半导体封装测试概论课件

半導體封裝測試概論講者王量玄

半導體封裝測試概論1大綱半導體材料及相關應用領域積體電路種類積體電路製造封裝技術發展傳統封裝與晶圓級封裝(waferlevelCSP)測試大綱半導體材料及相關應用領域2半導體材料及相關應用領域種類材料應用SiSi積體電路(IntegratedCircuit)太陽能電池(SolarCell)微機械元件(Micromechanics)化合物GaAsGaPZnSeZnS高速高頻積體電路發光二極體(LightEmittedDiode)半導體雷射(SemiconductorLaser)平面顯示器(FlatPanelDisplays)半導體材料及相關應用領域種類材料應用SiSi積體電路(In3積體電路種類邏輯(Logic):CPU,晶片組(Chip_Set),繪圖晶片……..記憶體(Memory):ROM,SRAM,DRAM,Flash…

積體電路種類邏輯(Logic):CPU,晶片組(C4積體電路製程積體電路製程5

封裝技術發展

ASEAssemblyMilestone

封裝技術發展

ASEAssemblyMilesto6傳統封裝與晶圓級封裝(waferlevelCSP)

傳統封裝

晶粒切割晶粒貼附打線灌膠彎腳成型SOJ傳統封裝與晶圓級封裝(waferlevelCSP)

傳統7晶圓級封裝(waferlevelCSP)

Ballspadopen&SolderbumpingWaferlevelfinaltesting晶圓級封裝(waferlevelCSP)

Ballsp8ProcessFlowWaferincomingCONFIDENTIALProcessFlowWaferincomingCONF9ProcessFlowBCBcoatingSputterTi/CuCONFIDENTIALProcessFlowBCBcoatingSputter10ProcessFlowCONFIDENTIALPRcoatingCu/Ni/AutraceplatingProcessFlowCONFIDENTIALPRcoa11ProcessFlowCONFIDENTIALPRstripping&Ti/CuetchingSoldermaskcoatingProcessFlowCONFIDENTIALPRstr12ProcessFlowCONFIDENTIALBacksidemarkingBallplacementProcessFlowCONFIDENTIALBacks13ProcessFlowWaferlevelfinaltestingCONFIDENTIALDicingsawPick&placeProcessFlowCONFIDENTIALDicing14

測試

測試Tester測試機MemoryTester,LogicTester,MixTester.Handler(自動分類機)&Prober(自動針測機)

測試

測試Tester測試機15

MemoryTester

16Handler

Handler17WaferLevelFinalTestingLoadBoardX/Y/ZStepMotorWaferChuckSolderBall

ProbeCardCopperPosttypeWaferLevelFinalTestingLoad18報告完畢敬請指教謝謝報告完畢敬請指教謝謝19半導體封裝測試概論講者王量玄

半導體封裝測試概論20大綱半導體材料及相關應用領域積體電路種類積體電路製造封裝技術發展傳統封裝與晶圓級封裝(waferlevelCSP)測試大綱半導體材料及相關應用領域21半導體材料及相關應用領域種類材料應用SiSi積體電路(IntegratedCircuit)太陽能電池(SolarCell)微機械元件(Micromechanics)化合物GaAsGaPZnSeZnS高速高頻積體電路發光二極體(LightEmittedDiode)半導體雷射(SemiconductorLaser)平面顯示器(FlatPanelDisplays)半導體材料及相關應用領域種類材料應用SiSi積體電路(In22積體電路種類邏輯(Logic):CPU,晶片組(Chip_Set),繪圖晶片……..記憶體(Memory):ROM,SRAM,DRAM,Flash…

積體電路種類邏輯(Logic):CPU,晶片組(C23積體電路製程積體電路製程24

封裝技術發展

ASEAssemblyMilestone

封裝技術發展

ASEAssemblyMilesto25傳統封裝與晶圓級封裝(waferlevelCSP)

傳統封裝

晶粒切割晶粒貼附打線灌膠彎腳成型SOJ傳統封裝與晶圓級封裝(waferlevelCSP)

傳統26晶圓級封裝(waferlevelCSP)

Ballspadopen&SolderbumpingWaferlevelfinaltesting晶圓級封裝(waferlevelCSP)

Ballsp27ProcessFlowWaferincomingCONFIDENTIALProcessFlowWaferincomingCONF28ProcessFlowBCBcoatingSputterTi/CuCONFIDENTIALProcessFlowBCBcoatingSputter29ProcessFlowCONFIDENTIALPRcoatingCu/Ni/AutraceplatingProcessFlowCONFIDENTIALPRcoa30ProcessFlowCONFIDENTIALPRstripping&Ti/CuetchingSoldermaskcoatingProcessFlowCONFIDENTIALPRstr31ProcessFlowCONFIDENTIALBacksidemarkingBallplacementProcessFlowCONFIDENTIALBacks32ProcessFlowWaferlevelfinaltestingCONFIDENTIALDicingsawPick&placeProcessFlowCONFIDENTIALDicing33

測試

測試Tester測試機MemoryTester,LogicTester,MixTester.Handler(自動分類機)&Prober(自動針測機)

測試

測試Tester測試機34

MemoryTester

35Handler

Handle