MPM-UP2000中文操作手册-

EmergencyStop警急停止開關 EmergencyStop警急停止開關TTemperature溫度控制表On電源啟動開關On電源啟動開關RelativeHumidity濕度控制表OffRelativeHumidity濕度控制表Off電源關閉開關Power電源燈Power電源燈StartCycStartCycle開始循環按鈕UP2000印刷機特性 視覺自動對準裝置VisionAlignmentSystem慢速脫模功能SlowSnap-offFunction 可程式設定刮刀頭ProgrammingSqueegee 自動擦拭鋼板系統StencilWipper2.1關於印刷週期PrintingCycle 印刷週期包涵以下過程基板搬入LoadingBoard基板定位LocatingBoard視覺系統對位VisionAlignment印刷平台上升ZTowerUP刮刀向前後刮印錫膏Printting慢速脫模SlowSnap-Off印刷平台下降ZTowerDown基板搬出UnloadingBoard2.2硬體操作介面 軌跡球或螢幕(TrackballorMonitor)Trackball軌跡球:移動螢幕上的指標↖移動各軸數入數字、參數等等…..開機後,顯示如下的畫面以上(因軟體版本新舊不一樣而不同)Ultraprint2000內全部馬達,都是步進馬達,所以剛開機必需RESET重新回原點後才干開始使用。MPMCorporationMPMCorporation訊息先顯示區即時影像工作區關於訊息先顯示區即時影像工作區關於MPM公司資訊VACUUMMOTORVACUUMMOTORFRAMECLAMPUP/DOWN 啟動鋼板固定鈕 啟動真空馬達鈕 DISPENSESOLVENTSQUEEGEEDISPENSESOLVENTSQUEEGEECLAMPS 啟動刮刀座固定鈕 啟動溶劑幫浦鈕STENCILLIGHTSQUEEGEESTENCILLIGHTSQUEEGEEFLIP 啟動前後刮刀座鈕 啟動照鋼板燈泡鈕BOARDLIGHTSQUEEGEEBOARDLIGHTSQUEEGEEUP/DOWN 啟動刮刀組上下鈕 啟動照基板燈泡鈕WIPERPAPERVACUUMWIPERPAPERVACUUMMOTOR 啟動真空馬達閘門鈕 啟動捲紙馬達鈕.1下拉式功能表PrintAutoPrintManualPrintPassThroughDemoPrintSPCDataAutoPrint自動印刷模式ManualPrint手動印刷模式PassThrough將機器當做輸送帶DemoPrint展示印刷模式SPCData生產統計過程資料1.AutoPrint自動印刷,機器會做印錫膏的動作PressSELECTtobeginor(按SELECT開始自動印刷)NexttochangeCycleLimits:NoLimit如下圖(按NEXT,以更換印刷片數:不限制) PrintCycleLimits PrintCycleLimitsRollTrackballToChangeValuePrintCycleLimit:3PressExitWhenDone.PrintCycleLimits (印刷週期設定)RollTrackballToChangeValue (滾動軌跡球,以變更印刷片數)PrintCycleLimit:3 (限定印刷週期:3片)最高999片PressExitWhenDone. (當設定完成後，按EXIT)PAUSE 暫時停止印刷按鈕PAUSEDISPENSERPENDING DISPENSERPENDING※(必須在設定第2頁EnableButtons內將Dispense打開為Yes)PPressSELECTtoraisesqueegeetoallowmoveroomwhenaddingpaste,orPressNexttocontinuePressSELECTtoraisesqueegee (按SELECT後刷刀會上昇，以便產生toallowmoveroomwhenaddingpaste, 足夠空間,讓操作員加錫)orPressNEXTtocontinue (按NEXT後在原地,讓使操作員加錫)WIPERPENDING WIPERPENDING ※(必須在設定第2頁EnableButtons內將Wiper打開為Yes)SPCDATASPCDATA2.ManualPrint手動印刷,機器會做印錫膏的動作3.PassThrough將機器當做輸送帶DemoPrint展示印刷模式5.SPCData生產統計過程資料CycleTime 顯示機器在印刷時所花的時間,如有擦拭,時間必加長CycleTimeIdleTime 機器在印刷時所等待送板與出板時間IdleTimeCorrection 顯示PCB板進入印刷位置與鋼板對位時X、Y、THETA軸Correction修正值ShapeScore 視覺系統辨別PCB板與鋼板Mark點亮度接受值顯示圖表ShapeScoreAlignment 視覺系統辨別PCB板與鋼板Mark點X、Y修正補償顯示圖表Alignment2DData 2D錫面覆蓋率檢查顯示圖表(需有此項功能才干顯示)2DData3DData 3D錫膏厚度檢查顯示圖表(需有此項功能才干顯示)3DDataTemperature 顯示機器內的溫度(需有ECU溫溼度監控配備此項功能)TemperatureHumidy 顯示機器內的濕度(需有ECU溫溼度監控配備此項功能)HumidySaveSaveInfo 將生產統計過程資料存入磁片ClearAll ClearAll 將生產統計過程資料全部刪除 PanLeft PanLeft 將扩大過資料與圖形向左邊移動 PanRight PanRight 將扩大過資料與圖形向右邊移動 ZoomZoomIn 將生產統計過程資料內(值及曲線)扩大與縮小圖形 ReturntoMainMenuReturntoMainMenu 回到主畫面按鈕SPSPCOptionsTeachTeachBoardTeachVisionDeviceLayoutTeachIDTeachCustomBGATeachOffsetMovesTeachVisionOffsetTeachBoard做一片PCB板新程式TeachVision做一片PCB新程式的Mark點DeviceLayout做2D檢查時,所要檢查零件TeachID做辨識鋼板身分TeachCustomBGA編輯自行設計的BGA零件檔案TeachOffsetMoves設定〞印刷前的焊墊〞與〞印刷後的焊墊〞位置修正值TeachVisionOffset設定〞視覺系統〞位置修正值1.TeachBoard重做新程式AbouttobeginTEACHoperation(開始設定操作)PressSELECTtoteachanewboardor(按SELECT,設定新基板)PressNEXTtocontinueonthisboardsetup(按NEXT,繼續這基板的設定)按SELECT之後，出現以下訊息視窗：CAUTION,ThemachinemustmovetoCAUTION,ThemachinemustmovetoTEACHPOSITIONbeforeteachcanbeginThemachineisnowgoingtomove.PressNEXTtoContinue,orEXITtoQuit.CAUTION,Themachinemustmoveto(警告,設定開始前,機器必須移動到TEACHPOSITIONbeforeteachcanbegin〞設定位置〞)Themachineisnowgoingtomove.(機器即將移動)PressNEXTtoContinue,orEXITtoQuit.(按NEXT繼續,按EXIT離開)1.1選擇BoardParameters進入PCB參數設定BoardParameters HardwareRequired:BoardParameters BoardBoardParameters基板(PCB)參數設定(PCB)基板X軸方向長度(PCB)基板Y軸方向寬度(PCB)基板厚度PCB板PCB板Y XEnterEnterBoardDimensionsintosetupmenu.ClickonYsizetoadjustTrackWidth.PressDonewhenfinished.EnterBoardDimensionsintosetupmenu.(輸入基板X、Y、厚度)ClickonYsizetoadjustTrackWidth.(點取Y方向尺寸，可調整軌道寬度)PressDonewhenfinished.(當你做完上述之步驟，按Done)點取Xsize，輸入基板寬度Xsize，按EXIT完成輸入，單位mm。例14.5cm=145mm點取Ysize輸入基板寬度Ysize，按EXIT之後出現如下訊息視窗：AbouttoadjusttheTRACKWIDTHfortheboard.AbouttoadjusttheTRACKWIDTHfortheboard.PressNEXTtoContinue,orEXITtoQuit.AbouttoadjusttheTRACKWIDTHfortheboard.(調整基板的軌道寬度)PressNEXTtoContinue,orEXITtoQuit.(按NEXT繼續,按EXIT離開)按NEXT之後，出現以下訊息視窗：ThisisthecurrentTrackwidthThisisthecurrentTrackwidthPressSELECTtofineadjustPressNEXTtoacceptThisisthecurrentTrackwidth(這是目前的軌道寬度)PressSELECTtofineadjust(按SELECT微調軌道寬度)PressNEXTtoaccept(按NEXT，接受目前的軌道寬度)如果，你按SELECT之後，出現以下訊息視窗：JogACTIVE…JogACTIVE…TRKWIDTH PressNEXTtoquit(調整完後，按EXIT)JogACTIVE…(這段訊息告訴你，用Jog方式去調整基板的軌道寬度)TRKWIDTH PressNEXTtoquit(調整完後，按NEXT)點取Thickness，輸入基板厚度。使用游標卡尺測量。PressDonewhenfinished.(當你做完上述之步驟，按Done)StencilDimensions鋼板尺寸設定參數鋼板尺寸EnterstencilinnerdimensionEnterstencilinnerdimensionPressDonewhenfinished.Enterstencilinnerdimension(輸入內部鋼板尺寸)PressDonewhenfinished.(當你做完上述之步驟，按Done)1.2選擇Worknest進入印刷工作平台參數設定Worknest HardwareRequired:Worknest Board,Tactile,VacuumChucksPleaseremovethestencil.Pleaseremovethestencil.Squeegeewillnowmoveback.PressSELECTwhenready.Pleaseremovethestencil.(請移開鋼板)Squeegeewillnowmoveback.(刮刀組現在將移動到後面)PressSELECTwhenready.(準備好後按SELECT)按NEXT之後，出現以下訊息：Now,adjustthevacuumrearandsideplatesNow,adjustthevacuumrearandsideplatesIfyouhaveadedicatedworkholder,installitnowPressNEXTtoContinue,orEXITtoQuit.Now,adjustthevacuumrearand(現在請調整後隔板和側(左右)隔板)sideplatesIfyouhaveadedicatedworkholder,(假设有使用專用PCB板支撐架,請現在installitnow把他裝上)PressNEXTtoContinue,orEXITtoQuit.(按NEXT繼續,按EXIT離開)按NEXT之後，出現以下訊息：TheZTOWERisabouttoloadTheZTOWERisabouttoloadtotoolingheightPressNEXTtoContinue,orEXITtoQuit.TheZTOWERisabouttoload(Z軸上升到toolingheight的位置)totoolingheightPressNEXTtoContinue,orEXITtoQuit.(按NEXT繼續,按EXIT離開)你按NEXT之後，出現以下訊息：IfyouhaveXsnuggers,adjustsnuggerpinsnow.IfyouhaveXsnuggers,adjustsnuggerpinsnow.PressNEXTtoContinue,orEXITtoQuit.IfyouhaveXsnuggers,adjustsnuggerpinsnow.(假设有使用X方向夾板,請調整好)PressNEXTtoContinue,orEXITtoQuit.(按NEXT繼續,按EXIT離開)你按NEXT之後，出現以下訊息：CAUTION,ThemachineisnowgoingtoCAUTION,ThemachineisnowgoingtoCenteritselfforthissizeboard.TheYAXISisabouttomoveforward.PressNEXTtoContinue,orEXITtoQuit.CAUTION,Themachineisnowgoingto(注意,機器現在將移動到基板Centeritselfforthissizeboard.中心點)TheYAXISisabouttomoveforward.(Y軸即將移動到前面(基板中心點)PressNEXTtoContinue,orEXITtoQuit.(按NEXT繼續,按EXIT離開)BoardParameters基板(PCB)參數設定PCB停於中心印刷位置值Loadspeed 432進板軌道皮帶轉速值(數字越大,轉速越快)Unloadspeed 381出板軌道皮帶轉速值(數字越大,轉速越快)Enterboardloadingparameters.Enterboardloadingparameters.Clickondetentfieldtotest.PressDonewhenfinished.Enterboardloadingparameters.(輸入PCB進板參數)Clickondetentfieldtotest.(點取detent,測試PCB停於中心印刷位置值)PressDonewhenfinished.(按Done完成全部動作)1.3.選擇TeachBoardstops進入基板停止位置參數設定TeachBoardstops HardwareRequired:TeachBoardstops ,Stencil,TactileTeachingBoardstop-Y TeachingBoardstop-YPlaceaboardontheinputtrack.Placeaboardontheinputtrack.PressSELECTtoContinue.Placeaboardontheinputtrack.(請將PCB板放到軌道輸入端)PressSELECTtoContinue.(按SELECT繼續)你按SELECT之後，出現開始做板邊視窗：Jogtotheleadingedgeoftheboard.Jogtotheleadingedgeoftheboard.Stay1/2inchinfromtherails.PressEXIT!Jogtotheleadingedgeoftheboard.(請將十字游標移動到基板板邊Stay1/2inchinfromtherails.PressEXIT!中間位置後,按EXIT離開)※此動作最主要是讓視覺系統內基板停止感應器,感應基板是否停止在印刷平台中心點位置選擇TeachBoardstops-X進入PCB板停止到印刷平台中心點位置參數設定與PCB板和鋼板對位Mark點) TeachingBoardstop-X TeachingBoardstop-XIstheboardcenteredcorrectly?PressSELECTtoacceptlocation.Istheboardcenteredcorrectly?PressSELECTtoacceptlocation.PressNEXTto-locateboard.PressEXITtoabortprocess.Istheboardcenteredcorrectly?(基板有無正確停止到印刷平台中心點位置)PressSELECTtoacceptlocation.(按SELECT接受目前位置)PressNEXTto-locateboard.(按NEXT調整基板正確停止到印刷平台中心點位置)PressEXITtoabortprocess.(按EXIT中止這一項步驟)你按NEXT之後，出現以下視窗：(將基板往前及往後送到印刷平台中心點位置)你按SELECT之後，出現以下訊息：Pleaseinsertastencil.Pleaseinsertastencil.PressNEXTtocontinue!Pleaseinsertastencil.(請放入鋼板)PressNEXTtocontinue!(按NEXT繼續)你按NEXT之後，出現以下訊息及視窗：Jogtoanytargetontheboard!Jogtoanytargetontheboard!Centertheobject.PressEXITJogtoanytargetontheboard!(請移動到基板上任一個對位Mark點)Centertheobject.PressEXIT(對正Mark中心點，按EXIT離開)你按EXIT之後，出現以下訊息及視窗：Jogtothesametargetonthestencil!Jogtothesametargetonthestencil!Centertheobject.PressEXITJogtothesametargetonthestencil!(請移動到鋼板上任一個對位Mark點Centertheobject.PressEXIT ，對正Mark中心點，但必須與基板上Mark點一樣,按EXIT離開)※但如果X軸方向,超過軟體保護極限會出現以下訊息,可能需重做對位點。WarningMessageWarningMessageXAXIS–SOFTWARELIMITWARNING!PressNEXTtoContinue.選擇Calc.Pre-Boardstops-X進入基板X方向停止位置參數設定Calc.Pre-Boardstop-X Calc.Pre-Boardstop-XPreboardstoppositionlearnedPreboardstoppositionlearnedPressSELECTtocontinuePressDonewhenfinished.Preboardstoppositionlearned(機器自行計算基板停止位置)PressSELECTtocontinue(按SELECT繼續)PressDonewhenfinished.(當你做完上述之步驟，按Done)選擇Stencil進入測鋼板高度參數設定Stencil HardwareRequired:Stencil Board,Stencil,Tactile,Pleaseinstallastencilnow.TheFRAMECLAMPSwillactivatewhenPleaseinstallastencilnow.TheFRAMECLAMPSwillactivatewhenyoupressNEXT.PressNEXTtoContinue,orEXITtoQuit.Pleaseinstallastencilnow.(請現在放入鋼板)TheFRAMECLAMPSwillactivatewhen(按NEXT後,啟動鎖住鋼板)youpressNEXT.PressNEXTtoContinue,orEXITtoQuit.(按NEXT繼續,按EXIT離開)你按NEXT之後，出現以下訊息及視窗：ThenextstepistosetSTENCILHEIGHT.PressNEXTtoContinue,orEXITtoQuit. ThenextstepistosetSTENCILHEIGHT.PressNEXTtoContinue,orEXITtoQuit.ThenextstepistosetSTENCILHEIGHT.(然後進行測鋼板高度)PressNEXTtoContinue,orEXITtoQuit.(按NEXT繼續,按EXIT離開)你按NEXT之後，出現以下訊息及視窗：CAUTION,Themachineisnowgoingtomove.STAYCLEAR.PressNEXTtoContinue,orEXITtoQuit.CAUTION,Themachineisnowgoingtomove.STAYCLEAR.PressNEXTtoContinue,orEXITtoQuit.CAUTION,Themachineisnowgoingto(警告,機器現在要移動,內部不能有 move.STAYCLEAR.任何東西,需清除)PressNEXTtoContinue,orEXITtoQuit.(按NEXT繼續,按EXIT離開)你按NEXT之後，出現以下訊息及視窗：PressSELECTtoJOGthesensorclearofpasteorstecilapertures,orPressNEXTtoCONTINUE.PressSELECTtoJOGthesensorclearofpasteorstecilapertures,orPressNEXTtoCONTINUE.PressSELECTorNEXTtoContinue. PressSELECTtoJOGthesensorclearof(按SELECT移動偵測感應器,勿 pasteorstecilapertures,碰到鋼板上錫膏及鋼板上PAD孔) orPressNEXTtoCONTINUE.(按NEXT馬上開始在本位置偵測鋼板高度)PressSELECTorNEXTtoContinue.(按SELECT或NEXT繼續)你按SELECT之後，出現以下訊息及視窗：JOGACTIVE…JOGACTIVE…SQUEEGEESTROKEPressEXITtoquit.JOGACTIVE…(移動現在刮刀行程位置)SQUEEGEESTROKEPressEXITtoquit.(按EXIT離開)你按NEXT與EXIT之後，出現以下訊息及視窗：Locatingtheboard…Locatingtheboard…CAUTIONCAUTION：Autoheightsensorinprogress. Pleasewait…(開始載入PCB,自動偵測鋼板高度)StencilheightFOUND.StencilheightFOUND.PressNEXTtoContinue.StencilheightFOUND.(完成偵測鋼板高度)PressNEXTtoContinue.(按NEXT繼續下一步驟)選擇Squeegee進入測刮刀高度與刮刀行程參數設定Squeegee HardwareRequired:Squeegee SqueegeeBlades,Stencil,TactileThisUtilitywillsettheSQUEEGEEheight.ThisUtilitywillsettheSQUEEGEEheight.PressNEXTtoContinue,orEXITtoquit.ThisUtilitywillsettheSQUEEGEEheight.(使用測刮刀高度)PressNEXTtoContinue,orEXITtoquit.(按NEXT繼續,按EXIT離開)按NEXT之後，出現以下訊息視窗：Pleaseinstallastencilnow.Pleaseinstallastencilnow.TheREAMECLAMPSwillactivatewhenyoupressNEXT.PressNEXTtoContinue,orEXITtoquit.Pleaseinstallastencilnow.(現在請放入鋼板)TheREAMECLAMPSwillactivatewhen(按NEXT之後,啟動鋼板固定夾)youpressNEXT.PressNEXTtoContinue,orEXITtoquit.(按NEXT繼續,按EXIT離開)按NEXT之後，出現以下訊息視窗：Youmustnowinstallthesqueegeeblade.Youmustnowinstallthesqueegeeblade.PressNEXTtoContinue,orEXITtoquit.Youmustnowinstallthesqueegeeblade.(你現在必須安裝刮刀)PressNEXTtoContinue,orEXITtoquit.(按NEXT繼續,按EXIT離開)按NEXT之後，出現以下訊息視窗：CAUTION,ThemachineisnowgoingtoCAUTION,ThemachineisnowgoingtoMovetheZTOWERandcycletheSQUEEGEEUPandDOWN.PressNEXTtoContinue,orEXITtoQuit.CAUTION,Themachineisnowgoingto(注意,機器的Z軸和刮刀上下將MovetheZTOWERandcycle會移動)theSQUEEGEEUPandDOWN.PressNEXTtoContinue,orEXITtoQuit.(按NEXT繼續,按EXIT離開)按NEXT之後，出現以下訊息視窗：PressSELECTtofindStencilHeightPressSELECTtofindStencilHeightorNEXTtoBypass.PressNEXTtoContinue,orEXITtoQuit.PressSELECTtofindStencilHeight(按SELECT之後,再測一次鋼板高度orNEXTtoBypass.按NEXT之後,不測鋼板高度)PressNEXTtoContinue,orEXITtoQuit.(按NEXT繼續,按EXIT離開)按NEXT之後，出現以下訊息視窗：PressSELECTtoJOGthesensorclearofPressSELECTtoJOGthesensorclearofpasteorstencilaperturesorpressNEXTtoCONTINUE.PressSELECTorNEXTtoContinue.PressSELECTtoJOGthesensorclearof(按SELECT移動偵測感應器,勿pasteorstencilapertures碰到鋼板上錫膏及鋼板上PAD孔)orpressNEXTtoCONTINUE.(按NEXT馬上開始在本位置偵測刮刀高度)PressSELECTorNEXTtoContinue.(按SELECT或NEXT繼續)你按SELECT之後，出現以下訊息及視窗：JOGACTIVE…JOGACTIVE…SQUEEGEESTROKEPressEXITtoquit.JOGACTIVE…(移動現在刮刀行程位置)SQUEEGEESTROKEPressEXITtoquit.(按EXIT離開)你按NEXT與EXIT之後，出現以下訊息及視窗並開始測前後刮刀高度：Levelingfrontblade.Levelingfrontblade.Levelingrearblade.Levelingrearblade.CAUTIONCAUTION：Autoheightsensorinprogress. Pleasewait…(開始偵測刮刀高度。測前刮刀時,偵測感應器先下降碰到鋼板後,前刮刀下降,第一次先壓平刮刀,第二次自動偵測前刮刀高度;測後刮刀時,偵測感應器先下降碰到鋼板後,後刮刀下降,第一次先壓平刮刀,第二次自動偵測後刮刀高度)(測完刮刀高度後,開始設定刮刀行程)AbouttosetSQUEEGEESTROKE.AbouttosetSQUEEGEESTROKE.PressNEXTtoContinue,orEXITtoquit.AbouttosetSQUEEGEESTROKE.(開始設定刮刀行程)PressNEXTtoContinue,orEXITtoQuit.(按NEXT繼續,按EXIT離開)YoumustnowjogtotheRearsqueegeeposition.YoumustnowjogtotheRearsqueegeeposition.PressNEXTtoContinue,orEXITtoquit.YoumustnowjogtotheRearsqueegeeposition.(你必須現在移動後刮刀位置)PressNEXTtoContinue,orEXITtoquit.(按NEXT繼續,按EXIT離開)JOGACTIVE…JOGACTIVE…SQUEEGEESTROKEPressEXITtoquit.(開始移動刮刀行程,完畢按EXIT離開)Youmustnowjogtothefrontsqueegeeposition.Youmustnowjogtothefrontsqueegeeposition.PressNEXTtoContinue,orEXITtoquit.Youmustnowjogtothe(你必須現在移動前刮刀位置)Rearsqueegeeposition.PressNEXTtoContinus,orEXITtoquit.(按NEXT繼續,按EXIT離開)JOGACTIVE…JOGACTIVE…SQUEEGEESTROKEPressEXITtoquit.(開始移動刮刀行程,完畢按EXIT離開)選擇PrintParameters進入印刷參數設定PrintParameters HardwareRequired:PrintParameters NoneSqueegee刮刀設定參數刮刀向下壓力[(刮刀長度X1.2)/2.2]刮刀碰到鋼板後再向下壓之距離PrintSpeed 25刮刀印刷行程之速度Entersqueegeeprintingparameters.(輸入刮刀印刷參數)(thisaffectsfrontANDrearsqueegees)(包涵前後刮刀)PressDonewhenfinished.(按Done完成)BoardParameters基板(PCB)參數設定PCB與鋼板之間隙(數字越大,間隙越大)ToolingType Unier. Dedicat.治具 不使用治具 使用治具 EnterSnapoffintosetupmenu.(輸入PCB與鋼板之間隙印刷參數)SettozeroforCONTACTprinting.(接觸式印刷時，請設為〞0”)PressDonewhenfinished.(按Done完成)SlowSnopoff慢速脫模參數設定Enabled No Yes不使用慢速脫模使用慢速脫模脫離鋼板前延遲時間慢速脫模之距離Speed 1 2 3 4 5 6慢速脫模速度 1脫模速度5mil/s 2脫模速度10mil/s 3脫模速度15mil/s 4脫模速度20mil/s 5脫模速度25mil/s 6脫模速度30mil/sEnterSlowsnapoffparameters.(輸入慢速脫模參數)PressDonewhenfinished.(按Done完成)TEACHisnowcomplete.(程式現在設定完成)PressSELECTtosavenow,or(按SELECT現在存入檔案)PressNEXTtocontinue.(按NEXT繼續回主畫面按SELECT之後,出現存入檔案鍵盤畫面PressNEXTtocontinue.(按NEXT繼續,回主畫面)2.TeachVision做一片PCB新程式的Mark點abouttoenterVISIONTEACHoperation.abouttoenterVISIONTEACHoperation.PressNEXTtoContinue,orEXITtoQuit.abouttoenterVISIONTEACHoperation.(即將進入視覺系統設定操作)PressNEXTtoContinue,orEXITtoQuit.(按NEXT繼續,按EXIT離開)你按NEXT之後，出現以下訊息：Placeaboardoninputtrack.Placeaboardoninputtrack.PressNEXTtoContinue,orEXITtoQuit.Placeaboardoninputtrack.(請將基板放到軌道輸入端)PressNEXTtoContinue,orEXITtoQuit.(按NEXT繼續,按EXIT離開)你按NEXT之後，出現以下訊息：Locatingtheboard…Locatingtheboard…ADDorDELETEtargetstochangethe(新增或刪除,所指Mark點位置或變更目currentvisionlayout.前Mark點位置)PressEXITwhenyouareFINISHED.(當你已完成Teachvision按EXIT)ADD 增加一個Mark點ADDDELETE 刪除一個Mark點DELETEVIEW 辨視做完的PC板與鋼板Mark點VIEWZOOMIN 將點選到位置扩大與縮小ZOOMIN你按ADD之後，出現以下訊息：Areyoutrainingsyntheticfiducials?Areyoutrainingsyntheticfiducials?SELECTforYES,NEXTforNOAreyoutrainingsyntheticfiducials?(你要選擇自設Mark點嗎？)SELECTforYES,NEXTforNO(按SELECT要；按NEXT不要)※當你按SELECT後,需要輸入自設選擇Mark點長、寬、高、尺寸等..)※當你按NEXT後,依影像視覺系統自行判別Mark點)按SELECT之後，出現以下視窗：※當你按SELECT後,需要輸入自設選擇Mark點長、寬、高、尺寸等..)ADDfiducialfortheBOARD(增加Mark點到PCB上)PleaseSELECTthetypeoffiducialadd.(請選擇Mark點型式)PressDONEwhenfinished.(按DONE完成)按NEXT之後，出現以下視窗：Movethetrackballpointertothearea(移動軌跡球指到PC板上Mark點位置後,whereatargetistobeAddedand按SELECT後，影像視覺系統會移動到你thepressSELECT. 所指的位置)按SELECT之後，出現以下視窗：JOGtoBoardTarget(移動到PC板上Mark點)PressNEXTforcontrastON,EXITtofinish.(按NEXT調整對比,按EXIT完成)按EXIT之後，出現以下視窗：BoardTarget1(PC板上第一個Mark點)Adjusting:Position(調整搜尋範圍框大小、尺寸)X:(搜尋範圍框X方向)Y:(搜尋範圍框Y方向)PleaseDefinetheBOARDTARGET.(請定義基板上Mark點收尋範圍的位置與尺寸)PressNEXTtoalternatebetweenPOSITION(按NEXT變換搜尋範圍框位置、尺adjustmodeandSIZEadjustmode.寸並調整)PressSELECTwhenDONE.(按SELECT完成)按SELECT完成後,會出現做第二個Mark點的訊息PressSELECTforMultiModelTeachorPressSELECTforMultiModelTeachorPressNEXTforSingleModelTeach.當做完第一個Mark點時,如果第二點與第一點形狀大小,都不一樣時按SELECT；如果第二點與第一點形狀大小,都一樣時按NEXT,此訊息主要是減少定義搜尋範圍框時間)按SELECT全部做完後，出現以下PC板上Mark點視窗：ADDorDELETEtargetstochangethe(新增或刪除,所指Mark點位置或變更目currentvisionlayout.前Mark點位置)PressEXITwhenyouareFINISHED.(當你已完成Teachvision按EXIT)按EXIT之後,出現存入檔案鍵盤畫面3.DeviceLayout做2D(錫膏覆蓋率)檢查時,所要檢查零件AbouttobeginDeviceLayoutTEACH.AbouttobeginDeviceLayoutTEACH.PressNEXTtoContinue,orEXITtoQuit.AbouttobeginDeviceLayoutTEACH.(即將開始做2D檢查的零件之設定)PressNEXTtoContinue,orEXITtoQuit.(按NEXT繼續,按EXIT離開)按NEXT之後,出現以下視窗畫面ADDorDELETEDevice(新增或刪除,所指2D零件點位置或變更目前位置)Tochangethecurrent.PressEXITwhenyouareFINISHED.(當你已完成DeviceLayout按EXIT)ADD 增加一個2D檢查點ADDDELETE 刪除一個2D檢查點DELETEZOOMIN 將點選到位置扩大與縮小ZOOMIN你按ADD之後，出現以下訊息視窗：PleaseSELECTthetypeofdevicetobeadded.(請選擇新增2D零件型式)PressEXITtoquit.(按EXIT離開)選擇QFP零件時MovethetrackballpointertotheAreaMovethetrackballpointertotheAreaWherethedeviceistobeaddedandPressSELECTMovethetrackballpointertotheArea(移動軌跡球,按SELECT點選到PCWherethedeviceistobeaddedand板上QFP零件位置)PressSELECT按SELECT之後,出現以下訊息視窗畫面JOGtotheclosestHorizontalendpad.(移動虛線,選擇QFP第一點水平Theobjectshouldbecentered.PAD點)PressEXITwhenyouareFINISHED.(按EXIT完成)PleaseDEFINEtheENDpadofthisdevice.PleaseDEFINEtheENDpadofthisdevice.PressNEXTtoalternatebetweenPOSITIONAdjustmodeandsizeadjustmode.PressEXITwhenyouareFINISHED.PleaseDEFINEtheENDpadofthisdevice.(請PAD點前後框起來)PressNEXTtoalternatebetweenPOSITION(按NEXT調整框位置、尺寸)Adjustmodeandsizeadjustmode.PressEXITwhenyouareFINISHED.(按EXIT完成)JOGtotheclosestVerticalendpad.(移動虛線,選擇QFP第一點垂直Theobjectshouldbecentered.PAD點)PresswhenyouareFINISHED.(按EXIT完成)PleaseDEFINEtheENDpadofthisdevice.PleaseDEFINEtheENDpadofthisdevice.PressNEXTtoalternatebetweenPOSITIONAdjustmodeandsizeadjustmode.PressEXITwhenyouareFINISHED.PleaseDEFINEtheENDpadofthisdevice.(將PAD點前後框起來)PressNEXTtoalternatebetweenPOSITION(按NEXT調整框位置、尺寸)Adjustmodeandsizeadjustmode.PressEXITwhenyouareFINISHED.(按EXIT完成)按EXIT之後,影像視覺系統自動搜尋QFP4.TeachID做辨識鋼板身分當有兩片一樣機種鋼板,一種為有IC零件,而另一種無IC零件,先做辨識鋼板身分以防放錯料。5.TeachCustomBGA編輯自行設計的BGA零件檔案版本)這個軟體能編輯自訂BGA，這個功能可達到50個X50的尺寸，計2500個PAD點，或單邊最大為100個PAD點，但是不能超過最大2500個PAD點。※編輯自訂一個新BGA視窗有十一個控制鈕。NEW 編輯一個新BGA。LOAD 載入已經存檔BGA檔案。SAVE 儲存已經編輯完成一個新BGA檔案。DELETE 刪除已經編輯完成BGA檔案。IMPORT 從磁片載入一個BGA檔案。EXPORT 將BGA檔案儲存到磁片。POINT 以個別方式選擇一個PAD點增加或刪除。AREA 以一個區域方式來增加或刪除PAD點。FILL 增加之前已經移走的任何PAD點。ZOOM 將BGA圖形顯示扩大與縮小。RESIZE 改變BGAPAD點陣列數尺寸。EXIT 離開編輯自訂一個新BGA視窗。6.TeachOffsetMovesPAD點與印刷完錫膏點設定位置點版本)當有印偏時先Teach所印偏PAD點位置。7.TeachVisionOffsetPAD點與印刷完錫膏點自動修正補償(修正完)做完印偏PAD點位置後,進入影像視覺系統,點取印偏兩個PAD點,螢幕上會有搜尋框,紅色框是點取印偏錫膏,黑色框是點取零件PAD點,當在Supervisor模式下做完此功能後,再到設定第一頁內Vision下,X、Y、ThetaOffset值會改變；當在Maintenance模式下做此功能後會改變內部Vision值。版本)※所以不要在Maintenance模式下做此功能。FileLoadFileSaveFileDeleteFileBackupSystemRestoreSystemFileUploadFileDownloadSaveTimingFileLoadFile載入已存入程式檔案SaveFile存入程式檔案DeleteFile刪除程式檔案BackupSystem備份機器內部資料及存入程式檔案RestoreSystem恢復備份機器內部資料及存入程式檔案到機器內硬碟FileUpload將已存入程式檔案存到磁片FileDownload將磁片內檔案回存入機器內硬碟SaveTimingFile將目前程式檔案有關時間參數存入到磁片1.LoadFile載入已存入檔案上、下頁捲軸棒所選的程式程式總數程式顯示區上、下頁捲軸棒所選的程式程式總數程式顯示區確定取消確定取消PressSELECTonscrollbartogoup/down.PressSELECTonscrollbartogoup/down.PressNEXTonscrollbartopageup/down.PressSELECTonscrollbartogoup/down.(在捲軸棒,按SELECT上下捲動)PressNEXTonscrollbartopageup/down.(在捲軸棒,按NEXT翻頁)操作程序：1.在程式顯示區找尋你所要的程式,利用捲軸棒來捲動或翻頁程式顯示區,然後點取你所要的程式。 2.點取的程式會顯示在『所選的程式』位置。 3.點取OK〔確定〕按鈕,表示要叫出程式。CANCEL〔取消〕按鈕,表示不要叫出程式。2.SaveFile儲存入檔案 當你點取File功能表上的SaveFile出現如下畫面。畫面說明 FRANK:一個程式名稱 BACKSP:倒退消除鍵 ENTER:輸入確認按鈕0~9數字鍵、26個英文字母鍵、1個空白鍵、1個『-』符號鍵:程式命名用Enterfilename.(輸入檔案名稱)Press<ENTER>whendone.(按ENTER輸入檔案名稱完成或按EXIT離開)OrEXITtoabort.ConfirmoverwriteConfirmoverwriteOKtooverwritefileOKtooverwritefile：FRANK？OKCANCELOKCANCEL(按OK後寫入檔案名稱)3.DeleteFile刪除已存入檔案程式總數上、下頁捲軸棒所選的程式程式顯示區程式總數上、下頁捲軸棒所選的程式程式顯示區取消確定取消確定PressSELECTonscrollbartogoup/down.PressSELECTonscrollbartogoup/down.PressNEXTonscrollbartopageup/down.PressSELECTonscrollbartogoup/down.(在捲軸棒,按SELECT上下捲動)PressNEXTonscrollbartopageup/down.(在捲軸棒,按NEXT翻頁)操作程序：在程式顯示區找尋你所要刪除的程式,利用捲軸棒來捲動或翻頁程式顯示區,然後點取你所要的程式。點取的程式會顯示在『所選的程式』位置。點取OK〔確定〕按鈕,表示要刪除程式。點取CANCEL〔取消〕按鈕,表示不要刪除程式。4.BackupSystem備份已存入檔案AbouttoBACKUPsystemfilesfrom:AbouttoBACKUPsystemfilesfrom:A：PressNEXTtoContinue,orEXITtoQuit.AbouttoBACKUPsystemfiles(將系統資料與程式檔案備份到A磁碟機)A：PressNEXTtoContinue,orEXITtoQuit.(按NEXT繼續,按EXIT離開)1Diskisrequiredforthisbackup.1Diskisrequiredforthisbackup.PressNEXTtoContinue,orEXITtoQuit.1Diskisrequiredforthisbackup.(需要一片磁片)PressNEXTtoContinue,orEXITtoQuit.(按NEXT繼續,按EXIT離開)※因程式檔案多寡,所需要磁片數目不同InsertblankdiskindriveA:InsertblankdiskindriveA:Disk1Disk1PressNEXTtoContinue,orEXITtoQuit.InsertblankdiskindriveA:(插入空白磁片到A磁碟機)Disk1Disk1(磁片第一片)PressNEXTtoContinue,orEXITtoQuit.(按NEXT繼續,按EXIT離開)CheckingdiskdriveCheckingdiskdrive (檢查是否為空白磁片,檢查完後開始備份系統資料與程式檔案)BackupcompleteBackupcompletePressNEXTtoContinueBackupcomplete(備份磁片完成)PressNEXTtoContinue(按NEXT繼續)5.RestoreSystem載回備份檔案磁片AbouttoRESTOREsystemfilesfrom:AbouttoRESTOREsystemfilesfrom:A：PressNEXTtoContinue,orEXITtoQuit.AbouttoRESTOREsystemfilesfrom:(將A磁碟機資料備份載回到機器A：內硬碟)PressNEXTtoContinue,orEXITtoQuit.(按NEXT繼續,按EXIT離開)InsertbackupdiskInsertbackupdisk1indriveA:PressNEXTtoContinue,orEXITtoQuit.Insertbackupdisk1indriveA:(插入備份磁片到A:磁碟機)PressNEXTtoContinue,orEXITtoQuit.(按NEXT繼續,按EXIT離開)ReadytorestoresystemReadytorestoresystemPressNEXTtoContinue,orEXITtoQuit.Readytorestoresystem(準備開始載回備份磁片)PressNEXTtoContinue,orEXITtoQuit.(按NEXT繼續,按EXIT離開)CheckingbackupCheckingbackup(檢查是否為備份磁片,檢查完後開始載回備份系統資料與程式檔案)RestoreRestorecompletePressNEXTtoContinue.Restorecomplete(載回備份磁片完成)PressNEXTtoContinue.(按NEXT繼續)6.FileUpload將已存入程式檔案存到磁片程式顯示區上、下頁捲軸棒所選的程式程式總數程式顯示區上、下頁捲軸棒所選的程式程式總數取消確定取消確定PressSELECTonscrollbartogoup/down.PressSELECTonscrollbartogoup/down.PressNEXTonscrollbartopageup/down.PressSELECTonscrollbartogoup/down.(在捲軸棒,按SELECT上下捲動)PressNEXTonscrollbartopageup/down.(在捲軸棒,按NEXT翻頁)操作程序：1.在程式顯示區找尋你所要的程式,利用捲軸棒來捲動或翻頁程式顯示區,然後點取你所要的程式。 2.點取的程式會呈現藍色。 3.點取OK〔確定〕按鈕,表示要存入磁片。CANCEL〔取消〕按鈕,表示不要存入磁片。Filetransfercomplete.Filetransfercomplete.1filestransferredPressNEXTtoContinue.Filetransfercomplete.(程式檔案存入到磁片已完成)1filestransferred(一個程式檔案存入到磁片)PressNEXTtoContinue.(按NEXT繼續)※因程式檔案多寡,所顯示程式檔案訊息不同7.FileDownload將磁片內檔案回存入機器內硬碟程式顯示區上、下頁捲軸棒程式總數所選的程式程式顯示區上、下頁捲軸棒程式總數所選的程式取消確定取消確定PressSELECTonscrollbartogoup/down.PressSELECTonscrollbartogoup/down.PressNEXTonscrollbartopageup/down.PressSELECTonscrollbartogoup/down.(在捲軸棒,按SELECT上下捲動)PressNEXTonscrollbartopageup/down.(在捲軸棒,按NEXT翻頁)操作程序：1.在程式顯示區找尋你所要的程式,利用捲軸棒來捲動或翻頁程式顯示區,然後點取你所要的程式。 2.點取的程式會呈現藍色。 3.點取OK〔確定〕按鈕,表示要從磁片存入機器內硬碟機。CANCEL〔取消〕按鈕,表示不要從磁片存入機器內硬碟機。ConfirmoverwriteConfirmoverwriteOKtooverwritefileOKtooverwritefile：FRANK？CANCELSKIPOKCANCELSKIPOK(按OK後從磁片存入機器內硬碟機)Filetransfercomplete.Filetransfercomplete.1filestransferredPressNEXTtoContinue.Filetransfercomplete.(程式檔案存入到磁片已完成)1filestransferred(一個程式檔案存入到磁片)PressNEXTtoContinue.(按NEXT繼續)※因程式檔案多寡,所顯示程式檔案訊息不同8.SaveTimingFile將目前程式檔案有關時間參數存入到磁片※此功能是將目前生產程式檔案內,有關時間參數存入到磁碟片中,如印刷完一片所需時間、等待時間等等…..UtilitiesLoadBoardStencilHeightSetStrokeLevelSqueegeeSqueegeeHeightKneadPasteCycleSqueegeeCycleWiperCycleDispenserVerifyStencilCalPrestopPositionECUUtilitiesLoadBoard載入PC板於中心點位置及視覺系統位置,頂到鋼板位置StencilHeight測PC板到鋼板高度SetStroke設定刮刀組行程LevelSqueegee測前/後刮刀到鋼板高度(可程式刮刀組用)SqueegeeHeight測前/後刮刀到鋼板高度(標準刮刀組用)KneadPaste手動攪拌錫膏CycleSqueegee手動更換前/後刮刀組方向CycleWiper手動擦拭鋼板一次CycleDispenser手動自動加錫器加錫一次(需有自動加錫器)VerifyStencil辨識鋼板身分CalPrestopPosition重新矫正PC板停止位置ECUUtilities溫溼度控制器設定使用視窗1.LoadBoard載入PC板於中心點位置及視覺系統位置,頂到鋼板位置LoadBoard進板指令集是將PC板送進機器內,ZAXIS將會升高到不同高度,當你在下拉式選項Utilities中選擇時,螢幕上會出現手動進板(ManualLoadBoard)的螢幕如上圖。鋼板高度(StencilHeight)：將PC板上升至鋼板的高度,這是可以查看PC板是否完全密和頂到鋼板及PC板與鋼板有無對位。鏡頭高度(VisionHeight)：將PC板上升至視覺影像高度,這是可以查看PC板Mark點是否錯誤。定位工具高度(ToolingHeight)：將PC板上升至定位工具高度,這是可以查看PC板吸真空是否定位优良及調整支撐PIN(SupportPIN)位置。4.Begin：開始送板到印刷區位置並依照上述設定上升高度5.Detent：載入PC板向前與向後於中心點位置6.Exit：跳出手動進板的畫面,回到主畫面2.StencilHeight測PCB板到鋼板厚度ThisutilitywillthesetThisutilitywillthesetSTENCILheight.PressNEXTtoContinue,orEXITtoQuit.ThisutilitywillthesetSTENCILheight.(要開始使用偵測鋼板高度)PressNEXTtoContinue,orEXITtoQuit.(按NEXT繼續,按EXIT離開)你按NEXT之後，出現以下訊息及視窗：CAUTION,Themachineisnowgoingtomove.STAYCLEAR.PressNEXTtoContinue,orEXITtoQuit.CAUTION,Themachineisnowgoingtomove.STAYCLEAR.PressNEXTtoContinue,orEXITtoQuit.CAUTION,Themachineisnowgoingto(警告,機器現在要移動,內部不能有 move.STAYCLEAR.任何東西,需清除)PressNEXTtoContinue,orEXITtoQuit.(按NEXT繼續,按EXIT離開)你按NEXT之後，出現以下訊息及視窗：PressSELECTtoJOGthesensorclearofpasteorstencilapertures,orPressNEXTtoCONTINUE.PressSELECTtoJOGthesensorclearofpasteorstencilapertures,orPressNEXTtoCONTINUE.PressSELECTorNEXTtoContinue.PressSELECTtoJOGthesensorclearof(按SELECT移動偵測感應器,以 pasteorstencilapertures,免碰到鋼板上錫膏及鋼板上PAD孔) orPressNEXTtoCONTINUE.(按NEXT馬上開始在本位置偵測鋼板高度