设计参考、源码手册1746个zhcs305c

ZHCS305C–DECEMBER2010–REVISEDOCTOBER查询样品: 应具有开/关控制功能的16通道、恒定吸收电流输 消息35mA(VCC≤3.6V)，45mA(VCC> VCC=3V–±0.6%（典型值

3.3V5VCMOS±2%（最大值 –器件间=±1%（典型值），±3%（最大值 立控制。当串行数据缓冲器被加载时，LATCH上的低饱和电压:在20mA(典型值)时，0.31 个上升沿将把数据传送至LEDx输出端。BLANK引–TA=+25℃,一个通道开

TLC59282级联起来，以利用同一个处理器来控制额外的LED。 Pleasebeawarethatanimportantnoticeconcerningavailability,standardwarranty,anduseincriticalapplicationsofTexasInstrumentssemiconductorproductsanddi erstheretoappearsattheendofthisdatasheet.Copyright©2010–2011,TexasInstrumentsAlltrademarksaretheCopyright©2010–2011,TexasInstrumentsPRODUCTIONDATAinformationiscurrentasofpublicationdate.ProductsconformtospecificationsperthetermsoftheInstrumentsstandardwarranty.Productionprocessingdoes EnglishDataSheet:necessarilyincludetestingofallThisintegratedcircuitcanbedamagedbyESD.TexasInstruments mendsthatallintegratedcircuitsbehandledwithappropriateprecautions.Failuretoobserveproperhandlingandinstallationprocedurescancausedamage.ESDdamagecanrangefromsubtleperformancedegradationtocompletedevicefailure.Precisionintegratedcircuitsmaybemoresusceptibletodamagebecauseverysmallparametricchangescouldcausethedevicenottomeetitspublishedspecifications.PACKAGE/ORDERINGPACKAGE-ORDERINGTRANSPORTMEDIA,SSOP-24/QSOP-TapeandReel,Tube,QFN-TapeandReel,TapeandReel,Forthemostcurrentpackageandorderinginformation,seethePackageOptionAddendumattheendofthis,orvisitthedeviceproductfolderat UMOveroperating-airtemperaturerange,unlessotherwiseSupply–0.3toVOutputcurrentOUT0toInputvoltageSIN,SCLK,LAT,BLANK,–0.3toVCC+VOutputvoltage–0.3toVCC+VOUT0to–0.3toVOperatingjunctionStoragetemperature–55toESDHumanbodymodelVChargeddevicemodelVStressesabovetheseratingsmaycausepermanentdamage.Exposuretoabsolute umconditionsforextendedperiodsmaydegradedevicereliability.Thesearestressratingsonly,andfunctionaloperationofthedeviceattheseoranyotherconditionsbeyondthosespecifiedisnotsupported.AllvoltagevaluesarewithrespecttonetworkgroundTHERMALTHERMAL2424Junction-to-ambientJunction-to-case(top)thermalJunction-to-case(bottom)thermal有关传统和新的热度量的信息，请参阅IC封装热度量应用报告SPRA953MENDEDOPERATINGAtTA=–40°Cto+85°C,unlessotherwiseTEST DCCharacteristics:VCC=3Vto5.5Supply3VVoltageappliedtoOUT0toVHigh-levelinput0.7×VLow-levelinput0.3×VHigh-leveloutputLow-leveloutput1ConstantoutputsinkOUT0toOUT15,3V≤VCC<3.62OUT0to3.6V≤VCC<5.52Operating-airtemperatureOperatingjunctiontemperatureACCharacteristics:VCC=3Vto5.5fCLKDatashiftclockPulseSetup4Hold4ELECTRICALAtVCC=3Vto5.5VandTA=–40°Cto+85°C.TypicalvaluesatVCC=3.3VandTA=+25°C,unlessotherwiseTESTHigh-leveloutputIOH=–1mAatVCC–VLow-leveloutputIOL=1mAatVInputVIN=VCCorGNDatSINand1SupplycurrentSIN/SCLK/LAT=low,BLANK=high,VOUTn=1RIREF= SIN/SCLK/LAT=low,BLANK=high,VOUTn=1V,RIREF=3kΩ(IOUT=16.8mAtarget) AllOUTn=ON,SIN/SCLK/LAT/BLANK=low,VOUTn=1V,RIREF=3kΩ7AllOUTn=ON,SIN/SCLK/LAT/BLANK=low,VOUTn=1V,RIREF=1.5kΩ(IOUT=33.6mAtarget)ConstantoutputAllOUTn=ON,VOUTn=VOUTfix=1V,RIREF=1.5atOUT0toOUT15(seeFigure6),TA=OutputleakageOUTn=OFF,VOUTn=VOUTfix=17V,BLANK=RIREF=1.5kΩatOUT0toOUT15(seeFigureConstant-currenterrorAllOUTn=ON,VOUTn=VOUTfix=1V,RIREF=1.5atOUT0to%AllOUTn=ON,VOUTn=VOUTfix=1V,RIREF=1.5kΩatOUT0toOUT15,TA=+25°C%LineAllOUTn=ON,VOUTn=VOUTfix=1V,RIREF=1.5kΩatOUT0toOUT15,VCC=3Vto5.5VLoadAllOUTn=ON,VOUTn=1Vto3V,VOUTfix=1V,RIREF=1.5kΩReferencevoltageRIREF=1.5kΩ,TA=VPull-upPull-down(IOUT0+IOUT1+...+IOUT14+IOUT15)Thedeviationofeachoutput(IOUT0+IOUT1+...+IOUT14+IOUT15)(%) 1.(IOUT0+IOUT1+...IOUT14+(IdealOutput(IOUT0+IOUT1+...IOUT14+(IdealOutputIdealOutput(%) IdealcurrentiscalculatedbytheIOUT(IDEAL)=41.9Lineregulationiscalculatedbythis(IOUTnatVCC5.5V)(IOUTnatVCC3 (IOUTnatVCC3 5.5V3Loadregulationiscalculatedbythe(IOUTnatVOUTn=3V)(IOUTnatVOUTn=1(%/V)(IOUTnatVOUTn=1

3V1SWITCHINGAtVCC=3Vto5.5V,TA=–40°Cto+85°C,CL=15pF,RL=130Ω,RREF=1.5kΩ,andVLED=5.5V.Typicalvaluesat=3.3VandTA=+25°C,unlessotherwiseTESTRiseSOUT(seeFigure5OUTn(seeFigureFallSOUT(seeFigure5OUTn(seeFigurePropagationdelaySCLK↑to8LAT↑orBLANK↑↓toOUT0/OUT7/OUT8/OUT15LAT↑orBLANK↑↓toOUT1/OUT6/OUT9/OUT14LAT↑orBLANK↑↓toLAT↑orBLANK↑↓toOutputon-timeOn/offlatchdata=all'1',30nsBLANKlowlevelone-shotpulseinput(1)Outputon-timeerror(tON_ERR)iscalculatedbytheformula:tON_ERR(ns)=tOUT_ON–BLANKlowlevelone-shotpulsewidth(TWL2).tOUT_ONindicatestheactualon-timeoftheconstant-currentoutput.16ChannelConstantCurrentSinkDriverwith4ChannelGroupedDelay16BitShiftRegister(1Bitx16(1Bitx16Channels)

OUT0 OUT14DEVICEDBQPACKAGE(TOPVIEW)

S(TOPS

789789

OUT15ThermalPad(BottomOUT14OUT13OUT12ThermalPad(Bottom123456NOTE:ThermalpadisnotconnectedtoGNDinternally.Thethermalpadmust123456TERMINAL2ISerialdatainputfordriveron/offcontrol;Sittbufferinput.WhenSINishigh,data'1'arewrittenintotheLSBofthe16-bitshiftregisterattheSCLKrisingedge.3ISerialdatashiftclock;Sittbufferinput.Alldatainthe16-bitshiftregisterareshiftedtowardtheMSBby1-bitsynchronizationofSCLK.41ILeveltriggeredlatch;Sittbufferinput.Thedatainthe16-bitshiftregistercontinuetotransfertotheoutputon/offdatalatchwhileLATishigh.Therefore,ifthedatainthe16-bitshiftregisterarechangedwhenLATishigh,thedatainthedatalatcharealsochanged.ThedatainthedatalatchareheldwhenLATislow.ThispinisinternallypulleddowntoGNDwitha500kΩ(typ)IBlank,alloutputs;Sittbufferinput.WhenBLANKishigh,allconstant-currentoutputs(OUT0–OUT15)aredoff.WhenBLANKislow,allconstant-currentoutputsarecontrolledbythedataintheoutputon/offdatalatch.ThispinisinternallypulleduptoVCCwitha500kΩ(typ)resistor.Constant-currentvaluesetting,OUT0–OUT15sinkconstant-currentissettodesiredvaluebyconnectiontoanexternalresistorbetweenIREFandGND.OSerialdataoutput.ThisoutputisconnectedtotheMSBofthe16-bitshiftregister.SOUTdatachangesattherisingedgeofSCLK.52OConstant-currentoutput.Eachoutputcanbetiedtogetherwithotherstoincreasetheconstant-current.Differentvoltagescanbeappliedtoeachoutput.63OConstant-current74OConstant-current85OConstant-current96OConstant-current7OConstant-current8OConstant-current9OConstant-currentOConstant-currentOConstant-currentOConstant-currentOConstant-currentOConstant-currentOConstant-currentOConstant-currentOConstant-current—Power-supply1—PowerPARAMETERMEASUREMENTPINEQUIVALENTINPUTANDOUTPUTSCHEMATICFigure1.SIN,SCLK,LAT, Figure2.

TEST

Figure3.OUT0ThroughRL

CC(1)CLincludesmeasurementprobeandjigFigure4.RiseTimeandFallTimeTestCircuitfor

(1)CLincludesmeasurementprobeandjigGND Figure5.RiseTimeGND Figure6.Constant-CurrentTestCircuitforTIMINGTWH0,TWL0,TWH1,TWH2, TSU0,TSU1,TH0, VCC

(1)Inputpulseriseandfalltimeis1nsto3

Figure7.Input

tR0,tR1,tF0,tF1,tD0,tD1,tD2,tD3,

VCC

VOHor(1)Inputpulseriseandfalltimeis1nsto3Figure8.Output

tRor

VOLor LSBDataPreviousOn/OffControlLatestOn/OffControlPreviousOn/OffControlLatestOn/OffControlMSB1DataMSBDataOutputOn/OffControlDataLatch

(1)OFFOutputon/offdata=tON_ERR=tOUTON–

Figure9.TimingReferenceResistorReferenceResistor101

TYPICALAtVCC=3.3VandTA=+25°C,unlessotherwiseREFERENCE OUTPUTCURRENTvsOUTPUT OUTPUTOutputOutputCurrent OutputCurrent

OutputVoltageFigure FigureOUTPUTCURRENTOUTPUT ΔIOLCvsAMBIENTIO=35IO=35VCC=3.3VVCC=5 OutputOutputCurrent OutputVoltage

OLC0 Figure FigureCONSTANT-CURRENTΔIOLCvsOUTPUT VOLTAGE4 CH1(22OLC0 OutputCurrentFigure

CH2(2CH3(2

Time(20FigureDETAILEDSETTINGFORTHECONSTANTSINKCURRENTTheconstant-currentvaluesaredeterminedbyanexternalresistor(RIREF)cedbetweenIREFandGND.Theresistor(RIREF)valueiscalculatedbyEquation1. (k)

VIREF

VIREF=theinternalreferencevoltageontheIREFpin(typically1.205 IOLCmustbesetintherangeof2mAto35mAwhenVCCislessthan3.6V.Also,whenVCCisequalto3.6Vorgreater,IOLCmustbesetintherangeof2mAto45mA.TheconstantsinkcurrentcharacteristicfortheexternalresistorvalueisshowninFigure10.Table1describestheconstant-currentoutputversusexternalresistorvalue.Table1.Constant-CurrentOutputversusExternalResistorIOLC(mA,RIREF45(VCC>3.6V40(VCC>3.6V52CONSTANT-CURRENTDRIVERON/OFFWhenBLANKislow,thecorrespondingoutputisturnedonifthedataintheon/offcontroldatalatchare'1'andremainsoffifthedataare'0'.WhenBLANKishigh,alloutputsaredoff.ThiscontrolisshowninTable2.Table2.On/OffControlDataTruthOUTPUTON/OFF01WhentheICisinitiallypoweredon,thedatainthe16-bitshiftregisterandoutputon/offdatalatcharenotsettotherespectivedefaultvalue.Therefore,theoutputon/offdatamustbewrittentothedatalatchbeforeturningtheconstant-currentoutputon.BLANKshouldbeatahighlevelwhenpoweredonbecausetheconstant-currentmaybeturnedonasaresultofrandomdataintheoutputon/offdatalatch.Theoutputon/offdatacorrespondingtoanyunconnectedOUTnoutputsshouldbesetto'0'beforeturningontheremainingoutputs.Otherwise,thesupplycurrent(ICC)increaseswhiletheLEDsareon.REGISTERTheTLC59282hasa16-bitshiftregisterandanoutputon/offdatalatch.Boththeshiftregisteranddatalatchare16bitslongandareusedtoturntheconstant-currentoutputsonandoff.Figure16showstheshiftregisteranddatalatchconfiguration.ThedataattheSINpinareshiftedintotheLSBofthe16-bitshiftregisterattherisingedgeoftheSCLKpin;SOUTdatachangeattherisingedgeofSCLK.Theoutputon/offdatainthe16-bitshiftregistercontinuetotransfertotheoutputon/offdatalatchwhileLATishigh.Therefore,ifthedatainthe16-bitshiftregisterarechangedwhenLATishigh,thedatainthedatalatcharealsochanged.ThedatainthedatalatchareheldwhenLATislow.WhentheICinitiallypowerson,thedataintheoutputon/offshiftregisterandlatcharenotsettothedefaultvalues;on/offcontroldatamustbewrittentotheon/offcontroldatalatchbeforeturningtheconstant-currentoutputon.BLANKshouldbehighwhentheICispoweredonbecausetheconstant-currentmaybeturnedonatthattimeasaresultofrandomvaluesintheon/offdatalatch.Allconstant-currentoutputsaredoffwhenBLANKishigh.TheOUTnon/offarecontrolledbythedataintheoutputon/offdatalatch.ThetimingdiagramandtruthtableforwritingdataareshowninFigure17andTable3.4321043210 On/OffDataOn/OffDataOn/OffDataOn/OffData

ToConstant-CurrentDriverControlFigure16.16-BitShiftRegisterandOutputOn/OffDataLatch

432143210 OutputOn/OffDataLatch(1Bit1616

D15D15 Don’tFigure17.OperationTimingTable3.TruthTablein↑Dn…Dn–7…Dn–Dn–↑Dn+NoDn–↑Dn+Dn+2…Dn–5…Dn–Dn–↓—Dn+Dn+2…Dn–5…Dn–Dn–↓—Dn+Dn–NOISELargesurgecurrentsmayflowthroughtheICandtheboardifall16outputsturnonoroffsimultaneously.Theselargecurrentsurgescouldinducedetrimentalnoiseandelectromagneticinterference(EMI)intoothercircuits.TheTLC59282independentlyturnsonorofftheoutputsforeachcolorgroupwitha20ns(typ)delaytime;seeFigure9.Theoutputcurrentsinksaregroupedintofourgroups.Thefirstgroupthatisturnedon/offareOUT0/7/8/15;thesecondgroupthatisturnedon/offareOUT1/6/9/14;thethirdgroupthatisturnedon/offareOUT2/5/10/13;andthegroupisOUT3/4/11/12.Bothturn-onandturn-offaredelayed.However,thestateofeachoutputiscontrolledbythedataintheoutputon-offdatalatchandBLANKlevel.REVISIONNOTE:PagenumbersforpreviousrevisionsmaydifferfrompagenumbersinthecurrentChangesfromRevisionB(July2011)toRevision Added低饱和电压特 ChangesfromRevisionA(December2010)toRevision Changed恒定电流准确度特 AddedRGEpackageinformationtoPackage/OrderingInformation AddedRGEpackagetoThermalInformation ChangedInputcurrentparametertestconditionsinElectricalCharacteristics AddedRGEpinoutandfootnotetoDeviceInformation AddedRGEinformationtoTerminalFunctions DeletedFigure11,POWERDISSIPATIONRATEvs-AIR PACKAGEOPTION16-Aug-PACKAGINGOrderableStatusPackagePackageEconMSLPeakTemp&noSb/Br)CU&noSb/Br)CU&noSb/Br)CU&noSb/Br)CU(1)ThemarketingstatusvaluesaredefinedasACTIVE:Product mendedfornewLIFEBUY:TIhasannouncedthatthedevicewillbedis,andalifetime-buyperiodisinNRND: mendedfornewdesigns.Deviceisinproductiontosupportexistingcustomers,butTIdoes mendusingthispartinanewPREVIEW:Devicehasbeenannouncedbutisnotinproduction.SamplesmayormaynotbeOBSOLETE:TIhasdistheproductionofthe(2)Econ-Thennedeco-friendlyclassification:Pb-(RoHS),Pb-(RoHSExempt),orGreen(RoHS&noSb/Br)-pleasecheck informationandadditionalproductcontentdetails.TBD:ThePb-/Green nhasnotbeenPb-(RoHS):TI'sterms"Lead- "or"Pb-"meansemiconductorproductsthatarecompatiblewiththecurrentRoHSrequirementsforall6substances,includingtherequirementthatleadnotexceed0.1%byweightinhomogeneousmaterials.Wheredesignedtobesolderedathightemperatures,TIPb- productsaresuitableforuseinspecifiedlead- Pb-(RoHSExempt):ThiscomponenthasaRoHSexemptionforeither1)lead-basedflip-chipsolderbumpsusedbetweenthedieandpackage,or2)lead-baseddieadhesiveusedbetweenthedieandleadframe.ThecomponentisotherwiseconsideredPb-(RoHScompatible)asdefinedabove.Green(RoHS&noSb/Br):TIdefines"Green"tomeanPb-(RoHScompatible),andofBromine(Br)andAntimony(Sb)basedflameretardants(BrorSbdonotexceed0.1%byweightinhomogeneousmaterial)(3)MSL,PeakTemp.--TheMoistureSensitivityLevelratingaccordingtotheJEDECindustrystandardclassifications,andpeaksolderImportantInformationandDier:TheinformationprovidedonthispagerepresentsTI'sknowledgeandbeliefasofthedatethatitisprovided.TIbasesitsknowledgeandbeliefoninformationprovidedbythirdparties,andmakesnorepresentationorwarrantyastotheaccuracyofsuchinformation.Effortsareunderwaytobetterintegrateinformationfromthirdparties.TIhastakenandcontinuestotakereasonablestepstoproviderepresentativeandaccurateinformationbutmaynothaveconducteddestructivetestingorchemicalysison ingmaterialsandchemicals.TIandTIrsconsidercertaininformationtobeproprietary,andthusCASnumbersandotherlimitedinformationmaynotbeavailableforrelease.InnoeventshallTI'sliabilityarisingoutofsuchinformationexceedthetotalpurchasepriceoftheTIpart(s)atissueinthissoldbyTItoCustomeronanannualPACKAGEMATERIALSPACKAGEMATERIALSTAPEANDREEL*AlldimensionsareWPackMaterials*AlldimensionsarePackagePackageLengthWidthHeightPackMaterialsDBO(R—PDSO— S丁ICSMALL—OU丁LINE0.3440.337-＾-0.2440.228已＼0.069

0.004-4/HNOTES:A.Alllineardimensionsareininches()FallswithinJEDECM0-137variation（-4/CLAND（-4/CDBQ(R—PDSO— S丁 OUTLINEINOTES:A.AlllineardimensionsareinIPublicationIPC-7351 mendedforalternateLasercuttingapertureswithtrapezoidalwallsandalso「oundingcorne「swillofferbetterpasterelease.Customersshouldcontacttheirboardassemblysiteforstencildesign mendations.Examplestencildesignbasedona50%volumetricmetalloadsolde「paste.RefertoIPC-7525forotherstencil ili区INSnUMEN；0,80｀， /G07E；0,80｀， /G07EGNT2sV}◄ A.Alllineardimensionsoreinmillimeters.DimensioningandtoleroncingperASMEY14.SM-QuadFlatpack,No-Leads(QFN)packageThepackagethe「malpadmustbesolderedtotheboardforthermalandmechanicalpe「SeetheadditionalfigureintheProductDataSheetfordetailsregardingtheexposedthermalpadfeaturesandFallswithinJEDECM0-』“T区unn1unn1fL12THERMALPADMECHANICALRGERGE(S-PVQFN—STICQUAD NO—ThispackageincorporatesanexposedthermalpadthatThispackageincorporatesanexposedthermalpadthatisdesignedtobeattacheddirectlytoanexternalheatsink.Thethermalpadmustbesoldereddirectlytotheprintedcircuitboard(PCB).Aftersoldering,thePCBcanbeusedasaheatsink.Inaddition,throughtheuseofthermalvias,thethermalpadcanbeattacheddirectlytotheappropriatecopperneshownintheelectricalschematicforthedevice,oralternatively,canbeattachedtoaspecialheatsinkstructuredesignedintothePCB.Thisdesignoptimizestheheattransferfromtheintegratedcircuit(IC).ForinformationontheQuadFlatpackNo-Lead(QFN)packageanditsadvantages,refertoApplicationReport,QFN/SONPCBAtta ent,TexasInstrumentsLi tureNo.SLUA271.This isavailableatTheexposedthermalpaddimensionsforthispackageareshowninthefollowing，◦＋-6/AAiTEYINSn.UMEN厂Example(NoteE)，勹｀丿—三·，丿三二勹勹＼二／二二了门丿＼、＼、勹厂Example(NoteE)，勹｀丿—三·，丿三二勹勹＼二／二二了门丿＼、＼、勹＼／，／，、＼＼、(60%PrintedSolderCoverageby＼、＼、＼、＼＇、＼＼ExampleViaLayoutDesignVialayoutmayvaryonlayoutconstraints(NoteD,F)／、、＼／、＼／飞＾，，，，＼◦，◦＼＼｀＼＇／ ／—5/MO,2104xR25x3:0000000000]}-:}`'I0DPeetkeN30tx97/111\9.yolOaepe',I''0,'30tx97/111\9.yolOaepe',I''0,',E\/82pde:[M­I-­,n0R'Oi,A,i\',',Pub