植球机(SBM371 SBI371)操作维护保养作业指导书V2.0

PAGE第40页，共40页文件编号：文件版本：V1.0密级：最高高中低页数：共40页植球机(SBM371SBI371)操作维护保养作业指导书BallDropmachineOperationandmaintenanceOperatinginstructions拟制审核批准修订记录版本修订内容修订日期修订者备注V1.0首次正式发布

1.Purpose/目的Standardizetheoperationmethodofballdropstationoperatorandmaintenancemethodofequipmenttechnician./规范植球机岗位操作员作业方法和设备技术员维护保养方法。2.Range/范围Suitableforballdropmachine(SBM371SBI371)./适用于植球机(SBM371SBI371)植球设备应用。Duties/职责3.1Techniciansperformcorrectoperationandmaintenanceofequipmentasrequired/技术员按要求对设备进行正确的操作维护保养3.2Theoperatorcorrectlyoperatedtheballdropmachineandcompletedtheworknormally/作业员正确操作植球机，正常完成作业3.3Familiarwiththesafetysignsontheequipmentandsafeoperation/熟知设备上面的安全标识，安全操作Operationcontentorstep/操作内容或步骤4.1Mainswitches,buttons,devices：/主要开关、按钮、装置:4.1.1Equipmentfrontintroduction/设备正面介绍 4.1.2Internalstructure/内部构造Controlpanel/控制面板（SBM）Pressthebuttontopoweronthedevice/按下按钮设备通电Pressthebuttontopoweroffthedevice/按下按钮设备断电Pressthebuttontostartthedevice/按下按钮设备开始运转Pressthebuttontostopthedeviceafteracertainperiodofaction/按下按钮设备某个周期动作完成后停止运转Pressthebuttontoresetoreliminatetheerrormessage/按下按钮复位或消除错误提示Theselectedaxiscanbemovedduringmanualoperationbypressingabutton/按下按钮手动操作时可以移动被选择的轴Pressthebuttonand(6)canmovetheaxisathighspeed/按下按钮配合（6）可以高速移动轴Buzzer/蜂鸣器Controlpanel/控制面板（SBI）Pressthebuttontopoweronthedevice/按下按钮设备通电Pressthebuttontopoweroffthedevice/按下按钮设备断电Pressthebuttontostartthedevice/按下按钮设备开始运转Pressthebuttontostopthedeviceafteracertainperiodofaction/按下按钮设备某个周期动作完成后停止运转Pressthebuttontoresetoreliminatetheerrormessage/按下按钮复位或消除错误提示Buzzer/蜂鸣器4.2Bootsteps/开机步骤：4.2.1Boot/开机（SBM/SBI）TurnontheSBMequipmentpowerswitch/打开SBM设备电源开关TurnonthepowerswitchoftheSBIdevice/打开SBI设备电源开关PresstheSBMPOWERONswitch/按下SBMPOWERON开关PresstheSBIPOWERONswitch/按下SBIPOWERON开关4.3Equipmentoperation(returntoorigin)andprogramcall：/设备运转（归原点）和程序调用：4.3.1Homing/归原点（SBM）①ConfirmthatboththePOWERONandSTOPbuttonsarelit/确认POWERON和STOP按钮都亮灯②Confirmthattheservopowerison,thecomputerison,andthevacuumpumpisworking/确认伺服电源开启，计算机开启，真空泵工作③SelectINITIALIZEtoHOMEALLAXIS,untilallbuttonschangefromdarkgreentolightgreen,andreturntozero./选择INITIALIZEHOMEALLAXIS,直至所有按钮由暗绿变为亮绿，归零OK.4.3.2Homing/归原点（SBI）①ConfirmthatboththePOWERONandSTOPbuttonsarelit/确认POWERON和STOP按钮都亮灯②Makesuretheservopowerisonandthecomputerison/确认伺服电源开启，计算机开启③SelectINITIALIZEtoHOMEALLAXIS,untilallbuttonschangefromdarkgreentolightgreen,andreturntozero./选择INITIALIZEHOMEALLAXIS,直至所有按钮由暗绿变为亮绿，归零OK.4.3.3SBMsoftwareoperationandprogramcallingsteps：/SBM软件运行和程序调用步骤：①Clicktoenterthecallingprograminterface,selecttheprogram,click,theprogramhasbeendownloadedtoSBM/点击，进入调用程序界面，选择程序，点击，程序已下载到SBM②Aftercallingtheprogram,youneedtoclickreturntotheorigin/调用程序后需要归原点，点击归原点③Pressthecontrolpanel"START",thedevicewillrunautomaticallyafter4beeps/按下控制面板“START”，响4声后设备自动运转4.3.4SBIsoftwareoperationandprogramcallingsteps:/SBI软件运行和程序调用步骤：①Clicktoenterthecallingprograminterface,selecttheprogram,click,theprogramhasbeendownloadedtoSBI./点击，进入调用程序界面，选择程序，点击，程序已下载到SBI。②Pressthecontrolpanel"START",thedevicewillrunautomaticallyafter4beeps./按下控制面板“START”，响4声后设备自动运转。4.3.5Shutdownsteps:/关机步骤：Allaxesreturntotheorigin/所有轴归原点PressthePOWEROFFbutton/按下POWEROFF按钮（SBM/SBI）Turnoffthepowerswitch,turnoffSBIfirst,thenturnoffSBM/关闭电源开关，先关闭SBI，再关闭SBM4.3.6SBMmanualdippingoperationsteps(forSBMfirstarticledipping)：/SBM手动蘸胶操作步骤（用于SBM首件蘸胶）：①CheckthePCBballdropsurfaceforforeignmatter,oilpollution,etc.TheMARKpositionmustnotbesmeared.Ifthereisany,pleasereportittothetechnicianimmediately/检查PCB植球面是否有异物、油污等不良，MARK位置不能赃污，如有立即反馈技术员②PutthePCBintothefixturecorrectlyaccordingtothedirectionoftheprogramintotheboard,andputthefixtureintothetrackentranceinthecorrectdirection/将PCB按照程序进板方向正确放入夹具，将夹具按照正确方向放入轨道入口③SelecttheTESTinterface,selecttheMODEinterface,andclicktheCARRYbuttontwicetomovethefixturetothejackingposition/选择TEST界面，选择MODE界面，点击CARRY按钮2次，让夹具移动到植球平台顶起位置=4\*GB3④Observewhetherthevacuumvalueofthevacuumsensorisabovethesetvalue,clickFLUXSQUEEZE,andpresstheSTARTkeyonthecontrolpaneltoallowthescrapertoscrapeafewcyclestoensureuniformflux/观察真空传感器真空值是否在设定值之上，点击FLUXSQUEEZE，按下控制面板上的START键，让刮刀循环刮几个，保证助焊胶均匀。SelecttheMANAULinterface,selecttheFLUXinterface,selecttheXYθinterface,andclickPICKUPtomovethedispensingheadtothedippingposition/选择MANAUL界面,选择FLUX界面，选择XYθ界面，点击PICKUP,让点胶头移动到蘸胶位置SelecttheZ/SQUEEZEinterface,clickDOWN,andthenclickUP,sothatthePINpinisdippedinflux/选择Z/SQUEEZE界面，点击DOWN，再点击UP，让PIN针蘸上助焊胶ReturntotheXYθinterface,enterthepositionofthepuzzleintheDEVICENOdialogbox,clickMARK1inFLUXXYSUPPORTθ,andclickMARK1inVISIONINSPECTION.MARK2operatesinthesamewayasMARK1tocorrectthepositionofthedippingglueonthePCB./返回XYθ界面，DEVICENO对话框中输入拼板位置，点击FLUXXYSUPPORTθ中的MARK1,点击VISIONINSPECTION中的MARK1，MARK2同MARK1操作，校正PCB上的蘸胶位置ClickTRANS(VISON)inFLUXXYSUPPORTθtomovethedispensingheadtothedippingposition/点击FLUXXYSUPPORTθ中的TRANS(VISON),将点胶头移动到蘸胶位置ReturntotheZ/SQUEEZEinterface,clickDOWN,andthenclickUP/返回Z/SQUEEZE界面，点击DOWN，再点击UPReturntotheXYθinterface,clickPICKtomovethedispensingheadbacktothedispensingposition/返回XYθ界面，点击PICK，将点胶头移回点胶位置ReturntotheTESTinterfaceandclicktheCARRYbuttontotransferthedispensedPCBtotheexitposition/返回TEST界面，点击CARRY按钮，将点胶的PCB传到出口位置SelecttheBALLinterface,clicktheXYθinterface,andclickMOUNT(VISION)tomovetheballdropaxistothemiddlepositionforeasyPCBremoval/选择BALL界面，点击XYθ界面，点击MOUNT(VISION)，将植球轴移到中间位置，便于取出PCBRemovethePCBmanuallyfromthetrackexit/手动从轨道出口取出PCB，注意清拿轻放PutthedippedPCBunderthemicroscopeandobservewhetherthedippedpositionandtheamountofdippedareOK.Ifitfails,youneedtoadjusttheparametersandmakethefirstpieceagain/将蘸胶的PCB放到显微镜下观察蘸胶位置和胶量是否OK，如不合格，需要调整参数再次做首件。4.3.7SBMmanualballdropsteps(forthefirstarticleballdropofSBM)/SBM手动植球操作步骤（用于SBM首件植球）：PutthedippedPCBintothefixturecorrectlyaccordingtothedirectionoftheboardintotheprogram,andputthefixtureintothetrackentranceinthecorrectdirection/将蘸胶PCB按照程序进板方向正确放入夹具，将夹具按照正确方向放入轨道入口SelecttheTESTinterface,selecttheMODEinterface,andclicktheCARRYbuttontwicetomovethefixturetothejackingposition/选择TEST界面，选择MODE界面，点击CARRY按钮2次，让夹具移动到植球平台顶起位置SelecttheMANAULinterface,selecttheFLUXinterface,selecttheXYθinterface,andclickPICKUPtomovethedispensingheadtothedippingposition/选择MANAUL界面,选择FLUX界面，选择XYθ界面，点击PICKUP,让点胶头移动到蘸胶位置SelecttheFLUXinterface,XYθinterface,enterthelocationofthepuzzleintheDEVICENOdialogbox,clickMARK1inFLUXXYSUPPORTθ,andclickMARK1inVISIONINSPECTION.MARK2operatesinthesamewayasMARK1tocorrectthedippingpositiononthePCB.Aftertheballplantingposition,itisnecessarytoidentifytheMARKcorrectionballplantingpositionbeforetheballdrop.Ifthisisnotremoved,thisstepisnotrequired.)/选择FLUX界面，XYθ界面，DEVICENO对话框中输入拼板位置，点击FLUXXYSUPPORTθ中的MARK1,点击VISIONINSPECTION中的MARK1，MARK2同MARK1操作，校正PCB上的蘸胶位置(粘胶板排出植球位置后，植球前需要再次识别MARK校正植球位置，如不移除，则不需此步骤)SelecttheBALLinterface,selecttheXYθinterface,andclickthePICKbuttontomovethebumpertothepositionwherethesolderballissucked/选择BALL界面，选择XYθ界面，点击PICK按钮，将植球吸盘移到吸取锡球的位置SelecttheZ/TRAYinterface,clickPICKUPinBALLZ1CYCLE,suckthesolderballintothesuctioncupnozzle,andclickDOUBLE/选择Z/TRAY界面，点击BALLZ1CYCLE中的PICKUP，将锡球吸入吸盘吸嘴，点击DOUBLE(7)ReturntotheXYθinterfaceandclickREJECTtocheckiftherearemoreballsonthenozzleplate/返回XYθ界面，点击REJECT,检查吸嘴盘上是否多球(8）IickMOUNT(VISION),movethenozzleplatetotheballdropposition,returntotheZ/TRAYinterface,andclickMOUNTinBALLZ1CYCLEtocompletetheballpntheDEVICENOdialogbox,enterthepuzzlecorrespondingtothedippingposition,cllantingaction/DEVICENO对话框中输入与蘸胶位置对应的拼板，点击MOUNT(VISION)，将吸嘴盘移动到植球位置，返回Z/TRAY界面，点击BALLZ1CYCLE中的MOUNT,完成植球动作ClickFEEDinBALLZtomovetheZaxisoftheballtothetransportheight,returntotheXYθinterface,clickREJECTtomovetheheadtothethrowingposition/点击BALLZ中的FEED，将植球Z轴移动到搬运高度，返回XYθ界面，点击REJECT，将头部移动到抛料位置ReturntoZ/TRAYinterface,clickonREMAIN,returntoXYθinterface,clickonPICK,andcheckifthereisaresidualball/返回Z/TRAY界面，点击REMAIN,返回XYθ界面,点击PICK，检测是否有残球SelecttheTESTinterfaceandclicktheCARRYbuttontotransferthedispensedPCBtotheexitposition/选择TEST界面，点击CARRY按钮，将点胶的PCB传到出口位置ReturntotheBALLinterface,clicktheXYθinterface,andclickMOUNT(VISION)tomovetheball-plantingaxistothemiddleforeasyremovaloftheballdropboard/返回BALL界面，点击XYθ界面，点击MOUNT(VISION)将植球轴移动到中间便于取出植球板Removetheballdropplatefromtheexitposition,payattentiontoholdingyourbreath,clearandgently,andtakeitouthorizontally/将植球板从出口位置取出，注意屏息、清拿轻放，水平取出(14)PuttheballdropplateunderthemicroscopetoseeifitisOK.Ifitfails,youneedtoadjusttheparametersandmakethefirstpieceagain./将植球板放入显微镜下观察是否OK，如不合格，需要调整参数再次做首件。4.3.8SBImanualoperationsteps(forSBImanualtesting)：/SBI手动操作步骤（用于SBI手动测试）：Puttheballdropboardintotheentranceofthetrackinthecorrectdirection/将植球板按正确方向放入轨道入口SelecttheTESTinterfaceandclickINPUTtomovetheballdropplatetothedetectionposition/选择TEST界面，点击INPUT，将植球板移动到检测位置ClickontheY-AXISINSPECTIONdrop-downlistaboveandselectthepositiontobedetectedintheYdirection/点击上面Y-AXISINSPECTION下拉列表，选择Y方向需要检测的位置ClickMARKINSPECTIONtoidentifyallMARKsintheselectedpartof(3)/点击MARKINSPECTION，识别(3)中选择部分的所有MARKClicktheY-AXISINSPECTIONdrop-downlistbelow,selectthepositiontobedetectedintheYdirection,(3)(5)TheYdirectionneedstobeconsistent,andclicktheDEVICENOdrop-downlisttoselectthedetectionpuzzle/点击下面Y-AXISINSPECTION下拉列表，选择Y方向需要检测的位置，(3)(5)Y方向需一致，点击DEVICENO下拉列表选择检测的拼板ClickBALLINSPECTION,thedialogboxontheleftwilldisplaythedetectionscreen/点击BALLINSPECTION，左边的对话框会显示检测画面ClickOUTPUTPOSITIONtoselectthepositionwherethesubstrateisdischarged(selectOUTPUT1,dischargetotheexitposition,selectREJECT,dischargetotheabnormalplatedischargeposition),clickOUTPUT,andpressSTARTonthecontrolpaneltoexcludetheplate/点击OUTPUTPOSITION选择基板排出的位置（选择OUTPUT1，排出到出口位置，选择REJECT，排出到异常板排出位置），点击OUTPUT，按下控制面板上的START，将板排除SelectMANUALinterface,selectTRANSFER,andclickREJECTPOSITIONinSHUTTLEMOTOR/选择MANUAL界面，选择TRANSFER，点击SHUTTLEMOTOR中的REJECTPOSITIONClickONinREJECTCONVEYORandBACKWARDinSHUTTLECONVEYOR/点击REJECTCONVEYOR中的ON，点击SHUTTLECONVEYOR中的BACKWARDClickinREJECTUNIT,clickSEND/点击REJECTUNIT中的，点击SEND(11)OpentheprotectivecoverandremovethePCB/将保护罩打开，取出PCB4.3.9SoftwareInterface(SBM)Introduction/软件界面（SBM）简介Thebootinterfaceisasfollows:/开机界面如下：Initialization,thedevicereturnstotheorigin(mustbereturnedtotheoriginafterstartingupandcallingtheprogram)/初始化，设备归原点（开机和调用程序后必须归原点）Automaticoperation,usedinnormalcontinuousoperation/自动运行，正常连续运转时使用Manualsingle-stepoperation,usedwhenconfirmingthefirstitemorcheckingequipment/手动单步动作，确认首件或检查设备时使用Themechanicaldevicecanbemovedtoacertainposition,andtheentiresetofactionsofacertaindevicecanbecompleted/可将机械装置移动到某个位置，可以完成某个装置的整套动作Historyrecordtoqueryallerrororwarningrecordsduringtheoperationofthedevice/历史记录，可查询设备运行期间的所有错误或警示记录Usedtodisplaycallableprograms,makeprograms,debugprograms,modifyequipmentparameters,etc/显示可调用的程序，制作程序，调试程序，修改设备参数等用到Theautomaticoperationinterfaceisasfollows：/自动运转界面如下：Showcurrentproductionstatus/显示当前生产状况Displaythecurrentoperationmode(automaticoperationordryoperation)/显示当前运行模式（自动运转或空运转）Displaythecurrentcameraidentificationscreen/显示当前相机识别画面Manualmainoperationmaininterfaceisasfollows：/手动主操作主界面如下：Cameradisplay/相机显示画面Single-stepoperationsuchasgluesupply,detection,scrapingspeed,dippingaction,etc/胶量供应，检测，刮胶速度，蘸胶动作等单步操作Single-stepoperationofsolderballsuction,inspection,placement,supplydeviceoperation,etc/锡球吸取，检测，贴装，供应装置动作等单步操作Motorrunningstatus,unlocking,locking,moving,etc/马达运行状态，解锁、锁定、移动等操作I/Osignalinterface/I/O信号界面Manualoperationinterfaceforeachaxiscarryingaction/各轴搬运动作手动操作界面Operationinterfaceforengineers/为工程师操作界面Displaythecurrenterrorlistandcommandresponse/显示当前的错误列表和命令回应Selecttheinformationinthelist/选中会自动跳出list中的信息TESToperationinterfaceisasfollows:/TEST操作界面如下：Completeacompletesetofrailhandlingactions/完成一个整套轨道搬运动作Completeacompletesetofdispensingactions/完成一个整套点胶动作Completeacompleteballdropaction/完成一个整套植球动作Displaythenumberofmulti-ballboards/显示多球板数Displaythenumberofmissingboards/显示缺失球板数Completeasetofscraperscrapingoperations/完成一个刮刀刮胶整套动作Thenumberfilledinisthenumberofscrapingcycles/填写的数字为刮胶循环的次数Startautomaticgluesupply/启动自动供胶Completeacompletesetofmovementsandacompletesetofballs/完成一个搬运整套动作和一个植球整套动作Repeatsuctionandreturnthesolderballtothedevice/重复吸球和将锡球放回装置Displaythecurrenterrorlistandcommandresponse/显示当前的错误列表和命令回应Checkingwillautomaticallypopouttheinformationinthelist/选中会自动跳出list中的信息Themaininterfaceofparameteradjustmentisasfollows：/参数调整主界面如下：ListfilesinSBMlocaldisk/列表中显示SBM本地磁盘中的文件ListfilesinexternalUSBflashdrive/列表中显示外接U盘中的文件Sortbydate/按日期排序Sortbyfilename/按文件名称排序Filedisplaylist/文件显示列表Callingprocedure/调用程序Saveorsaveanewprogram(Note:thenewprogramisautomaticallycalledwhentheprogramnameischanged)/保存或另存新的程序（注意：更改程序名保存时会自动调用新程序）RemoveProgram/删除程序UnmountUdisk(mustclickbeforeunpluggingUdisk)/卸载U盘（拔出U盘前必须点击）Openlocaldisk/打开本地磁盘OpenUSBstick/打开U盘Selectanotherpositiondisk/选择其他位置盘Closetheinterface/关闭界面TheinputinterfaceofsubstratesizeandMARKcoordinatesareasfollows:/基板尺寸，MARK坐标等输入界面如下：Thedistancebetweenthepiecesandtheoriginpositionissetasfollows:/拼板间距，原点位置设定如下：ThefoolproofMARKcoordinateinputinterfaceisasfollows：/防呆MARK坐标输入界面如下：ThefoolproofMARKloginandadjustmentinterfaceisasfollows：/防呆MARK登录、调节界面如下：Camerascreen/相机画面ON:Livescreenisdisplayedin(1),OFF:Livescreenisnotdisplayedin(1)/ON：（1）中显示现场画面，OFF:（1）中不显示现场画面LogintoMARK/登录MARKShowlogineffect/显示登录效果FindtheloginMARK/查找登录MARKSavethepicturetothedisklocation/保存图片到磁盘位置Lightingdevice,whichcanbeturnedon,offandadjusted/照明装置，可打开，关闭，调节照明ThepositionofthesubstrateMARKandthelogininterfaceareasfollows:/基板MARK位置和登录界面如下：Whichpuzzletochoose/选择哪个拼板Showpuzzleposition/显示拼板位置ShowMARKcoordinates/显示MARK坐标FLUXaxisangularoffset/FLUX轴角度偏移Movetothespecifiedposition(MARKandplacementposition)/移到到指定的位置（MARK和贴片位置）FLUXshaftheadposition/FLUX轴头部位置Cameradisplayscreen/相机显示画面MARKselection/MARK选择Whethertodisplaythelivescreen/是否显示现场画面LogintoMARK/登录MARKDisplayrecognitionstatus/显示识别状态FindtheregisteredMARK/寻找登录的MARKThefollowingisanintroductiontosomeoftheoperatinginterfacesofSBIequipment/以下为SBI设备部分操作界面简介Theinitializationinterfaceisasfollows:/初始化界面如下：Returntoorigin/归原点Automaticoperationinterface/自动运转界面Manualoperationinterface/手动操作界面Testinterface/测试界面History/历史记录Callmodificationprogram,equipmentparametersettinginterface/调用修改程序，设备参数设定界面Theautomaticoperationinterfaceisasfollows:/自动运转界面如下：Manualoperationinterfaceisasfollows:/手动操作界面如下：Thebeltisturnedon/皮带转动开启Adjustingtheheightofthesupportplatform/调整支撑平台高度Afterclicking,themotorwillruntothecorrespondingposition/点击后马达运转到相应位置Clicktocontrolthetransferdirection/点击控制传送方向Controlbafflelift/控制档板升降Pushplateforcontrollingtrackexitforwardorbackward/控制轨道出口的推板前进或后退Unloadingthesubstratestartsorstops/卸载基板开始或停止Controltheactionoftheoutletrowdevice/控制出口排板装置动作TESTinterfaceisasfollows:/TEST测试界面如下：Cameradisplayinterface/相机显示界面Completeasetofactionstotransferthesubstratetotheinspectionposition/完成一个传送基板至检测位置的整套动作Clicktest④partofthesubstrateMARK/点击测试④的部分基板MARKChoiceofsubstrateMARKtestposition/基板MARK测试位置选择SaveMARKpicture/保存MARK图片Repeateddetection/多次重复检测Test⑧partofthesubstrate/检测⑧的部分基板Inspectionofsubstratebumptest/基板植球测试部分检测Chooseapuzzlelocation/选择拼板位置Showtheballdropdetectioninterface/显示植球检测界面Savetestpicture/保存检测图片Clicktoimportthesubstrateintothetrackexclusionposition/点击将基板导入轨道排除位置Selectwhichexclusiondevicetoexcludesubstratesto/选择将基板排除到哪个排除装置Completeacompletesetofboardmoves,excludeto/完成一个整套的排板动作，排除到Theparameteradjustmentinterfaceisasfollows:/参数调整界面如下：Filecall,modify,saveinterface/文件调用，修改，保存界面Programproductioninterface/程序制作界面Calibrationinterface/校正界面Systemsettingsinterface/系统设置界面Machineparameterinterface/机器参数界面Displaythecurrentcamerainterface/显示当前相机界面Outputmachineparameters/输出机器参数Thefollowingisthesolderballpatternmakinginterfaceofthedetectionprogram.Itmainlyuses2operations/以下是检测程序锡球图案制作界面，主要用到2个操作Boardediting,BGAgraphiceditinginterface/基板编辑、BGA图形编辑界面Testparametersettinginterfaceafterballdrop/植球后检测参数设置界面ThefollowingistheloginsettinginterfaceofthepuzzleOFFSETandthedaughterboardMARK:/以下为拼板OFFSET和子板MARK的登录设定界面：Substrateschematic/基板示意图Numberofjigsawpieces,coordinates,andboardsize/拼板数量、坐标、基板尺寸ThereferencepositionandMARKcoordinatesselectedbythedaughterboardMARK/子板MARK选取的基准位置、MARK坐标Confirminputandexit/确定输入并退出Thefollowingisthesettinginterfaceofthescanningmethod:/以下为扫描方式的设定界面：schematicdiagram/拼板示意图Numberofboards/拼板数量ScansinXdirection/X方向扫描次数NumberofscansinY/Y方面扫描次数Xspacing,thisspacingshouldbelessthanthepanelspacingsetinBOARD/X间距，此间距需小于BOARD中设置的拼板间距Yspacing,thisspacingshouldbelessthanthepanelspacingsetinBOARD/Y间距，此间距需小于BOARD中设置的拼板间距Thefollowingistheballplantingpatternsetting:/以下为植球图案设定:Solderballpatterndisplay/锡球图案显示Solderballdiameter/锡球直径Solderballpatternserialnumber(upto10patternscanbeset)/锡球图案序号（最多可设置10种图案）NumberofsolderballsinXdirection/X方向锡球个数NumberofsolderballsinYdirection/Y方向锡球个数X-directionspacing/X方向间距Y-directionspacing/Y方向间距Tinballcentercoordinates/锡球中心坐标Adjustsolderballarrangement,deleteoneeveryother/调整锡球排列，隔一个删除一个Thefollowingisthepatterncombinationsettinginterface/以下为图案组合设定界面Displaysolderballpattern/显示锡球图案Solderballpatternnumber/锡球图案序号Combineandnamedifferentpatterns/将不同的图案组合并命名Combinationnamelistcolumn/组合名称列表栏Determinethecombination/确定组合Deletecombination/删除组合Show①Numberoftinballs/显示①中锡球的个数ThefollowingisthescanrangeanddaughterboardMARKlogininterface/以下为扫描范围和子板MARK登录界面Displaythecurrentimageofthecamera/显示相机当前的影像DisplayselectedY-axisposition/显示选择的Y轴位置Startandendpositionsofthecamerascan/相机扫描的起点和结束位置CAPTURE:ClicktocaptureMARKgraphics/CAPTURE：点击捕获MARK图形LoginandregisterMARK/登录注册MARKSelectthecorrespondingMARKregisteredin⑤fortheMARKsetinthepuzzle/为拼板中设定的MARK选择⑤中登录的对应MARKThefollowingistheparameterinterfacefordetectingsolderballerror/以下为检测锡球误差参数界面Cameradisplay/相机显示画面Inputofparametersfordetectingsolderballpositionandquantity/检测锡球位置，数量等项目的参数的输入Clicktoselecttheitemsthatneedtobetestedforsolderballs(lessballs,abnormalsamples,position,size,spacing)/点击可选择锡球需要检测的项目（少球、异样、位置、大小、间距）SelectthepositionoftheY-axisscanningsurface/选择Y轴扫面的位置Plantingpositiondisplayrange(largerthanthecomponentsizewhensetting,topreventmisidentification)/植球位置显示范围（设置时比元件尺寸稍大即可，防止误识别）Capturesolderballdetectionscreen/LOADpictureorsavepicture/捕获锡球检测画面/LOAD图片或保存图片Detectsolderballs,thelistontheleftwillshowtherecognitionresult/检测锡球，左边的列表会显示识别结果Selectthesolderballtodetecttheselectedpuzzleposition/选择检测选择的拼板位置的锡球5.Maintenancerequirements/维护保养要求Daymaintenancecontent/日保养内容：Removedustfromequipmentsurface/清除设备表面灰尘.Whethertheemergencyswitchisnormal/紧急开关是否正常.Whetherthepowerindicatorisnormal/电源指示灯是否正常.Isthebarometerat0.5MPa/气压表是否在0.5MPa.Noabnormalnoiseduringequipmentoperation/设备运行无异响.DispensedPINneedlewithoutdirtandbend/点胶PIN针无脏污及弯曲.Nodirtandscratchesonthesupplytray/供胶托盘无脏污、划伤.Thescraperhasnodirtanddeformation,andthefluxspreadsevenly/刮刀无脏污变形，助焊剂摊开均匀.Thescraperhasnodirtanddeformation,andthefluxspreadsevenly/锡球供应盘无脏污堵塞.Weekmaintenancecontent/周保养内容：Checktheconveyorbeltforcracksandcreases/检查传送皮带无裂纹、折痕.Checkthesensitivityofeachsensor/检查各感应器灵敏度.Cleansupportplatformsandtracks/清洁支撑平台及轨道.Cleanthefans,Cleandustinsidethecase/清洁各风扇，清洁机箱内部灰尘.Checkforloosedeformationofthecontrolpanelbuttons/检查控制面板按钮有无松弛变形.5.3Monthmaintenancecontent/月保养内容：Checkeachrefuelingpositionandaddlubricant/检查各加油位置并加润滑油.Checkthattheairintakefilteroftheequipmentisnotblocked/检查设备进气过滤器无堵塞.theatomizationseparatorisnoclogged/雾化分离器无堵塞.thevacuumfilteroftheplacementheadisnoclogged/贴装头真空过滤器无堵塞.Belttensioncheck，noslackslip/检查皮带张力，无松弛打滑.Checkthebrightnessofeachsensor/检查各感应器亮度.Checkeachmovementaxisisnoexcessivelymoved/检查各运动轴无移动过度.Inspecttheairhosefordamageandcracks,andforairleakage/检查气路软管有无破损和裂纹，有无空气泄漏.Checktheconnectorofeachlineisnoloose/检查各线路连接头无松弛.Thelocationisasfollows:/位置如下图：Note:dailymaintenanceshallbecompletedbyproductionlineoperatorsandconfirmedbytechnicians.Weeklyandmonthlymaintenanceshallbecompletedbythetechnicianandconfirmedbythetechnicalforeman./注：日保养由产线作业员完成，技术员监督确认；周、月度保养由技术员完成，技术领班确认.6.Safetyprotectionandprecautions/安全防护及注意事项Pleasenotifythetechnicianwhentheequipmentisabnormal;/设备发生异常时请第一时间通知技术员处理；Cleansolderballsupplydevice(maintainedbytechnicianswithin2Hafterproductioniscompleted);/清洁锡球供应装置（生产完成后2H内由技术员完成保养）；CleanthedippedPINneedledevice(maintainedbyatechnicianwithin2Hafterproductioniscompleted);/清洁蘸胶PIN针装置（生产完成后2H内由技术员完成保养）；Cleanthenozzledeviceoftheplacementhead(maintainedbyatechnicianwithin2Hafterproductioniscompleted);/清洁贴装头吸嘴装置（生产完成后2H内由技术员完成保养）；Cleanthefluxtrayandscraperdevice(maintainedbyatechnicianwithin2Hafterproductioniscompleted);/清洗助焊胶托盘和刮刀装置（生产完成后2H内由技术员完成保养）；Continuousproductionof2Hrequirescleaningthedippindevice;/连续生产2H需要清洁蘸胶PIN针装置；Whenmaintainingthedispensingneedle,takecaretopreventitfromdeformingduetoimpact;/保养点胶针时注意轻拿轻放，防止撞击导致变形；Thesolderballsinthethrowingboxcannotbeusedforproductionagain;/抛料盒中的锡球不可再次用于生产；Iftheequipmentisnotusedformorethan12H,changethewire,youneedtocleanthesuctionnozzleandfluxtraywithalcohol-dust-freeclothtoreproduce;/如果设备超过12H不用后换线，需要用蘸酒精的无尘布清洁吸嘴和助焊胶托盘再生产；Thetypeoffluxusedandthethicknessofthescraperneedtobeperformedaccordingtotheprocessrequirementsontheveneerflowchart.Every100largeboardsneedtobeinspectedandaddedwithflux.Afteraddingnewflux,youneedtomanuallyoperatethescrapertomovebackandforth.Severaltimestoensureuniformthicknessandmaterial./使用的助焊胶种类和刮胶厚度需要按单板流程图上的工艺要求执行，每生产完100片大板需检查并添加助焊胶，添加新助焊胶后，需要手动操作刮刀来回运转几次，保证厚度、材质均匀。Theremovalandmaintenancemethodsofeachdeviceareasfollows:/各装置拆除保养方法如下：Ⅰ.Themethodofremovingandcleaningthedippingdeviceisasfollows:/蘸胶装置拆除并清洁方法如下：Startthesoftwareandreturntotheorigin/启动软件并归原点MovetheFLUXshaftheadtothePICKpositionandopenthebackdoor/将FLUX轴头部移至PICK位置，打开后门Holdbothsidesofthedispensingtransferheadwithbothhandsandremovethetwoscrews(ScrewKnob)ontheheadasshownbelow:/两手拖住点胶传送头两边，拆除头部的两颗螺丝（ScrewKnob）如下图：Takeoutthedispensingneedletrayslowlyandinparallel(note:thedispensingneedlecaneasilyhitotherobjectsandcausedeformation)/缓慢平行取出点胶针盘（注意：点胶针极容易撞到其他物体造成变形）Placethewet,clean,dust-freeclothflatonahorizontal