六西格玛案例R2_Measure_v2008a

1、V2008 R2 - 1Measure OutlineIdentify Input, Process and Output IndicatorsFishboneCE metricsCollect DataData Collection Plan and Operation DefinitionMSAMSA PlanMSA ConclusionProcess CapabilityDPPM, Cpk, Yield, Z valueID IPO IndicatorsCollect DataMSAProcess CapabilityV2008 R2 - 2Fishbone Diagram ID IPO

2、 IndicatorsCollect DataMSAProcess CapabilityDetermine the major categories (Input &/or Process Indicators) of the effect (CTQ/CTP)CTQ / CTPWhy Gap?Manpower(Generic Category)Machine(Generic Category)Material(Generic Category)Method(Generic Category)Measurement(Generic Category)Input IndicatorsPro

3、cessIndicatorsProcessIndicatorsProcessIndicatorsInput IndicatorsV2008 R2 - 3Cause & Effect Matrix ID IPO IndicatorsCollect DataMSAProcess CapabilityScale: 0=None, 1=Low, 3=Moderate, 9=StrongX4X5X6V2008 R2 - 4ID IPO IndicatorsCollect DataMSAProcess CapabilityOperational definition Operational def

4、initionX20.X4X3X2X1Source of XsInput/ Process Indicator (X)Sl. No.Y4Y3Y2Fishbone or CE MatrixY1Source of Ys Output Indicator (Y)Sl. No.Remarks:While writing operational definition keep in mind the data to be collected for each Y & X. Data Collection Plan-1 Fishbone or CE Matrix Key Indicator Ope

5、ration Definition & SummaryV2008 R2 - 5Data Collection Plan -2ID IPO IndicatorsCollect DataMSAProcess CapabilityRemarks:Other data refers to additional information from stratification perspective.Performance measure (Y)Operational definitionData source and locationSample sizeWho will collect the

6、 dataWhen will data be collectedHow will data be collectedOther data that should be collected at the same timeY1 客戶退貨率#退貨Qty/ /#出貨Qty品保1QA/ Andy Chenby Lot1.Customer complainX1-X15MSAProcess / Input (X)Operational definitionData source and locationSample sizeWho will collect the dataWhen will data b

7、e collectedHow will data be collectedOther data that should be collected at the same timeV2008 R2 - 6MSA Plan (for all Ys)ID IPO IndicatorsCollect DataMSAProcess Capability外觀外觀離散型離散型特性Y1:污點Y2:刮傷Y3:印刷位置測試人員3 person3 person3 person測試設備目視目視目視進行方法編號130給3位進行 判定，循環2次 編號130給3位進行 判定，循環2次 編號130給3位進行 判定，循環2次

8、判定方法共取得180個資料, 依Gage R&R計算之數值判定 共取得180個資料, 依Gage R&R計算之數值判定 共取得180個資料, 依Gage R&R計算之數值判定 Sampling10 good, 10 NG, 10 grey10 good, 10 NG, 10 grey10 good, 10 NG, 10 greyMesurement Methods卡尺厚薄規溫度計CCD投影機Calibration PlanGRR PlanV2008 R2 - 7MSA Plans (for Key Xs)ID IPO IndicatorsCollect DataMSAP

9、rocess Capability數據型態數據型態離散型離散型特性焊錫品質錫膏厚度偏移量檢測測試人員3 persons2 SPI2 AOI測試設備目視CyberOptics / SE300Orbotech與 x 相關性x2x5x1 , x8x3進行方法利用3片報廢板製作標準件, 每件標準板上, 打上30顆元件, 排定為10 顆OK之焊錫結果, 20 顆NG之焊錫結果. 編號130, 隨機抽取1 片標準板給3位目檢人員進行判定，循環3次從BS1線印刷10片 MB, 每片MB擷取固定一點進行量測,Load andUn-load循環3次後, 再交由另一台SPI進行量測.定義預量測的位置, 進入AOI

10、 機台進行偏移測量三次判定方法共取得270個資料, 依Gage R&R計算之數值kappa指數判定(=90%)共取得60個資料, 依Gage R&R 計算之數值 % R&R判定共取得60個資料, 依Gage R&R計算之數值 % R&R判定備註標準件缺點類別 : 短路 *3 , 空焊 *3 , 損件*2 , 缺件 *2 , 偏移 *4 , 墓碑 * 3, 錫尖* 2, 錫過多* 1量測系統分析進行計畫量測系統分析進行計畫連續型連續型V2008 R2 - 8ID IPO IndicatorsCollect DataMSAProcess Capability

11、 % % ConConP/TVP/TV(SV/Proc)(SV/Proc)P/SVP/SV(%SV)(%SV)P/TP/T(SV/Toler(SV/Toler) )Distinct Distinct CategoriesCategoriesAcceptable 1% 1% 10% 10% 10% 10% 10% 5 5Maybe Accept1 9%1 9%10 10 30%30%10 10 30%30%10 10 30%30%3 - 43 - 4Not Acceptable 9% 9% 30% 30% 30% 30% 30% 30% 3 0)1OK0.857730.1290996.6440.

12、0000 空銲0.498270.1290993.85960.0001 站立0.944340.1290997.31480.0000 短路1.0000 0.1290997.7460.0000 錫少0.384740.1290992.98020.0014 Overall0.748070.06534911.44730.0000 2OK0.944340.1290997.31480.0000 空銲0.666370.1290995.16160.0000 站立10.1290997.7460.0000 短路10.1290997.7460.0000 錫少0.551670.1290994.27320.0000 Ove

13、rall0.833040.06471912.87170.0000 3OK0.90180.1290996.98530.0000 空銲0.591440.1290994.58130.0000 站立0.944340.1290997.31480.0000 短路10.1290997.7460.0000 錫少0.327310.1290992.53530.0056 Overall0.769330.065211.79960.0000 Action PlanOwnerDue dateAssign SMT inspectors to attend the IPC-A-610C training course and

14、 get the certification.SMT/Ray7/ESMT inspectors must be certified by QA every 3 months to ensure their capability. SMT/RayFrom now on1. Reliability of SMT inspector need to be improved.2. The detection sensitivity of solder open and solder insufficiency need to clarify and train the SMT inspectors.

15、Remark: Agreement Analysis, 算出Kappa 值要大於90%,若Kappa USLPPM USLPPM USLPPM LBPpkZ.LSLZ.USLZ.BenchCpmCpkZ.LSLZ.USLZ.BenchStDev (Overall)StDev (Within)Sample NMeanLower BoundTargetUSL428227.93428227.93 *381383.00381383.00 *400000.00400000.00 0.000.06 *0.180.18 *0.10 *0.300.303.941682.36210107.2870.0006.0

16、008.000Exp. Overall PerformanceExp. Within PerformanceObserved PerformanceOverall CapabilityPotential (Within) CapabilityProcess DataWithinOverallObservationIndividual Value9181716151413121111706050403020100_X=34.05UCL=66.59LCL=1.52I Chart of Avg No. of orders per m oCurrent Baseline Performance:Mea

17、n: 7.28 Standard Deviation: s =2.36 Distribution Shap：Too WidlyConclusion: variance is big and shift mean, both of Mean and variance need to be improvedV2008 R2 - 11Baseline Y2 (Discrete Data) ID IPO IndicatorsCollect DataMSAProcess CapabilityCurrent Baseline Performance: Yield Rate 80%V2008 R2 - 12Baseline SummaryID IPO IndicatorsCollect DataMSAProcess CapabilityBaseline Summarization (Ys)Continuous (Y)Output indicatorAverageStandard deviation CpCpkSigma Level Y1Y2Y3Discrete (Y)Output indicatorNo. of unitsNo. of opportunities per unit No. of defectsDPMOSigma Level Y1Y2Y3Baselin