theyieldofGrindBeadproducts-GB(六西格码项目

1、Increase the yield of Grind Bead products-GBLaird Technologies Six Sigma GB ProjectDefine Phase1Project SummaryProject TitleIncrease the yield of Grind Bead products-GBProject ScopeGrind BeadGreen Belt*Deployment Champion *Process Owner *Finance Representative *Mentor *2Project Team MembersTeam Memb

2、ers & DepartmentsLeader: * Process Engineer Member: * Process Engineer * Production Supervisor * Production Supervisor * Production Supervisor * QA Supervisor 3Problem StatementProblem StatementThe yield of Grind Bead products is 77.53% from Jan-2010 to May-2010, which impacted FGTS seriously Projec

3、t ObjectiveIncrease the yield: From 77.53% to 90% by the end of Sep. 2010Business BenefitsProjected Annual Savings of $30KMeet Customer Delivery4Project BackgroundComment: Grind Bead Yield is more lower than the other products.5Project BackgroundComment:1. Grind Bead belong to S100 products.2. The t

4、otal yield of S100 is close to 90%. 6Project Metrics12.5% room of improvementBaseline = 77.5%Target = 90%7Project Time Frame (Milestone)Define 2010.06.01 Measure 2010.07.01 Analyze 2010.07.30 Improve 2010.08.20 Control 2010.09.01 8Financial Impact & SavingAssessed saving=Standard Cost* Forecast*(Bas

5、eline Scrap rate-Target Scrap Rate)= USD30KActual Saving From Oct To Dec:Actual Saving=USD59.4K 9Summary Deliverables & ConclusionGrind Bead Yield was 77.5% from Jan to May-2010, there is about 12.5% potential defect ratio reduction to achieve target 90% by the end of 2010.Projected Annual Savings o

6、f $30K Meet Customer Delivery10Increase the yield of Grind Bead products-GBLaird Technologies Six Sigma GB ProjectMeasure Phase11Pareto ChartComment : 1. Scrap data is from product daily report in May-2010 2.In the Pareto Chart of Defect Item, Loss, chip and samll ID occupy 99.0% of total scrap qty

7、. So they should be main improved.Main improve defects12Pareto Chart analysisComment : Loss come from the management, It means the products drop away during the transferring. We had arranged a meeting with production. Please see the below meeting summary. After production improved, the Pareto Chart

8、show the main defects are Small ID and Chips.关于少数的 a.成型称对批量数量 叶华飞 韩应明(负责培训) 2010-8-25 b.各工序培训员工注意搬运手势避免掉落损坏产品 S100所有班组长(负责培训) 2010-8-25 13Pareto Chart-Sep. 2010Comment : 1. Scrap data is from product daily report in May-2010 2.In the Pareto Chart of Defect Item, chip, samll ID and Loss occupy 99.0%

9、of total scrap qty . So they should be main improved.Main improve defectsSmall IDChipLoss14Process Map15Identify KPIVsManmaterialMethodEnvironmentLustrationDryness5SCostumeTechnician skillGaugeInspection criteriaInspection methodWI (x)Operators skill (x)MachineMeasureKilnGrinding machinePressing mac

10、hineSpeedDiamond wheel (x)CleaningStainless trayPress machineLCR meter Pro Samples P O2Package BoxesSelf controlConsciousness Small IDWI training (x)SpeedPlastic bagsWork standardCleaning roomAir conditionPowder Lot noPowder sizeAdapt the machine Press condition Firing profile Powder propertiesWashi

11、ng procedure16Identify KPIVsManmaterialMethodEnvironmentLustrationDryness5SCostumeTechnician skillGaugeInspection criteriaInspection methodWI (x)Operators skill (x)MachineMeasureKilnGrinding machinePressing machineSpeedDiamond wheel (x)CleaningStainless trayPress machineLCR meter Pro Samples P O2Pac

12、kage BoxesSelf controlConsciousness ChipWI training (x)SpeedPlastic bagsWashing procedureWork standardCleaning roomAir conditionPowder Lot noPowder sizeAdapt the machine Press condition Firing profile Powder properties17FMEA18FMEA19Gage R&RSmall ID20Control ChartControl Chart ID dimensionComments :

13、In Aug of 2010,Small ID actual scrap rate is 17.01%； Sigma level (Z Value) is 0.01321Potential KPIVs ListAccording to analysis we found four potential KPIVs:1. Pressing processPressing condition (SPI)2. Firing processTemperature settings3. Grinding processWashing procedure 4. Management processSourc

14、ing chain22Measure Phase DeliverablesDeveloped the Pareto Charts Developed process mapping Developed Fishbone Diagram and FMEAIdentified potential KPIVsDeliverables & ConclusionConclusion From Measure PhaseWe had confirmed the Measure system Gage R & R is OK. Through Process map, Fishbone Diagram, C

15、 & E Matrix, FMEA analysis , we found 4 KPIVs.We had made the Action Plan for 4 KPIVs.23Increase the yield of Grind Bead products-GBLaird Technologies Six Sigma GB ProjectAnalysis Phase24Potential KPIVs Identified Summary NoKPIVHypothesis Test1Pressing processPressing condition (SPI) Two samples2Fir

16、ing processTemperature settings Two samples3Grinding processWashing procedure No need test4Management processSourcing chain25KPIV 1: Change the KPIV1 can impact the Small ID scrap rate.KPIV 1 Detail Pressing processPressing condition (SPI) Before: We set the average value around 1.77 after firing sa

17、mples. Change method: We set the average value around 1.79 after firing samples. And since the pin will be damaged after per week. We will check if the pressing condition need to be changed weekly.Hypothesis TestTwo samples test will be used to test this KPIV.Hypothesis StatementHo : After change KP

18、IV1, the ID distribution is as same as before. Ha : After change KPIV1, the ID distribution is not same as before. 26KPIV 1: Change the KPIV1 can impact the Small ID scrap rate.Hypothesis Test (Small ID)Comments : P-Value 0.005 ,the result shows after adjust pressing condition, Small ID (P(2) reduce

19、d obviously and significantly.P-Value0, 00527KPIV 1: Change the KPIV1 can impact the Small ID scrap rate.Hypothesis Test (Small ID)P-Value0, 005 Non normal28KPIV 1: Change the KPIV1 can impact the Small ID scrap rate.Hypothesis Test (Small ID)Comments : P-Value 0.005 , the data is non normal, 2 samp

20、le-T test can be used for it.P-Value0.05 ,the result shows after reduced the top temperature, Properties (R and ) is still same with before. The properties didnt change so much.Two-sample T for 1190-2 vs 1220 N Mean StDev SE Mean1190-2 25 13.516 0.395 0.0791220 25 13.449 0.386 0.077Difference = mu (

21、1190-2) - mu (1220)Estimate for difference: 0.06640095% CI for difference: (-0.155591, 0.288391)T-Test of difference = 0.05 (vs not =): T-Value = 0.15 P-Value = 0.883 DF =48Both use Pooled StDev = 0.3904Individual Value Plot of 1190-2, 1220 Boxplot of 1190-2, 1220 KPIV 2: Change the KPIV1 can impact

22、 the Chip scrap rate.Two-sample T for 1190-1 vs 1220 N Mean StDev SE Mean1190-1 25 13.423 0.189 0.0381220 25 13.449 0.386 0.077Difference = mu (1190-1) - mu (1220)Estimate for difference: -0.02640095% CI for difference: (-0.199156, 0.146356)T-Test of difference = 0.05 (vs not =): T-Value = -0.89 P-V

23、alue = 0.378 DF =48Both use Pooled StDev = 0.3038Individual Value Plot of 1190-1, 1220 Boxplot of 1190-1, 1220 33Hypothesis Test (Chip )P-Value=0,447 P(1) =P(2)P-Value=0, 261 P(1) =P(2)Comments : P-Value 0.05 ,the result shows after reduced the top temperature, Properties (R and ) is still same with

24、 before. The properties didnt change so much.Two-sample T for 1190-2 vs 1220 N Mean StDev SE Mean1190-2 50000 46.800 0.807 0.1650000 46.50 1.06 0.2Difference = mu (1190-1) - mu (1220)Estimate for difference: 0.30400095% CI for difference: (-0.233542, 0.841542)T-Test of difference = 0 (vs not =): T-V

25、alue = 1.14 P-Value = 0.261 DF = 44KPIV 2: Change the KPIV1 can impact the Chip scrap rate.Two-sample T for 1190-1 vs 1220 N Mean StDev SE Mean1190-1 50000 46.691 0.689 0.1450000 46.50 1.06 0.21Difference = mu (1190-3) - mu (1220)Estimate for difference: 0.19565095% CI for difference: (-0.318849, 0.

26、710149)T-Test of difference = 0 (vs not =): T-Value = 0.77 P-Value = 0.447 DF = 4134Summary Conclusion Significant KPIVs The below potential KPIVs have been identified as significant; and further action will be taken to implement the improvement plans in the next phase:KPIV 1: Reviewing the pressing

27、 condition oftenly.KPIV 2: Reduce the top temperature.KPIV 3: Change the washing procedure. KPIV 4: The operator will check the quantities for each batch when the products be shipped to next process.35Increase the yield of Grind Bead products-GBLaird Technologies Six Sigma GB ProjectImprove Phase36I

28、mprovement & Action Plan SummaryNoKPIVActionOwnerDue DateStatus 1Pressing processPressing condition (SPI) 1. Check samples result when a new set of tooling will be used.*8-OctClosed 2. Check samples result for each machine weekly.*8-Oct2Firing processTemperature settings Reduced the top temperature

29、from 1220 to 1190.*8-NovClosed 3Grinding processWashing procedure Implement new washing procedure after grinding.*1-DecClosed 4Management processSourcing chainThe operator will check the quantities for each batch when the products be shipped to next process.*8-OctClosed 37Pressing processPressing co

30、ndition (SPI) can impact the Small ID scrap rate. KPIV 1:We checked some batches with high Small ID scrap rate, and we found only pressing condition which can impact Small ID seriously, per team analysis, we fond that the releasing condition is the root cause, and we changed pressing condition at th

31、at time.From 8th Oct, we did some test with different pressing condition by same machine, the test result is as below: Batch Lot#Pressing condition Small ID Scrap RateMachineS10T0509170.225g/pc8.01%RP3#S10TE0509230.234g/pc1.03%RP3#From the above sheet, we can find that used 0.234g/pc releasing agent

32、 the small ID scrap rate is the lower.So from 8th oct, 0.234g/pc pressing condition was used by all pressing process. 38Pressing processPressing condition can impact the Small ID scrap rate. KPIV 1:From 8th to 28th Oct, we did many tests to optimize the pressing condition, and base on the test data,

33、 we drew a conclusion : The pressing condition changed that the Small ID scrap rate was changed. The tooling will be damaged after 1 or 2 weeks and it will affect the scrap rate also. It means we need to adapt the pressing condition oftenly.Lot#Pressing condition Small ID Scrap RateMachineS10T050950

34、0.234g/pc3.40%RP3#S10T0509680.234g/pc7.40%RP3#S10T0509810.234g/pc9.50%RP3#39Firing processTop temperature can impact the Chip scrap rate. KPIV 2:We compared the chip scrap rate for 35B0110-010 and 24B0110-010. And we found the chips come from 24B0110-010 mainly. And the grinding process for these tw

35、o items are both same. So we think the material of 24B0110-010 is too much hard than 35# material. So we decide to test lower firing temperature from 28th-Sep. When the temperature is changed to 1190, we found the yield increased a few percents.40Grinding processWashing procedure can impact the Chip

36、 scrap rate. KPIV 3:After grinding, the products will be putted into a box. The products will be washed by hand. It will bring a lot of chips during washing. We had implemented a new ultrasonic machine to wash products. And we found the yield increased. 41Grinding processWashing procedure can impact

37、 the Chip scrap rate. KPIV 3:Machine picture is as below.42Project Metrics: Actual Vs TargetComments : The yield increased to 87%.YieldBaseline 77.5%43Summary Conclusion Conclusion from action items We validated four KPIVs which have obvious impact to defect rate ,we had finished improvement actions

38、 and update related drawing and documents. Through these actions, we reduced the scrap rate from 22.5% to 12.84%.44Laird Technologies Six Sigma GB ProjectControl PhaseIncrease the yield of Grind Bead products-GB45KPIV Control Plan SummaryKPIVDetailProposed Control Action / PlanFrequencyPerson-In-Cha

39、rge1Pressing processPressing condition (SPI)Tooling will be damaged little bit after 1 or 2 weeks.For new tooling, the samples will be tried firing. Pressing condition need to be monitoring weekly.Weekly*2Firing processTemperature settings Too high temperature.Operators check the actual temperature.

40、Daily *3Grinding processWashing procedure Changed to use ultrasonic machine to wash products.Operators follow the WI.Daily *4Management processSourcing chainFollow up procedure during transfer.Operators follow the WI.Daily *46FMEA - Updated Score47FMEA - Updated Score48Pressing condition control ME

41、should review samples result for new tooling. ME should review samples result weekly for each machine.49Firing process control Release ECN to change top temperature from 1220 to 1190 . 50Firing process control After change the profile, the performance is still same with before.51Firing process control After change the profile, the performance is still same with before.specR 10MHz 10MHz52Washing procedure control Production had fini