标准解读

《GB/T 44924-2024 半导体集成电路 射频发射器/接收器测试方法》是一项国家标准,旨在为半导体集成电路中的射频发射器和接收器提供一套统一的测试方法。该标准涵盖了从设备准备到最终数据处理的全过程,确保了不同制造商之间产品性能评价的一致性和可比性。

在适用范围上,此标准适用于所有类型的射频发射器与接收器,包括但不限于移动通信、无线局域网以及其他需要进行射频信号传输的应用场合。它不仅限定了测试环境条件(如温度、湿度),还详细规定了测试所需的仪器精度要求及校准程序,以保证测试结果的准确可靠。

对于具体测试项目而言,《GB/T 44924-2024》包含了对输出功率、频率稳定性、相位噪声、调制特性等多个关键参数的测量指导。每个参数都有明确的定义说明,并给出了推荐使用的测试配置示例,帮助技术人员根据实际情况选择合适的测试方案。

此外,该标准还强调了测试过程中需要注意的安全事项,比如防止静电损坏器件、正确接地避免干扰等,这些都是保障测试顺利进行不可或缺的部分。


如需获取更多详尽信息,请直接参考下方经官方授权发布的权威标准文档。

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文档简介

ICS31.200

CCSL56

中华人民共和国国家标准

GB/T44924—2024

半导体集成电路

射频发射器/接收器测试方法

Semiconductorintegratedcircuits—

MeasuringmethodsforRFtransmitter/receiver

2024⁃12⁃31发布2025⁃04⁃01实施

国家市场监督管理总局

国家标准化管理委员会发布

GB/T44924—2024

目次

前言··························································································································Ⅲ

1范围·······················································································································1

2规范性引用文件········································································································1

3术语和定义··············································································································1

4一般要求·················································································································4

4.1总则·················································································································4

4.2环境要求···········································································································4

4.3测试条件···········································································································4

4.4测试系统及仪器设备····························································································4

4.5测试注意事项·····································································································5

5详细要求·················································································································5

5.1mW5

动态功耗P(a)································································································

5.2dB6

功率增益G(P)·································································································

5.3ΔdB10

功率增益平坦度G(P)····················································································

5.4dB11

线性功率增益GPLIN()·······················································································

5.5ΔdB11

线性功率增益平坦度GPLIN()···········································································

5.6dBm12

输出功率P(o)·····························································································

5.7dBm13

抗烧毁功率PKSH()························································································

5.8效率η(%)········································································································14

5.9功率增益可调范围GR(dB)··················································································15

5.10dBc16

镜像抑制比RIMJ()························································································

5.11dBc17

谐波抑制比RHR()························································································

5.12dBc18

本振抑制比RLO()························································································

5.13dBc19

边带抑制比RSB()·························································································

5.14dB20

杂散抑制比RFS()··························································································

5.15PNdBdBm21

_压缩点CP⁃N()··················································································

5.16输出二阶互调截止点OIP2(dBm)·········································································23

5.17输入二阶互调截止点IIP2(dBm)··········································································26

5.18输出三阶互调截止点OIP3(dBm)·········································································26

5.19输入三阶互调截止点IIP3(dBm)··········································································28

5.20ns29

通道建立时间tON()·························································································

5.21ns30

通道关断时间tOFF()························································································

5.2231

收发切换时间tTR······························································································

GB/T44924—2024

5.23噪声系数NF(dB)·····························································································34

5.24端口回波损耗RL(dB)/电压驻波比VSWR·····························································37

5.25端口阻抗Z(Ω)·································································································40

5.26ns41

群时延tGD()··································································································

5.27带内相位非线性PNL(°)·····················································································42

5.28dBm/Hz43

噪声基底NFL()·····················································································

5.29本振泄漏LOL(dBm)························································································44

5.30∆dB45

幅度稳定度AP(o)·······················································································

5.31相位稳定度Δθ(°)·····························································································46

5.32°47

通道间相位一致性PSER()··················································································

5.33dB50

通道间幅度一致性AMER()··············································································

5.34I/Q°51

相位误差PEIQ()························································································

5.35I/QdB53

幅度误差AEIQ()·····················································································

5.36调制精度EVM(%)···························································································54

5.37邻信道功率抑制比ACPR(dB)·············································································55

5.38dB56

通道隔离度KISO()·························································································

5.39载波泄露CL(dB)·····························································································58

GB/T44924—2024

前言

本文件按照GB/T1.1—2020《标准化工作导则第1部分:标准化文件的结构和起草规则》的规

定起草。

请注意本文件的某些内容可能涉及专利。本文件的发布机构不承担识别专利的责任。

本文件由中华人民共和国工业和信息化部提出。

本文件由全国集成电路标准化技术委员会(SAC/TC599)归口。

本文件起草单位:中国电子科技集团公司第二十四研究所、重庆西南集成电路设计有限责任公司、

中国电子科技集团公司第十四研究所、中国电子科技集团公司第三十八研究所、成都振芯科技股份有

限公司、深圳市晶峰晶体科技有限公司。

本文件主要起草人:苏良勇、王露、唐景磊、阳润、戚园、刘丹、许娟、苏巧、陈翔、刘晓政、范超、高青。

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