PCB专业英语资料PCB海外销售英语资料

1、PCB专业英语What is PCB? Printed Circuit BoardPCB Effect？Conduct ElectricityTransmission SignelSupported Fixation Action前言Foreword（印刷线路板）（导电）（传输信号）（支撑固定）PCB Sort分类A:Single-sidedDouble- sidedMulti-layer Printed Circuit Board (PCB)B:Rigid PCB Flexible PCB Flex-rigid PCB单面/双面/多层PCB刚性/挠性/刚挠性PCBPCB Sort分类meta

2、lbasePCB(金属基板)Blindboard(盲孔板)buriedboard(埋孔板)bareboard(裸板)Quickturnprototype(样板)LaminateCut (开料)Inner Dry Film (内层菲林)Inner Etching内层蚀刻Black Oxide 黑化Brown Oxidation棕化Laminating层压Drilling钻 孔Plated-through hole沉铜Outer Dry Film外层干膜Pattern Plating图形电镀 Outer Etching外层蚀刻 Wet Film 阻焊 Silk Screen纲版印刷字符 Surfa

3、ce Treatment表面处理 Golden Finger 镀金手指 Hot Air Leveling喷锡 Routing外形 E-test （电子测试 ) Packing包装 Output 出 货 二、Process Flow 工艺流程 Inner Dry FilmInner Etching内层菲林Outer Dry Film 外层菲林 内层蚀刻outer Etching 外层蚀刻Inner Inspection 内检Outer Inspection 外检层压 LALaminate DR BO棕/黑氧化Brown/Black Oxidation钻 孔Drilling PTH PP WF 沉

4、铜 Plated-through hole 图形电镀 阻焊Pattern PlatingWet FilmEngineering Common words 常用词语Base MaterialCoppercladlaminate(CCL)(覆铜板)PREPREG(半固化片)Epoxyresin(环氧树脂)Copperfoil(铜箔)Dielecteics(介质)PTFE(Polytetralluoetylene)Teflon(聚四氟乙烯)dielectricconstant（介电常数）Engineering Common words 常用词语Soldermask(阻焊)Dryfilm（干膜）leg

5、endink(字符油墨)peelablesolder mask(可剥离阻焊)Engineering Common words 常用词语Surface Treatment沉金Immersion GoldChemical GoldEnectroless Gold PlatingENIG= Enectroless Nickel and Immersion GoldEngineering Common words 常用词语电镀金Gold platingElectric Gold platingHard Gold Plating无铅喷锡Lead Free HASLHASL for Pb FreeSN10

6、0CEngineering Common words 常用词语喷锡HAL=Hot Air LevelingHASL=Hot Air Solder LevelingSn/Pb(63/36)Tin/Lead solderEngineering Common words 常用词语金手指Gold FingersEdge Connector PlatingTabconnector Chamfer(倒角)桥连Bridge ConnectingTab ConnectingEngineering Common words 常用词语桥连邮票孔Connecting tabs with Stamp holesCon

7、necting tabs with Mouse(Mice) Bite holes工艺边Rails(Tooling Rails)Tooling StripEngineering Common words 常用词语Panel FrameHolding FrameWaste EdgeBurr(毛刺)Twist and Warp(翘曲) Common words 常用词语检验FinalInspection(终检) Fibreexposure(漏基材)Holebreakout(破孔)Thermalshock(热冲击)Thermalstress(热应力)Reworking(返工) Overetching(

8、过蚀) Common words 常用词语Majorequipments Laserplotter(激光光绘机) CNCrouting machine(数控铣床)Patternplatingline(图形电镀线)Dryfilmlaminator（贴膜机） Exposuredevelopingline (曝光显影线)FlyingProbetestFPT（飞针检测仪）Automaticoptical instrumentAOI (自动光学检测仪) EngineeringDesign tearpad(泪滴焊盘)isolation pad(隔离焊盘)thermalpad(热焊盘)mountinghol

9、e(安装孔)Fiducial Mark(基准点、反光点) ComponentAssembly （元器件组装） SMT(Surfacemounttechnology)(表面贴装技术)Bonding(邦定)BGA(ballgridarray)(球栅封装)SMD(Surfacemountdevices)(表面贴装设备)Placementmachine(贴装机)REFOLWSOLDERING(回流焊)WAVESOLDERING(波峰焊) ExampleADD 4 TOOLING HOLES IN EACH OF THE CORNERS OF THE PANEL FRAME.THE DIAMETER O

10、F EACH TOOLING HOLE SHOULD BE 3.5MM. EACH TOOLING HOLE SHOULD BE PLACED Y=2.5MM AND X=2.5MM FROM THE CORNERS OF THE PANELFRAME. THE PANEL FRAME HAS A WIDTH OF 5MM AND SHOULD ONLY EXIST ON 2 SIDES OF THE PANEL. 拼版后加2 个宽5MM 的附边，在拼版附边上的4 角加4 个定位孔，直径3.5MM，X，Y 方向分别离附边 2.5MM Example6 LAYER PCB , 1.60 MM T

11、HICK FR4 ,2 X GREEN SOLDER MASKS , 2 X WHITE OVERLAYS , UL IS REQUIRED , PCBS TO BE BARE BOARD TESTED , PANEL ROUTED , PCB SIZE : 265 X 356 MM QUANTITY IS PER PCB , 10 OFF PCBS REQUIRED , IMMERSION SILVER 6 层板，1.6MM 厚，FR-4 板材，两层绿色阻焊，两层白色字符，UL 标记要加，做裸板测试，拼版铣外形，板尺寸：265 X 356 MM，交货数量 10 个,沉银 处理习惯对于外销客户，客户在回复工程问题后，会问道Please confirm all the questions are clear and the order could be proceeded ?/Please feedback if you could understand all the comment above?我们在处理工程问题后，正确礼