电子与计算机英语词组缩写

1、.PAGE ：.；PAGE 22电子专业术语缩写简写All-In-On单一主板构造设计VGAVideo Grephics Array视频图形阵列CRTCathode Rey Tude阴极射线管LVDSLow Voltage Differential Signal低压差分信号LCDLiquid Crystal Display液晶显示器CPUCentral Process Unit中央处置器DIYDo It Yourself本人动手做TFTThin Film Tramsistor薄膜晶体管HDDHard Disk Drive硬盘驱动器IDEIntegrated Drive Electronics集

2、成开发环境、电子集成驱动器SATASerial ATA串行ATAODDOptical Disk Drive光盘驱动器1ODD中的一倍速150KB/SRAMRandom Access Memory随机存取存储器Inverter高压板反向器XGAExtended Graphics Array延伸绘图陈列SVGASuper VGAUXGAUltra XGA调整VGAWLANWireless Local Area Net无线局域网CCKComplementary Code Keying)补码键控调制OFDMOrthogonal Frequency Division Multiplexing正交频分多路

3、复用技术 FSBFront Side Bus前端总线SDRAMSynchronous Dynamic RAM同步动态RAMDDRDouble Data Rate双倍数据传输率Stick Point指点杆Touth Pad触控板OEMOriginal Equipment Manufacturer电脑原始设备制造商ODMOriginal Design Manufacturer设计制造商R&DResearch&Development研发PCBPrint Circuit Board印制电路板EMIElectro Magnetic Interference 电磁干扰EMCElectro Magnetic

4、 Compatibility电磁兼容Blind Via(盲孔)Buried Via(埋孔)Through Via(通孔)PAD(焊点)VIA(导通孔)SMT(Surface Mount Technology)外表安装技术ME(Mechabical engineer)机构工程师BOM(Bill Of Material)物料单DIP(Dual Inline Package) 双列直插式组装QFP(Qual Flat Package) 方型扁平封装PGA(Pin Grid Array)BGA(Ball Grid Array Package)球栅阵列阵列CSPShip Size Package芯片尺寸

5、封装MCMMulti Chip Model多芯片模块OOBA (Out Of Box Audit)开箱检查Electric Screw Diver电动起子 Fixture治具Barcode Scanner(条形码扫描仪)IPQC(In Process Quality Control)制程中的质量检测人员OQC(Output Quality Control)最终出货质量管理人员IQC(Incoming Quality Comtrol )进料质量管理人员OQA(Output Quality Assurance)出货质量保证人员FAI(First Article Inspection)新品首件检查F

6、AA(First Article Assurance)首件确认P/N(Part Number)料号L/N(Lot Number)批号PDCA(Plan Do Check Action)方案、执行、检查、总结ECN(Engineering Change Notes)工程变卦通知供货商ECO(Engineering Change Order)工程改动要求客户PCN(Process Change Notice)工序改动通知PMP(Product Management Plan)消费控制方案SOP(Standard Operation Procedure)制造作业规范IS(Inspection Spe

7、cification)废品检验规范PSPackage Specification包装规范SPECSpecification规格ESEngineering Standardization工程规范POPurchasing Order采购订单MOManufacture Orde消费单D/CDate Code消费日期码ID/CIdentification Code供货商识别码ESDElectro Static Discharge静电排放ASSYAssembly组装MATSMaterial资料LEDLight-Emitting Diode发光二极管COACertification Of Authenti

8、cation微软之授权条码EOLEnd Of Life产品消费周期SCSISmall Computer System Interface小型计算机接口系统BIOSBasic Input/Output System根本输入输出系统SFISShop Floor Information System现场信息整合系统ICIntegrated Circuit集成电路SPCStatistical Process Control统计制程控制SQCStatistical Quality Control统计质量控制DIMDimension 尺寸DIADiameter直径SIPStandard Inspectio

9、n Procedure制程检验规范程序ISInspection Specification废品检验规范MCMaterial Control物料控制PCCProduction Plan Control消费方案控制N/ANot Applicable不适用NGNot Good不良AC(alternating current) 交流(电) AD(analog to digital) 模拟数字转换 ADC(analog to digital convertor) 模拟数字转换器 ADM(adaptive delta modulation) 自顺应增量调制 ADPCM(adaptive different

10、ial pulse code modulation) 自顺应差分脉冲编码调制 ALU(arithmetic logic unit) 算术逻辑单ASCII(American standard code for information interchange) 美国信息交换规范码 AV(audio visual) 声视，视听BCD(binary coded decimal) 二进制编码的十进制数 BCR(bi-directional controlled rectifier)双向晶闸管 BCR(buffer courtier reset) 缓冲计数器BZ(buzzer) 蜂鸣器，蜂音器 C(cap

11、acitance，capacitor) 电容量，电容器CATV(cable television) 电缆电视 CCD(charge-coupled device) 电荷耦合器件 CCTV(closed-circuit television) 闭路电视CMOS(complementary) 互补MOSCPU(central processing unit)*处置单元 CS(control signal) 控制信号D(diode) 二极管 DAST(direct analog store technology) 直接模拟存储技术 DC(direct current) 直流DIP(dual in-l

12、ine package) 双列直插封装DP(dial pulse) 拨号脉冲 DRAM(dynamic random access memory) 动态随机存储器DTL(diode-transistor logic) 二极管晶体管逻辑DUT(device under test) 被测器件 DVM(digital voltmeter) 数字电压表 ECG(electrocardiograph) 心电图 ECL(emitter coupled logic) 射极耦合逻辑 EDI(electronic data interchange) 电子数据交换EIA(Electronic Industries

13、 Association) 电子工业结合会 EOC(end of conversion) 转换终了 EPROM(erasable programmable read only memory) 可擦可编程只读存储器EEPROM(electrically EPROM) 电可擦可编程只读存储器 ESD(electro-static discharge) 静电放电 FET(field-effect transistor) 场效应晶体管 FS(full scale) 满量程 FV(frequency to voltage convertor) 频率电压转换 FM(frequency modulation

14、) 调频 FSK(frequency shift keying) 频移键控 FSM(field strength meter) 场强计 FST(fast switching shyster) 快速晶闸管 FU(fuse unit) 保险丝安装FWD(forward) 正向的 GAL(generic array logic) 通用阵列逻辑 GND(ground) 接地，地线 GTO(Sate turn off thruster) 门极可关断晶体管 HART(highway addressable remote transducer) 可寻址远程传感器数据公路 HCMOS(high density

15、 COMS) 高密度互补金属氧化物半导体(器件) HF(high frequency) 高频 HTL(high threshold logic) 高阈值逻辑电路 HTS(heat temperature sensor) 热温度传感器IC(integrated circuit) 集成电路ID(international data) 国际数据 IGBT(insulated gate bipolar transistor) 绝缘栅双极型晶体管IGFET(insulated gate field effect transistor) 绝缘栅场效应晶体管 IO(inputoutput) 输入输出 IV(

16、current to voltage convertor) 电流-电压变换器IPM(incidental phase modulation) 附带的相位调制 IPM(intelligent power module) 智能功率模块 IR(infrared radiation) 红外辐射 IRQ(interrupt request) 中断恳求 JFET(junction field effect transistor) 结型场效应晶体管LAS(light activated switch)光敏开关LASCS(light activated silicon controlled switch) 光

17、控可控硅开关LCD(liquid crystal display) 液晶显示器LDR(light dependent resistor) 光敏电阻LED(light emitting diode) 发光二极管LRC(longitudinal redundancy check) 纵向冗余(码)校验LSB(least significant bit) 最低有效位LSI(1arge scale integration) 大规模集成电路 M(motor) 电动机 MCT(MOS controlled gyrator) 场控晶闸管 MIC(microphone) 话筒，微音器，麦克风 min(minut

18、e) 分 MOS(metal oxide semiconductor)金属氧化物半导体 MOSFET(metal oxide semiconductor FET) 金属氧化物半导体场效应晶体管 N(negative) 负 NMOS(N-channel metal oxide semiconductor FET) N沟道MOSFET NTC(negative temperature coefficient) 负温度系数 OC(over current) 过电流 OCB(overload circuit breaker) 过载断路器 OCS(optical communication system

19、) 光通讯系统 OR(type of logic circuit) 或逻辑电路 OV(over voltage) 过电压 P(pressure) 压力FAM(pulse amplitude modulation) 脉冲幅度调制 PC(pulse code) 脉冲码 PCM(pulse code modulation) 脉冲编码调制 PDM(pulse duration modulation) 脉冲宽度调制PF(power factor) 功率因数 PFM(pulse frequency modulation) 脉冲频率调制 PG(pulse generator) 脉冲发生器 PGM(progr

20、ammable) 编程信号PI(proportional-integral(controller) 比例积分(控制器) PID(proportional-integral-differential(controller)比例积 分微分(控制器)PIN(positive intrinsic-negative) 光电二极管 PIO(parallel input output) 并行输入输出 PLD(phase-locked detector) 同相检波PLD(phase-locked discriminator) 锁相解调器PLL(phase-locked loop) 锁相环路 PMOS(P-ch

21、annel metal oxide semiconductor FET) P沟道MOSFETPPM(pulse phase modulation) 脉冲相位洲制 PRD(piezoelectric radiation detector) 热电辐射控测器 PROM(programmable read only memory) 可编只读程存储器 PRT(platinum resistance thermometer) 铂电阻温度计 PRT(pulse recurrent time) 脉冲周期时间 PUT(programmable unijunction transistor) 可编程单结晶体管PW

22、M(pulse width modulation) 脉宽调制 R(resistance，resistor) 电阻，电阻器 RCT(reverse conducting thyristor) 逆导晶闸管 REF(reference) 参考，基准 REV(reverse) 反转R/F(radio frequency) 射频 RGB(redgreenblue) 红绿蓝ROM(read only memory) 只读存储器 RP(resistance potentiometer) 电位器RT(resistor with inherent variability dependent) 热敏电阻 RTD(

23、resistance temperature detector) 电阻温度传感器 RTL(resistor transistor logic) 电阻晶体管逻辑(电路) RV(resistor with inherent variability dependent on thevoltage) 压敏电阻器 SA(switching assembly) 开关组件 SBS(silicon bi-directional switch) 硅双向开关，双向硅开关 SCR(silicon controlled rectifier) 可控硅整流器 SCS(safety control switch) 平安控制

24、开关 SCS(silicon controlled switch) 可控硅开关 SCS(speed control system) 速度控制系统 SCS(supply control system) 电源控制系统 SG(spark gap) 放电器 SIT(static induction transformer) 静电感应晶体管SITH(static induction thyristor) 静电感应晶闸管 SP(shift pulse) 移位脉冲 kwSnTSPI(serial peripheral interface) 串行外围接口 SR(sample realy，saturable r

25、eactor) 取样继电器，饱和电抗器 SR(silicon rectifier) 硅整流器 SRAM(static random access memory) 静态随机存储器 SSR(solid-state relay) 固体继电器 SSR(switching select repeater) 中断器开关选择器SSS(silicon symmetrical switch) 硅对称开关，双向可控硅 SSW(synchro-switch) 同步开关 ST(start) 启动 ST(starter) 启动器 STB(strobe) 闸门，选通脉冲T(transistor) 晶体管，晶闸管 TACH

26、(tachometer) 转速计，转速表 TP(temperature probe) 温度传感器 TRIAC(triodes AC switch) 三极管交流开关 TTL(transistor-transistor logic) 晶体管一晶体管逻辑 TV(television) 电视 UART(universal asynchronous receiver transmitter) 通用异步收发器 VCO(voltage controlled oscillator) 压控振荡器 VD(video decoders) 视频译码器 VDR(voltage dependent resistor) 压

27、敏电阻 VF(video frequency) 视频 VF(voltage-to-frequency) 电压频率转换 VI(voltage to current convertor) 电压-电流变换器 VM(voltmeter) 电压表 VS(vacuum switch) 电子开关VT(visual telephone) 电视 VT(video terminal) 视频终端CPU 3DNow!3D no waitingALUArithmetic Logic Unit，算术逻辑单元AGUAddress Generation Units，地址产成单元BGABall Grid Array，球状矩阵陈

28、列BHTbranch prediction table，分支预测表BPUBranch Processing Unit，分支处置单元Brach Pediction分支预测CMOS: Complementary Metal Oxide Semiconductor，互补金属氧化物半导体 CISCComplex Instruction Set Computing，复杂指令集计算机CLKClock Cycle，时钟周期COBCache on board，板上集成缓存CODCache on Die，芯片内集成缓存CPGACeramic Pin Grid Array，陶瓷针型栅格阵列CPUCenter Pr

29、ocessing Unit，中央处置器Data Forwarding数据前送Decode指令解码DIBDual Independent Bus，双独立总线ECEmbedded Controller，嵌入式控制器Embedded Chips嵌入式EPICexplicitly parallel instruction code，并行指令代码FADDFloationg Point Addition，浮点加FCPGAFlip Chip Pin Grid Array，反转芯片针脚栅格阵列FDIVFloationg Point Divide，浮点除 FEMMS：Fast Entry/Exit Multim

30、edia State，快速进入/退出多媒体形状FFTfast Fourier transform，快速热欧姆转换FIDFID：Frequency identify，频率鉴别号码FIFOFirst Input First Output，先入先出队列flip-chip芯片反转FLOPFloating Point Operations Per Second，浮点操作/秒FMULFloationg Point Multiplication，浮点乘FPUFloat Point Unit，浮点运算单元FSUBFloationg Point Subtraction，浮点减GVPPGeneric Visual

31、 Perception Processor，常规视觉处置器HL-PBGA: 外表黏著,高耐热、轻薄型塑胶球状矩阵封装 IAIntel Architecture，英特尔架构ICUInstruction Control Unit，指令控制单元ID：identify，鉴别号码 IDFIntel Developer Forum，英特尔开发者论坛IEUInteger Execution Units，整数执行单元IMM: Intel Mobile Module, 英特尔挪动模块 Instructions Cache，指令缓存Instruction Coloring指令分类IPCInstructions P

32、er Clock Cycle，指令/时钟周期ISAinstruction set architecture，指令集架构KNIKatmai New Instructions，Katmai新指令集，即SSELatency埋伏期LDTLightning Data Transport，闪电数据传输总线Local Interconnect局域互连MESIModified, Exclusive, Shared, Invalid：修正、排除、共享、废弃MMXMultiMedia Extensions，多媒体扩展指令集MMUMultimedia Unit，多媒体单元MFLOPSMillion Floation

33、g Point/Second，每秒百万个浮点操作MHzMillion Hertz，兆赫兹MPMulti-Processing，多重处置器架构MPSMultiProcessor Specification，多重处置器规范MSRsModel-Specific Registers，特别模块存放器NAOCno-account OverClock，无效超频NI：NonIntel，非英特尔 OLGAOrganic Land Grid Array，基板栅格阵列OoOOut of Order，乱序执行PGA: Pin-Grid Array引脚网格阵列,耗电大Post-RISCPRPerformance Rat

34、e，性能比率PSNProcessor Serial numbers，处置器序列号PIBProcessor In a Box，盒装处置器PPGAPlastic Pin Grid Array，塑胶针状矩阵封装PQFPPlastic Quad Flat Package，塑料方块平面封装RAWRead after Write，写后读Register Contention抢占存放器Register Pressure存放器缺乏Register Renaming存放器重命名 Remark芯片频率重标识Resource contention资源冲突Retirement指令引退RISCReduced Instr

35、uction Set Computing，精简指令集计算机SEC: Single Edge Connector，单边衔接器 Shallow-trench isolation浅槽隔离SIMDSingle Instruction Multiple Data，单指令多数据流SiO2FFluorided Silicon Oxide，二氧氟化硅SMISystem Management Interrupt，系统管理中断SMMSystem Management Mode，系统管理方式SMPSymmetric Multi-Processing，对称式多重处置架构SOI: Silicon-on-insulato

36、r，绝缘体硅片 SONCSystem on a chip,系统集成芯片SPECSystem Performance Evaluation Corporation，系统性能评价测试SQRTSquare Root Calculations，平方根计算SSEStreaming SIMD Extensions，单一指令多数据流扩展Superscalar超标量体系构造TCP: Tape Carrier Package薄膜封装,发热小Throughput吞吐量TLBTranslate Look side Buffers，翻译旁视缓冲器USWCUncacheabled Speculative Write C

37、ombination，无缓冲随机结合写操作VALUVector Arithmetic Logic Unit，向量算术逻辑单元VLIWVery Long Instruction Word，超长指令字VPUVector Permutate Unit，向量陈列单元VPUvector processing units，向量处置单元，即处置MMX、SSE等SIMD指令的地方主板ADIMMadvanced Dual In-line Memory Modules，高级双重内嵌式内存模块AMRAudioModem Riser；音效调制解调器主机板附加直立插卡AHAAccelerated Hub Archite

38、cture，加速中心架构ASK IRAmplitude Shift Keyed Infra-Red，长波形可挪动输入红外线ATX: AT Extend扩展型ATBIOSBasic Input/Output System，根本输入/输出系统CSEConfiguration Space Enable，可分配空间DB:Device Bay，设备插架 DMIDesktop Management Interface，桌面管理接口EBExpansion Bus，扩展总线EISAEnhanced Industry Standard Architecture，加强形工业规范架构EMIElectromagnet

39、ic Interference，电磁干扰ESCDExtended System Configuration Data，可扩展系统配置数据FBCFrame Buffer Cache，帧缓冲缓存FireWire火线，即IEEE4规范FSB: Front Side Bus，前置总线，即外部总线 FWH Firmware Hub，固件中心GMCHGraphics & Memory Controller Hub，图形和内存控制中心 GPIsGeneral Purpose Inputs，普通操作输入ICHInput/Output Controller Hub，输入/输出控制中心IRinfrared ray

40、，红外线IrDAinfrared ray，红外线通讯接口可进展局域网存取和文件共享ISA:Industry Standard Architecture，工业规范架构 ISAinstruction set architecture，工业设置架构MDCMobile Daughter Card，挪动式子卡MRH-RMemory Repeater Hub，内存数据处置中心MRH-SSDRAM Repeater Hub，SDRAM数据处置中心MTHMemory Transfer Hub，内存转换中心NGIONext Generation Input/Output，新一代输入/输出规范P64H64-bit

41、 PCI Controller Hub，64位PCI控制中心PCBprinted circuit board，印刷电路板PCBAPrinted Circuit Board Assembly，印刷电路板装配PCI:Peripheral Component Interconnect，互连外围设备 PCI SIGPeripheral Component Interconnect Special Interest Group，互连外围设备专业组POSTPower On Self Test,加电自测试RNGRandom number Generator，随机数字发生器RTC: Real Time Clo

42、ck 实时时钟KBCKeyBroad Control，键盘控制器SAPSideband Address Port，边带寻址端口SBASide Band Addressing，边带寻址SMA: Share Memory Architecture，共享内存构造 STDSuspend To Disk，磁盘唤醒STRSuspend To RAM，内存唤醒SVR: Switching Voltage Regulator 交换式电压调理USBUniversal Serial Bus，通用串行总线USDMUnified System Diagnostic Manager，一致系统监测管理器VIDVoltag

43、e Identification Definition，电压识别认证VRM Voltage Regulator Module，电压调整模块ZIF: Zero Insertion Force, 零插力 ACOPS:Automatic CPU OverHeat Prevention SystemCPU 过热预防系统SIV: System Information Viewer系统信息察看ESDJEasy Setting Dual Jumper，简化CPU双重跳线法浩鑫UPTUSB、PANEL、LINK、TV-OUT四重接口芯片组ACPIAdvanced Configuration and Power

44、 Interface，先进设置和电源管理AGPAccelerated Graphics Port，图形加速接口I/OInput/Output，输入/输出MIOC: Memory and I/O Bridge Controller，内存和I/O桥控制器NBC: North Bridge Chip北桥芯片PIIX: PCI ISA/IDE Accelerator加速器PSE36: Page Size Extension 36bit，36位页面尺寸扩展方式 PXB:PCI Expander Bridge，PCI加强桥 RCG: RAS/CAS Generator，RAS/CAS发生器 SBC: So

45、uth Bridge Chip南桥芯片SMB: System Management Bus全系统管理总线SPDSerial Presence Detect，内存内部序号检测安装SSB: Super South Bridge，超级南桥芯片 TDP:Triton Data Path数据途径TSC: Triton System Controller系统控制器QPA: Quad Port Acceleration四接口加速显示设备ASIC: Application Specific Integrated Circuit特殊运用积体电路ASCAuto-Sizing and Centering，自动调效屏

46、幕尺寸和中心位置ASCAnti Static Coatings，防静电涂层AGASAnti Glare Anti Static Coatings，防强光、防静电涂层BLA: Bearn Landing Area电子束落区BMCBlack Matrix Screen，超黑矩阵屏幕CRC: Cyclical Redundancy Check循环冗余检查CRTCathode Ray Tube，阴极射线管DDC：Display Data Channel，显示数据通道 DECDirect Etching Coatings，外表蚀刻涂层DFLDynamic Focus Lens，动态聚焦DFSDigita

47、l Flex Scan，数字伸缩扫描DIC: Digital Image Control数字图像控制 Digital Multiscan II数字式智能多频追踪DLPdigital Light Processing，数字光处置DOSD:Digital On Screen Display同屏数字化显示DPMSDisplay Power Management Signalling，显示能源管理信号Dot Pitch点距DQLDynamic Quadrapole Lens，动态四极镜DSPDigital Signal Processing，数字信号处置EFEALExtended Field Elli

48、ptical Aperture Lens，可扩展扫描椭圆孔镜头FRC:Frame Rate Control帧比率控制HVDHigh Voltage Differential，高分差动LCDliquid crystal display，液晶显示屏LCOS: Liquid Crystal On Silicon硅上液晶LEDlight emitting diode，光学二级管L-SAGICLow Power-Small Aperture G1 wiht Impregnated Cathode，低电压光圈阴极管LVDLow Voltage Differential，低分差动LVDS:Low Volta

49、ge Differential Signal低电压差动信号MALSMulti Astigmatism Lens System，多重散光聚焦系统MDAMonochrome Adapter，单色设备MS: Magnetic Sensors磁场感应器Porous Tungsten活性钨RSDS: Reduced Swing Differential Signal小幅度摆动差动信号SCScreen Coatings，屏幕涂层Single Ended单终结Shadow Mask阴罩式TDTTimeing Detection Table，数据测定表TICRG: Tungsten Impregnated C

50、athode Ray Gun钨传输阴级射线枪TFTthin film transistor，薄膜晶体管UCCUltra Clear Coatings，超明晰涂层VAGP: Variable Aperature Grille Pitch可变间距光栅VBI: Vertical Blanking Interval垂直空白间隙VDTVideo Display Terminals，视频显示终端VRR: Vertical Refresh Rate垂直扫描频率 视频3D：Three Dimensional，三维3DS3D SubSystem，三维子系统AEAtmospheric Effects，雾化效果AF

51、RAlternate Frame Rendering，交替渲染技术Anisotropic Filtering各向异性过滤APPEAdvanced Packet Parsing Engine，加强形帧解析引擎AVAnalog Video，模拟视频Back Buffer，后置缓冲Backface culling隐面消除Battle for Eyeballs眼球大战，各3D图形芯片公司为了争夺用户而作的竞争Bilinear Filtering双线性过滤CEMcube environment mapping，立方环境映射CGComputer Graphics，计算机生成图像Clipping剪贴纹理Cl

52、ock Synthesizer，时钟合成器compressed textures紧缩纹理Concurrent Command Engine，协作命令引擎Center Processing Unit Utilization，中央处置器占用率DACDigital to Analog Converter，数模传换器Decal印花法，用于生成一些半透明效果，如：鲜血飞溅的局面DFPDigital Flat Panel，数字式平面显示器DFS: Dynamic Flat Shading动态平面描影,可用作加速Dithering抖动Directional Light，方向性光源DME: Direct Me

53、mory Execute直接内存执行DOFDepth of Field，多重境深dot texture blending点型纹理混和Double Buffering双缓冲区DIRDirect Rendering Infrastructure，基层直接渲染DVIDigital Video Interface，数字视频接口DxR: DynamicXTended Resolution动态可扩展分辨率DXTCDirect X Texture Compress，DirectX纹理紧缩，以S3TC为根底Dynamic Z-buffering动态Z轴缓冲区,显示物体远近,可用作远景E-DDCEnhanced

54、 Display Data Channel，加强形视频数据通道协议，定义了显示输出与主系统之间的通讯通道，能提高显示输出的画面质量Edge Antialiasing，边缘抗锯齿失真E-EDIDEnhanced Extended Identification Data，加强形扩展身份辨识数据，定义了电脑通讯视频主系统的数据格式Execute Buffers，执行缓冲区environment mapped bump mapping环境凹凸映射Extended Burst Transactions，加强式突发处置Front Buffer，前置缓冲Flat平面描影Frames rate is King

55、帧数为王FSAAFull Scene Antialiasing，全景抗锯齿Fog雾化效果flip double buffered反转双缓存fog table quality雾化表画质GARTGraphic Address Remappng Table，图形地址重绘表Gouraud Shading，高洛德描影，也称为内插法均匀涂色GPUGraphics Processing Unit，图形处置器GTFGeneralized Timing Formula，普通程序时间，定义了产生画面所需求的时间，包括了诸如画面刷新率等HALHardware Abstraction Layer，硬件抽像化层hard

56、ware motion compensation硬件运动补偿HDTVhigh definition television，高明晰度电视HEL: Hardware Emulation Layer硬件模拟层high triangle count复杂三角形计数ICDInstallable Client Driver，可安装客户端驱动程序IDCTInverse Discrete Cosine Transform，非延续反余弦变换，GeForce的DVD硬件强化技术Immediate Mode，直接方式IPPR: Image Processing and Pattern Recognition图像处置和

57、方式识别large textures大型纹理LFLinear Filtering，线性过滤，即双线性过滤lighting光源lightmap光线映射Local Peripheral Bus局域边缘总线mipmappingMIP映射Modulate调制混合Motion Compensation，动态补偿motion blur模糊挪动MPPS：Million Pixels Per Second，百万个像素/秒Multi-Resolution Mesh，多重分辨率组合Multi Threaded Bus Master，多重主控Multitexture多重纹理 nerest Mipmap临近MIP映射

58、，又叫点采样技术Overdraw透支，全景渲染呵斥的浪费partial texture downloads并行纹理传输Parallel Processing Perspective Engine平行透视处置器PCPerspective Correction，透视纠正PGCParallel Graphics Configuration，并行图像设置pixelPicture element，图像元素，又称P像素，屏幕上的像素点point light普通点光源point sampling点采样技术，又叫临近MIP映射Precise Pixel Interpolation，准确像素插值Procedur

59、al textures可编程纹理RAMDACRandom Access Memory Digital to Analog Converter，随机存储器数/模转换器Reflection mapping反射贴图ender着色或渲染S端子SeperateS3Sight、Sound、Speed，视频、音频、速度S3TCS3 Texture Compress，S3纹理紧缩，仅支持S3显卡S3TLS3 Transformation & Lighting，S3多边形转换和光源处置Screen Buffer屏幕缓冲SDTVStandard Definition Television，规范明晰度电视SEMsp

60、herical environment mapping，球形环境映射Shading，描影Single Pass Multi-Texturing，单通道多纹理SLIScanline Interleave，扫描线间插，3Dfx的双Voodoo 2配合技术Smart Filter智能过滤soft shadows柔和阴影soft reflections柔和反射spot light小型点光源SRASymmetric Rendering Architecture，对称渲染架构Stencil Buffers模板缓冲Stream Processor流线处置SuperScaler Rendering，超标量渲染