编于十五点Contents爐膛設計Profile四個區間說明融錫狀態PWI高溫影響CTE測溫線埋設爐溫升溫圖型說明速度與爐膛加熱計算模擬目前三页\总数二十页\编于十五点InsideofOven(加熱爐膛內部)HeatingIntheovenUseVitronicsXPM21030目前四页\总数二十页\编于十五点Reflowprofile目前五页\总数二十页\编于十五点Angle-chipforCapacitor目前六页\总数二十页\编于十五点tc1–smallSMDΔT:thesmallerthemass,thehotteritgets!

tc1–mediumSMDtc3–largeSMD目前七页\总数二十页\编于十五点TimeTemp.230°C250°Ctc1–smallSMDtc1–mediumSMDtc3–largeSMD20°C20°CSmallSnAgCuProcessWindowTooHot!TooCold!Peak:230–250°Ctc1–255Ctc2–235°Ctc3–225°C目前八页\总数二十页\编于十五点HighTemperatureProfilesforleadfreereflowsolderingHightemp.reflowprofilesareoftenrecommendedtosolderleadfreeassemblies.Peaktemperaturesupto260°Carewrittenintheliterature.Thisextremehightemperaturesmaydamagecomponents,PCBlaminateandinfluencesolderjointreliabilityandshape.SnPb SnAgCu SnAgCuTmax215°C Tmax235°C Tmax260°CComponent:ChipC1206AgPdBoard:NiAu

Pictures:Zollner,Zandt

LeadFreeReflowProcessConcerns目前九页\总数二十页\编于十五点LeadFreeReflowProcessConcerns:ComponentDamage225ºC250ºCVaporpressureinELCOPictures:PhilipsLFPeak:230°C–250°C??目前十页\总数二十页\编于十五点LeadFreeReflowProcessConcerns:ComponentDamage225ºC255ºCPictures:PhilipsLFPeak:230°C–250°C??目前十一页\总数二十页\编于十五点240ºC270ºCDeformationofthermo-plasticcomponentbodiesLeadFreeReflowProcessConcerns:ComponentDamagePictures:JabilLFPeak:230°C–250°C??目前十二页\总数二十页\编于十五点LeadFreeReflowProcessConcerns:OpenorNearOpenJointsResultofboardwarpageandcomponentbulgingduetohightemperaturePicture:Philips目前十三页\总数二十页\编于十五点Theriskofmicrocracksincreasewiththedistancetothecenter.Ashigherthetemperature,ashighertheexpansionthermalexpansion(CTE)目前十四页\总数二十页\编于十五点Highertemperatureincreasesmechanicalstressonsolderjoints目前十五页\总数二十页\编于十五点FailuretoproperlymountTCswillresultinanunwantedT!ReflowMachineProfiling–TheMostImportantStep!X??SurfacemeasurementBGAballmeasurement目前十六页\总数二十页\编于十五点ClassicalTemperatureProfileofaHotflow2/24Gradients deltaT PCB PBGASpeed:1m/minT=5,8°C!ThermalManagement:FlexibleProfiling–ClassicalSoak(1)HighPlateauTemperaturemaydamagePCBlaminate目前十七页\总数二十页\编于十五点ThermalManagement:FlexibleProfiling–ClassicalSoak(2)ClassicalTemperatureProfileofaHotflow2/24Gradients deltaT PCB PBGASpeed:1m/minT=4,5°C!RaisingPreheattempcanreduceT

目前十八页\总数二十页\编于十五点LinearTemperatureProfileofaHotflow2/24Gradients deltaT PCB PBGARunningjustalinearprofileonsuchahighsofisticatedmachinemakesnosense!DeltaTcanbereducedbydifferentsetup.T=9,3°C!Speed:1m/minThermalManagement:FlexibleProfiling–StraightLine(1)目前十九页\总数二十页\编于十五点LinearTemperatureProfileofaHotflow2/24withflatpeakGradients deltaT PCB PBGASettingupaflatpeakwillre