芯源配置和报价specificd for pi bake tsmc hp5cp

AutomaticDeveloSystemConfiguration&SpecificationforPIBaking

ForTSMC

Ver. -C300-4D

SystemModel:KS-C300-4DProcessWafer:300mm

ProposedbyKINGSEMICo.,

SystemConfiguration&Specification:

KS-C300-4DAutomaticDeveloSystemConfiguration&Specification

1. ProcessWafer:

Substrate: ø300mm,wafer

Material: Silicon,Glass

2．Load-port 4Units (HirataEFEMprovidedbyTSMC)

Type: Load-port,byFouporCassette

Sensor: ReflexTransducer

WaferSensor: TheOppositeTypePhotoelectricTransducerWaferDelivery: WafertoWafer

WithRFIDFunction

3.WaferTransfer

WaferDelivery: AutomaticDeliverybyRobotRobot(A): ProcessStationRobot(PSR)1Set

RobotType: TwoArms,VacuumSuctiontoWaferRobotAxle: 4Axles(R1,R2,Z,T)

WaferSensor: DigitalVacuumTransducerTransducer： ReflexTransducer

Fingermaterial: CeramicFingerSuckerMaterial:Fluororubber

Robot(B): CassetteStationRobot(CSR)1Set

(IncludedinEfem,needESDfunction)

4. HP 6Sets(Followingdescriptionfor1Set)

ControlMethod: AirCylinderControl

GradualRange: 0~25mm

TemperatureRange: 50~180°CBottomTemperatureUniformity:

50~120°C ±0.75°

120.1~180°C ±1.0°C

HotteSurfaceMaterial: AluminumhardanodizingContactGap: 0.1mm

ContactGapMaterial： Vespel

PillarCapMaterial: SUS304+Vespel

PillarCapShape: Hemisphere

Withexhaustfunction withindependentdigitalflowgaugeWithShutter

CPE(Chillte&EdgeCentering) 5Sets(Followingdescriptionfor1Set)

Chillte

ControlMethod: AirCylinderControl

GradualRange: 0~15mm

TemperatureRange: 18~28°C

Min.TemperatureAdjust: 0.1°CTemperatureUniformity: 18~28°C±0.2°C

TemperatureControlMethod: ProportionalIntegralAlgorithm

2-SectionAlarm: Temperature2-SectionMonitoringColdteSurfaceMaterial: Aluminumhardanodizing

ContactGap: 0.1mm

ContactGapMaterial： Vespel

PillarCapMaterial: SUS304+Vespel

PillarCapShape: Hemisphere

5.2EdgeCentering

ControlMethod: AirCylinderControl

ContactMaterial: PPS

AlignAccuracy:

≤±0.2mm

6. SystemControl:Controller:OperationScreen:OperationSystem:Interface:

CommunicationMode：SignalBeacon:

Monitorscreen:

IndustrialComputer17”TouchScreenWindowsGraphicalInterfaceEthernetNetwork

3Colors

17”Screen

FacilitySystem

CDA:

Pressure:

FlowRate:Connection:

ty:

VAC

Pressure:

FlowRate:Connection:

ty:

PN2(forprocessuse)Pressure:

FlowRate:Connection:

ty:

P.C.WforCPE

P.C.Win:

P.C.Wout:Flowrate：

Connection:

≥0.5Mpa

≥120L/min3/8”ButtJoints3Set

≤-75KPa

≥30L/min3/8”ButtJoints2Sets

≥0.4Mpa

≥120L/min3/8”ButtJoints1Set

1Set0.15—0.3MPa

0MPa

20L/min

3/8”ButtJoints

Exhaust

Exhaust: 3Sets,2.8m3/min

Pressure: -350Pa～-450Pa

Connection: ø100mmPipe

ConnectionPosition: BacksideandBelow

Main-toolElectricPower： 208Volt,3-Phase,4-wire

SystemDimensionandWeight

Dimension: 2300mm(W)x3100mm(D)x2850mm(H)

Weight: 4500Kg

2300mm

EFEM

PST

1-4

LP4

1-0

CSR

2-11HP6

2-10HP5

2-7HP2

2-9HP4

1-3

LP3

2-6HP1

2-8HP3

2-5CPE5

2-4CPE4

2-3CPE3

1-2

LP2

2-2CPE2

2-0PSR

2-1CPE1

1-1

LP1

3100mm

SystemFootprint&La