pcb板制作工艺流程介绍课件

HDIManufacturingProcessFlowPre-engineeringPatternimagingEtchingLaminatingDrillingCuplatingHolepluggingPatternimagingLaminationLaserAblationMechanicaldrillingPatternimagingCuplatingSolderMaskSurfaceFinishedRoutingVisualinspectionElectrictestShippingPre-engineeringPatternimagingEtchingLaminatingDrillingDesmearCuplatingHolepluggingCuplatingBeltSandingLaminationLaserAblationMechanicaldrillingCuplatingPatternimagingSolderMaskGoldplatingRoutingElectricaltestPatternimagingHolecounterShippingVisualinspection*Rawmaterial(ThinCore,Copper,Prepreg…...)RawMaterial:FR-4(Difuntional,Tetrafuntional)Supplier:EMC,Nan-YaSheetsize:36”*48”,40”*48”,42”*48CoreThickness:0.003”,0.004”,0.005”,0.006”0.008”,0.010”,0.012”,0.015”0.021”,0.031”,0.039”,0.047”CopperFoil:1/3oz,1/2oz,1.0oz,2ozPrepregtype:1080,2113,2116,1506,7628,76301.內層基板(THINCORE)LaminateCopperFoil裁板(PanelSize)

COPPERFOILEpoxyGlassPhotoResist2.內層線路製作(壓膜)(DryFilmResistCoat)EtchPhotoresist(D/F)PhotoResist3.內層線路製作(曝光)(Expose)A/WArtwork(底片)Artwork(底片)AfterExposeBeforeExpose4.內層線路製作(顯影)(Develop)PhotoResist5.內層線路製作(蝕刻)(Etch)PhotoResist6.內層線路製作(去膜)(StripResist)7.黑氧化(OxideCoating)8.疊板(Lay-up)LAYER2LAYER3LAYER4LAYER5LAYER1LAYER6Layer1Layer2Layer3Layer4CopperFoilCopperFoilInnerLayerPrepreg(膠片)Prepreg(膠片)9.壓合(Lamination)典型之多層板疊板及壓合結構...COPPERFOIL0.5OZThinCore,FR-4prepregCOMPS0LD.prepregThinCore,FR-4prepregCOPPERFOIL0.5OZ疊合用之鋼板疊合用之鋼板10-12層疊合壓合機之熱板壓合機之熱板COPPERFOIL0.5OZThinCore,FR-4prepregCOMPS0LD.prepregThinCore,FR-4prepregCOPPERFOIL0.5OZ疊合用之鋼板疊合用之鋼板墊木板鋁板10.鑽孔

(Drilling)11.電鍍Desmear&CopperDeposition12.塞孔(HolePlugging)13.去溢膠(BeltSanding)14.減銅(CopperReduction)→Option15.去溢膠(BeltSanding)→Option16.外層壓膜DryFilmLamination(Outerlayer)PhotoResist17.外層曝光ExposeUV光源18.AfterExposed19.外層顯影Develop20.蝕刻Etch20.去乾膜StripResist21.壓合(Build-upLayerLamination)RCC(ResinCoatedCopperfoil)21.護形層製作(壓膜)(ConformalMask)DryFilm(乾膜)DryFilm(乾膜)Artwork(底片)Artwork(底片)22.護形層製作(曝光)(ConformalMask)BeforeExposureAfterExposure23.護形層製作(顯像)(ConformalMask)24.護形層製作(蝕銅)(ConformalMask)25.護形層製作(去膜)(ConformalMask)26.雷射鑽孔(LaserAblation)及機械鑽孔MechanicalDrill(P.T.H.)LaserMicrovia(BlindVia)27.機械鑽孔(MechanicalDrill)28.電鍍(Desmear&CopperDeposition)29.外層線路製作(Patternimaging)壓膜(D/FLamination)

曝光(Exposure)顯像(D/FDeveloping)

蝕銅(Etching)去膜(D/FStripping)

30.防焊(綠漆)製作(SolderMask)WWEI94V-0R10531.S/M顯像(S/MDeveloping)32.印文字(LegendPrinting)33.浸金(噴錫……)製作(ElectrolessNi/Au,HAL……)WWEI94V-0R105WWEI94V-0R105DedicateoruniversalTesterFlyingProbeTester34.成型(Profile)35.測試(ElectricalTesting)WWEI94V-0R105WWEI94V-0R10536.終檢(FinalInspection)37.O.S.P.(entekplusCu_106A….)→OptionLASERBLIND&BURIEDVIALAY-UPA=THROUGHVIAHOLE(導通孔)

B=BURIEDVIAHOLE(埋孔)C=OneLevelLaserBlindVia(雷射盲孔)LASERBLIND&BURIEDVIALAY-UPBURIEDVIA

ANDLASERBLINDVIAOPTION(雷射盲埋孔之選擇)DCCD=TwoLevelLaserVia(雷射盲孔)CDCB-STAGEFR-4CoreRCCFR-4CoreB-STAGERCCABBABURIEDVIALAY-UPA=THROUGHVIAHOLE(導通孔)

B=BURIEDVIAHOLE(埋孔)C=BLINDVIAHOLE(盲孔)

D=BLINDHOLEMLBVIA(多層盲孔)BLINDVIALAY-UPBLINDVIASEQUENTIALLAY-UPABBARESINB-STAGE

BLINDANDBURIEDVIAOPTION(盲埋孔之選擇)DACC

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