印制电路板设计要求SMD元器件封装库尺寸要求中兴通讯的PCB设计规范

1、Q/ZX深圳市中兴通讯股份有限公司企业标准(技术标准)Q/ZX 04.100.5 - 2001 - 2001 印制电路板设计规范SMD元器件封装库尺寸要求2001-12-11 发布 2002-01-01实施深圳市中兴通讯股份有限公司 发 布Q/ZX - 2001目 次1范围12引用标准13术语14使用说明25焊盘图形25.1SMD：表面贴装方焊盘图形尺寸25.2SMDC：表面贴装圆焊盘图形尺寸35.3SMDF表面贴装手指焊盘图形尺寸45.4THC通孔圆焊盘图形尺寸55.5THS通孔方焊盘图形尺寸65.6THR通孔矩形焊盘图形尺寸76SMD元器件及焊盘图形尺寸86.1SMD分立元件8SMD电阻8

2、6.1.1.1 SMD电阻元件尺寸8SMD电容10SMD电感12SMD钽电容14MELF（金属电极无引线端面元件）16SMD排阻18SOT 2320SOT 8922SOD 12324SOT 14326SOT 22328TO 252/TO 26830SMD220元件（对应物料代码为15100085等）32SMA元件(对应物料代码为15100016a)34SOT-323元件(对应物料代码为15100001)36SOT-363元件(对应物料代码为15100001)386.2两侧翼形引脚元件40SOICSmall Outline Integrated Circuits:小外形集成电路40SSOICSm

3、all Outline Integrated Circuits:小外形集成电路42SOPSmall Outline Package Integrated Circuits:小外形封装集成电路44TSOPThin Small Outline Package:薄小外形封装46CFPCeramic Flat Packs:陶瓷扁平封装486.3两侧“J”形引脚元件SOJ50SOJ 元件尺寸50SOJ的焊盘尺寸516.4四边有翼形引脚的元件54PQFP(Plastic Quad Flat Pack)54SQFP(Shrink Quad Flat Pack),方形56SQFP矩形64CQFPCeramic

4、 Quad Flat Pack686.5四边有“J”形引脚的元件70方形PLCCPlastic leaded chip carriers70PLCC，矩形72LCC Leadless ceramic chip carriers746.6改进型双列引脚元件76DIPModified Dual-In-Line components766.7BGA78PBGAPlastic Ball Grid Array,方形781.27mm R-PBGA92前 言 本标准规定了印制电路板设计过程中，元器件封装库焊盘图形及SMD焊盘图形尺寸要求。 本标准由深圳市中兴通讯股份有限公司康讯工艺部提出，技术中心技术部归口

5、。 本标准起草部门：康讯工艺部。 本标准起草人：贾变芬，贾忠中，杨清亮，袁红波。 本标准于2001年12月首次发布。Q/ZX - 2001深圳市中兴通讯股份有限公司企业标准（设计标准）印制电路板设计规范元器件封装库尺寸要求 Q/ZX 04.100.5 20011 范围本标准规定了印制电路板（以下简称PCB）设计所使用的元器件封装库中的焊盘图形及SMD焊盘图形尺寸要求。本标准适用于深圳市中兴通讯股份有限公司。2 引用标准下面引用的标准，以网上发布的最新标准为有效版本。IPC-SM-782 Surface Mount Design and Land Pattern Standard。Q/ZX 04

6、.100.2-2001 印制电路板设计规范工艺性要求。Q/ZX 04.100.4-2001 印制电路板设计规范元器件封装库基本要求。3 术语SMD: Surface Mount Devices/表面贴装元件。 RA：Resistor Arrays/排阻。MELF：Metal electrode face components/金属电极无引线端面元件.SOT：Small outline transistor/小外形晶体管。SOD：Small outline diode/小外形二极管。SOIC：Small outline Integrated Circuits/小外形集成电路.SSOIC: Shr

7、ink Small Outline Integrated Circuits/缩小外形集成电路.SOP: Small Outline Package Integrated Circuits/小外形封装集成电路.SSOP: Shrink Small Outline Package /缩小外形封装集成电路.TSOP: Thin Small Outline Package/薄小外形封装.TSSOP: Thin Shrink Small Outline Package/收缩薄小外形封装.CFP: Ceramic Flat Packs/陶瓷扁平封装.SOJ:Small outline Integrated

8、 Circuits with J Leads/ “J” 形引脚小外形集成电路.PQFP：Plastic Quad Flat Pack/塑料方形扁平封装。SQFP：Shrink Quad Flat Pack/缩小方形扁平封装。CQFP：Ceramic Quad Flat Pack/陶瓷方形扁平封装。PLCC：Plastic leaded chip carriers/塑料封装有引线芯片载体。LCC ：Leadless ceramic chip carriers/无引线陶瓷芯片载体。 DIP：Dual-In-Line components/双列引脚元件。 PBGA：Plastic Ball Grid

9、 Array /塑封球栅阵列器件。4 使用说明4.10 表格中的“min”表示最小尺寸； “max”最大尺寸； “ref”表示参考尺寸； “basic”表示基本尺寸；封装名称中的 “mm”表示公制型号； in表示英制型号。4.20 区域网格表示图形占用的网格数，表中给出为网格的数量，换算成 mm 时，应乘以 0.5 mm。5 焊盘图形5.10 SMD：表面贴装方焊盘图形尺寸表面贴装方焊盘图形尺寸因应符合图1的要求。见图1：焊盘名称X（mm）Y(mm)焊盘名称X（mm）Y(mm)焊盘名称X（mm）Y(mm)SMD0r17X1r600.171.60SMD0r80X3r400.803.40SMD2r

10、20X2r002.202.00SMD0r25X1r600.251.60SMD1r00X0r901.000.90SMD2r20X2r602.202.60SMD0r30X1r600.281.80SMD1r00X1r001.001.00SMD2r40X2r002.402.00SMD0r35X1r800.351.80SMD1r00X1r401.001.40SMD2r40X2r402.402.40SMD0r35X2r600.352.60SMD1r00X1r601.001.60SMD2r40X2r602.402.60SMD0r40X1r600.401.60SMD1r00X3r401.003.40SMD2r

11、60X1r452.601.45SMD0r40X1r800.401.80SMD1r20X1r401.201.40SMD2r60X1r502.601.50SMD0r40X2r200.402.20SMD1r20X2r001.202.00SMD2r70X1r602.701.60SMD0r50X1r800.501.80SMD1r20X2r201.202.20SMD2r70X1r802.701.80SMD0r50X2r000.502.00SMD1r30X1r001.301.00SMD2r80X1r402.801.40SMD0r50X2r200.502.20SMD1r40X2r201.402.20SMD3r

12、20X1r803.201.80SMD0r60X2r000.602.00SMD1r40X2r401.402.40SMD3r40X1r903.401.90SMD0r60X2r200.602.20SMD1r40X3r401.403.40SMD3r60X1r803.601.80SMD0r65X2r200.652.20SMD1r50X1r301.501.30SMD3r60X2r203.602.20SMD0r65X2r400.652.40SMD1r60X1r201.601.20SMD4r00X1r804.001.80SMD0r65X2r600.652.60SMD1r60X1r301.601.30SMD5r

13、40X6r205.406.20SMD0r70X0r600.700.60SMD1r80X1r401.801.40SMD4r00X1r804.001.80SMD0r80X1r400.801.40SMD1r80X1r601.801.60SMD6r80X1r906.801.90SMD0r80X1r600.801.60SMD2r00X1r602.001.60SMD6r80X9r606.809.60SMD0r80X2r600.802.60SMD2r00X1r802.001.80SMD13r60X13r4013.6013.40图1 表面贴装方焊盘图形尺寸5.20 SMDC：表面贴装圆焊盘图形尺寸表面贴装圆焊

14、盘图形尺寸应符合图2要求。见图2：焊盘名称C（mm）焊盘名称C（mm）SMDC0r350.35SMDC0r900.90SMDC0r400.40SMDC1r001.00SMDC0r500.50SMDC2r602.60SMDC0r600.60图2 表面贴装圆焊盘图形尺寸5.30 SMDF表面贴装手指焊盘图形尺寸表面贴装手指焊盘图形尺寸应符合图3要求。见图3：焊盘名称X（mm）Y(mm)焊盘名称X（mm）Y(mm)SMDF1r00X2r501.002.50SMDF1r80X2r501.802.50SMDF1r00X2r801.002.80SMDF1r80X2r301.802.30图3 表面贴装手指焊

15、盘图形尺寸5.40 THC通孔圆焊盘图形尺寸通孔圆焊盘图形尺寸应符合图4要求。见图4：焊盘名称C（mm/mil）D(mm/mil)焊盘名称C（mm/mil）D(mm/mil)THC0r50D0r200.45/180.20/8THC1r30D0r801.30/510.80/32THC0r60D0r300.60/240.30/12THC1r40D0r901.40/550.90/36THC0r70D0r400.70/280.40/16THC1r50D1r001.50/601.00/40THC0r90D0r500.80/360.50/20THC2r60D1r302.60/1021.30/51THC1r

16、10D0r601.10/440.60/24THC3r20D1r603.20/1261.60/63THC1r20D0r701.20/480.70/28THC4r00D2r004.00/1582.00/79THC1r20D0r701.23/490.73/29THC0r00D3r000/03.00/118 图4 通孔圆焊盘图形尺寸5.50 THS通孔方焊盘图形尺寸 通孔方焊盘图形尺寸应符合图5要求。见图5：焊盘名称S（mm/mil）D(mm/mil)焊盘名称S（mm/mil）D(mm/mil)THS1R10D0R601.10/440.60/24THS1r50D1r001.50/601.00/40TH

17、S1r20D0r701.20/480.70/28THS2r60D1r302.60/1021.30/51THS1r30D0r801.30/510.80/32THS3r20D1r603.20/1261.60/63THS1r40D0r901.40/550.90/36THS4r00D2r004.00/1582.00/79图5 通孔方焊盘图形尺寸5.60 THR通孔矩形焊盘图形尺寸通孔矩形焊盘图形尺寸应符合图6要求。见图6：焊盘名称X（mm/mil）Y（mm/mil）D(mm/mil)THR1r20X1r40D0r701.20/481.40/550.70/28 图6 通孔矩形焊盘图形尺寸6 SMD元器件

18、及焊盘图形尺寸6.10 SMD分立元件6.1.1 SMD电阻6.1.1.1 SMD电阻元件尺寸 SMD电阻元件尺寸应符合图7的规定。见图7：封装名称L(mm)S(mm)W(mm)T(mm)H(mm)minmaxminmaxminmaxminmaxmax0402R1.001.100.400.700.480.600.100.300.400603R1.501.700.701.110.700.950.150.400.600805R1.852.150.551.321.101.400.150.650.651206R3.053.351.552.321.451.750.250.750.711210R3.053

19、.351.552.322.342.640.250.750.712010R4.855.153.153.922.352.650.350.850.712512R6.156.454.455.223.053.350.350.850.71图7 SMD电阻元件尺寸6.1.1.2 SMD电阻的焊盘尺寸 SMD电阻的焊盘尺寸应符合图8的规定。见图8：封装名称Z(mm)G(mm)X(mm)Y(mm)C(mm)区域网格（网格单元号码）refref0402R2.200.400.700.901.302×40603R2.800.601.001.101.704×60603R-W3.200.800.701

20、.202.004×60805R3.200.601.501.301.904×80805R-W3.600.801.001.402.204×81206R4.401.201.801.602.804×101206R-W4.801.201.201.803.004×101210R4.401.202.701.602.806×102010R6.202.602.701.804.406×142512R7.403.803.201.805.608×16注：大于0603R的元件在波峰焊时，Y-尺寸向外侧增加0.2mm，X-尺寸减小30% 。封

21、装名称加后缀“-W”。图8 SMD电阻的焊盘尺寸6.1.2 SMD电容6.1.2.1 SMD电容元件尺寸 SMD电容元件尺寸应符合图9的规定。见图9：封装名称L(mm)S(mm)W(mm)T(mm)H(mm)Minmaxminmaxminmaxminmaxmax0402C0.901.100.300.650.400.600.100.300.600504C1.021.320.260.720.771.270.130.381.020603C1.451.750.450.970.650.950.200.500.850805C1.802.200.301.111.051.450.250.751.101206C

22、3.003.401.502.311.401.800.250.751.351210C3.003.401.502.312.302.700.250.751.351812C4.204.802.303.463.003.400.250.951.351825C4.204.802.303.466.006.800.250.951.10图9 SMD电容元件尺寸6.1.2.2 SMD电容焊盘尺寸 SMD电容焊盘尺寸应符合图10的规定。见图10：封装名称Z(mm)G(mm)X(mm)Y(mm)C(mm)区域网格（网格单元号码）refref0402C1.600.400.700.601.002×40504C2.

23、000.401.300.801.204×60603C2.800.601.001.101.704×60603C-W3.200.800.701.202.004×60805C3.200.601.501.301.904×80805C-W3.600.801.001.402.204×81206C4.401.201.801.602.804×101206C-W4.801.201.201.803.004×101210C4.401.202.701.602.806×101812C5.802.003.401.903.908×12

24、1825C5.802.006.801.903.9014×12注：大于0603C的元件在波峰焊时，Y-尺寸向外侧增加0.2mm，X-尺寸减小30% 。封装名称加后缀“-W”。 图10 SMD电容焊盘尺寸6.1.3 SMD电感6.1.3.1 SMD电感元件尺寸 SMD电感元件尺寸应符合图11的规定。见图11：封装名称L(mm)S(mm)W1(mm)W2(mm)T(mm)H1(mm)H2(mm)minMaxminmaxminmaxminmaxminmaxmaxmax2012L-C1.702.301.101.760.601.200.100.301.203216L-C2.903.501.902

25、.631.301.900.200.501.904516L-C4.204.802.603.530.601.200.300.801.90-2825L-P2.202.800.901.621.952.112.102.540.370.652.290.073225L-P2.903.500.901.831.401.80-0.501.002.000.504532L-P4.204.802.203.133.003.40-0.501.002.800.505038L-P4.354.952.813.512.462.623.413.810.510.773.800.763225-3230L-M3.003.401.602.1

26、81.802.002.302.700.400.702.400.514035L-M3.814.320.811.601.201.502.923.181.201.502.671.274532L-M4.204.802.303.152.002.203.003.400.650.953.400.505650L-M5.305.503.304.323.804.204.705.300.501.005.801.008530L-M8.258.765.256.041.201.502.923.181.201.502.671.27注: C为Chip的简写,P为Prec.w/w ( Precision wire wound

27、) 的简写,M为Molded的简写。图11 SMD电感元件尺寸6.1.3.2 SMD电感焊盘尺寸SMD电感焊盘尺寸应符合图12的规定。见图12：封装名称 Z(mm)G(mm)X(mm)C(mm)Y(mm)区域网格（网格单元号码）refref2012L-C3.001.001.002.001.004×83216L-C4.201.801.603.001.206×104516L-C5.802.601.004.201.604×122825L-P3.801.002.402.401.406×103225L-P4.601.002.002.801.806×104

28、532L-P5.802.203.604.001.808×145038L-P5.803.002.804.401.408×143225-3230L-M4.401.202.202.801.606×104035L-M5.401.001.403.202.208×124532L-M5.801.802.403.802.008×145650L-M6.803.204.005.001.8012×168530L-M9.805.001.407.402.408×22注：1后缀“-C”的元件在波峰焊时，Y-尺寸向外侧增加0.2mm，X-尺寸减小30%

29、。封装名称加后缀“-W”。 2 后缀“-P”和“-M”的元件在波峰焊时，Y-尺寸向外侧增加0.2mm，X-尺寸不变，封装名称加后缀“-W”。 图12 SMD电感焊盘尺寸6.1.4 SMD钽电容6.1.4.1 SMD钽电容元件尺寸 SMD钽电容元件尺寸应符合图13的规定。见图13：封装名称L(mm)S(mm)W1(mm)W2(mm)T(mm)H1(mm)H2(mm)minmaxminmaxminmaxminmaxminmaxmaxmax3216T3.003.400.801.741.171.211.401.800.501.100.701.803528T3.303.701.102.042.192.2

30、12.603.000.501.100.702.106032T5.706.302.503.542.192.212.903.501.001.601.002.807343T7.007.603.804.842.392.914.004.601.001.601.003.10图13 SMD钽电容元件尺寸6.1.4.2 SMD钽电容焊盘尺寸SMD钽电容的焊盘尺寸应符合图14的规定。见图14： 封装名称Z(mm)G(mm)X(mm)Y(mm)C(mm)区域网格（网格单元号码）refref3216T4.800.801.202.002.806×123528T5.001.002.202.003.008

31、15;126032T7.602.402.202.605.008×187343T9.003.803.002.606.4010×20注：元件在波峰焊时，Y尺寸向外侧增加0.2mm，X尺寸不变，封装名称加后缀“-W”。图14 SMD钽电容焊盘尺寸6.1.5 MELF（金属电极无引线端面元件）6.1.5.1 MELF元件尺寸 MELF元件尺寸应符合图15的规定。见图15：mm in封装名称L(mm)S(mm)W(mm)T(mm)元件类型MinMaxminmaxminmaxminmaxSOD80MLL343.303.702.202.651.601.700.410.55二极管SOD87

32、MLL414.805.203.804.252.442.540.360.50二极管2012M0805M1.902.101.161.441.351.450.230.370.10mW电阻3216M1206M3.003.401.862.311.751.850.430.570.25mW电阻3516M1406M3.303.702.162.611.551.650.430.570.12W电阻5923M2309M5.706.104.364.812.402.500.530.670.25W电阻图15 MELF元件尺寸6.1.5.2 MELF的焊盘尺寸 MELF的焊盘尺寸应符合图16的规定。见图16：mm in封装名

33、称Z(mm)G(mm)X(mm)Y(mm)C(mm)AB区域网格（网格单元号码）refrefSOD80MLL344.802.001.801.403.400.500.506×12SOD87MLL416.303.402.601.454.850.500.506×142012M0805M3.200.601.601.301.900.500.354×83216M1206M4.401.202.001.602.800.500.556×103516M1406M4.802.001.801.403.400.500.556×125923M2309M7.204.202.

34、601.505.700.500.656×18注：元件在波峰焊时，Y尺寸向外侧增加0.2mm，X尺寸不变，封装名称加后缀“-W”。 图16 MELF焊盘尺寸6.1.6 SMD排阻6.1.6.1 SMD排阻元件尺寸 SMD排阻元件尺寸应符合图17的规定。见图17：封装名称L(mm)W(mm)T(mm)A(mm)B(mm)P(mm)C(mm)1206RA3.2±0.101.6±0.150.5±0.100.5±0.150.3±0.150.8±0.10.3±0.15图17 SMD排阻元件尺寸 6. SMD排阻焊盘尺寸 SMD

35、排阻焊盘尺寸应符合图18的规定。见图18：封装名称区域网格（网格单元号码）1206RA8x6 图18 SMD排阻焊盘尺寸6.1.7 SOT 236.1.7.1 元件尺寸 SOT 23的尺寸应符合图19的规定。见图19： 封装名称L(mm)S(mm)W(mm)T(mm)H(mm)P(mm)MinmaxminmaxminmaxminmaxmaxnomSOT 232.302.601.101.470.360.460.450.601.100.95图19 SOT 23的元件尺寸6.1.7.2 SOT 23的焊盘尺寸SOT 23的焊盘尺寸应符合图20的规定。见图20： 封装名称Z(mm)G(mm)X(mm)

36、Y(mm)C(mm)E(mm)区域网格（网格单元号码）refRefrefSOT 23(回流焊)3.600.801.001.402.200.958×8注:如果采用波峰焊工艺, “Y”尺寸外延0.2 mm. 图20 SOT 23焊盘尺寸6.1.8 SOT 896.1.8.1 元件尺寸 SOT 89的尺寸应符合图21的规定。见图21：封装名称L(mm)T(mm)W1(mm)W2(mm)W3(mm)K(mm)H(mm)P(mm)minmaxminmaxminmaxminmaxminmaxminmaxmaxbasicSOT 893.944.250.891.200.360.480.440.561

37、.621.832.602.851.601.50图21 SOT 89的元件尺寸6.1.8.2 SOT 89的焊盘尺寸SOT 89的焊盘尺寸应符合图22的规定。见图22：封装名称Z(mm)Y1(mm)X1(mm) X2(mm) X3(mm)Y2(mm)Y3(mm)E(mm)区域网格（网格单元号码）MinmaxminmaxrefRefbasicSOT 895.401.400.800.801.001.802.002.404.901.5012×10 图22 SOT 89焊盘尺寸6.1.9 SOD 1236.1.9.1 元件尺寸 SOD 123的尺寸应符合图23的规定。见图23：封装名称L(mm

38、)S(mm)W1(mm)W2(mm)T(mm)H(mm)minMaxMinmaxminmaxminmaxMinmaxmaxSOD 1233.553.852.352.930.450.651.401.700.250.601.35SMB5.215.592.173.311.962.213.303.940.761.522.41图23 SOD 123的元件尺寸6.1.9.2 SOD 123的焊盘尺寸SOD 123的焊盘尺寸应符合图24的规定。见图24：封装名称Z(mm)G(mm)X(mm) Y(mm) C(mm)区域网格（网格单元号码）refrefSOD 1235.001.800.801.603.404&

39、#215;12SMB6.802.002.402.404.408×16 图24 SOD 123焊盘尺寸6.1.10 SOT 1436.1.10.1 元件尺寸 SOT 143的尺寸应符合图25的规定。见图25：封装名称 L(mm) S(mm) W1(mm) W2(mm) T(mm)P1(mm)P2(mm)H(mm)MinMaxminmaxMinmaxminmaxMinmaxbasicbasicMaxSOT 1432.102.641.001.690.370.460.760.890.250.551.921.721.20图25 SOT 143的元件尺寸6.1.10.2 SOT 143的焊盘尺寸

40、SOT 143的焊盘尺寸应符合图26的规定。见图26：封装名称Z(mm)G(mm)X1(mm) X2(mm) C(mm)E1(mm)E2(mm)Y(mm)区域网格（网格单元号码）MinmaxrefbasicBasicrefSOT 1433.600.801.001.001.202.201.901.701.408×8 图26 SOT 143焊盘尺寸6.1.11 SOT 2236.1.11.1 元件尺寸 SOT 223的尺寸应符合图27的规定。见图27：封装名称L(mm)S(mm)W1(mm)W2(mm)T(mm)H(mm)P1(mm)P2(mm)MinMaxminmaxMinmaxmin

41、maxMinmaxmaxbasicBasicSOT 2236.707.304.104.920.600.882.903.180.901.301.802.304.60图27 SOT 223的元件尺寸6.1.11.2 SOT 223的焊盘尺寸SOT 223的焊盘尺寸应符合图28的规定。见图28：封装名称Z(mm)G(mm)X1(mm) X2(mm) Y(mm)C(mm)E1(mm)E2(mm)区域网格（网格单元号码）Minmaxref refbasicbasicSOT 2238.404.001.203.403.602.206.202.304.6018×14 图28 SOT 223焊盘尺寸6

42、.1.12 TO 252/TO 2686.1.12.1 元件尺寸 TO 252的尺寸应符合图29的规定。见图29：封装名称 L(mm) W1(mm) W2(mm) T1(mm) T2(mm)P1(mm)P2(mm)H (mm)MinMaxminMaxMinmaxminmaxMinmaxbasicbasicmaxTS-003a9.3210.410.640.914.355.350.510.804.005.502.284.572.38TS-005b14.6015.880.510.916.226.862.292.798.009.002.545.084.83TO 26818.7019.101.151.4

43、513.3013.602.402.7012.4012.705.4510.905.10注a : 以前为TO 252。注b ：以前为 TO 263。图29 TO 252的元件尺寸6.1.12.2 TO 252的焊盘尺寸TO 252的焊盘尺寸应符合图30的规定。见图30：封装名称Z(mm)Y1(mm)Y2(mm)X1(mm) X2(mm)C(mm)区域网格（网格单元号码） refTS-003*11.201.606.201.005.407.3024×16TS-005*16.603.409.601.006.8010.1036×24TO 26819.803.4013.401.4013.6011.4042×34 图30 TO 252焊盘尺寸6.1.13 SMD220元件（对应物料代码为15100085等）6.1.13.1 SMD220元件尺寸 元件尺寸应符合图31的规定。见图31：封装名称图31 SMD-220元件尺寸 6.1.13.2 SMD-220 焊盘尺寸 焊盘尺寸应符合图32的规定。见图32：封装名称区域网格（网格单元号码）SMD-22024x36 图32 SMD-220焊盘尺寸6.1.14 SMA元件(对应物料代码