封装专用英语词汇修订版

1、封装专用英语词汇集团标准化小组：VVOPPT-JOPP28-JPPTL98-IM常见封装形式简介DIP =DualInlinePackage =双列直插封装HDIP =DualInlinePackage with Heat Sink=带散热片的双列直插封装SDIP =ShrinkDual Inline Package =紧缩型双列直插封装SIP =SingleInlinePackage =单列直插封装HSIP =SingleInline Package with Heat Sink =带散热片的单列直插封装SOP =SmallOutlinePackage =小外形封装HSOP =SmallOu

2、tlinePackage with Heat Sink =带散热片的小外形封装eSOP =Small Outline 1Package with exposed thermal pad = 载体夕卜露于塑封体的小外形封装SSOP =TSSOP =Shrink SmallThin ShrinkOutline Package = 紧缩型小外形封装Small Outline Package =薄体紧缩型小外形封装TQPF =PQFP =Thin ProfilePlastic QuadQuad Flat Package =薄型四边引脚扁平封装Flat Package =方形扁平封装LQPF =Low

3、Profile Quad Package =薄型方形扁平封装eLQPF = Low Profile Quad Flat Package with exposed thermal pad =载体外露于塑封体的薄型方形扁平封装DFN = Dual Flat Non-leaded Package =双面无引脚扁平封装QFN = Quad Flat Non-leaded Package = 双面无引脚扁平封装TO = Transistor package = 晶体管封装SOT = Small Outline of Transistor = 小外形晶体管BGA = Ball Grid Array =球栅

4、阵列封装BQFP = Quad Flat Package With Bumper =带缓冲垫的四边引脚扁平封装CAD = Computer Aided Design =计算机辅助设计CBGA = Ceramic Ball Grid Array = 陶瓷焊球阵列CCGA = CSP = DFP = DSO = 3D = 2D = FCB = IC = I/O = LSI = MBGA = MCM =Ceramic Column Grid Chip Size Package Dual Flat Package Dual Small Outline Three-Dimensional Two-Dim

5、ensional Flip Chip Bonding Integrated Circuit Input/Output Large Scale Integrated Metal BGA = Multichip Module =Array =陶瓷焊柱阵列 芯片尺寸封装 双侧引脚扁平封装 双侧引脚小外形封装 三维_维N装焊集成电路 输入/输出Circuit =大规模集成电路 金属基板BGA 多芯片组件p I B MFFMSOLPCPGASIPSOTSOPSOPWBMultichip Package =多芯片封装Microelectro Mechanical System = 微电子机械系统Mini

6、Flat Package =微型扁平封装Medium Scale Integration =中规模集成电路Outer Lead Bonding=外引脚焊接Plastic BGA=塑封 BGAPersonal Computer=个人计算机Pin Grid Array =针栅阵列System In a Package=系统级封装Small Outline Integrated Circuit = 小外形封装集成电路Small Outline J-Lead Package = 小外形 J 形引脚封装Small Outline Package = 小外形封装 System On a Package =

7、 系统级封装 Wire Bonding=引线健合Wafer Level Package=晶圆片级封装常用文件、表单.报表中英文名称清除通知单 工程变更申请 持续改善计划 戴尔专案 收据 数据表 核对表 文件清单 设备清单 调査表，问卷 报名表 追踪记录表 日报表 周报表 月报表 年报表 年度报表 财务报表 品质报表 生产报表 不良分析报表 首件检查报告 初步报告（或预备报告） 一份更新报告 一份总结报告纠正与改善措施报告（异常报告单） 出货检验报告Purge noticeECR(Engineering Change Request)CIP(continuous improvement plan

8、) Dell ProjectReceiptDatd sheetCheck listDocumentation checklistEquipment checklistQuestionnaireEntry formTracking logDaily reportWeekly reportMonthly reportYearly reportAnnual reportFinancial reportQuality reportProduction reportFAR(Failure analysis report)First article inspection report Preliminar

9、y report An undated reportA final reportCAR (Corrective Action Report)Outgoing Inspection Report符合性报告（材质一致性证明） 稽核报告品质稽核报告制程稽核报告5S稽核报告客户稽核报告供应商稽核报告年度稽核报告内部稽核报告外部稽核报告SPC报表（统计制程管制）工序能力指数（Cpk）（规格）上限（规格）下限规格上限规格下限上控制限（或管制上限）下控制限（或管制下限）最大值平均值最小值临界值MRB单（生产异常通知报告） 工艺流程图TECN自主点检表随件单（流程卡） 压焊图 晶圆管制卡晶圆进料品质异常反馈单

10、Quality Problems 订购单 出货通知单 送货单/交货单 询价单可靠性实验报告 产品报废单 特釆控制表返工单异常处理行动措施COC(Certificate of Compliance)Audit reportQuality audit reportProcess audit report5S audit reportCustomer audit reportSupplier audit reportAnnual audit reportInternal audit reportExternal audit reportStatistical process controlProce

11、ss capability indexUpper limitLower limitUpper Specification Limit(USL)Lower Specifiedtion Limit(LSL)Upper Control Limit(UCL)Lower Control Limit(LCL)Maximum valueAverage valueMinimum valueThreshold value / critical value Material Review Board Report Process Flow Diagram物料清单（产品结构表/用料结构表）BOM （Bill of

12、Materials ）合格供应商名录 异常报告单AVL (Approved Vendor List)CAR工程规范报告通知单（工程变更通知）ECNSelf Check ListTraveling Card (Run Card)Bonding diagramWafer inspection cardFeedback Report for Wafer IncomingPO (Purchase Order)Advanced Ship NoticeDO (Delivery Order)RFQ(Request for quotation)Reliability Monitor ReportPSBCRBP

13、RBOCAP减薄：Wafer *weifm 威化饼干、电子晶片（晶圆薄片）GrindEgraind 1 vt. & vi.磨碎；嚼碎 n .磨，碾 Crack krkj vt. & vi.（使）开裂，破裂肚裂缝，缝隙InktikZ n.墨水，油墨Die dai vt. & vi. 死亡（芯片）Dotdtl n .点，小圆点Mounting *maunti n.装备,衬托纸Tapeteip n.带子；录音磁带；录像带SizeEsaizJ n.大小，尺寸，尺码Thick0ik adj.厚的，厚重的 Thickness iknis n.厚（度），深（度）宽（度）Positionp 4zi?n n.方

14、位，位置Roughrfl adj .粗糙的；不平的Fine fain adj.美好的，优秀的，优良的，杰出的 Speed spi : d_ n.速度，速率Sparkspa:k_ n.火花；火星Out autl adv.离开某地，不在里面；（火或灯）熄灭 Grindstone graindstunZ n.磨石、砂轮Mount mauntZ vt. & vi.装上、配有Mounter 装配工;安装工;镶嵌工Mount ing *mauntij/2.装备，衬托纸MagazineE, mgzi：n n.杂志，期刊，弹药库（传递料盒） Cassette k 4 setn.盒式录音带；盒式录像带Inspe

15、ctin spektvt.检查，检验，视察InspectionEin *spekn n.检查，视察Cardka:d n.卡，卡片，名片划片：Saws： n. 锯 vt. & vi.锯，往复运动Sawing s: iI n.锯，锯切，锯开FilmEfilm n.影片，电影（薄膜,蓝膜）Frame freim n.框架，骨架，构架 Cleankli:nZ adj清洁的，干净的；纯净的 Cleaner 4kli：n尽作清洁工作的人或物 Oven vn”.烤箱，炉Cassettek set： n.盒式录音带；盒式录像带 Handler h?ndl a.（物品、商品）的操作者 Scribe skraib

16、Z n .抄写员，抄书吏Street? n.大街，街道BladeEbleidl n.刀口，刀刃，刀片Cut ktZ vt. & vi.切，剪，割，削Speed spi：d_ n.速度，速率Spindle *spindlj n.主轴，（机器的）轴SizeEsaiz n.大小，尺寸，尺码CoolingE ku: liZ adj.冷却（的）Kerfk：fl n.锯痕，截口，切口WidthEwid 11 1 n .宽度，阔度，广度Chip tip n.碎片、缺口Chippingt *t?ipil n.碎屑，破片Crackkr?k 吒.（使）开裂，破裂刀.裂缝，缝隙 MissingE *misil ad

17、j.失掉的，失踪的，找不到的 Die dail vt. & vi.死亡（芯片）Saws: j n.锯 vt. & vi.锯，往复运动 Street stri:tZ 刀.大街，街道FilmfilmL 刀.电影（薄膜，蓝膜）影片，Frame freiml n. 框架，骨架，构架 Tape teip 刀.带子：录音磁带；录像带Bubble bblZ n.泡，水泡，气泡 mount贴frame框架tape膜loader上料un-loader出料air空气pressure压力alignment校准ink黑点limit限制cover盖子saw切割water水sensor感应器wheel轮子check检查f

18、eed进给cutter切割new新clean清洗？wafer晶圆blade刀片cassette盒子initial初始化failure失败die芯片-device产品elevator升降机setup测高speed速度shift轮班completion完成open打开vacuum真空error错误data数据spindle主轴rotary旋转height高度pause暂停center中心chip崩边change变换enter确认alarm报警Off center偏离中心broken破的上芯：Attach tt vt. & vi.贴上；系；附上 BondEbndn.连接，接合，结合vt.使粘结，使结

19、合Bonder bud1 n.联接器，接合器,粘合器Die attach material epoxy 粘片胶Epoxye pksin.环氧树脂（导电胶）Haterialm 1tirilj n.材料，原料Non-conductive epoxy 绝缘胶Conductivekn dktiv adj. 传导的Dispenser dis pens： n.配药师，药剂师 NozzleE *nzl n.管嘴，喷嘴Rubber *rb1 n（合成）橡胶，橡皮TipEtipj n. 尖端，末端Die pick-up tool 吸嘴Too lt u: 1 n.工具，用具Collect k *lektZ vt.

20、收集，釆集（吸嘴）Ejectori 4dekt1 n.驱逐者，放出器,排出器PinEpin n.针，大头针，别针Lead Frame 引线框架LeadEli ：dj vt. & vi.带路，领路，指引Frame freim. n.杂志，期刊（料盒）框架，骨架，构架 Magazine , mg zi:n n.Curing kjurin.塑化，固化，硫化，硬化Oven * vnj n.烤箱，炉Scrapskrpj n.小片，碎片，碎屑Dent denta 凹痕，凹坑Die L辻t-off晶粒脱落（芯片脱落，掉芯）SkewEskju： J adj.歪，偏，斜Misorientation? mis,

21、:rien tein n.定向误差，取向误差Pre squeeze del写胶前气压延时Post squeeze del写胶后气压延时Squeezeskwi:zvt. 榨取，挤出n.挤，榨，捏Eject i dektvt. & vi .弹出，喷出，排出Delaytdi lei：n.延迟Heigh t hait jn.高度，身高Level levl_ n.水平线，水平面；水平高度HeadEhed刀.头部，领导，首脑Eject up delay顶针延迟Eject up height顶针高度Bond level粘片高度Pick Level捡拾芯片高度Head pick delay粘接头拾取延迟Hea

22、d bond delay粘接头粘接延时Pick delay捡拾芯片延时Bond delay粘接芯片延时Crack krkj vt. &viCrack krkj vt. &viIndex indeksj n.索引；标志，象征；量度Clamp klmplvt. & vi. 夹紧；夹住n.夹具Index clamp delay步进夹转换延时Index delay框架步进延时Shear iJ吐剪羊毛，剪n大剪刀Test test刀.Die shear testThickness 0 iknis测验，化验，试验，检验 推晶试验n.厚（度人粗Coverage kvridjn.覆盖范围Epoxy thick

23、ness & coverage 导电胶厚度和覆盖率OrientationE, :rien 4teinj 刀.方向，目标Die Orientation芯片方向Voidvidadj. 空的，空虚的刀.太空，宇宙空间;空隙,空处;空虚感,失落感Epoxy void导电胶空洞ChipEtipJ 碎片Damage 4dmid. vt. & 卩丄损害，毁坏，加害于 尽 损失，损害，损毁Chip damage芯片损伤Backside bksaidj 刀.臀部，屁股，背面Chip backside damage芯片背面损伤TiltEtilt（使）倾斜Tilted die芯片歪斜Epoxy on die芯片粘胶

24、（使）开裂，破裂裂缝，缝隙Crack dieLi.ft lift J vt. & vi.芯片裂缝/芯片裂痕举起，抬起 抬，举Lifted die Misplace , mis把放错位置 Misplaced die NO die on L/F Insufficient, ns 4fintj adj.不足的，不够的Insufficient epoxy Epoxy crack Epoxy curing EdgetedZ刀.边，棱，边缘Partial wpa: 1Z adj 部分的，不完全的 Mirror *mirj刀.翘芯片4pleisvt.设置芯片空粘导电胶不足 导电胶多胶 银浆烘烤镜子Missi

25、ngE *misiZ adj.失掉的，失踪的，找不到的Edge die / partial dieMirror dieMissing dieSplash splvt.Splatter * spItvt.（使某物）溅泼Diagram daigrmj刀.Ink splash / ink splatterDie bonding diagram边缘片/边沿芯片光片/镜子芯片掉芯/漏芯/掉片使（液体）溅起Vi.（液体）溅落 & vi.图解，简图，图表墨溅上芯图Die shesr testDie shear testerDie shesr tool推片实验/推晶试验推片试验机 推片头Gold wire金丝

26、Pad pd给装衬垫，vt.加垫子n.垫，护垫Bond pad焊点、铝垫1st bond第一焊点Pad size焊点尺寸/铝垫尺寸CapillaryEk P订ri刀毛细管；毛细血管（劈刀）PitchEpitJ程度；強度；高度Pad pitch铝垫间距/焊点间距Elongationti : 14gei?n刀延长；延长线；延伸率Breaking 4breiki 破坏，阻断Load ludjn.负荷；负担;工作量，负荷量Breaking LoadPullpul破断力吒& vi.拉，扯，拔Shearij吒剪羊毛，剪门.大剪刀Wire pull / ball pullWire shear / ball

27、shear（焊丝）拉力（焊丝）推力Ultrasonic , ltr * snikj adj.（声波）超声的Power 4pauJ功力，动力，功率Forcef:sn.力；力量；力气Ultrasonic power超声功率Bonding force压力Bonding time时间Temperature 4tempritj温度，气温Bonding temperature温度Ultrasonic wire bonding超声波圧焊EFOLoop height孤高Wire pull test拉力试验Ball shear test金球推力试验打火烧球looplu：pj圈，环，环状物PIN 1Ball he

28、ight球高Ball diameter球径第一脚Cratering 4kreitri缩孔;陷穴（弹坑）KOH etching testKOH腐蚀试验Bond Cratering test汗焊腐蚀试验（弹坑试验）热的，热量的热压焊Thermal0 :mljCompressionkm 4prenj挤压，压缩TCB ( Thermal Compression Bond)Bonding Diagram压焊图/布线图布线错误Wrong Bonding线钩（测拉力）推球头（测推力）Incomplete, nkm 4pli:tjIncomplete bondNo bondingN2 BOXRTPCTrayt

29、rei盘子，托盘Handing TrayFBIFBI insp-M/CMicroscope 4maikrskupj 显微镜Low Power MicroscopeFluxfIks熔剂、焊剂；助熔剂，助焊剂HookEhuk钩住，吊住，挂住Wire pull hookBall shear tooladj.不完全的，未完成的焊不牢无焊氮气柜实时过程监控刀.产品盘压焊后LI检圧焊检验机低倍显微镜vt. & vi.Metal *metljn.金属Discolordis *kl匕使脱色；（使）变色，（使）褪色Oxide 4ksaidJn.氧化物Metal Discolor铝条变色Bond Pad Disc

30、olor铝垫变色Bond Pad Oxide铝垫氧化StickEstikJvt. & vi.粘贴，张贴a剥皮，剥下的皮PeelingE *pi:liCratering 4kreitri.刀缩孔;陷穴(弹坑) Nonstick bond on pad Bond pad peelingBond pad cratering Limit * limit 限制；限定ScratchEskrtj 抓，搔，刮伤Over rework limitBond remove / seratchBall bond non-stickBall to large (small)Ball bond shortNon-stic

31、k on lead misplaceE, mis pleis 把放错位置 connectionk 4neknj Misplaced bond on LD Wire brokenMissing wireWrong connection defectiveEdi fektivj 有缺陷的，欠缺的Defective loopingSagging sgi铝垫不粘铝垫脱落铝垫弹坑vt.vt. & vi.超过返工数剔球划伤金球脱落金球过大（小）金球短路引脚脱落（鱼尾脱落）vt.n.连接，联结压焊打偏断线漏打错打adj.弧度不良下垂沉，陷，松垂，垂度Loop saggingLow loopHigh loop

32、Loop shortOverhang , uv *h弧度下陷弧度太低弧度太高弧度短路吒伸出；悬挂于之上n.剩余，余渣刀歪曲，曲解Residue rezidju:Distortiondis *t：nWire overhang on LDWire residueLF distortionQuantity kwntiti 数目，数量Mismatch mis mtJScrapskrpj废料Vt.废弃，丢弃ScratchskrtlQuantity MismatchEmptynot scrapGold Wire Scratch跨越引线框架残丝引线框架变形刀.就.使配错，使配合不当刀.卩匕刮伤数量不符 空粘

33、未报废 金丝受损Parameter参数Statistics统计Utility应用Contact search接触测Teach教习 Bond tip offset一焊线点纠偏Zoom off center放大倍数偏心校准Cali bra t i on校准BQM焊接质量控制PRpatterrecognition一图像识别Alignment tolerance对点偏差PR indexing图像控制下的步进Capillary焊线劈刀Wire spool送线卷轴Window clamp一窗口夹板Transducer一功率换能器FTX 功能键Wire threading一送线器 EFO 电子打火 Line

34、ar power 线性马达 Vacuum sensor 真空感应器Step driver一步进驱动Post bond inspection一焊接后检查Wire pull一拉线Ball shape一推球Ball size一焊球大小Ball thickness一焊球尚度Loop height一线弧高度Loop shape一线弧形状Neck crack一线颈折损Fine adjust -精确调整Conversion - 换产品1st bond non stick第一点不粘2nd bond non stick一第二点不粘peeling拔铝垫（扯皮）Bond off脱焊 Ball deformation

35、一焊球变形servo motor一伺服电机weld off管脚脱焊crater裂缝gold wire金线missing ball球未烧好塑封：MoldEmuld 模子，铸型vt. 浇铸，塑造Molding *muldi 成型（塑封） Compound kmpaund Moiding M/C： Mold Press Presspres 印刷机weak bond虚焊刀.刀.刀.复合物，化合物塑封机Heater khi:tJ刀.加热器；炉子Pre-heat er预热机ChaseEteisJn追捕，追猎Mold die / Mold chaseMGP moldAuto moldloadEludJ1把装

36、上车船2装loaderf ludj装货的人，装货设备,装弹机Auto L / F loaderhandler 4hndlJ（动物）驯化者（抓手）temperature 4temprit温度，气温Pre-heat TemperatureMold TemperatureClampklmpj夹紧；夹住n.夹具Pressure preClamp PressureTransfer pressureTransfer trns *f:转移塑封模具MGP多缸模具 自动包封机 vt. &亿匚自动排片机料饼预热温度 模具温度vt. &卩丄a压（力），压强合模压强注塑压强vt. &卩丄转移；迁移n.Curing “

37、kjuri塑化，固化，硫化，硬化CuringtimeCuringtemperaturePre-heatTimeTransferspeedTransfertime固化时间固化温度（料饼）预热时间注塑速度注塑时间PMC time (Post Mold Cure Time)后固化时间Load / unload上料/下料Sweep swi：pjvt. & vi.扫，打扫,拂去Wire Sweep冲丝Open开路Short短路Fill filvt. & vi.（使）充满，（使）装满，填满Underfill ndfil刀.（孔型）未充满Body underfilled胶体未灌满Incomplete , n

38、km *pli:tadj.不完全的,Incomplete mold未封满Chip tipn.碎片，缺口Chip package / body chip-out崩角Porosity p： rsitijn.多孔性，有孔性Porosity Body胶体麻点Bubble b?bl刀.泡，水泡，气泡Blister blist气泡vt. &卩丄（使）起水泡Smear smiVt.弄脏，弄污n.污迹，污斑Surface s：fis面，表面Roough surface不均匀（表面）未完成的Mold flash废胶Mold flash废胶Delaminate di： lmneitj 将分层，分成细层 Delam

39、inatingVoid v?id空的，空虚的PKG VoidDeep di:pl深的Scratch skrtBody deep scratchDimension di *mennjMold PKG dimensionBTM width / lengthTop width / lengthPKG thickMismatch mis mt 使配错，使配合不当Mold mismatch / PKGOffset *fsetjV.后固化vt.剥去,剥夺,夺走空封分层adj.胶体空洞adj.vt.刮伤胶体刮痕尽尺寸，度量塑封体尺寸背面宽/长正面宽/长塑封体厚度Vt.mismatch包封偏差（胶体错位）Vt

40、.抵消，补偿Misalignment *mislainmntln.未对准Mold offset PKG misalignment偏心PMC (post mold cure)Dummy dmi人体模型Strip stripDummy molded strip料饼醒料（回温过程）Gate geitjMold gateRemain ri meinj剩余物；残余Gate remainCompound *kmpaundjAging *eidi老化，成熟的过程Compound AgingLocator lu 4keitJ刀门，栅栏门注浇口、进浇口小脚刀复合物，化合物表示位置之物，土地Block bl?k刀

41、大块（木料、石料、金属、冰等）Locator Block定位块Ejector i 4dektJ驱逐者，放出器Pin pin大头针，别针，针Depth dep 0刀深，深度Ejector Pin顶针E-pin Depth顶针深度Storage st:ridn储藏处，仓库Cold room / compoundstorage冷藏库/料饼存放库Air 空气?Gun gnjn.枪，炮n.Coating kutij 涂层，覆盖层Material m 4tirilj材料，原料,素材，资料AirGun气枪DieCoating芯片涂胶Autodie coating M/C芯片涂胶机DieCoating Mat

42、erial覆晶胶Car tka:tj刀.手推车ASS YBCart后站推车Tablet tblit刀药片、止Loader 4ludj装货的人，装货设备,装弹机Preheater pri:hi:tjn.预热器Fixture fikstjn.（房屋等的）固定装置Auto TabletLoader自动排胶粒机CompoudPreheater咼频预热机Load /UnloadFixture上料/下料架TabletMagazine胶粒盒Compoud Tablets塑封料饼Molding Cleaning Compoud洗模饼misorientationmis, :rien 4teinj定向误差，取向误

43、差PKG Misorientat ion胶体压反Mold flash on lead塑封溢胶Mold crack胶体裂痕Semiconductor 半导体Molding 模封Onload 上料Offload -出料Belt 皮带Preheater turntable - 预热转盘Transfer传送Safety Door安全门Pickand place -机械手Motor马达Station -模腔Cleaning brush清洁刷Cylinder气缸Sensor传感器Solenoid电磁阀Turn over - 翻转器Degate - 切料口Bearing轴承Picker爪（Pusher -推

44、动器Cull bin -垃圾箱Pin针Vacuum pump真空泵Morn it or -显示器Cable -导线Profile-温度曲线Alarm报警Error-错误Driver驱动Sensor -感应器Inspection检查Parameter参数Manual手动，手册Reset复位Initialing初始化Guide -导轨Substrate基板Device 产品种类LotTraveller随工单Magazine盒子Cylinder -汽缸Bearing - 轴承Stop停止Emergency Stop紧急停止Gripper -夹子Heat -加热器Pipe -管子r emperatur

45、e温度Hopper - 漏斗Compress air -压缩空气Over flow反面漏胶Semiconductor 半导体MoldingOperation -操作Flange - 法兰盘Pump-泵Chamber -腔体Vent - 气孔Value-值Alarm报警Error错误Inspection检查Parameter参数Manual手动，手册Reset复位Initialing初始化Overflow漏胶Incomplete fill 模封不全 inching扭曲Misalignment模封错位Resin Hole / Void气孑LWire sweep线弯曲Package mismatch

46、模封错位Foreign materials夕卜来物Rough surface表面粗糙Wrong Orientation模封方向反Eng. Sample工程师样品Stain/Dirty on package表面脏污Resin burr树脂有毛刺Resin flashes毛刺Damage frameFRAME损坏Scratch on package树脂表面划伤Evaluation评估Crack package 树脂开裂切筋 Trim-FormSPC sample -SPC 样品1 切筋Trimming2切筋模Trim die3成形模Form die分离模singulate冲废De-junk6检测7

47、再成型机模具8再成型机9料盘10连筋11毛刺14溢料15裂纹16离层（分层）17管脚反翘18筋未切19筋凸出20筋切入Dambar cutInspection外观检测Reform DieReform systemPlastic trayUncut dambarburrJunkCrackDelaminatingLead tip bendDam-bar uncutDam-bar protrusionDam-bar cut in打印 Marking1打印2印章3激光打印4油墨打印5正印6背印7镜头8打印不良模糊MarkingMarking layoutLaser markingInk (UV) ma

48、rkingTop side markBack side markLensIllegible marking9漏打No marking10断字Broken character11缺字Missing character12印字倾斜Slant marking13印记错误Wrong marking14重印Remark15印字模糊（褪色）Fade mark16印字粘污Smear19电流current21字体（字形）Font22定位针Location pin23胶皮打印机Pad printer24激光打印机Laser Marking M/C25后固化PMC(Post Mold Cure)26后固化烤箱PM

49、C Oven27打印污斑Marking stain28印记移位Marking shift电镀 Plating1电镀Plating2来料Incoming3冲废Dejunk4热煮软化槽Socking Tank7检验Inspection外观检测8烘烤Curing / Baking 150C; 60-90ms9出料Unload10高速线电镀High-speed Plating Line11统计过程控制SPC12搭锡Solder bridge13锡丝、锡须Solder flick / Whisker43水压Water pressure14镀层不良Plating defects15发黄Yellowish1

50、6发黑Blacken17变色Discolor18露底材（露铜）Expose copper19粘污Smear20镀层用度Plating thickness 7-20um21镀层成分Plating composition22外观Outgoing23易焊性Solder ability24无铅化Pb-free / lead free25结合力Adhesive force26可靠性Reliability27电解Electrolytic deflash28清洗（自来水）City water29高压清洗High pressure rinse30脱脂Descale31清洗（纯水）DI water32活化（合金

51、）Activation33预镀、预浸Pre-dip34电镀Plating35吹风Air blow36中和Neutralization37褪镀Stripper38拖出Drag out39上料机Loader40下料机Unloader41纯锡Tin42纯水（去离子水）DI water电镀成分，Sn4647515253545556596061626364656667686970717273747544理化分析Physical and chemical analysis45 测丿7仪Plating Thickness Meter Electroplated CoatingThicknessTest离子污

52、染度测试仪 Ion Contamination Tester Contamino CT100c含量测试仪Carbon Tester去氧化HSCU Descale预浸Pre-dip电镀电流Current镀液温度Temperature 电镀液plating solution电镀槽plating tank中和Neutralization烘干Curing锡球Solder ball锡疗度和成分Sn thickness & composition冲废De-junk去胶渣去溢料Degate冲塑，冲胶去飞边Deflash去胶（塑封工序）锡铅电镀Tin lead plating无铅电镀Lead free plating; Pure tin plating镀层起泡Solder bump镀层剥落Solder peel off镀层偏用或