电子研发工程师英文简历表格VIP

电子研发工程师英文简历表格下面是yjbys我和大家共享的电子研发工程师英文简历表格，更多内容请关注(./jianli)。

Name：yjbysHukou：ShanghaiResidency：ShanghaiWorkExperience：CurrentSalary：Tel：E-mail：./jianliCareerObjectiveDesiredIndustry：Electronics/Semiconductor/IC,Science/Research,Government,Others,Testing,CertificationDesiredPosition：SeniorHardwareEngineer,SemiconductorTechnology,BranchOfficeManager,ChiefRepresentative,ResearchSpecialistStaffDesiredaddress：Shanghai,Hongkong,Beijing,Taiwan,MacaoDesiredSalary：NegotiableWorkExperience20xx/06Present***CompanyIndustry:Electronics/Semiconductor/IC

IntelFlashEngineeringDepartmentIndividualContributor

Responsibilities：

IhavebeenworkinginIntelFlashAssemblyTestEngineering

DepartmentasanIndividualContributorsinceJuneof20xx.

BeingLeaderofATEYieldteam,Ihavebeenworkingwiththeteammemberstoimprovetheproductsyield.Oureffortsarepaidoff:

Theyieldofyear20xxhasbeendramaticallyincreasedthanthatofyear20xx.Theyieldofallproducts,consecutivelymeetsthegoal.Thetotalamountofcostsavingduetoyieldimprovementismorethan$1millioncomparedwithyear20xx.BeingtheLeaderofBoardRepairTeaminATE,Iworkedwithmyteammembers,setupasetofnewproceduretoreplacethecurrentone,Idefinedtheschedule,dividedtherolesresponsibilitiesamongteammembers,followuptheprogress.Finally,theteamhasmadeagreatcostsavingof$2.5Min20xx.ReportDirectlyto:DepartmentManagerNumberofSubordinate:14

Reference:BaoPowel

Achievements:BeingLeaderofATEYieldteam,Ihavebeenworkingwiththeteammemberstoimprovetheproductsyield.

Oureffortsarepaidoff:

Theyieldofyear20xxhasbeendramaticallyincreasedthanthatofyear20xx.Theyieldofallproducts,consecutivelymeetsthegoal.Thetotalamountofcostsavingduetoyieldimprovementismorethan$1millioncomparedwithyear20xx.BeingtheLeaderofBoardRepairTeaminATE,Iworkedwithmyteammembers,setupasetofnewproceduretoreplacethecurrentone,Idefinedtheschedule,dividedtherolesresponsibilitiesamongteammembers,followuptheprogress.Finally,theteamhasmadeagreatcostsavingof$2.5Min20xx.20xx/0120xx/05Intel(Shanghai)TechnologyDevelopmentLtd.CompanyIndustry:Electronics/Semiconductor/IC

IntelSTTD-ChinaDepartmentElectronicsDevelopmentEngineer

Responsibilities：

IhadbeenworkinginSTTD-ChinasinceJan20xxtoMay20xxasaseniormoduleengineer.Atthattime,asamaincontributorofthisproject,wesucceededindevelopingasetofMASSIVELYPARALLELCLASSTESTequipment,whichisabletotestmorethan6700unitsinonetime.ReportDirectlyto:HopmanMarkNumberofSubordinate:14

Reference:BaoPowel

ReasonforLeaving:IwastransferredtoIntel（Shanghai）ProductsLtd.Companyduetotheinternalre-organizationinJuneof20xx.

Achievements:AsamaincontributorofSTTD-Chinadepartment,Ico-workwithmycolleaguestosucceedindevelopingasetofMASSIVELYPARALLELCLASSTESTequipment,whichisabletotestmorethan6700unitsinonecycle.20xx/0520xx/01NanyangUniversityofScienceTechnologyIndustry:Electronics/Semiconductor/IC

ElectronicsElectricalEngineeringDepartmentResearchFellow

Responsibilities：

IworkinElectronicsElectricalEngineeringDepartmentofNanyangUniversityofScienceTechnologyasaResearchFellow.ImajoredatGateOxideReliabilityResearchintheduration.ReportDirectlyto:ProfessorPeyKinLeoh

Subordinate:3

Reference:PatrickLow

ReasonforLeaving:IcompletedtheprojectwhichIundertookbymyself,andwanttodomorechallengingjob.

Achievements:Inlessthanoneyear,Imadealotofexperimentsandacquiredthewonderfuldatafortheprojectbymyself.ProjectExperience20xx/01PresentAssemblyNPI(NewProductIntroduction)ProjectDescription:TointroducemoreproductsintoIntelFlashAssemblyfactory,IjoinAssemblyNPIteamandworkastheteamleader.IcoordinatewithIE,Planner,MarketingguyandEngineertoselectnewproductitems,dodemoinfactory,andthenqualifyit.

Responsibility:IamworkingasNPITeamleaderandcoordinateallteammembers,definetheNPIcandidate,makeAssemblybuildplan,followuptheprogress.20xx/0120xx/12MarginalElectricalBoardsRescueProjectDescription:Torescuesomeelectricalboardsoftestingequipment,aTaskForceteamwasbuiltupandledbyme.Wecategorizedeachkindofboard,madehistoricalfailureanalysisoneachkindofboardandaround2.5milliondollarswassavedfinally.

Responsibility:Beingtheteamleader,Itookthejobofdataanalysis,defineeachmembersrole,makeprogramplan,coordinateeachteammemberandfollowuptheprogress.20xx/1020xx/05OptimizationthecurrentTestProcessOrderforFlashMemoryProjectDescription:TosimplifythecurrentTestprocedureandenhancetheworkingefficiency,aTaskForceteamhasbeencalledandstartedbyme.

Responsibility:BeingtheProjectleader,Itakethemainresponsibility,suchas,design,plan,organizeandimplement.20xx/0520xx/12TestYieldofFlashmemoryImprovementProjectDescription:Toimprovethetestyieldofdifferentproducts,aTaskForceteamwasbuiltupandledbyme.Beingtheteamleader,Iworkedwithallteammemberstodigoutthefailurerootcauseforeachproduct,definedactiontakenplanforeachemergencycase,coordinatedeachteammemberandmakepro-activeplantoavoidedunexpectedthingshappen.

Responsibility:BeingtheteamleaderofImprovingTestYield,coordinateeachteammember,makeprogramplanandfollowup.EducationandTraining20xx/0520xx/01NanyangUniversityofScienceTechnologyMicroelectronicsDoctorateIworkedinNanyangUniversityofScienceTechnologyasaResearchFellow.ImajoratGateoxideReliabilityresearchintheduration.20xx/0320xx/03SeoulNationalUniversityofKoreaMicroelectronicsOthersIhadbeenworkinginNationalPhysicalLabofSeoulNationalUniversityinKoreasinceMarchof20xxtoMarchof20xxasaPost-doctor.WhereIunhooktheprojectofresearchdevelopmentofCarbon-NantubeBiosensor.Andonlyafteroneyear,anEISsensorbasedonCMOStechnologyhasbeensuccessfullyproduced.AndoneSCIpaperaboutithasbeenpublishedinSemiconductorScienceandTechnology.20xx/0320xx/03ShanghaiInstituteofMicrosystemsandInformationTechnology，ChineseAcademyofSciencesInformationTechnologyDoctorate20xx/0920xx/03NanjingUniversityofScienceTechnologyMaterialScienceandEngineeringMasterBeingamasterstude