纳米BN-环氧树脂高导热绝缘复合材料

1、Highly thermally conductive insulating polymer composites based on BN nanoparticles华桂祥Highly powered electronicintel Core i7Power88W30100WExtensive applicationsElectronic packaging technologyminiaturizationDIPQFPBGA/CSPPGA/BGA60-70S80s90s00sMCM/SiP05sElectronic packaging technologyPolymer matrix and

2、 their low thermal conductivity Great processibility Low cost Thermal interface materialsMaterialsThermal conductivity(W/mK)Polyethylene0.42-0.51Polypropylene0.1-0.22Polystyrene0.14-0.17Metals400(copper)Ceramics36(Al2O3);100(AlN)Potential thermally conductive fibbersThermal conductivity of polymer a

3、nd FillersFillersThermal conductivity(W/mK)Micro size Al2O336Micro size Si3N445Micro size AlN60-320Micro size h-BN60BN nanotube3000(theory) 200-300(experiment)BN nanosheet100-1000AlN,Al2O3Si3N4 ect,nanowireBranch,networkNew generation thermally conductive insulating fillersConventional Fillers Decen

4、t high thermal conductivity Cheap and easy fabrication Low aspect ratio（纵横比） Low effeciencyNew generation fillers High aspect ratio Ultra-high thermal conductivity Specially designed structureThermal conductivity and Mechanical properites of h-BN particleHigh thermal conductivity good mechanical pro

5、pertiesh-BN particlePoor thermal conductivity and mechanical propertiesThermal conductivity and Mechanical properites of BN nanotubeHigh thermal conductivity good mechanical propertiesBN nanotubeThermal conductivity and Mechanical properites of BN nanosheetsBN nanosheetsHigh thermal conductivity Goo

6、d mechanical propertiesThermal conductivity and Mechanical properites of BN nanosheetsBN nanosheetsHigh thermal conductivity Synthesis Methods of BN nanotubesMethodsSourcesProductsyieldPurityArc dischargeon boride electrodeW-BHfB2BN-NiTubes200nm+WTubes700nm+HfTubes100nm+NilowimpureLaser heatingHigh

7、pressurec-BNB-Li-N2Tubes30nm,shortTubes30nm+LiLowpureImpureTemplate synthesisCNTAl2O3Tubes100nm+CTubes100nm+Al2O3Low Impure CVD(chemical vapor deposition)B-C-N-OB3N3H6Tubes100nm+C+OTubes100nmHigh ImpureChemical reactionZrB2+NH3Tubes10m+ZrB2HighImpurePressurized vapor/condenser(PVC) methodBall-millin

8、g methodNoncovalent functionalization of BNNPs sonicating a mixture of 10 mg BNNP powder and 2mg 1-pyrenecarboxilic acid in 5mL methanol for 2 h. 30mL of distilled water was added to this mixture under ultrasonicating for 10 h. left on a laboratory bench top for several days. The solution was centri

9、fuged repeatedly to remove uncombined PCA and methanol, and the resultant PBA-BNNP precipitation/complex was washed repeatedly with deionized water and fresh ethanol, respectively. the PBA-functionalized BNNPs were dried in a vacuum oven at about 60 8C for 12 h for composite fabrication.Characteriza

10、tion of f-BNNP(a) Particle-size distribution; (b) HRTEM image (inset for SAED pattern); (c) Raman spectrum.Preparation of BNNTs/epoxy composites The BNNTs were dispersed ultrasonically for 5 h in acetone, and the epoxy resin was added to the BNNTs suspension and was subjected to 30 min of high-shear

11、 mixing to ensure good dispersion. The residual solvent was removed at 50 8C in a vacuum oven and an aromatic diamine curing agent was added under continuous stirring in a ratio of epoxy to curing agent of 100:25 by weight. The final mixture was cast into a metallic mold and cured under hot pressing at 100 8C for 2 h. The subsequent post-cure was conducted at 150 8C for another 2 h. A series of f-BNNP/epoxy composites containing 0, 2, 5, 8, and 10 wt.% f-BNNP