半导体行业对外测试设备介绍

electrical日E用财修J.%r；岬快叫EE胸r戒网哪MWW/'trSSM2000electrical日E用财修J.%r；岬快叫EE胸r戒网哪MWW/'trThespreadingresistancetechniqueisamethodformeasuringthepropertiesofsemiconductormaterialswithveryhighspatialresolution;itisbasedonmeasurementsofthecontactresistanceofspeciallypreparedpointcontactsondopedsiliconsamples.TheSSM2000NANOSRP®Systemisanautomatedspreadingresistanceprobedesignedtocharacterizetheelectricalpropertiesofdopedsiliconmaterials.Thissystemgeneratesprofilesofresistivity,carrierdensity,andelectricallyactivedopantdensitymorequicklyandmoreeasilythanitspredecessor,theSSM150.ItisthemostadvancedSRPtestmachineinworld.Silancharacteristic1、Canaffordthebestaccuracyresultforcustom.2、WehavetheuniqueabilitytotesttheUltrashallowlayer.Examplewecantestimplantresistivityprofileronsurface.Wecanguarantee6nmresolutionfortestUltrashallowlayer.3、Canmeasuretheresistivityofpatternedsamples(dimensionofpatternabove80um).扩展电阻率测试是用高分辨率测试半导体材料的电特性。它基于被测样片上接触的探针来测试。SSM2000是一台自动的用扩展电阻的方法来反应参杂硅材料电特性的机器。它能产生整个硅片电阻率的轮廓特性，载流子浓度，参杂浓度。它比国内常用的SSM150要快速，准确许多。是目前世界最先进的SRP测试设备之一。士兰特点：1、能给用户提供国内最精确的■测试结果。■2、是国内唯一有能力准确测试浅层结构，如注入表层电阻率的变化特性。能保证6nm的分辨率准确性。3、能测试图形中样品的扩展电阻率（图形尺寸80um以上）。SSM495C-V测试TheSSM495isanautomatic

mercuryprobecapacitance-voltage(CV)measuringsystem.TheSSM495hasanadvancedmeasurementtoolwithmanycharacteristicssuchasgoodspatialresolution,goodsensitivityandnon-destructive.TheresistivityofallkindsepisamplescanbeaccuratelymeasuredusingSSM495.Themeasurementrangeisfrom0.1tolOOQ.cminn-typewafer;from0.24to330Q.cminP-typewafers.TheSSM495canalsobeusedtomonitoroxidequality(Thresholdvoltage:Vth;Flatbandvoltage:Vfb;Oxidecapacitance:Cox;Effectiveoxidecharge:Neff).Inaddition,itcanoffergoodresolutioninmonitoringtheimplantdoseofB,PorAsinthechannelregionunderthegate.SILANCharacteristicWecantestmostofPtypeEPIwaferwhichisveryhardformanycompaniessometimes.SSM495全自动汞探针CV测试系统是先进的测试工具，具有空间分辨率高、灵敏度好、非破坏性等特点。它能精确地测试各种外延片的电阻率。N型硅片的测试范围为：0.1〜100Q.cm；P型硅片的测试范围为：0.24〜330Q.cm。SSM495亦可用于监测氧化层质量(阀值电压Vth；平带电压Vfb；氧化层电容Cox;氧化层电荷数Neff)。此外，对于栅极下面沟道区的B、P、入、注入剂量，SSM495能提供完美的监测方案。士兰特点：对于P型外延片电阻率的测试一般公司很难有能力测试，有的甚至放弃测试P型外延片，而我们能测试大部分的P型片。QSFTIR系列介绍QSFTIRseriesisanadvancedFT-IRtooldevelopedbyBio-Radlaboratories,Inc.IthasstrongfunctionswhicharewidelyusedinanalysisofPSGfilms,BPSGfilms,siliconnitridefilms,epilayersandbarewafers.TheconcentrationofBandPinBPSGfilmscanbemeasuredusingPCRorPLStechniquescontainedinQSM-408,anditcananalyzeHydrogeninsiliconnitridefilms,oxygenandcarboninsilicon,alsomeasureEpitaxialthickness.SILANCharacteristic1、WeowntheBio-RadQSseriesFTIRmachineswhichisthefamousFTIRinworld.IncludingseveralQS300,QS408,QS500etc.models.

2、Wecanaffordtherapidandaccuracyresultbyourexperienceandtheory.QSFTIR系列是台由Bio-Rad实验室有限公司制造的FT-IR测试工具。其功能强大，广泛应用于分析PSG薄膜、BPSG薄膜、Si3N4薄膜、外延层和硅片。QSFTIR提供的PCR和PLS技术可用于测试BPSG薄膜中的B、P含量。此外，QSFTIR还可用于测试Si3N4薄膜中的氢含量，硅中的碳、氧含量以及外延层的厚度。士兰特点：1、拥有FTIR业界标准的BIO-RADQS系列产品，包括多台QS300，QS408，QS500等各类型号。2、丰富的理论与实践能力保证了测试的快速，准确性。是国内用FTIR应用最广泛的公司之一。Opti-Probe介绍TheOpti-Probeisapowerfulfilmthicknessmeasurementtoolthatcanmeasuremostfilmsandfilmstackswithhighprecisionandrepeatability,suchast,n,andk.Itperformsthisfunctionbyintegratingthreefilmthicknessmeasurementtechniques:BeamProfileReflectometry,VisibleSpectrometry,BeamProfileEllipsometry.Onfullyequippedsystems,theOpti-Probecanutilizeallthreetechnologiestoobtainrobust,repeatablemeasurementresults.Athinstandardshouldmeasurewithin±1Aofawafer’sknownvalue.Athickstandardshouldmeasurewithin±2Aofawafer’sknownvalue.SILANCharacteristic:Thetestingapplicationengineerwithperfectexperiencecanprovideallkindsofcomplextestproject.Theadvancedequipmentperformanceandtop-rankingtechnologyteaminChinafarthestassuretheresultsaccurate.OPTI-PROBE设备能够测试各种

膜质和膜层的膜厚，折射率，消光系数，具有很高的精确性和重复性oOPTI-BPROBE是通过三种目前世界上最先进的膜厚测试技术来保证准确性：BPR(BeamProfileReflectometry)、BPE(BeamProfileEllipsometry)、VS(VisibleSpectrometry)。在整个系统中，OPTI-PROBE可以综合利用上面三种技术获得稳定的测试结果，对于薄的膜层测试精度±1A,对于厚的膜层测试精度±2A士兰特点：具有丰富的经验的测试应用工程师能提供各类复杂测试的解决方案。先进的设备性能以及国内一流的技术团队能最大程度地保证测试结果准确性。ADE9500介绍ADE’sUltraGage9500hasbecometheindustrystandardforwafergeometrycharacterizationforbothdevicefabsandsiliconwafermanufactures.Thesmallfootprint,noncontactmeasurementsandautomatedoperationcombinedwith10nmresolutionpositiontheUltraGageastheidealprocessdevelopment,analysisandcontroltoolforphotolithography,thinfilmstress,thermal,CMPandbackgrindprocesses.Measurements:Thickness,Flatness(Global&Site),Shape(Bow/Warp)Features:Non-contactmeasurements,10nmresolution,Patternedorpolishedwafers,Integralprealignment,ManualorcassetteoperationAccuracy:Thickness(±0.5um),flatness(±0.15um)BowandWarp(±3.0um+5%ofreading)SILANCharacteristicWecanaffordthebesttestresultofaccuracybytheseverestcalibrationmethodandourperfectlytechnology.ADE公司生产的UltraGage9500已经成为硅片制造商和集成电路制造商