常压容器设备强度计算书(模板)

内压圆筒体(NB/T47003.1-2009),,,,,,内压椭圆形封头(NB/T47003.1-2009),,,,,,内压碟形封头(NB/T47003.1-2009),,,,,,内压平盖(NB/T47003.1-2009),,,,,,内压筒体开孔补强(NB/T47003.1-2009),,,,,,,内压筒体开孔补强(NB/T47003.1-2009),,,,,,,内压椭圆封头开孔补强(NB/T47003.1-2009),,,,,,,内压椭圆封头开孔补强(NB/T47003.1-2009),,,,,,,内压碟形封头开孔补强(NB/T47003.1-2009),,,,,,,内压碟形封头开孔补强(NB/T47003.1-2009),,,,,,,内压平盖开孔补强(NB/T47003.1-2009),,,,,,,内压平盖开孔补强(NB/T47003.1-2009),,,,,,

设计条件,,,单位,简图,,设计条件,,,单位,简图,,设计条件,,,单位,简图,,设计条件,,,单位,简图,,设计条件,,,,单位,管口号：,E1,开孔补强计算,,,,,单位,,设计条件,,,,单位,管口号：,,开孔补强计算,,,,,单位,,设计条件,,,,单位,管口号：,,开孔补强计算,,,,,单位,,设计条件,,,,单位,管口号：,,开孔补强计算,,,,,单位,

设计压力,P,0,Mpa,,,设计压力,P,0,Mpa,,,设计压力,P,0,Mpa,,,设计压力,P,0,Mpa,,,设计压力,,P,0,Mpa,,,圆筒开孔所需的补强面积,,A=dδ=,,6.26,mm2,,设计压力,,P,0,Mpa,,,椭圆封头开孔所需的补强面积,,A=dδ=,,10.17,mm2,,设计压力,,P,0,Mpa,,,碟形封头开孔所需的补强面积,,A=dδ=,,0.00,mm2,,设计压力,,P,0,Mpa,,,平盖开孔所需的补强面积,,A=0.5dδp=,,106.56,mm2,

物料密度,ρ,997,kg/m3,,,物料密度,ρ,997,kg/m3,,,物料密度,ρ,997,kg/m3,,,物料密度,ρ,997,kg/m3,,,物料密度,,ρ,997,kg/m3,,,有效补强宽度,,B=2d,,99.4,mm,,物料密度,,ρ,997,kg/m3,,,有效补强宽度,,B=2d,,53.2,mm,,物料密度,,ρ,997,kg/m3,,,有效补强宽度,,B=2d,,53.2,mm,,物料密度,,ρ,997,kg/m3,,,有效补强宽度,,B=2d,,53.2,mm,

重力加速度,g,10,N/kg,,,重力加速度,g,10,N/kg,,,重力加速度,g,10,N/kg,,,重力加速度,g,10,N/kg,,,重力加速度,,g,10,N/kg,,,壳体有效厚度减去计算厚度之外的多余面积A1=(B-d)(δe-δ)=,,,,277.03,mm2,,重力加速度,,g,10,N/kg,,,壳体有效厚度减去计算厚度之外的多余面积A1=(B-d)(δe-δ)=,,,,141.45,mm2,,重力加速度,,g,10,N/kg,,,壳体有效厚度减去计算厚度之外的多余面积A1=(B-d)(δe-δ)=,,,,95.07,mm2,,重力加速度,,g,10,N/kg,,,壳体有效厚度减去计算厚度之外的多余面积A1=(B-d)(δe-δ)=,,,,44.90,mm2,

液面高度,h,1860,mm,,,液面高度,h,4000,mm,,,液面高度,h,1860,mm,,,液面高度,h,1860,mm,,,液面高度,,h,1300,mm,,,外伸接管有效厚度减去计算厚度之外的多余面积A2=2h1(δet-δt)=,,,,176.76,mm2,,液面高度,,h,1100,mm,,,外伸接管有效厚度减去计算厚度之外的多余面积A2=2h1(δet-δt)=,,,,18.12,mm2,,液面高度,,h,1860,mm,,,外伸接管有效厚度减去计算厚度之外的多余面积A2=2h1(δet-δt)=,,,,724.69,mm2,,液面高度,,h,1860,mm,,,外伸接管有效厚度减去计算厚度之外的多余面积A2=2h1(δet-δt)=,,,,93.45,mm2,

液注静压力,ρgh,0.019,Mpa,,,液注静压力,ρgh,0.040,Mpa,,,液注静压力,ρgh,0.019,Mpa,,,液注静压力,ρgh,0.019,Mpa,,,液注静压力,,ρgh,0.013,Mpa,,,内伸接管有效厚度减去计算厚度之外的多余面积A3=2h2(δet-C2)=,,,,0.00,mm2,,液注静压力,,ρgh,0.011,Mpa,,,内伸接管有效厚度减去计算厚度之外的多余面积A3=2h2(δet-C2)=,,,,0.00,mm2,,液注静压力,,ρgh,0.019,Mpa,,,内伸接管有效厚度减去计算厚度之外的多余面积A3=2h2(δet-C2)=,,,,0.00,mm2,,液注静压力,,ρgh,0.019,Mpa,,,内伸接管有效厚度减去计算厚度之外的多余面积A3=2h2(δet-C2)=,,,,0.00,mm2,

计算压力P+ρgh,PC,0.019,Mpa,,,计算压力P+ρgh,PC,0.040,Mpa,,,计算压力P+ρgh,PC,0.019,Mpa,,,计算压力P+ρgh,PC,0.019,Mpa,,,计算压力P+ρgh,,PC,0.013,Mpa,,,有效补强范围截面积Ae=A1+A2+A3=,,,,453.80,mm2,,计算压力P+ρgh,,PC,0.011,Mpa,,,有效补强范围截面积Ae=A1+A2+A3=,,,,159.57,mm2,,计算压力P+ρgh,,PC,0.019,Mpa,,,有效补强范围截面积Ae=A1+A2+A3=,,,,819.76,mm2,,计算压力P+ρgh,,PC,0.019,Mpa,,,有效补强范围截面积Ae=A1+A2+A3=,,,,138.35,mm2,

设计温度,t,80,℃,,,设计温度,t,80,℃,,,设计温度,t,80,℃,,,设计温度,t,80,℃,,,设计温度,,t,80,℃,,,,,,,,,,设计温度,,t,80,℃,,,,,,,,,,设计温度,,t,80,℃,,,,,,,,,,设计温度,,t,80,℃,,,,,,,,,

筒体内径,Di,1500,mm,,,凸形封头内直径或锥形封头大端内直径,Dhi,1500,mm,,,球面部分内半径,Ri,1500,mm,,,平盖计算直径,Dc,1500,mm,,,接管内径,,di,49.1,mm,,,判断,Ae≥A,则开孔不需另加补强,,,,,接管内径,,di,22,mm,,,判断,Ae≥A,则开孔不需另加补强,,,,,接管内径,,di,22,mm,,,判断,Ae≥A,则开孔不需另加补强,,,,,接管内径,,di,22,mm,,,判断,Ae≥A,则开孔不需另加补强,,,,

筒体材料,,06Cr19Ni10,,,,封头材料,,06Cr19Ni10,,,,封头材料,,06Cr19Ni10,,,,封头材料,,06Cr19Ni10,,,,接管厚度负偏差,,C1,0.3,mm,,,,Ae＜A,则开孔需另加补强,,,,,接管厚度负偏差,,C1,0.3,mm,,,,Ae＜A,则开孔需另加补强,,,,,接管厚度负偏差,,C1,0.3,mm,,,,Ae＜A,则开孔需另加补强,,,,,接管厚度负偏差,,C1,0.3,mm,,,,Ae＜A,则开孔需另加补强,,,,

试验温度下屈服强度,ReL,137,Mpa,,,试验温度下屈服强度,ReL,235,Mpa,,,试验温度下屈服强度,ReL,137,Mpa,,,试验温度下屈服强度,ReL,137,Mpa,,,接管腐蚀裕量,,C2,0,mm,,,,,,,,,,接管腐蚀裕量,,C2,2,mm,,,,,,,,,,接管腐蚀裕量,,C2,2,mm,,,,,,,,,,接管腐蚀裕量,,C2,2,mm,,,,,,,,,

常温下材料许用应力,[σ],137,Mpa,,,常温下材料许用应力,[σ],140,Mpa,,,常温下材料许用应力,[σ],137,Mpa,,,常温下材料许用应力,[σ],137,Mpa,,,厚度附加量,,C,0.3,mm,,,Ae≥A,,,,可行,,,厚度附加量,,C,2.3,mm,,,Ae≥A,,,,可行,,,厚度附加量,,C,2.3,mm,,,Ae≥A,,,,可行,,,厚度附加量,,C,2.3,mm,,,Ae≥A,,,,可行,,

设计温度下材料许用应力,[σ]t,130,Mpa,,,设计温度下材料许用应力,[σ]t,92,Mpa,,,设计温度下材料许用应力,[σ]t,130,Mpa,,,设计温度下材料许用应力,[σ]t,130,Mpa,,,开孔直径,,d,49.7,mm,,,,,,,,,,开孔直径,,d,26.6,mm,,,,,,,,,,开孔直径,,d,26.6,mm,,,,,,,,,,开孔直径,,d,26.6,mm,,,,,,,,,

钢板厚度负偏差,C1,0.3,mm,,,钢板厚度负偏差+减薄量,C1,1.56,mm,,,钢板厚度负偏差+减薄量,C1,0.3,mm,,,钢板厚度负偏差,C1,0.3,mm,,,圆筒开孔处的计算厚度,,δ,0.13,mm,,,补强圈补强,,,,,,,椭圆封头开孔处的计算厚度,,δ,0.38,mm,,,补强圈补强,,,,,,,碟形封头开孔处的计算厚度,,δ,0.00,mm,,,补强圈补强,,,,,,,平盖结构特征系数,,Kp,0.20,mm,,,补强圈补强,,,,,,

腐蚀裕量,C2,0,mm,,,腐蚀裕量,C2,3,mm,,,腐蚀裕量,C2,0,mm,,,腐蚀裕量,C2,0,mm,,,圆筒或椭圆封头内直径,,Di,1500,mm,,,补强圈取与壳体相同材料,,,,,,,圆筒或椭圆封头内直径,,Di,1600,mm,,,补强圈取与壳体相同材料,,,,,,,圆筒或椭圆封头内直径,,Di,1600,mm,,,补强圈取与壳体相同材料,,,,,,,圆筒或椭圆封头内直径,,Di,1600,mm,,,补强圈取与壳体相同材料,,,,,,

焊接接头系数,φ,0.85,,,,焊接接头系数,φ,0.85,,,,焊接接头系数,φ,0.85,,,,焊接接头系数,φ,1,,,,设计温度下接管材料许用应力,,[σ]t,137,Mpa,,,取最小值,补强圈外径D=,,,,mm,0,设计温度下接管材料许用应力,,[σ]t,137,Mpa,,,取最小值,补强圈外径D=,,,,mm,0,设计温度下接管材料许用应力,,[σ]t,137,Mpa,,,取最小值,补强圈外径D=,,,,mm,0,设计温度下接管材料许用应力,,[σ]t,137,Mpa,,,取最小值,补强圈外径D=,,,,mm,0

壁厚计算,,,,,,封头形状系数,K,1,,,,封头形状系数,M,1,,,,结构特征系数,Kp,0.2,,,,接管焊接接头系数,,φ,1,,,,,补强圈有效宽度B=2d=,,,99.4,mm,,接管焊接接头系数,,φ,1,,,,,补强圈有效宽度B=2d=,,,53.2,mm,,接管焊接接头系数,,φ,1,,,,,补强圈有效宽度B=2d=,,,53.2,mm,,接管焊接接头系数,,φ,1,,,,,补强圈有效宽度B=2d=,,,53.2,mm,

壳体最小厚度min(mm),,碳钢低合金钢≥,,3,取较大值,壁厚计算,,,,,,壁厚计算,,,,,,壁厚计算,,,,,,取最小值,接管实际外伸高度,h1,100,mm,16.68,,补强圈取与壳体相同厚度,,,,,,,椭圆封头曲面深度,,hi,375,mm,,,补强圈取与壳体相同厚度,,,,,,,碟形封头内球面半径,,Ri,1500,mm,,,补强圈取与壳体相同厚度,,,,,,,取最小值,接管实际外伸高度,h1,100,mm,12.63,,补强圈取与壳体相同厚度,,,,,,

（不包括腐蚀裕量）,,不锈钢≥,,2,,计算厚度δh=KPcDhi/2[σ]tφ=,,,0.38,mm,,计算厚度δh=MPcRhi/2[σ]tφ=,,,0.13,mm,,计算厚度δp=Dc√KpPc/[σ]tφ=,,,8.01,mm,,,√dδnt,,16.68,mm,,,适用于标准补强圈JB/T4736-2002,,,,,,,椭圆封头形状系数[2+（Di/2hi）2]/6,,K1,1.09,,,,适用于标准补强圈JB/T4736-2002,,,,,,,取最小值,接管实际外伸高度,h1,100,mm,97.98,,适用于标准补强圈JB/T4736-2002,,,,,,,,√dδnt,,12.63,mm,,,适用于标准补强圈JB/T4736-2002,,,,,,

计算厚度δ=PcDi/2[σ]tφ=,,,0.13,mm,,,,,,,,,,,,,,,,,,,,取最小值,接管实际内伸高度,h2,0,mm,0.00,,,,,,,,,开孔位于以椭圆形封头中心80%内直径范围开孔处的计算厚度,,δ,0.12,mm,,,,,,,,,,,√dδnt,,97.98,mm,,,,,,,,,,取最小值,接管实际内伸高度,h2,0,mm,0.00,,,,,,,,

,,,,,,壁厚附加量C=C1+C2=,,,4.56,mm,,壁厚附加量C=C1+C2=,,,0.3,mm,,壁厚附加量C=C1+C2=,,,0.3,mm,,,√dδnt,,16.68,mm,,,,,,,,,,,,,,,δ=PcK1Di/2[σ]tφ,,,,,,,,,取最小值,接管实际外伸高度,h2,0,mm,0.00,,,,,,,,,,√dδnt,,12.63,mm,,,,,,,,,

壁厚附加量C=C1+C2=,,,0.3,mm,,设计厚度δ`n=δ+C=,,,4.94,mm,,设计厚度δ`n=δ+C=,,,0.43,mm,,设计厚度δ`n=δ+C=,,,8.31,mm,,接管的名义厚度,,δnt,5.6,mm,,,,,,,,,,取最小值,接管实际外伸高度,h1,100,mm,,,,,,,,,,,√dδnt,,97.98,mm,,,,,,,,,,接管的名义厚度,,δnt,6,mm,,,,,,,,,

设计厚度δ`n=δ+C=,,,2.30,mm,,名义厚度取δn=δh+C2+C1+圆整,,,8,mm,,名义厚度取δn=δh+C2+C1+圆整,,,6,mm,,名义厚度取δn=δh+C2+C1+圆整,,,10,mm,,壳体开孔处的有效厚度,,δe,5.7,mm,,,,,,,,,,,√dδnt,,2.45,mm,2.45,,,,,,,,,接管的名义厚度,,δnt,6,mm,,,,,,,,,,壳体开孔处的有效厚度,,δe,7.7,mm,,,,,,,,,

名义厚度取δn=δ+C2+C1+圆整,,,6,mm,,有效厚度δhe=δn-C=,,,3.44,mm,,有效厚度δhe=δn-C=,,,5.7,mm,,有效厚度δhe=δn-C=,,,9.7,mm,,接管的有效厚度,,δet,5.3,mm,,,,,,,,,,取最小值,接管实际内伸高度,h2,0,mm,,,,,,,,,,壳体开孔处的有效厚度,,δe,3.7,mm,,,,,,,,,,接管的有效厚度,,δet,3.7,mm,,,,,,,,,

有效厚度δe=δn-C=,,,5.7,mm,,液压试验时应力效核,,,,,,液压试验时应力效核,,,,,,液压试验时应力效核,,,,,,接管的计算厚度,,δt,0.002,mm,δt=PcDi/2[σ]tφ,,,,,,,,,,√dδnt,,2.45,mm,0.00,,,,,,,,,接管的有效厚度,,δet,3.7,mm,,,,,,,,,,接管的计算厚度,,δt,0.001,mm,δt=PcDi/2[σ]tφ,,,,,,,,

液压试验时应力效核,,,,,,液压试验压力（取较大值）,PT=1.25Pc[σ]/[σ]t=,,0.08,Mpa,0.075858696,液压试验压力（取较大值）,PT=1.25Pc[σ]/[σ]t=,,0.02,Mpa,0.05,液压试验压力（取较大值）,PT=1.25Pc[σ]/[σ]t=,,0.02,Mpa,0.05,,,,,,,,,,,,,,,接管的名义厚度,,δnt,6,mm,,,,,,,,,,接管的计算厚度,,δt,0.002,mm,δt=PcRi/2[σ]tφ,,,,,,,,,,,,,,,,,,,,,,

液压试验压力（取较大值）,PT=1.25P[σ]/[σ]t=,,0,Mpa,0.05,,,,0.05,Mpa,,,,,0.05,Mpa,,,,,0.05,Mpa,,,,,,,,,,,,,,,,壳体开孔处的有效厚度,,δe,5.7,mm,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,

,,,0.05,Mpa,,试验压力下封头的应力σT=PT(Di+δe)/2δe=,,,16.58,Mpa,,试验压力下封头的应力σT=PT(Di+δe)/2δe=,,,6.60,Mpa,,试验压力下封头的应力σT=PT(Di+δe)/2δe=,,,3.89,Mpa,,,,,,,,,,,,,,,,接管的有效厚度,,δet,3.7,mm,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,

试验压力下圆筒应力σT=PT(Di+δe)/2δe=,,,6.60,Mpa,,许用值σT≤0.9φReL,,,179.78,Mpa,,许用值σT≤0.9φReL,,,104.81,Mpa,,许用值σT≤0.9φReL,,,123.30,Mpa,,,,,,,,,,,,,,,,接管的计算厚度,,δt,0.001,mm,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,

许用值σT≤0.9φReL,,,104.81,Mpa,,σT≤0.9φReL,,,可行,,,σT≤0.9φReL,,,可行,,,σT≤0.9φReL,,,可行,,,,,,,,,,,,,,,,,,,,,,δt=PcDi/2[σ]tφ,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,

σT≤0.9φReL,,,可行,,,压力计算,,,,,,压力计算,,,,,,压力计算,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,

盛水试验时应力效核,,,,,,最大允许设计压力[P]=2[σ]tφδhe/KDhi=,,,0.36,Mpa,,最大允许设计压力[P]=2[σ]tφδhe/MRhi=,,,0.84,Mpa,,最大允许设计压力[P]=2[σ]tφδhe/KpDc=,,,8.41,Mpa,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,

设计温度下圆筒计算应力,σ=PcDi/2δe,,2.44,Mpa,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,

许用值σ≤φ[σ]t,,,110.5,Mpa,,盛水试验时应力效核,,,,,,盛水试验时应力效核,,,,,,盛水试验时应力效核,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,

σ≤φ[σ]t,,,可行,,,设计温度下圆筒计算应力,σ=PcDi/2δhe,,8.69,Mpa,,设计温度下圆筒计算应力,σ=PcDi/2δhe,,2.44,Mpa,,设计温度下圆筒计算应力,σ=PcDi/2δhe,,1.43,Mpa