纯玻璃触控技术比较

1、純玻璃純玻璃觸控技術比較觸控技術比較比較項目電容式電容式(Capacitive)音波式音波式 (SAW)紅外線式紅外線式 (IR) 近場感應式近場感應式 (NFI)觸控介質手或其他帶導體之介質限手或其他軟性介質手(可戴手套)或其他介質手(可戴手套)或其他介質感應方式運用人體靜電感應電流變化 偵測聲波 訊號遮斷 電場感應透光度 90%以上 92%以上 100% 90%觸控準確度 佳(錯誤率 5m mmPixel electrodePixel electrodeTouch Panel for New User InterfaceUI focusing on finger input (UI def

2、ines how user operates the device; not touch panel)Apple iPhoneLG PRADAHTC TouchScreen Size3.5” (HVGA 480 x320)3.0” (WQVGA 400 x240)2.8” (QVGA 320 x240)Touch Panel Capacitive Touch Panel Capacitive Touch Panel on Protective Screen (Synaptics)Resistive Touch PanelMulti-touchMulti-touchSingle-touchSin

3、gle-touchOperationTwo handSingle handSingle HandUIiPhone UI on OS-XAdobe Flash Lite UIWindows Mobile &HTCs TouchFLOFinger input only applications: DSC, Car navigation, PMP, MP3, information displayFor PDA, smart phone or GPS, UI can cover the need of pen writing using on-screen keypad.Capacitive

4、 Type Touch PanelProximity of object to sensor provide different capacitance value for sensorsDetection of sensor can be done with two typesE-field SensorDetection of capacitance by change of electric fieldCapacitive SensorDetection of capacitance by measuring holding chargeOther sensor typesInducti

5、ve SensorsDetection of the proximity of metal objects only (electro-magnetic)Optical SensorsNon-Contact Presence Sensors (Proximity)Sensor Design ConsiderationCapacitive Touch PanelTPII Proposal v1Feature:n Easy Process- Not necessary to be traIt could be attached by 雙面膠 in module process.Issue:n Th

6、ick module-An extra glass and AG film is necessary.TFTCF GlassGlass (0.5mm)LCPFTouch Sensor SetColor ResistTFTCF GlassLCPFColor ResistAGAGTPII Proposal v2Feature:n Thin moduleNo need extra glass. Issue:n Process complexity Due to CF maker could not pattern ITO, it is necessary to finish touch panel

7、in Array Fab before CF process. Color ResistTFTCF GlassLCPFTouch Sensor SetTP side processTP Sensor Process FlowGlassITOMolyOC1Glass 入料ITO SputterITO EtchingMetal SputterMetal EtchingOC1 depositAPR PrintingOC2 deposit3F ITO line2F TBM line3F OC line2F Cr line3F Metal etching line3F PI coater line3F

8、PS lineOn cellTP2TP side processGlassITO SputterITO EtchingOC1 ProcessMoly EtchingAPR ProcessOC2 ProcessITO targetTP Sensor One Glass Process ( 5PEP )GlassBMTP sensorGlass 入料ITO SputterITO EtchingMetal SputterMetal EtchingOC1 depositAPR PrintingOC2 depositBM depositThe original 6 peps design to a ne

9、w 5 peps design.2. The new 5 peps design has few advantages, as cost down, lead time reduced and etc.ITOOC1BMMetalOC2OC0BMITOMetalOC2Compare 5 pep with 6 pep processOne glass _ Original design with OC0 processProcess sequence : BM, black matrix (black matrix frame) BMOC0BMOC0BMOC0BMITOITO, (patterne

10、d sensor) OC0, over coat layer0(isolated BM and ITO) One glass _ Original design with OC0 processProcess sequence : OC1, over coat layer1 (isolated ITO & metal) Metal, metal bridge(sensor connection) OC2, over coat layer2 (Protection coating) OC0BMITOMetalOC2OC0BMITOMetalOC0BMITOProcess sequence

11、 : BM, black matrix (black matrix frame) ITO, (patterned sensor) OC1, over coat layer1 (isolated ITO & metal) ITOBMBMOC1BMITOOne glass _ New design remove OC0 processOC1BMMetalITOOC1BMMetalITO Metal, metal bridge(sensor connection) OC2, over coat layer2 (Protection coating) OC2One glass _ New de

12、sign remove OC0 processCF side processCF Process FlowGlass reserveBM FormationR resistorcoatingOCITOPSB resistorcoatingG resistorcoating2F RED line2F BLU line2F GRN line2F Thermal OC line2F ITO line2F PS lineCr BM Process空白玻璃 鍍第一層Cr膜上光阻(coating)對準,曝光(stepping)顯影液顯影(developing) 蝕刻(etching) 強酸液去光阻(str

13、iping)去光阻液光罩RBM Process空白玻璃 塗佈Resin film顯影成膜及硬烤顯影液對準,曝光(exposing)光罩RGB Process _ part 1 (2F_RGB line)光罩 R光阻塗佈 = Spin 曝光BM玻璃R顯影成膜及硬烤B光阻塗佈= Spin= SpinSlit coater 曝光光罩Slit coaterRGB Process _ part 2 (2F_RGB line)B顯影成膜及硬烤G光阻塗佈= Spin 曝光B顯影成膜及硬烤三色成品檢驗Slit coaterOC Process (2F_Thermal OC line)烘烤OC layer塗佈S

14、pinless RGB基板ITO ProcessRGB+OC基板鍍好ITO膜之基板在基板上放遮罩移去遮罩之成品濺鍍ITO靶MVA Process (4F_MVA line) MVA光阻塗佈及旋轉顯影烘烤MVA光罩曝光UV 燈PS Process (2F_PS line) PS光阻塗佈及旋轉顯影烘烤PS光罩曝光UV 燈TPII Mask Design1. TPII 5m X 5m design ( Cypress Design ) 2. TPII 5m X 5m design ( for Yokohama ) TPII V1 : 根據根據Cypress Design Guide line 設計設

15、計Sensor size = 4.9mm x 4.9mmSensor spacing = 0.3mm Sensor bridge width = 50umSpace = 0.3mmV2Sensor size = 4.9mm x 4.9mmSensor spacing = 0.3mmDummy width = 240umITO spacing = 30umSensor size = 4.9mm x 4.9mmSensor spacing = 0.3mmDummy width = 60umITO spacing = 30umSensor density = 14*8TPII Type G v2 D

16、esign Capacitive Sense Touch panel (Sample output:8/E)Glasssensordummydummydummysensordummy30umSensors in 2 planeSensors in the same planeAITO300ASiNx1000AITO300APC4033umITO300APC4033.0umITO300APC4033umITO300APC4033.0umITO300APC4033umGlasssensorsensordummy30umGlasssensorsensor30um60umITO bridge BCyp

17、ress : 10k TPII v2 : 4050k (14X), 105pF (14X)Type 1st insulator2nd insulatorT% ( x, y )R 7.5X (1X)BSiNxPC40395.36%(0.315,0.322)28.8K (4.6k)B PC403PC40391.53%(0.316,0.323)23.6K (3.1k)APC403PC40391.90%(0.321,0.329)23.2K (3.1k) LCDs with Integrated Touch Panel (Current status)AUOSamsungiTSPSamsunghTSPT

18、MDWintekCypress CapSenseSynapticOnyxSensor TypeIn-cell Capacitive / Switch Sensor ExternalResistive SensorIn-cell Capacitive SensorIn-cell Photo SensorIn-cell Capacitive SensorCapacitive(in-cell or integrated on-cell)External Capacitive SensorDetection Pressure50g (touch mura)Pressure requiredPressu

19、re required0g0g0g0gLCM ThicknessLCM onlyLCM + 1 filmLCM onlyLCM onlyLCM onlyLCM onlyLCM only + external TPInput MethodFinger or stylusFinger or stylusFinger or stylusFinger or light penFinger or metal stylusFinger or metal stylusFinger or metal stylusPen WritingYESYESYESYESYESYESYESMulti-touchYESNOY

20、ESYESYESYESYESIssuesTouch MuraDual side process for CFTouch MuraTouch Mura Lighting required for sensingPatterned ITO process for CFPatterned ITO process for CFVendor focuses on TP on protection screenDemo3.6” QVGA4.8” WSVGA7.0” WVGA(SID 2007)3.5” QVGA2.8” WQVGA (SID 2007)3.5” QVGA(SID 2007)LG PRADA

21、 phoneCurrently, there are only 4 companies with multi-touch technology and patent license:1. Synaptics, 2. Cypress, 3. ALPS, 4. EMCTouch Panel Technology Comparison AUO (Current)Traditional ResistiveTraditional CapacitiveMulti-touchResistiveMulti-touchCapacitivePhotoCypress CapSenseSensor TypeIn-ce

22、ll Cap. / Switch Sensor Resistive SensorCapacitive SensorRes. Sensor ArrayCap. Sensor ArrayPhoto Sensor ArrayCap. SensorSensingPressurePressureProximityPressureProximityShadowProximityPressure50g 30g0g 30g0g0g0gLCM ThicknessLCM onlyLCM + 1 glass / filmLCM onlyLCM + 1 glass / filmLCM onlyLCM onlyLCM

23、onlyITO for TP0212101Transmittance80%80%90%80%90%80%90%Input MethodFinger or stylusFinger or stylusFinger or metal stylusFinger or stylusFinger or metal stylusFinger or light penFinger or metal stylusPen WritingYESYESYES *YESYES *YES *YES *Multi-touchYESNONOYESYESYESYES Single HandYES *YES *YESYES *

24、YESYES *YESDetectionSimple / ComplicatedSimpleComplicatedSimpleComplicatedMost ComplicatedComplicatedIssuesTouch Mura vs pressureTP cavity, film process, patterned ITO on CFpatterned ITO on CFTP cavity, film process, patterned ITO on CFpatterned ITO on CFLighting required, complex algorithmPatterned

25、 ITO for CFApplicationHTC TouchMid / Small size applicationLG PradaLarge / Mid Size applicationApple iPhoneTMDWinTek* Single hand operation can be achieved if pressure is 20g* Stylus with metallic tip required for pen writing* Light Pen required for pen writing* Single hand operation depends on soft

26、ware capabilitySource: 全球產研整理2000/10 & 2001/11, 中華液晶資訊網2002/05, 工研院IEK-IT IS計畫2006/03, 時緯科技2003/05, Hi touch2005/04, Microtouch, G touchTouch Panel Technology ComparisonTech. ItemCapacitiveAcousticOpticalResistive電磁感應式電磁感應式DigitizerSurfaceProjected(NFI)SAWAPRInfraredPhoto Sensor4W5W6W7W8WDetecti

27、onCurrentElectric fieldWave absorptionWavegenerationLight interruptionPhoto currentVoltageMagnetic fieldInput mediumFinger, conductive stylusFinger, Gloves, or conductive stylusFinger, GlovesFinger, Gloves, or Stylus (All)ObstacleFinger, GlovesFinger, Gloves, or Stylus (All)專用電磁筆特性特性(差異點差異點)反應速度快、防污

28、、防靜電及灰塵, 但容易因靜電或溼度造成誤動作, 每次使用需作校正, 成本高較不適用於小尺寸面板高精確度, 抗震, 可在戶外陽光下使用, 不怕雨、水、灰塵等怕水、油污及灰塵, 易受雜質干擾(水, 溼氣)拖曳、耐久性、穩定性佳, 防水、防塵、防油, 只需出廠校正一次, 無飄移現象, Palm rejection,價格便宜價格便宜 可靠性高, 但防水及防污較差、容易誤動作、解析度較差(精密度不高), LED發光量會衰退應用於小尺寸面板, 容易因環境光而誤動作不耐刮、壽命短、便宜改良四線式不耐刮之缺點, 表層破損時仍可使用耐刮、防電磁波、防雜訊耐刮、準確度較高特性同四線式, 耐溼度及環境溫度變化, 適合工業用途電磁筆不需接觸到面板, 也可感應到位置訊息優優 / 缺缺優點優點:1.防刮, 耐高溫2.透光度高3.手輕微碰觸即可動作缺點缺點:1.製程較複雜2.過去有專利問題, 成本較高 (APR例外)3.易受周圍環境影響 (Surface, SAW, IR)優點優點:1.可整合現行製程2.Longe