下载本文档
版权说明:本文档由用户提供并上传,收益归属内容提供方,若内容存在侵权,请进行举报或认领
文档简介
1、印 制 电 路 板(printed circuit boards) ipc-m-105rigid printed board manual 刚性印制板设计手册ipc-d-325adocumentation requirements for printed boards 印制板设计文件图册要求ipc-pe-740atroubleshooting for printed board manufacture and assembly印制板制造和组装的故障排除ipc-mb-380guidelines for molded interconnection devices 模压互连器件导则ip
2、c-d-326ainformation requirements for manufacturing printed circuit boards and other electronic assemblies印制板制造和其它电子组装的信息要求规范ipc-6010 seriesipc-6010 qualification and performance seriesipc-6010印制电路板质量标准和性能规范系列手册ipc-6011generic performance specification for printed boards 印制板通用性能规范ipc-6012bqualificati
3、on and performance specification for rigid printed boards刚性板的合格和性能规范要求ipc-6015qualification & performance specification for organic multichip module (mcm-l) mounting and interconnections 有机多芯片模块(mcm-l)安装及互连结构的鉴定与性能规范ipc-6016qualification & performance specification for high density interconn
4、ect (hdi) layers or boards 高密度互连(hdi)层或印制板的鉴定与性能规范ipc-6018amicrowave end product board inspection and tech 微波成品印制板的检验和测试 ipc-a-600gacceptability of printed boards 印制板验收条件ipc-qe-605a printed board quality evaluation handbook 印制板质量评价ipc-pwb-eval-chprinted circuit board defect evaluation chart印制板缺陷评估图表
5、ipc-hm-860specification for multilayer hybrid circuits多层混合电路规范ipc-tf-870qualification and performance of polymer thick film printed boards聚合物厚膜印制板的鉴定与性能ipc-ml-960qualification and performance specification for mass lamination panels for multilayer printed boards 多层印制板的鉴定与性能规范用预制内层在制板的鉴定与性能规范ipc-tr-4
6、81results of multilayer tests program round robin多层印制板联合试验计划结果ipc-tr-551quality assessment of printed boards used for mounting and interconnecting electronic components 用于电子元件安装与互连的印制板质量评价ipc-tr-579round robin reliability evaluation of small diameter plated through holes in pcbs 印制板中小直径镀覆孔可靠性评价联合试验i
7、pc-4552specification for electroless nickel/immersion gold(enig) plating for printed circuit boards 印制电路板表面非电镀镍/沉金规范ipc-dr-572drilling guidelines for printed boards 印制板钻孔导则it-95080improvements/alternatives to mechanical drilling of pcb vias印制板通孔机加工方案的改进和优选手册ipc-nc-349computer numerical control forma
8、tting for drillers and routers钻床和铣床用计算机数字控制格式ipc-sm-839pre & post solder mask application cleaning guidelines施加阻焊前及施加后清洗导则ipc-hdi-1high density interconnect microvia technology compendium高密度(hdi)互连微通孔技术纲要ipc/jpca-4104specification for high density interconnect (hdi) and microvia materials高密度互连(h
9、di)及微导通孔材料规范ipc-6016qualification & performance specification for high density interconnect (hdi) layers or boards 高密度互连(hdi)层或印制板的鉴定与性能规范ipc/jpca-6801ipc/jpca terms & definitions, test methods, and design examples for build-up/high density interconnection 积层/高密度互连的术语和定义、试验方法与设计例ipc-dd-135qu
10、alification testing for deposited organic interlayer dielectric materials for multichip modules 多芯片组件内层有机绝缘材料的鉴定试验it-96060high density pcb microvia evaluation (october project), phase i, round 1高密度印制板微通孔评价指标手册, 第一期第一版it-97071high density pcb microvia evaluation, phase i, round 2高密度印制板微通孔评价指标手册, 第一期第
11、二版it-30101high density pcb microvia evaluation, phase i, round 3高密度印制板微通孔评价指标手册, 第一期第三版it-98123microvia manufacturing technology cost analysis report微通孔制作技术成本核算报告ipc-2141acontrolled impedance circuit boards & high speed logic design控制阻抗电路板与高速逻辑设计ipc-2251design guide for the packaging of high spe
12、ed electronic circuits高速电子电路封装的设计指南ipc-2252design guide for rf/microwave circuit boards 射频/微波电路板设计指南ipc-4103specification for base materials for high speed/high frequency applications 高速高频用基材规范ipc-6018amicrowave end product board inspection and test 微波成品印制板的检验和测试ipc-d-317adesign guidelines for elect
13、ronic packaging utilizing high speed techniques采用高速技术电子封装设计导则ipc-m-102flexible circuits compendium 挠性电路纲要ipc-4202flexible base dielectrics for use in flexible printed circuitry挠性印制线路用挠性绝缘基底材料ipc-4203adhesive coated dielectric films for use as cover sheets for flexible printed circuitry and flexible
14、adhesive bonding films 挠性印制线路覆盖层用涂粘接剂绝缘薄膜ipc-4204flexible metal-clad dielectrics for use in fabrication of flexible printed circuitry挠性金属箔去电应用于柔性电路组装ipc-6013aqualification & performance specification for flexible printed boards挠性印制板的鉴定与性能规范ipc/jpca-6202ipc/jpca performance guide manual for singl
15、e- and double-sided flexible printed wiring boards ipc/jpca单双面挠性印制板性能手册ipc-fa-251guidelines for assembly of single- and double-sided flex circuits单面和双面挠性电路组装导则ipc-fc-234composite metallic materials specification for printed wiring boards印制线路板复合金属材料规范ipc-m-107standards for printed board materials man
16、ual 印制板材料标准手册ipc-mi-660incoming inspection of raw materials manual 原材料接收检验手册ipc-4101aspecifications for base materials for rigid and multilayer printed boards刚性及多层印制板用基材规范ipc-4121guidelines for selecting core construction for multilayer printed wiring board applications 多层印制板用芯板结构选择导则ipc-4562metal f
17、oil for printed wiring applications 印制线路用金属箔ipc-cf-148aresin coated metal for printed boards 印制板用涂树脂金属箔ipc-cf-152bcomposite metallic materials specification for printed wiring boards印制线路板复合金属材料规范ipc-tr-482new developments in thin copper foils 薄铜箔的新发展ipc-tr-484results of ipc copper foil ductility rou
18、nd robin studyipc铜箔延展性联合研究结果 ipc-tr-485results of copper foil rupture strength test round robin study铜箔断裂强度试验联合研究结果ipc-4412specification for finished fabric woven from ”e” glass for printed boards“e”类精纺玻璃纤维层印制板技术规范ipc-4130specification & characterization methods for nonwoven "e" glass
19、materialse 玻璃纤维非织布材料规范及性能确定方法ipc-4110specification and characterization methods for nonwoven cellulose based paper for printed boards印制板用纤维纸规范及性能确定方法ipc-4411-aspecification and characterization methods for non-woven para-aramid reinforcement聚芳基酰胺非织布规范及性能确定方法ipc-sg-141specification for finished fabri
20、c woven from "s" glass for printed boards印制板用经处理s玻璃纤维织物规范ipc-a-142specification for finished fabric woven from aramid for printed boards印制板用经处理聚芳酰胺纤维编织物规范ipc-qf-143specification for finished fabric woven from quartz (pure fused silica) for printed boards 印制板用经处理石英(熔融纯氧化硅)纤维编织物规范ipc-2524pwb
21、 fabrication data quality rating system 印制板制造数据质量定级体系ipc-9151aprinted board process, capability, quality and relative reliability benchmark test standard and database印制板工艺, 容量, 质量,可靠性试验标准和数据库ipc-9191general guidelines for implementation of statistical process control (spc) 实施统计过程控制(spc)的通用导则ipc-9199statistical process control (spc) quality rating 统计分析控制ipc-9252guidelines and requirements for e
温馨提示
- 1. 本站所有资源如无特殊说明,都需要本地电脑安装OFFICE2007和PDF阅读器。图纸软件为CAD,CAXA,PROE,UG,SolidWorks等.压缩文件请下载最新的WinRAR软件解压。
- 2. 本站的文档不包含任何第三方提供的附件图纸等,如果需要附件,请联系上传者。文件的所有权益归上传用户所有。
- 3. 本站RAR压缩包中若带图纸,网页内容里面会有图纸预览,若没有图纸预览就没有图纸。
- 4. 未经权益所有人同意不得将文件中的内容挪作商业或盈利用途。
- 5. 人人文库网仅提供信息存储空间,仅对用户上传内容的表现方式做保护处理,对用户上传分享的文档内容本身不做任何修改或编辑,并不能对任何下载内容负责。
- 6. 下载文件中如有侵权或不适当内容,请与我们联系,我们立即纠正。
- 7. 本站不保证下载资源的准确性、安全性和完整性, 同时也不承担用户因使用这些下载资源对自己和他人造成任何形式的伤害或损失。
最新文档
- 二级建造师考试重点公路(实务)
- 四年级数学(简便运算)计算题专项练习与答案
- 终止推广合作协议书(2篇)
- 六年级上册《比的意义》说课稿9篇
- 南京航空航天大学《材料工程基础》2022-2023学年第一学期期末试卷
- 南京工业大学浦江学院《数据结构》2021-2022学年期末试卷
- 某供电公司综合工区门卫施工组织设计
- 南京工业大学浦江学院《酒店人力资源管理》2023-2024学年第一学期期末试卷
- 《小雨沙沙》说课稿
- 租聘挖机合同(2篇)
- 快乐读书吧-读后分享课:《十万个为什么》教学案列
- 2024年 贵州茅台酒股份有限公司招聘笔试参考题库含答案解析
- 2024年华融实业投资管理有限公司招聘笔试参考题库含答案解析
- 2024年1月普通高等学校招生全国统一考试适应性测试(九省联考)历史试题(适用地区:贵州)含解析
- 儿童心理健康问题的评估与干预方案
- NB-T 47013.7-2012(JB-T 4730.7) 4730.7 承压设备无损检测 第7部分:目视检测
- 空气化工高精度气体分装及储运中心一期项目环评报告书
- 肝吸虫护理查房课件
- 社区工作者案件调解流程
- 学校监控使用安全应急预案
- 汽车构造复习
评论
0/150
提交评论