表面黏著型整流二极体之制造方法ppt

FormosaMicrosemiCo.,LTDCompanyProfile1CompanyProfile*CompanyOverview*CompanyPolicy*CompanyOrganization*QualityCertificate*ProductConstruct*PatentCertificate*RevenueGrowth*FactoryEquipment*ProductCapacity*PackageList&NewPackageDevelopmentPlan*MajorCustomers21EstablishedJUL.19962PresidentMr.BenW.P.Huang3CapitalUSD8.5M4Employees4505Address5F,NO.208,Sec.3,ChungYangRoad,Tucheng,TaipeiHsien,TaiwanCompanyOverview3MainProducts

SchottkyBarrierDiodeSwitchingDiode

ZenerDiodeGeneralPurposeRectifierFastRecoveryRectifierSuperFastRectifier4TaiwanFactoryLocated:Taipei,Taiwan5MainLandChinaFactoryLocated:

HangZhou6Located:

HangZhouMainLandChinaFactory7Located:

SuZhouMainLandChinaFactory8InnovationQualityServiceCompanyPolicy9CompanyOrganizationTaiwanFMSBoardDirectorGeneralManagerMr.BenHuangTaiwanFactoryMr.BenHuangRectifiersDiodeSmallSignalBridgeOthersSuZhouFactoryMr.DavidXuSwitchingDiodeDiacDiodeOthersChinaLocalSalesCompanyHangZhouFormosa

Mr.StephenHuangShenZhenoffice

Mr.JetChangTaiwanLocalSalesCompanyFormosaTechnologyHangZhouFactoryMr.YangQiJIWaferFABRectifiers10ISO9001:2000ISO9001ISO14001QualityCertificate11FormosaMS-SMATraditional-SMA1.Thecontactpinpickstrimming,thecurvedformation,intheprocessthematerialeasyindirectdamage,thequalitynottobeeasiertocontrol.2.Thecopperleadframeonlyhas0.2mmthickness.3.Theoutlookbig,thicknessishigh,theusermustconsidergivesthebiggerspatialdesign,ismoreuneconomical.4.Traditionaloutlook.5.Thesolderingcontactfacepicksthemachineryformation,smoothnessisworse.6.Processonthetraditionalcontrol,thequantityproducesslowly.ProductConstruct1.Light2.Thin3.Short4.Small5.Thequalityisgood(Highquality)6.Thepatentsystemprocess,hascompetitiveness12TaiwanPatentNo.124076TaiwanPatentNo.134855TaiwanPatentNo.159803PatentCertificate表面黏著型整流二極體之製造方法表面黏著型排列二極體之製造方法無引線型片狀橋式整流器之構造13TaiwanPatentNo.195776TaiwanPatentNo.253150TaiwanPatentNo.256585表面黏著型整流二極體之結構改良雙金屬與陶瓷組成之功率半導體構造及其製造方法功率半導體之散熱構造PatentCertificate14JapanPatentNo.3105138U.S.A.PatentNo.6,085,396U.S.A.PatentNo.6,334,971B1功率半導體之冷卻裝置整流二極體之製造方法表面黏著型排列二極體之製造方法PatentCertificate15ChinaPatentNo.ZL99109757.2ChinaPatentNo.ZL00121446.7ChinaPatentNo.ZL200420050732.3表面黏著型整流二極體之製造方法表面黏著型排列二極體之製造方法功率半導體之散熱構造PatentCertificate16ForecastRevenueGrowthUnit:MillionNTD17LightningStrikeTesterThermalResistanceTesterEquipmentforHi-Reliability18H.T.R.B.TesterOP.LIFETesterEquipmentforHi-Reliability19VF/PIV/IR/TrrTestEquipmentTemperatureCycleEquipmentEquipmentforHi-Reliability20DeltaVF&ForwardSurgeTesterSolderAbilityEquipmentEquipmentforHi-Reliability21AxialSMDDiffusionWaferProductCapacity22SMDPackageList&

NewPackageDevelopmentPlan23OEMBusinessMajorCust