品质管理Q七大手法Q常用单词中英对照

{品质管理Q七大手法}Q常用单词中英对照1.QC:qualitycontrol2.IQC:iningqualitycontrol4.PQC:processqualitycontrolIPQC:inprocessqualitycontrol.7.MA:majordefeat8.MI:minordefeat9.CR:criticaldefeat10.SMT:surfacemountingtechnology11.SMD:surfacemountingdeviceSMC:surfacemountingponent12.ECN:engineeringchangenotice13.DCN:designchangenotice16.BOM:billofmaterial17.BIOS:basicallyinputandoutputsystem19.ISO:internationalstandardorganization20.DRAM:21.Polarity:22.Icicles:23.Non-wetting:空焊28.Insufficientsolder:29.Excessivesolder:錫多30.Solderresidue:31.Solderball:32.Tombstone:33.Sideward:側🖂35.Goldfinger:39.OBW:onboardwriterBIOS40.Simplerandomsampling:簡單隨機抽樣41.Histogram:42.Standarddeviation:標準差45.Sub-contractors:46.SQE:Supplierqualityengineering47.Samplingsample:48.Loader:49.QTS:Qualitytrackingsystem50.Debug:51.Spareparts:52.Inventoryreportfor:庫存表53.Manpower/Tactestimation54.Calibration:55.S/N:serialnumber60.Sumofsquare:61.Range:全距65.Fixture:66.Probe:67.Hostprobe:68.Goldencard:樣本卡73.Targetvalue:74.Relateddepartment:相關部門78.ponentdamageorbroken79.Unmeletedsolder80.fluxresidue85.standoffheight91.Internalnotification:96.UCL:Uppercontrollimit97.LCL:Lowercontrollimit98.CL:Centerline99.R.T.Y:Rolledthroughoutyield102.Resistor:103.Capacitor:104.Resistorarray:105.Capacitorarray:107.SOT:108.Crystal:109.Fuse:110.Bead:111.Connector:聯結器112.ADM:AdministrationDepartment113.CE:ComponentEngineering114.CSD:CustomerServiceDepartment115.ID:IndustrialDesign116.IE:IndustrialEngineering117.IR:IndustrialRelationship118.ME:MechanicalEngineering119.MIS:ManagementInformationSystem120.MM:MaterialManagement121.PCC:ProjectCoordination/Control122.PD:ProductionDepartment123.PE:ProductEngineering124.PM:ProductManager125.PMC:ProductionMaterialControl126.PSC:ProjectSupport&Control128.MetalShearing:129.CEM:ContractElectronicsManufacturingSCM:Supplychainmanagement131.OJT:Onjobtraining132.AccessTime:光碟搜尋時間B2BEC:BusinesstobusinesselectronicCommerce134.CCL:CopperCladLaminate135.Intranet:企業內部通訊網路GSM:GlobalSystemforMobileCommunicationGPS:HomePage:139.VideoClip:140.HTML:141.Domainname:142.IP:143.Notebook:筆記型電腦144.VR:VirtualReality145.WAP:WirelessApplicationProtocol146.LAN:LocalareanetworkWWW:WorldWideWebWAN:WideAreaNetwork147.3C:Computer,Communication,Consumerelectronic150.Processedmaterial:151.Entity/Item:152.Qualityloop:質量環153.Qualitylosses:154.Correctiveaction:155.Preventiveaction:預防措施156.PDCA:PlanCheck/Action157.Integratedcircuits(IC):集成電路158.Applicationprogram:159.Utilities:實用程序160.Auxiliarystorage/Secondstorage:;161.Siliconchip:硅片165.Montherboard:166.Mermoryboard:167.Slot:插槽169.Plotter:170.MPC:Multimediapersonalputer173.Joystickport:174.VGA:VideoGraphicsArray175.Resolution:176.Register:177.ISA:IndustryStandardArchitecture:工業標準結構181.NIC:Networkinterfacecard184.SIMM:Singlein-linememorymodule)185.Casing:186.Aluminum:鋁質192.Defaultcode:193.Auxiliaryport:輔助端口194.Carriagereturn:195.Linefeed:換行197.Videoanalog:198.TTL:Transistor-Transistorlogic201.Floppydisk:202.Outputlevel:輸出電平205.Compatible:206.HardwareExpansionCard:硬件擴充卡207.Buffer:208.CRM:CustomerrelationshipManagement214.PDA:PersonalDateAssistantPLA:PersonalInformationAssistant215.PPAP:AdvancedProductQualityPlanningandControlPlan216.FMEA:ProtenticalFailureModeandEffectsAnalysis217.MSA:MeasurementSystemsAnalysisBenchmarking:Analysisofmotion/ErgonomicsRokaYokeMCR:machinecapabilityratioMistakeProofingTaguchimethods226.Cause&Effectscharts227.Scattle:Fool-ProofSystem229.ArrowChartAffiliateChart230.PDPC:ProcessDecisionProgramChartSystemChart231.RelationChartMatrixChart232.MatrixDataAnalysis234.Brain-stormJIT:JustInTime:及時性生產模擬235.DemingPrize:Prototype236BPM:BusinessProcessManagement.MBO:目標管理237.MBP:FTA:QSCV:服務品質238.IPPB:InformationPlanningProgrammingBudget239.EQ:EmotionQuotient:IQ:IntelligenceQuotient:智商240.ImpliedNeeds:SpecifiedRequirement:規定要求Probation:IningProductreleasedforurgentproductionAdvancedqualityplanningAOQ:AverageOutgoingQualityAOQL:AverageOutgoingQualityLimitApprovedSupplierListAttributedateBenchmarkingCalibrationCapableprocessCapabilityIndexCapabilityratioCHANGECYCLETIMEContinuousimprovementControlplansCostofqualityCycletimereductionDesignofexperimentsDeviation/SubstitutionESD:ElectrostaticdischargeEH&S:Environmental,Health,andSafelyESS:EnvironmentalStressScreeningFMEA:FailureModeEffectAnalysisFirstArticleapprovalFirstpassyieldFirstsampleinspectionFMECA:FailuremodeeffectandcriticallyanalysisGaugecontrolGR&R:GaugerepeatabilityandreproducibilityIN-CONTROLPROCESSINDUSTRIALAVERAGEJIT(justintime)manufacturing(KeycharacteristicKeyponentLifeTestingLottraceabilityNONCONFORMANCEOUT-OF-CONTROLPROCESSPilotApplicationPreventivevsdetectionPreventivemaintenanceProcesscapabilityindexQualityClinicProcessChart(QCPC)QualityinformationsystemQualitymanualQualityplanQualityplanningQualitypolicyQualitysystemReliabilityRUNChartSkillMatrixStatisticalqualitycontrol(SQC)TeamworkTotalqualitymanagementVariabledataVariationValueAnalysisVisualFactoryProfileImprovementPlanSupplierAuditReportSiteAuditTypicalagendaInternalandexternalfailurecostsFailureratepercentageProductivity(output/input)CustomerplaintsCustomersatisfactionindicesRootcauseanalysisoffailuresNominal:Enumeration:Screeningstage:Screeningmaterials:Nonparametricparativeexperimental:Pitfall:Fractionalfactorialexperiments:Managementbymunication:Managementbyobjective:Managementbyresult:Humanrelationshipskill:Conceptialskill:Safetystock:leadtime:EOQ:EconomicorderQuantityRunatrate: