压锡深度测试

1、P. 1UAT-D1829/709WS-CO-EX-01ICGEngineeringProcessVanden Abeele JanPROCESS CONTROLSOLDERINGExecuting level1. CONTROLLING IMMERSION DEPTH OF BOARD1.1MEASUREMENT + LIMITSCHIPWAVE:for boards with thickness X = 1.6 mm:Nominal valueMin valueMax value1.61.62.4for boards with thickness X = 1.0 mm:Nominal va

2、lueMin valueMax value1.01.02.4 PRINTED BOARDImmersion depthXP. 2UAT-D1829/709WS-CO-EX-01ICGEngineeringProcessVanden Abeele JanPROCESS CONTROLSOLDERINGExecuting levelMAIN WAVE:for boards with thickness 1.6 mm:Nominal valueMin valueMax value0.80.81.6for boards with thickness 1.0 mm:Nominal valueMin va

3、lueMax value0.50.51.0PRINTED BOARDImmersion depth TP. 3GLASS1Wave height jigGLASS22.4 mm1.6 mm0.8 mmFLOW DIRECTION THROUGH MACHINEUAT-D1829/709WS-CO-EX-01ICGEngineeringProcessVanden Abeele JanPROCESS CONTROLSOLDERINGExecuting level1.2METHOD1.2.1 REQUIRED TOOLSSee list of process tools: AGR60-2-1933

4、, available on the PE&T WebsiteP. 4ICGEngineeringProcessVanden Abeele JanPROCESS CONTROLSOLDERINGExecuting levelP. 5ICGEngineeringProcessVanden Abeele JanPROCESS CONTROLSOLDERINGExecuting levelP. 6ICGEngineeringProcessPROCESS CONTROLSOLDERINGExecuting levelP. 7UAT-D1829/709WS-CO-EX-01ICGEngineer

5、ingProcessVanden Abeele JanPROCESS CONTROLSOLDERINGExecuting level1.4OUT OF CONTROL ACTION PLAN (OCAP)Measuring methodRequirementimmersion depth jig1.6 mm chip wave height 2.4 mm-Check the height of the molten solder in the bath; solder waves must be switched ON-Is the distance between the bottom si

6、de of the jig and the glass plates accordingspecification 0.8 mm, 1.6 mm and 2.4 mm? No contamination should be present. (weeklycleaning in IPA)-Are the fingers of the transport system clean and straight? If not go on with checking thefinger cleaner and/or do the mechanical finger check.-Do a second

7、 measurement with special attention to the positioning of the jig into thefingers.-If the requirement is fulfilled make a note of the second measurement and stop with thisactivity schedule.-If the requirement is not fulfilled go on with the activity schedule.-Is the nozzle of the jet wave clean?-Try

8、 to create a smooth wave (top side) by switching the wave off and on, or by changingthe pump speed. If this wont work, the machine has to be opened and the nozzle and/orsump has to be cleaned.-Make a note of the (re)adjustment of the system on the Maintenance Follow Up Sheet (seeUAT-D1829/680).-Re-a

9、djust the wave height of the jet wave with the rotation speed of the pump.-Inform the technical supervisor.P. 8UAT-D1829/709WS-CO-EX-01ICGEngineeringProcessVanden Abeele JanPROCESS CONTROLSOLDERINGExecuting levelMeasuring methodRequirementimmersion depth jig0.8 mm main wave height 1.6 mm-Check the h

10、eight of the molten solder in the bath; solder waves must be switched ON-Is the distance between the bottom side of the jig and the glass plates accordingspecification 0.8 mm, 1.6 mm and 2.4 mm? No contamination should be present (weeklycleaning in IPA)-Are the fingers of the transport system clean

11、and straight? If not go on with checking thefinger cleaner and/or do the mechanical finger check.-Is the solder flow direction relatively standstill with respect to the printed board speed? Ifnot check the solder bath level and/or backplate position with respect to the settinginstruction and re-adju

12、st if necessary.-Do a second measurement with special attention to the positioning of the jig into thefingers.-If the requirement is fulfilled make a notation of the second measurement and stop withthis activity schedule.-If the requirement is not fulfilled go on with the activity schedule.-Re-adjust the wave height of the lambda wave with the rotation speed of the pump.-Make a notation of the (re)adjustment of the system on the Maintenance Follow Up Sheet(see UAT-D1829/680).-Inform the