PCB专业用语总集(doc-18)

pcb专业用语综合词汇

1、印制电路：printedcircuit

2、印制线路：printedwiring

3、印制板：printedboard

4、印制板电路：printedcircuitboard(pcb)

5、印制线路板：printedwiringboard(pwb)

6、印制元件：printedcomponent

7、印制接点：printedcontact

8、印制板装配：printedboardassembly

9、板：board

10、单面印制板：single-sidedprintedboard(ssb)

11、双面印制板：double-sidedprintedboard(dsb)

12、多层印制板：mulitlayerprintedboard(mlb)

13、多层印制电路板：mulitlayerprintedcircuitboard

14、多层印制线路板：mulitlayerpritedwiringboard

15、刚性印制板：rigidprintedboard

16、刚性单面印制板：rigidsingle-sidedprintedborad

17、刚性双面印制板：rigiddouble-sidedprintedborad

18、刚性多层印制板：rigidmultilayerprintedboard

19、挠性多层印制板：flexiblemultilayerprintedboard

20、挠性印制板：flexibleprintedboard

21、挠性单面印制板：flexiblesingle-sidedprintedboard

22、挠性双面印制板：flexibledouble-sidedprintedboard

23、挠性印制电路：flexibleprintedcircuit(fpc)

24、挠性印制线路：flexibleprintedwiring

25、刚性印制板：flex-rigidprintedboard,rigid-flexprintedboard

26、刚性双面印制板：flex-rigiddouble-sidedprintedboard,rigid-flexdouble-sidedprinted

27、刚性多层印制板：flex-rigidmultilayerprintedboard,rigid-flexmultilayerprintedboard

28、齐平印制板：flushprintedboard

29、金属芯印制板：metalcoreprintedboard

30、金属基印制板：metalbaseprintedboard

31、多重布线印制板：mulit-wiringprintedboard

32、陶瓷印制板：ceramicsubstrateprintedboard

33、导电胶印制板：electroconductivepasteprintedboard

34、模塑电路板：moldedcircuitboard

35、模压印制板：stampedprintedwiringboard

36、顺序层压多层印制板：sequentially-laminatedmulitlayer

37、散线印制板：discretewiringboard

38、微线印制板：microwireboard

39、积层印制板：buile-upprintedboard中国最大的资料库下载

40、积层多层印制板：build-upmulitlayerprintedboard(bum)

41、积层挠印制板：build-upflexibleprintedboard

42、外表层合电路板：surfacelaminarcircuit(slc)

43、埋入凸块连印制板：b2itprintedboard

44、多层膜基板：multi-layeredfilmsubstrate(mfs)

45、层间全内导通多层印制板：alivhmultilayerprintedboard

46、载芯片板：chiponboard(cob)

47、埋电阻板：buriedresistanceboard

48、母板：motherboard

49、子板：daughterboard

50、背板：backplane

51、裸板：bareboard

52、键盘板夹心板：copper-invar-copperboard

53、动态挠性板：dynamicflexboard

54、静态挠性板：staticflexboard

55、可断拼板：break-awayplanel

56、电缆：cable

57、挠性扁平电缆：flexibleflatcable(ffc)

58、薄膜开关：membraneswitch

59、混合电路：hybridcircuit

60、厚膜：thickfilm

61、厚膜电路：thickfilmcircuit

62、薄膜：thinfilm

63、薄膜混合电路：thinfilmhybridcircuit

64、互连：interconnection

65、导线：conductortraceline

66、齐平导线：flushconductor

67、传输线：transmissionline

68、跨交：crossover

69、板边插头：edge-boardcontact

70、增强板：stiffener

71、基底：substrate

72、基板面：realestate

73、导线面：conductorside

74、元件面：componentside

75、焊接面：solderside

76、印制：printing

77、网格：grid

78、图形：pattern

79、导电图形：conductivepattern

80、非导电图形：non-conductivepattern

81、字符：legend

82、标志：mark

二、基材：

1、基材：basematerial

2、层压板：laminate

3、覆金属箔基材：metal-cladbadematerial

4、覆铜箔层压板：copper-cladlaminate(ccl)

5、单面覆铜箔层压板：single-sidedcopper-cladlaminate

6、双面覆铜箔层压板：double-sidedcopper-cladlaminate

7、复合层压板：compositelaminate

8、薄层压板：thinlaminate

9、金属芯覆铜箔层压板：metalcorecopper-cladlaminate

10、金属基覆铜层压板：metalbasecopper-cladlaminate

11、挠性覆铜箔绝缘薄膜：flexiblecopper-claddielectricfilm

12、基体材料：basismaterial

13、预浸材料：prepreg

14、粘结片：bondingsheet

15、预浸粘结片：preimpregnatedbondingsheer

16、环氧玻璃基板：epoxyglasssubstrate

17、加成法用层压板：laminateforadditiveprocess

18、预制内层覆箔板：masslaminationpanel

19、内层芯板：corematerial

20、催化板材：catalyzedboard,coatedcatalyzedlaminate

21、涂胶催化层压板：adhesive-coatedcatalyzedlaminate

22、涂胶无催层压板：adhesive-coateduncatalyzedlaminate

23、粘结层：bondinglayer

24、粘结膜：filmadhesive

25、涂胶粘剂绝缘薄膜：adhesivecoateddielectricfilm

26、无支撑胶粘剂膜：unsupportedadhesivefilm

27、覆盖层：coverlayer(coverlay)

28、增强板材：stiffenermaterial

29、铜箔面：copper-cladsurface

30、去铜箔面：foilremovalsurface

31、层压板面：uncladlaminatesurface

32、基膜面：basefilmsurface

33、胶粘剂面：adhesivefaec

34、原始光洁面：platefinish

35、粗面：mattfinish

36、纵向：lengthwisedirection

37、模向：crosswisedirection

38、剪切板：cuttosizepanel

39、酚醛纸质覆铜箔板：phenoliccellulosepapercopper-cladlaminates(phenolic/paperccl)

40、环氧纸质覆铜箔板：epoxidecellulosepapercopper-cladlaminates(epoxy/paperccl)

41、环氧玻璃布基覆铜箔板：epoxidewovenglassfabriccopper-cladlaminates

42、环氧玻璃布纸复合覆铜箔板：epoxidecellulosepapercore,glassclothsurfacescopper-cladlaminates

43、环氧玻璃布玻璃纤维复合覆铜箔板：epoxidenonwoven/wovenglassreinforcedcopper-cladlaminates

44、聚酯玻璃布覆铜箔板：ployesterwovenglassfabriccopper-cladlaminates

45、聚酰亚胺玻璃布覆铜箔板：polyimidewovenglassfabriccopper-cladlaminates

46、双马来酰亚胺三嗪环氧玻璃布覆铜箔板：bismaleimide/triazine/epoxidewovenglassfabriccopper-cladlamimates

47、环氧合成纤维布覆铜箔板：epoxidesyntheticfiberfabriccopper-cladlaminates

48、聚四乙烯玻璃纤维覆铜箔板：teflon/fiberglasscopper-cladlaminates

49、超薄型层压板：ultrathinlaminate

50、陶瓷基覆铜箔板：ceramicsbasecopper-cladlaminates

51、紫外线阻挡型覆铜箔板：uvblockingcopper-cladlaminates

三、基材的材料

1、a阶树脂：a-stageresin

2、b阶树脂：b-stageresin

3、c阶树脂：c-stageresin

4、环氧树脂：epoxyresin

5、酚醛树脂：phenolicresin

6、聚酯树脂：polyesterresin

7、聚酰亚胺树脂：polyimideresin

8、双马来酰亚胺三嗪树脂：bismaleimide-triazineresin

9、丙烯酸树脂：acrylicresin

10、三聚氰胺甲醛树脂：melamineformaldehyderesin

11、多官能环氧树脂：polyfunctionalepoxyresin

12、溴化环氧树脂：brominatedepoxyresin

13、环氧酚醛：epoxynovolac

14、氟树脂：fluroresin

15、硅树脂：siliconeresin

16、硅烷：silane

17、聚合物：polymer

18、无定形聚合物：amorphouspolymer

19、结晶现象：crystallinepolamer

20、双晶现象：dimorphism

21、共聚物：copolymer

22、合成树脂：synthetic

23、热固性树脂：thermosettingresin

24、热塑性树脂：thermoplasticresin

25、感光性树脂：photosensitiveresin

26、环氧当量：weightperepoxyequivalent(wpe)

27、环氧值：epoxyvalue

28、双氰胺：dicyandiamide

29、粘结剂：binder

30、胶粘剂：adesive

31、固化剂：curingagent

32、阻燃剂：flameretardant

33、遮光剂：opaquer

34、增塑剂：plasticizers

35、不饱和聚酯：unsatuiatedpolyester

36、聚酯薄膜：polyester

37、聚酰亚胺薄膜：polyimidefilm(pi)

38、聚四氟乙烯：polytetrafluoetylene(ptfe)

39、聚全氟乙烯丙烯薄膜：perfluorinatedethylene-propylenecopolymerfilm(fep)

40、增强材料：reinforcingmaterial

41、玻璃纤维：glassfiber

42、e玻璃纤维：e-glassfibre

43、d玻璃纤维：d-glassfibre

44、s玻璃纤维：s-glassfibre

45、玻璃布：glassfabric

46、非织布：non-wovenfabric

47、玻璃纤维垫：glassmats

48、纱线：yarn

49、单丝：filament

50、绞股：strand

51、纬纱：weftyarn

52、经纱：warpyarn

53、但尼尔：denier

54、经向：warp-wise

55、纬向：weft-wise,filling-wise

56、织物经纬密度：threadcount

57、织物组织：weavestructure

58、平纹组织：plainstructure

59、坏布：greyfabric

60、稀松织物：wovenscrim

61、弓纬：bowofweave

62、断经：endmissing

63、缺纬：mis-picks

64、纬斜：bias

65、折痕：crease

66、云织：waviness

67、鱼眼：fisheye

68、毛圈长：featherlength

69、厚薄段：mark

70、裂缝：split

71、捻度：twistofyarn

72、浸润剂含量：sizecontent

73、浸润剂残留量：sizeresidue

74、处理剂含量：finishlevel

75、浸润剂：size

76、偶联剂：couplintagent

77、处理织物：finishedfabric

78、聚酰胺纤维：polyarmidefiber

79、聚酯纤维非织布：non-wovenpolyesterfabric

80、浸渍绝缘纵纸：impregnatinginsulationpaper

81、聚芳酰胺纤维纸：aromaticpolyamidepaper

82、断裂长：breakinglength

83、吸水高度：heightofcapillaryrise

84、湿强度保存率：wetstrengthretention

85、白度：whitenness

86、陶瓷：ceramics

87、导电箔：conductivefoil

88、铜箔：copperfoil

89、电解铜箔：electrodepositedcopperfoil(edcopperfoil)

90、压延铜箔：rolledcopperfoil

91、退火铜箔：annealedcopperfoil

92、压延退火铜箔：rolledannealedcopperfoil(racopperfoil)

93、薄铜箔：thincopperfoil

94、涂胶铜箔：adhesivecoatedfoil

95、涂胶脂铜箔：resincoatedcopperfoil(rcc)

96、复合金属箔：compositemetallicmaterial

97、载体箔：carrierfoil

98、殷瓦：invar

99、箔〔剖面〕轮廓：foilpro、光面：shinyside

101、粗糙面：matteside

102、处理面：treatedside

103、防锈处理：stainproofing

104、双面处理铜箔：doubletreatedfoil

四、设计

1、原理图：shematicdiagram

2、逻辑图：logicdiagram

3、印制线路布设：printedwirelayout

4、布设总图：masterdrawing

5、可制造性设计：design-for-manufacturability

6、计算机辅助设计：computer-aideddesign.(cad)

7、计算机辅助制造：computer-aidedmanufacturing.(cam)

8、计算机集成制造：computerintegratmanufacturing.(cim)

9、计算机辅助工程：computer-aidedengineering.(cae)

10、计算机辅助测试：computer-aidedtest.(cat)

11、电子设计自动化：electricdesignautomation.(eda)

12、工程设计自动化：engineeringdesignautomaton.(eda2)

13、组装设计自动化：assemblyaidedarchitecturaldesign.(aaad)

14、计算机辅助制图：computeraideddrawing

15、计算机控制显示：computercontrolleddisplay.(ccd)

16、布局：placement

17、布线：routing

18、布图设计：layout

19、重布：rerouting

20、模拟：simulation

21、逻辑模拟：logicsimulation

22、电路模拟：circitsimulation

23、时序模拟：timingsimulation

24、模块化：modularization

25、布线完成率：layouteffeciency

26、机器描述格式：machinedescriptionmformat.(mdf)

27、机器描述格式数据库：mdfdatabse

28、设计数据库：designdatabase

29、设计原点：designorigin

30、优化〔设计〕：optimization(design)

31、供设计优化坐标轴：predominantaxis

32、表格原点：tableorigin

33、镜像：mirroring

34、驱动文件：drive、中间文件：intermediate、制造文件：manufacturingdocumentation

37、队列支撑数据库：queuesupportdatabase

38、元件安置：componentpositioning

39、图形显示：graphicsdispaly

40、比例因子：scalingfactor

41、扫描填充：scanfilling

42、矩形填充：rectanglefilling

43、填充域：regionfilling

44、实体设计：physicaldesign

45、逻辑设计：logicdesign

46、逻辑电路：logiccircuit

47、层次设计：hierarchicaldesign

48、自顶向下设计：top-downdesign

49、自底向上设计：bottom-updesign

50、线网：net

51、数字化：digitzing

52、设计规那么检查：designrulechecking

53、走〔布〕线器：router(cad)

54、网络表：netlist

55、计算机辅助电路分析：computer-aidedcircuitanalysis

56、子线网：subnet

57、目标函数：objectivefunction

58、设计后处理：postdesignprocessing(pdp)

59、交互式制图设计：interactivedrawingdesign

60、费用矩阵：costmetrix

61、工程图：engineeringdrawing

62、方块框图：blockdiagram

63、迷宫：moze

64、元件密度：componentdensity

65、巡回售货员问题：travelingsalesmanproblem

66、自由度：degreesfreedom

67、入度：outgoingdegree

68、出度：incomingdegree

69、曼哈顿距离：manhattondistance

70、欧几里德距离：euclideandistance

71、网络：network

72、阵列：array

73、段：segment

74、逻辑：logic

75、逻辑设计自动化：logicdesignautomation

76、分线：separatedtime

77、分层：separatedlayer

78、定顺序：definitesequence

五、形状与尺寸：

1、导线〔通道〕：conduction(track)

2、导线〔体〕宽度：conductorwidth

3、导线距离：conductorspacing

4、导线层：conductorlayer

5、导线宽度/间距：conductorline/space

6、第一导线层：conductorlayerno.1

7、圆形盘：roundpad

8、方形盘：squarepad

9、菱形盘：diamond