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SOPASSEMBLYPROCESSFLOW&QUALITYCONTROLINSTRUCTIONSOPASSEMBLYPROCESSFLOW&QUContentsPackageInstructionProcessFlowQualityControlContentsPackageInstructionPackageInstructionSOPSSOP3.TSSOP4.MFPASEASEPackageInstructionSOPSSOP3.TPackageInstructionPackageInstructionASYprocessflowWaferSawDieAttach
WireBond
WaferMountWaferGrindingEpoxyCure
MoldingPostMoldCurePlatingTrim/FormPacking&ShippingDe-junkLaserMarking前段制程后段制程WaferDie(chip)DieonLeadframeEpoxyLeadFrameBeforeAfterLaserMarkingLaserMarkingLaserMarkingLaserMarkingASYprocessflowWaferSawDieAWaferGrindingLOADUNLOADGRINGINGPurpose:GrindingthewafertoCustomerrequiredthicknessWaferGrinding晶圓(未研磨)研磨機晶圓(研磨後)WaferGrindingLOADUNLOADGRINGI晶元背面WaferbacksideFrameMountTapePurpose:
CombinethewaferwithDicingtapeontotheframefor
die
sawingWafermountMachineWaferMountFrame晶元背面WaferbacksideFrameMountTPurpose:
ToseparatediesfromeachotherfordieattachMonitorLoad/UnloadSawingCleaningMachineWaferSawPurpose:MonitorLoad/UnloadSawBeforewafersaw:Afterwafersaw:WaferSawBeforewafersaw:AfterwafersPurpose:AttachthedieswithepoxyonsubstrateforthefollowingprocessDieAttachOutputDiebondSubstrateloadbondPurpose:DieAttachOutputDieboWorkingflow:DieAttachRobbertipLead-frameEpoxyWorkingflow:DieAttachRobberPurpose:
SolidifytheepoxyafterD/AInsideOvenEpoxyCurePurpose:InsideOvenEpoxyCurePurpose:
ConnectingthechipandtheexteriorcircuitinputinputoutputBondlocationTheory:
Useultrasonic,thermal,forcetoformtheintermetallicbetweengoldenwireandjointmetal(Al,Au,Ag…)WireBondGoldwireleadDieAlpadCapillaryPurpose:inputinputoutputBondMoldMachineMoldingPurpose:
SealtheproductwithEMCtopreventdie,goldwirefrombeingdamaged,contaminatedandoxygenic.MoldMachineMoldingPurpose:MoldingMoldingTopchaseAirventBottomchaseCavityLeadframePlungerPotGateinsertRunnerCompoundBottomcullblockTopcullblockMoldingMoldingTopchaseAirvenMoldingMoldingTopchaseAirventBottomchaseCavityLeadframePotGateinsertRunnerCompoundBottomcullblockTopcullblockPlungerMoldingMoldingTopchaseAirvenMoldingMoldingTopchaseAirventBottomchaseCavityLeadframePotGateinsertRunnerCompoundBottomcullblockTopcullblockPlungerMoldingMoldingTopchaseAirvenMoldingAfterMoldMoldingTopchaseAirventBottomchaseCavityLeadframePotGateinsertRunnerCompoundBottomcullblockTopcullblockPlungerEpoxyLeadFrameMoldingAfterMoldMoldingTopchPurpose：
UselaserlightirradiatedbyCO2orYAGtovapourtheEMCtoshowcontentonthepackage，suchasdate,schedule,placeofproductionandsoon.LaserMarkinglaserEMCvapouredBeforeAfterLasermarkingPurpose：LaserMarkinglaserEMCOvenInsidePurpose:
ToletEMCreactcompletelysothatproductscanbeprotectedmoreeffectively.PostmoldcureOvenInsidePurpose:PostmoldcDe-junkPurpose：
Removethedem-barofleadframe.WorkingareaBeforeAfterLaserMarkingLaserMarkingDe-junkPurpose：WorkingareaBePlatingPurpose:
ToplatingSnontheleadwhichwillmountonboardpad.loadunloadPlatinglinePlatingPurpose:loadunloadPlatPlatingAfterBefore投料區電解去膠高壓噴洗酸洗收料區活化槽電鍍槽中和槽熱D.I.水烘乾
SOLDERPLATING(S/P
區)ELECTRODEFLASH(E/D區
)面板操作PlatingAfterBefore投料區電解去膠高壓噴洗酸Purpose:
Removethetie-barandlead-frameandformproductstounitsfromstrips,fillthemintotubesandthenpasstonextprocess.TrimFormSawworkareaunloadWorkingareaunloadLasermarkingPurpose:TrimFormSawworkareTrimFormWorkingareaLasermarkingunloadunloadLeadCutFormingTrimFormWorkingareaLasermarQualityControlDieSaw切偏Chipping外观检查划片宽度量测RejRejQualityControlDieSaw切偏ChippiLeadFrameEpoxyDieQualityControlDieShearEpoxyVoidCheckDieAttachLeadFrameEpoxyDieQualityContQualityControlEpoxyThickness&FilletHeightDieAttachDieLocationRejQualityControlEpoxyThicknessQualityControlWireBond外观检查第二焊点重叠RejRejRejRej第二焊点偏移线弧不良RejRejQualityControlWireBond外观检查第二DieQualityControl推球测试拉力测试WireBondDieQualityControl推球测试拉力测试WireQualityControlWireBond验证级工程确认IMCCoverageIMCThicknessCraterTest1stbond1stbond2ndbondLoopingQualityControlWireBond验证级工程确QualityControlMoldLooping外观检查上下错位孔洞缺角溢胶内部气泡冲线值量测RejRejRejRejRejQualityControlMoldLooping外观检查Plating外观检查Solderabilitytest镀层厚度量测QualityControl170°C烘烤8小时，90~95°C蒸汽老化10小时。锡覆盖率≥95%RejRejRejPlating外观检查Solderabilitytest镀QualityControlTirm/Form毛刺脚偏漏底材长短脚脚弯异物附着外观检查外形尺寸量测超声波扫描RejRejRejRejRejRejQualityControlTirm/Form毛刺脚偏漏底SOPASSEMBLYPROCESSFLOW&QUALITYCONTROLINSTRUCTIONSOPASSEMBLYPROCESSFLOW&QUContentsPackageInstructionProcessFlowQualityControlContentsPackageInstructionPackageInstructionSOPSSOP3.TSSOP4.MFPASEASEPackageInstructionSOPSSOP3.TPackageInstructionPackageInstructionASYprocessflowWaferSawDieAttach
WireBond
WaferMountWaferGrindingEpoxyCure
MoldingPostMoldCurePlatingTrim/FormPacking&ShippingDe-junkLaserMarking前段制程后段制程WaferDie(chip)DieonLeadframeEpoxyLeadFrameBeforeAfterLaserMarkingLaserMarkingLaserMarkingLaserMarkingASYprocessflowWaferSawDieAWaferGrindingLOADUNLOADGRINGINGPurpose:GrindingthewafertoCustomerrequiredthicknessWaferGrinding晶圓(未研磨)研磨機晶圓(研磨後)WaferGrindingLOADUNLOADGRINGI晶元背面WaferbacksideFrameMountTapePurpose:
CombinethewaferwithDicingtapeontotheframefor
die
sawingWafermountMachineWaferMountFrame晶元背面WaferbacksideFrameMountTPurpose:
ToseparatediesfromeachotherfordieattachMonitorLoad/UnloadSawingCleaningMachineWaferSawPurpose:MonitorLoad/UnloadSawBeforewafersaw:Afterwafersaw:WaferSawBeforewafersaw:AfterwafersPurpose:AttachthedieswithepoxyonsubstrateforthefollowingprocessDieAttachOutputDiebondSubstrateloadbondPurpose:DieAttachOutputDieboWorkingflow:DieAttachRobbertipLead-frameEpoxyWorkingflow:DieAttachRobberPurpose:
SolidifytheepoxyafterD/AInsideOvenEpoxyCurePurpose:InsideOvenEpoxyCurePurpose:
ConnectingthechipandtheexteriorcircuitinputinputoutputBondlocationTheory:
Useultrasonic,thermal,forcetoformtheintermetallicbetweengoldenwireandjointmetal(Al,Au,Ag…)WireBondGoldwireleadDieAlpadCapillaryPurpose:inputinputoutputBondMoldMachineMoldingPurpose:
SealtheproductwithEMCtopreventdie,goldwirefrombeingdamaged,contaminatedandoxygenic.MoldMachineMoldingPurpose:MoldingMoldingTopchaseAirventBottomchaseCavityLeadframePlungerPotGateinsertRunnerCompoundBottomcullblockTopcullblockMoldingMoldingTopchaseAirvenMoldingMoldingTopchaseAirventBottomchaseCavityLeadframePotGateinsertRunnerCompoundBottomcullblockTopcullblockPlungerMoldingMoldingTopchaseAirvenMoldingMoldingTopchaseAirventBottomchaseCavityLeadframePotGateinsertRunnerCompoundBottomcullblockTopcullblockPlungerMoldingMoldingTopchaseAirvenMoldingAfterMoldMoldingTopchaseAirventBottomchaseCavityLeadframePotGateinsertRunnerCompoundBottomcullblockTopcullblockPlungerEpoxyLeadFrameMoldingAfterMoldMoldingTopchPurpose：
UselaserlightirradiatedbyCO2orYAGtovapourtheEMCtoshowcontentonthepackage，suchasdate,schedule,placeofproductionandsoon.LaserMarkinglaserEMCvapouredBeforeAfterLasermarkingPurpose：LaserMarkinglaserEMCOvenInsidePurpose:
ToletEMCreactcompletelysothatproductscanbeprotectedmoreeffectively.PostmoldcureOvenInsidePurpose:PostmoldcDe-junkPurpose：
Removethedem-barofleadframe.WorkingareaBeforeAfterLaserMarkingLaserMarkingDe-junkPurpose：WorkingareaBePlatingPurpose:
ToplatingSnontheleadwhichwillmountonboardpad.loadunloadPlatinglinePlatingPurpose:loadunloadPlatPlatingAfterBefore投料區電解去膠高壓噴洗酸洗收料區活化槽電鍍槽中和槽熱D.I.水烘乾
SOLDERPLATING(S/P
區)ELECTRODEFLASH(E/D區
)面板操作PlatingAfterBefore投料區電解去膠高壓噴洗酸Purpose:
Removethetie-barandlead-frameandformproductstounitsfromstrips,fillthemintotubesandthenpasstonextprocess.TrimFormSawworkareaunloadWorkingareaunloadLasermarkingPurpose:TrimFormSawworkareTrimFormWorkingareaLasermarkingunloadunloadLeadCutFormingTrimFormWorkingareaLasermarQualityCon
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