铜箔基板材料技术

1、1INTRODUCTION OF COPPER CLAD LAMINATENAN YA PLASTICS CORPORATION銅銅箔基板技箔基板技術處術處江江澤澤修修2 1、 銅箔基板生產技術 2、銅箔基板原料及品質管理 3、銅箔基板技術發展Content (內容)3 全球印刷電路市場應用領域(表一)4電腦週邊設備32.5%儀錶/ 醫療 器材8.7%通信25.4%工業控制7.8%汽車6.8%航太/ 軍事3.6%消費性電子15.3% 全球印刷電路市場應用領域(表二)5何謂銅箔基板 ? CCL ?Cu-良好導體Core-絕緣體Cu-良好導體 物性要求6電路板基板材料種類基板材料細分類紙基材銅箔基

2、板紙基材酚醛樹脂銅箔基板(非耐燃板、XPC)紙基材酚醛樹脂銅箔基板(耐燃板、FR-1)紙基材聚酯類銅箔基板紙基材環氧樹脂銅箔基板複合基板Composite銅箔基板(CEM-1)Composite銅箔基板(CEM-3)玻纖布銅箔基板玻纖布含浸耐燃氧樹脂銅箔基板(FR-4)耐熱性玻纖環氧樹脂銅箔基板(FR-5)玻纖布含浸Polyimide樹脂銅箔基板玻纖布含浸Teflon(PTFE)樹脂銅箔基板軟/硬板Polyester Base銅箔基板(軟板)Polyimide Base銅箔基板(軟板)Polyester或Polyimide銅箔基板(軟硬板)陶瓷基板氧化鋁基板、氮化鋁基板、碳化矽鋁基板低溫燒結基

3、板金屬基板金屬Base基板、Metal-Core基板熱塑性基板耐熱性熱可塑性樹脂銅箔基板PTEE類基板Aramid聚亞醯胺銅箔基板7印刷電路板之種類 分類 樹脂 補強材 應用 P FR-1/-3 酚醛樹脂 牛皮紙 電話機、電視 CEM-1/-3 環氧樹脂 棉紙/玻纖蓆 電玩、計算機 FR-4 環氧樹脂 玻纖布 主機板、通訊板 FR-5 modify 環氧樹脂 玻纖布 通訊板、substrate P.I、CYANATE、B.T 玻纖布 特殊應用 8PCB多層板結構Why ? 1.6mm Thickness is major雙面板四層板六層板厚度 載 component 插卡9CCL PRODUC

4、TION FLOW10厚度玻纖布經(緯)紗玻纖布緯(經)紗(環氧)樹脂薄基板厚度控制研討一、銅箔基板厚度組成 玻璃纖維布 樹脂+厚度決定因素1. 玻纖布體積1. 玻纖布密度(DENSITY)2. 樹脂體積2. 玻纖布穩定的重量3. 樹脂與玻纖布密實度3. 樹脂含量4. WETABILITY11二、製程控制.熱板Cushion(PAD or 牛皮紙)鋼板基板or PCB鋼板Cushion (PAD or 牛皮紙)熱板 PRESSUREHEAT FLOWHEAT FLOW1. 平坦度 熱板平坦度、平行度 護板、鋼板平坦度及厚度分佈 CUSHION材的緩衝能力2.樹脂動態黏度 昇溫速度 PRESSU

5、RECUSHION12熱壓原理13銅箔基板一般物性要求 耐(難)燃性 UL94V0、V1 耐熱性 28830” 板翹、 板扭 銅箔拉力強度 抗麻斑 蝕刻特性 VOID、 雜質 板厚 尺寸安定性 彎曲強度 Tg 吸水率 電氣性質 絕緣阻抗、Df、Df14常用玻纖布種類 布種 組成 YARN/IN 絲種類 (經 緯) 絲種類 (g M2) 7628 44 33 ECG75 ECG75 208 1506 47 46 ECE110 ECE110 164 2116 60 58 ECE225 ECD225 107 2113 60 56 ECE225 ECE450 78 2112 40 40 ECE225

6、ECE225 70 1080 60 48 ECD450 ECD450 48 106 56 56 ECD900 ECD900 24E：Electronic gradeC：Continuous fiberG.D.E：Yarn Diamter 9m、7m、5m75 = 7500 Yards/lb15Glass Composition Composition E glass S glass D glass SiO2 5357 5865 7275 B2O3 58 - 2325 Al2O3 1215 2326 - MgO 35 911 - CaO 2226 - - TiO2 Trace - - K2O+N

7、a2O 1 1 4 Fe2O3 0.5 0.5 1 Items E glass S glass D glass Specific gravity 2.54 2.49 2.16 Tensile strength, lb/in 5 105 6.65 105 3.5 105 D.k at 1MHz 6.3 4.5 3.6 D.k at 1GHz 6.1 - 4.0 D.f at 1MHz 0.001 0.002 0.005 D.f at 1GHz 0.0039 0.0068 0.0026 General Properties16Glass Cloth propertiesBase weight ：

8、2.5%L.O.I： 0.04%Pick / in： 2Tensile strength： -Treatment： SilaneVisual： -17 7628 P/P GT VS VISCOSITY18一般布開纖布19EPOXY RESIN FUNCTION20Typical Epoxy Resin (Difunction) CH2CHCH2O C OCH2CHCH2 C OCH2CH CH2 CH3 CH3 CH3 CH3 O O OH Tetrafunction Epoxy Resin CH2CHCH2O OCH2CHCH2 O O O O CH-CH CH2CHCH2O OCH2CHC

9、H2 Multifunction Epoxy Resin n C C C O O O C C O O O 21HARDER (DICYADIAMIDE) H NCNHC N NH TWO-Dimensional Difunctional Epoxy Dicyadiamide Difunctional Epoxy Tetra Multi-functional Epoxy Dicyadiamide Tetra or Multi-functional Epoxy 22Silane與玻纖表面反應機構 Condensation Hydrolysis Hydrogen Bonding RSi(OH)3 R

10、Si(OH)3 3CH3OH 3H2O R R R | | | HO-Si-O-Si-O-Si-OH | | | OH OH OH : : : OH OH OH | | | R R R | | | HO-Si-O-Si-O-Si-OH | | | O O O | | | 2RSi(OH)3O Glass Cloth Bond Formation 23銅箔生產流程圖製造流程：溶解 生箔製造 銅箔處理 裁檢 包裝24COPPER FOIL壓延銅箔電解銅箔電解銅箔剝面圖25銅箔常用規格 OZ 3/8 H 1 2 3 4 基重 g/M2 107 160 310 610 915 1220 厚度 m 12

11、 18 35 70 105 140 26銅箔SEM圖27Copper Foil propertiesBase weight： 8 %Tensile strength： - Elongation： -Peel strength： -Solder ability： -Roughness： -Thermal resitance： -Chemical resistance： -Oxidation resistance： -282930ELECTRICAL PRODUCT TREND31IC PACKAGE TECHNICAL TREND32 1986 1987 1988 1989 1990 1991

12、1992 1993 1994 1995 1996 1997 1998 1999 2000 2001 2002 2003 2004 2005 Semiconductor Growth End of Year(%) 22 23 38 8 4 8 10 29 32 42 -9 4 -8 19 37 -32 6 15 20 41 Printed Circuit Value Growth(%) 4.2 5.2 9.5 1.4 1.4 -6.8 -3.5 14.2 11.5 16 12 9.5 3.7 9.2 12.5 -15.3 4.1 11.9 10.8 10.1 50% 40% 30% 20% 10

13、% 0% -10% -20% -30% -40% -50% 20% 15% 10% 5% 0% -5% -10% -15% -20% Year on Year Semiconductor Growth Year on Year World Rigid PCB Growth Printed Circuit Value Growth Semiconductor Growth End of Year WORLD PRINTED CIRCUIT FORECAST33印刷電路板市場應用及物性要求 IC 載板 消費性電子15%航太/軍事4%汽車7%工業控制8%通信25%儀錶/醫療器材9%電腦週邊設備32%

14、一般要求 絕緣性高 信賴性高 特殊板材 特殊板材 絕緣性 輕薄短小 成本考量 綠色材料 信賴性高 速度快 輕薄短小 遊戲 主機板 伺服器 T.g 高 耐熱性佳 34銅箔基板技術發展 印刷電路板 技術趨勢 快速訊號輸送 T.g 高 耐熱性佳 絕緣性佳 低膨脹率 低吸水率 阻抗控制板 低介質常數 低消耗因數 超高層 多層板. 增層製程 介質厚度均勻材料 低介質常數. 低消耗因數基板 B.T 基板 FR-5基板80 HIGH CTI 無鹵素要求 Film Type 超薄銅箔使用 2mil 基板 RCC 低膨脹率基板 輕. 薄 短. 小 信賴性 提高 超細線路 環境保護材料 35ItemsMax. T

15、echnical PerformanceMass productionLine width/PitchInner layerFor 1oz3mil /3mil56mil / 56milFor 0.5oz2mil / 2mil45mil / 45milOuter layerPositive method (%)4mil / 4mil5mil / 5milNegative method (%)4mil / 4mil6mil / 6milMin hole diameter before platingLaser drilling4mil59milMechanical drilling9.8mil13

16、16milAspect Ratio6:14:1SMD pad width/pitch810mil / 810mil1120mil / 1120milLayers of MLBOne step lamination14Layer68 LayerStep by step lamination1618Layer68 LayerMin. thickness of inner core2mil4milPanel size20“24”20“24”Registration for solder maskRegistration for layer to layer2mil3mil34mil34milPCB

17、PROCESS CAPIBILITY3600.20.40.60.811.21.41.6010 20 30 40 50 60 70 80 90 100HOURSWater absorption (%)NP180NP200NP140HL832PCT(120,2atm) Water Absorption3701234567891001002003004005006007008009001000HOURSPeel Strength (lb/in)NP-140NP-180NP-200HL832copper thickness 18mPeel strength in long term thermal a

18、ging (177)Thermal Performance38Difference in Z-axis C.T.E ( 10-6) Between Halogen-Free FR-4 and Standard FR-4 Thermal Performance 39Expansion, PPM/FR-4NPGX-CTEY-CTE1518151811141114Z-CTE, Before TgZ-CTE, After Tg6730130175Thermal Expansion Properties Thermal Performance4002468101201002003004005006007

19、00800HRPeel strength (lb/in)FR4H.F.Peel Strength in Long-Term Aging(177)41 Fluoro Laminate 13 17 16 15 14 PPE Cyanate ester/EPoxy BT Polyimide Epoxy 3.0 4.44.7 4.2 4.0 3.9 3.5 121 112 106 105 102100 Signal Propagation Speed (cm/ns) Relative Speed Velocity / Dk Relative Signal Propagation Speed of Va

20、rious MaterialsV= c / (Dk)1/2 (cm/ns)42 100MHz 1GHz 10GHz 100GHZ 個人電腦 166600MHz Intel Pentium 大哥大() 900MHz 大哥大() 1.8 MHz 個人通信 (PCS) IMT-200 大哥大() 2GHz 1.8 MHz 衛星電視 4GHz 呼叫器 24GHz 全球定位 系統(GPS) 衛星電視 (Japan) 超高頻 SHF Microwave TV 28GHz 航空防撞系統 Collision Avoidance 6090GHz 高頻基板之市場應用範圍43A: Cross section of

21、IVHB: SEM of MicroviaC: Cross section of IVH & THCross Section44Hole to hole Hole to patternLine to lineLayer to layerCAF= Conductive Anodic FilamentWhats CAF451.Cu Cu2+ +2e- (Copper dissolved at anode ) H2O H+OH- 2 H+ +2e- H2 2.Cu2+2OH-Cu(OH)2 (copper move from anode to cathode) Cu(OH)2 CuO+H2O

22、3.Cu2+ +2e-Cu (Copper deposited at cathode) CuO+H2OCu(OH)2Cu2+2OH- CAF Mechanism46Hole to Hole Failure CAF Cross section 47CAF EDS AnalysisCopper was detected on the glass fibers-resin interface48 TEST1 TEST2 TEST3 Layers Double side Double side 8 layers Board thickness 1.6mm 1.6mm 1.6mm Hole diamet

23、er 0.7mm 1.4mm 0.35mm Pattern Hole wall to Hole wall distance 0.4mm,0.5mm 0.6mm 1.2mm 0.35mm,0.45mm Temperature 85 85 85 Relative humidity 85%RH 85%RH 85%RH Applied voltage 50VDC 50VDC 50VDC Measure voltage 500VDC 50VDC 50VDC Test condition Measure frequency off line test on line test on line test T

24、otal time 2000hours 2000hours 240hours Judgment standard Bellow 108ohms NG Bellow 106ohms NG Bellow 106ohms NG Vari ous t est pat t ern and condi t i on CAF Test Design491.E+071.E+081.E+091.E+101.E+111.E+121.E+131.E+14025050075010001250150017502000Testing Time(hr)Insulation Resistancehole to hole wall Distance 0.6mm)hole to hole wall Distance 0.5mm)hole to hole wall Distance 0.4mm)hole to hole wall Distance 0.3mm)NO1:Before improvement1.E+071.E+081.E+091.E+101.E+111.E+121.E+131.E+14025050075010001250150017502000Testi